查看購物車
  • Simplified Chinese
  • English
  • Japanese
  • Korean
封面
市場調查報告書
商品編碼
1438021

到 2030 年線路重布材料的市場預測：按類型、材料類型、應用和區域進行全球分析

Redistribution Layer Material Market Forecasts to 2030 - Global Analysis By Type (Fan-out wafer-level packaging, 5D/3D Integrated Circuit Packaging and Other Types), Material Type, Application, and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據Stratistics MRC預測，2023年全球線路重布材料市場規模將達2.1836億美元，預計2030年將達到5.2985億美元，預測期內複合年成長率為13.5%。

線路重布材料 (RLM) 是電子設備中的關鍵組件，有助於能量和訊號的有效分配。 RLM 充當晶片不同層之間的橋樑，實現高效互連和訊號分配。 RDL 材料通常需要與先進的封裝製程相容，例如覆晶接合和 TSV（矽通孔）技術。 RDL材料具有良好的導熱性能，能夠散發運作過程中產生的熱量，確保半導體裝置的可靠性和壽命，特別是在半導體產業的新技術和小型化趨勢下。

據尤索夫伊薩東南亞研究院稱，東南亞是重要的汽車生產中心，也是全球第七大汽車生產中心，2021年生產汽車350萬輛。

積體電路的複雜性不斷增加

積體電路變得越來越複雜，在有限的空間中整合了更多的組件和功能。這些材料提供高效的互連解決方案，最大限度地減少訊號損失，並增強先進半導體裝置有限空間內的溫度控管。此外，RDL材料還有助於提高積體電路的可靠性和性能，推動市場成長。

高成本

開發具有高導電性和導熱性等精確特性的 RDL 材料非常複雜，並且帶來了許多成本挑戰。這些先進製程導致更高的製造成本並影響半導體裝置的整體承受能力。此外，競爭激烈的市場需要具有成本效益的解決方案，這給製造商最佳化生產成本帶來了越來越大的壓力。材料成本上漲導致最終產品價格上漲，限制了市場進入和採用。

先進封裝技術

隨著電子設備變得越來越複雜，對緊湊、高效能封裝解決方案的需求不斷增加。這些封裝創新對於滿足從行動裝置到複雜運算系統的現代電子應用的需求至關重要。此外，促進在單一晶片上整合多種功能、提高性能以及創建更小、更高性能的設備正在推動這一市場的擴張。

有限的標準化

缺乏標準化的測試方法和基準使得相關人員很難準確評估和比較不同RDL材料的性能。這種通用的缺乏阻礙了互通性和相容性，使 RDL 材料與不同半導體裝置的整合變得複雜。此外，對於製造商來說，供應鏈管理的複雜性增加，阻礙了市場擴張。

COVID-19 的影響

COVID-19的爆發對市場產生了重大影響，導致供應鏈中斷並影響市場動態。許多製造商面臨原物料採購困難，導致價格上漲和報酬率壓力。此外，向遠距工作的轉變以及消費者在非必需電子產品上的支出減少進一步削弱了市場表現。

5D/3D 積體電路 (IC) 封裝領域預計將在預測期內成為最大的領域

5D/3D 積體電路 (IC) 封裝領域預計將佔據最大佔有率，因為它將多層 IC 整合到3D以增強效能和功能。模式轉移提高導熱性、電氣性能和可靠性的材料。此外，由於 5D/3D IC 封裝實現了多個半導體層的堆疊，RDL 材料在促進這些複雜結構內的互連和訊號分佈方面發揮關鍵作用，使得我們正在推動這一領域的成長。

Butene領域預計在預測期內複合年成長率最高

預計Butene產業在預測期內將出現最高的複合年成長率，特別是在先進微電子和半導體封裝領域。 BCB是一種高性能聚合物，是積體電路RDL製造的必備材料。此外，良好的熱穩定性、低介電常數和出色的平坦化能力等獨特特性使其成為 RDL 應用的理想選擇，推動了該領域的成長。

比最大的地區

由於家用電子電器、通訊和汽車電子的快速擴張，亞太地區在預測期內佔據了最大的市場佔有率。中國、日本、韓國和台灣等國家處於該市場的前沿，擁有主要的半導體製造商和組裝設施。此外，隨著電子設備變得越來越複雜、越來越小，高效的 RDL 材料對於確保高性能積體電路變得至關重要，從而推動了該地區的市場規模。

複合年成長率最高的地區：

由於半導體封裝和微電子技術的進步，預計歐洲在預測期內將呈現最高的複合年成長率。該地區是英飛凌科技、日立化學、杜邦微系統有限責任公司和 Amkor Technology 等主要企業以及主要製造和研究設施的所在地。此外，政府促進創新的努力以及對品質和精密工程的重視正在支持該地區的擴張。

