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市場調查報告書
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1878355

無線連接晶片組市場-2025-2030年預測

Wireless Connectivity Chipset Market - Forecasts from 2025 to 2030

出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 140 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

無線連接晶片組市場預計將從 2025 年的 106.56 億美元成長到 2030 年的 165.26 億美元,複合年成長率為 9.17%。

無線連接晶片組市場由現代通訊系統內部硬體的基本建構模組所構成。這些晶片組旨在透過無線通訊協定(包括 Wi-Fi、藍牙或二者結合)實現設備連接。該市場的擴張主要得益於消費領域智慧家庭自動化技術的日益普及以及汽車行業對先進連接技術的需求不斷成長。高速網路存取的日益普及,尤其是在歐洲、北美和亞太地區,正在加速連網設備和智慧家庭應用的普及。這個生態系統涵蓋了不斷擴展且種類繁多的產品,包括語音助理、智慧家電、智慧照明、恆溫器和保全攝影機。然而,這種擴張也帶來了網路複雜性的增加和安全隱患,因為每個連網設備都代表著網路攻擊的新途徑。

物聯網 (IoT) 在住宅、商業和工業環境中的快速整合是推動高級自動化發展以及無線晶片組需求成長的根本因素。自動化帶來的優勢眾多,包括提高生產力、增強營運柔軟性和可靠性、提升安全性、加快處理速度、提升生活便利性以及提高整體成本效益。預計未來幾年,物聯網連接在各個領域的持續成長將成為無線晶片組市場持續成長的驅動力。

主要市場成長促進因素

市場的主要驅動力是網路在家庭和企業中日益普及和變革性的應用。現代數位經濟的特徵是對網路連線的高度依賴,這為Wi-Fi晶片組創造了持續的需求,也為製造商帶來了機會。 Wi-Fi網路技術的進步為用戶提供了更快的速度和更低的延遲,從而促進了資料密集型服務和應用的蓬勃發展。這一趨勢主要受消費者對高清影片內容的需求以及企業和消費者領域向雲端基礎服務的廣泛轉變所驅動。這些因素顯著增加了透過Wi-Fi網路傳輸的資料量。這種數據爆炸性成長催生了對強大無線連接的需求,以支援高速、高容量的網路。 5G的持續部署,以及未來擴增實境(AR)和虛擬實境(VR)等身臨其境型技術的普及,預計將進一步加速資料流量和效能需求的成長。

第二個相互關聯的促進因素是自動化在多個領域的日益普及。物聯網 (IoT) 在住宅、商業和工業環境中的快