免費客製化服務：

訂閱此報告的客戶可以存取以下免費自訂選項之一：

  • 公司簡介
    • 其他市場參與者的綜合分析（最多 3 家公司）
    • 主要企業SWOT分析（最多3家企業）
  • 區域分割
    • 根據客戶興趣對主要國家的市場估計、預測和複合年成長率（註：基於可行性檢查）
  • 競爭基準化分析
    • 根據產品系列、地理分佈和策略聯盟對主要企業基準化分析

目錄

第1章執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 資料分析
    • 資料檢驗
    • 研究途徑
  • 調查來源
    • 主要調查來源
    • 二次調查來源
    • 先決條件

第3章市場趨勢分析

  • 促進因素
  • 抑制因素
  • 機會
  • 威脅
  • 應用分析
  • 新興市場
  • 新型冠狀病毒感染疾病（COVID-19）的影響

第4章波特五力分析

  • 供應商的議價能力
  • 買方議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭對手之間存在敵對關係

第5章全球線路重布材料市場：依類型

  • 扇出晶圓級封裝 (FOWLP)
  • 5D/3D 積體電路 (IC) 封裝
  • 其他類型

第6章全球線路重布材料市場：依材料類型

  • Butene
  • 聚醯亞胺
  • Polybenzoxazole
  • 其他材質類型

第7章全球線路重布材料市場：依應用

  • 化學工業
  • 電子產品
  • 其他用途

第8章全球線路重布材料市場：按地區

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲

第9章 主要進展

  • 合約、夥伴關係、協作和合資企業
  • 收購和合併
  • 新產品發布
  • 業務擴展
  • 其他關鍵策略

第10章 公司簡介

  • Fujifilm Corporation
  • HD MicroSystems LLC
  • NXP Semiconductors.
  • A/SE Group
  • Infineon Technologies
  • Samsung Electronics Co., Ltd.
  • Amkor Technology
  • SK Hynix Inc.
  • Shin-Etsu Chemical Co., Ltd
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
Product Code: SMRC25009

According to Stratistics MRC, the Global Redistribution Layer Material Market is accounted for $218.36 million in 2023 and is expected to reach $529.85 million by 2030 growing at a CAGR of 13.5% during the forecast period. A redistribution layer material (RLM) is a crucial component in electronic devices, facilitating efficient energy or signal distribution. It serves as a bridge between different layers of a chip, enabling efficient interconnection and signal distribution. RDL materials often need to be compatible with advanced packaging processes, such as flip-chip bonding or through-silicon via (TSV) technology. RDL materials possess favorable thermal conductivity characteristics to dissipate heat generated during operation, ensuring the reliability and longevity of the semiconductor device, particularly in the context of emerging technologies and miniaturization trends in the semiconductor industry.

According to the ISEAS-Yusof Ishak Institute, Southeast Asia is an important automobile production base and seventh largest automotive manufacturing hub worldwide and produced 3.5 million vehicles in 2021.

Market Dynamics:

Driver:

Rising complexity in integrated circuits

Integrated circuits are becoming more intricate, incorporating a greater number of components and functionalities within a limited space. These materials provide efficient interconnection solutions, minimize signal losses, and enhance thermal management within the confined spaces of advanced semiconductor devices. In addition, RDL materials contribute to the reliability and performance of integrated circuits, thereby boosting market growth.

Restraint:

High costs

The complexity of developing RDL materials with precise properties, such as high electrical and thermal conductivity, adds to the cost challenge. These sophisticated processes contribute to elevated production costs, impacting the overall affordability of semiconductor devices. Furthermore, the demand for cost-effective solutions in a competitive market intensifies the pressure on manufacturers to optimize production expenses. High material costs can lead to increased end-product prices, limiting market accessibility and adoption.

Opportunity:

Advanced packaging technologies

The demand for compact and high-performance packaging solutions has intensified as electronic devices become increasingly sophisticated. These packaging innovations are crucial for meeting the demands of modern electronic applications, ranging from mobile devices to complex computing systems. Moreover, it facilitates the integration of multiple functions on a single chip, enhances performance, and enables the creation of smaller, more powerful devices, which is driving this market expansion.

Threat:

Limited standardization

The absence of standardized testing methods and benchmarks makes it challenging for stakeholders to assess and compare the performance of different RDL materials accurately. This lack of common ground hinders interoperability and interchangeability, leading to complications in the integration of RDL materials into diverse semiconductor devices. It also increases the complexity of supply chain management for manufacturers, which is impeding this market size.

Covid-19 Impact

The COVID-19 pandemic has significantly impacted the market, causing disruptions in the supply chain and influencing market dynamics. Many manufacturers faced difficulties in sourcing raw materials, leading to increased prices and a strain on profit margins. Moreover, the shift towards remote working and reduced consumer spending on non-essential electronics further dampened the market's performance.

The 5D/3D integrated circuit (IC) Packaging segment is expected to be the largest during the forecast period

The 5D/3D integrated circuit (IC) Packaging segment is estimated to hold the largest share, due to the integration of multiple layers of ICs in three dimensions, enhancing performance and functionality. A paradigm shift towards materials offer improved thermal conductivity, electrical performance, and reliability. Moreover, as 5D/3D IC packaging enables the stacking of multiple semiconductor layers, RDL materials play a critical role in facilitating interconnects and signal distribution within these complex structures which is driving this segment growth.

The benzocylobutene segment is expected to have the highest CAGR during the forecast period

The benzocylobutene segment is anticipated to have highest CAGR during the forecast period, particularly in the realm of advanced microelectronics and semiconductor packaging. BCB, a high-performance polymer, serves as a crucial material for the fabrication of RDLs in integrated circuits. Furthermore, unique properties, including excellent thermal stability, a low dielectric constant, and superior planarization capabilities, make it an ideal choice for RDL applications, which are boosting this segment's growth.

Region with largest share:

Asia Pacific commanded the largest market share during the extrapolated period, owing to a rapidly expanding consumer electronics, telecommunications, and automotive electronics. Countries such as China, Japan, South Korea, and Taiwan are at the forefront of this market, hosting major semiconductor manufacturers and assembly facilities. In addition, as electronic devices become more sophisticated and compact, the need for efficient RDL materials becomes critical for ensuring high-performance integrated circuits, driving the size of this region.

Region with highest CAGR:

Europe is expected to witness highest CAGR over the projection period, owing to advancements in semiconductor packaging and microelectronics. The region is home to several key players, including Infineon Technologies, Hitachi Chemical, DuPont MicroSystems L.L.C., and Amkor Technology, which host major manufacturing and research facilities. Moreover, government initiatives promoting innovation, coupled with a strong emphasis on quality and precision engineering, are propelling this region's expansion.

Key players in the market

Some of the key players in the Redistribution Layer Material Market include Fujifilm Corporation, HD MicroSystems LLC, NXP Semiconductors, ASE Group, Infineon Technologies, Samsung Electronics Co., Ltd., Amkor Technology, SK Hynix Inc., Shin-Etsu Chemical Co., Ltd and Jiangsu Changjiang Electronics Technology Co., Ltd.

Key Developments:

In November 2023, Amkor Technology, Inc. announced that it has committed to setting targets to reduce greenhouse gas emissions in alignment with the Science Based Targets initiative (SBTi).

In June 2023, FUJIFILM Cellular Dynamics, announces the global commercial launch of its human iPSC-derived iCell® Blood-Brain Barrier Isogenic Kit for scientists engaged in neuroscience research and drug discovery for neuroactive drugs.

In January 2023, FUJIFILM Cellular Dynamics, Inc., announced that it has entered an agreement to grant global healthcare company Novo Nordisk A/S a non-exclusive right to use FUJIFILM Cellular Dynamics' iPSC platform for the development and commercialization of iPSC-derived cell therapies with a focus on addressing serious chronic diseases

Types Covered:

  • Fan-out wafer-level packaging (FOWLP)
  • 5D/3D Integrated Circuit (IC) Packaging
  • Other Types

Material Types Covered:

  • Benzocylobutene
  • Polyimide
  • Polybenzoxazole
  • Other Material Types

Applications Covered:

  • Chemical Industry
  • Electronic Appliances
  • Other Applications

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 Emerging Markets
  • 3.8 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Redistribution Layer Material Market, By Type

  • 5.1 Introduction
  • 5.2 Fan-out wafer-level packaging (FOWLP)
  • 5.3 5D/3D Integrated Circuit (IC) Packaging
  • 5.4 Other Types

6 Global Redistribution Layer Material Market, By Material Type

  • 6.1 Introduction
  • 6.2 Benzocylobutene
  • 6.3 Polyimide
  • 6.4 Polybenzoxazole
  • 6.5 Other Material Types

7 Global Redistribution Layer Material Market, By Application

  • 7.1 Introduction
  • 7.2 Chemical Industry
  • 7.3 Electronic Appliances
  • 7.4 Other Applications

8 Global Redistribution Layer Material Market, By Geography

  • 8.1 Introduction
  • 8.2 North America
    • 8.2.1 US
    • 8.2.2 Canada
    • 8.2.3 Mexico
  • 8.3 Europe
    • 8.3.1 Germany
    • 8.3.2 UK
    • 8.3.3 Italy
    • 8.3.4 France
    • 8.3.5 Spain
    • 8.3.6 Rest of Europe
  • 8.4 Asia Pacific
    • 8.4.1 Japan
    • 8.4.2 China
    • 8.4.3 India
    • 8.4.4 Australia
    • 8.4.5 New Zealand
    • 8.4.6 South Korea
    • 8.4.7 Rest of Asia Pacific
  • 8.5 South America
    • 8.5.1 Argentina
    • 8.5.2 Brazil
    • 8.5.3 Chile
    • 8.5.4 Rest of South America
  • 8.6 Middle East & Africa
    • 8.6.1 Saudi Arabia
    • 8.6.2 UAE
    • 8.6.3 Qatar
    • 8.6.4 South Africa
    • 8.6.5 Rest of Middle East & Africa

9 Key Developments

  • 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 9.2 Acquisitions & Mergers
  • 9.3 New Product Launch
  • 9.4 Expansions
  • 9.5 Other Key Strategies

10 Company Profiling

  • 10.1 Fujifilm Corporation
  • 10.2 HD MicroSystems LLC
  • 10.3 NXP Semiconductors.
  • 10.4 A/SE Group
  • 10.5 Infineon Technologies
  • 10.6 Samsung Electronics Co., Ltd.
  • 10.7 Amkor Technology
  • 10.8 SK Hynix Inc.
  • 10.9 Shin-Etsu Chemical Co., Ltd
  • 10.10 Jiangsu Changjiang Electronics Technology Co., Ltd.

List of Tables

  • Table 1 Global Redistribution Layer Material Market Outlook, By Region (2021-2030) ($MN)
  • Table 2 Global Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
  • Table 3 Global Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
  • Table 4 Global Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
  • Table 5 Global Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 6 Global Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
  • Table 7 Global Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
  • Table 8 Global Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
  • Table 9 Global Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
  • Table 10 Global Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
  • Table 11 Global Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
  • Table 12 Global Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
  • Table 13 Global Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
  • Table 14 Global Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
  • Table 15 North America Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
  • Table 16 North America Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
  • Table 17 North America Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
  • Table 18 North America Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
  • Table 19 North America Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 20 North America Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
  • Table 21 North America Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
  • Table 22 North America Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
  • Table 23 North America Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
  • Table 24 North America Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
  • Table 25 North America Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
  • Table 26 North America Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
  • Table 27 North America Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
  • Table 28 North America Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
  • Table 29 Europe Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
  • Table 30 Europe Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
  • Table 31 Europe Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
  • Table 32 Europe Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
  • Table 33 Europe Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 34 Europe Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
  • Table 35 Europe Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
  • Table 36 Europe Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
  • Table 37 Europe Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
  • Table 38 Europe Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
  • Table 39 Europe Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
  • Table 40 Europe Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
  • Table 41 Europe Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
  • Table 42 Europe Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
  • Table 43 Asia Pacific Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
  • Table 44 Asia Pacific Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
  • Table 45 Asia Pacific Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
  • Table 46 Asia Pacific Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
  • Table 47 Asia Pacific Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 48 Asia Pacific Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
  • Table 49 Asia Pacific Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
  • Table 50 Asia Pacific Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
  • Table 51 Asia Pacific Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
  • Table 52 Asia Pacific Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
  • Table 53 Asia Pacific Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
  • Table 54 Asia Pacific Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
  • Table 55 Asia Pacific Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
  • Table 56 Asia Pacific Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
  • Table 57 South America Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
  • Table 58 South America Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
  • Table 59 South America Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
  • Table 60 South America Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
  • Table 61 South America Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 62 South America Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
  • Table 63 South America Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
  • Table 64 South America Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
  • Table 65 South America Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
  • Table 66 South America Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
  • Table 67 South America Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
  • Table 68 South America Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
  • Table 69 South America Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
  • Table 70 South America Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
  • Table 71 Middle East & Africa Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
  • Table 72 Middle East & Africa Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
  • Table 73 Middle East & Africa Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
  • Table 74 Middle East & Africa Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
  • Table 75 Middle East & Africa Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 76 Middle East & Africa Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
  • Table 77 Middle East & Africa Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
  • Table 78 Middle East & Africa Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
  • Table 79 Middle East & Africa Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
  • Table 80 Middle East & Africa Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
  • Table 81 Middle East & Africa Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
  • Table 82 Middle East & Africa Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
  • Table 83 Middle East & Africa Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
  • Table 84 Middle East & Africa Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)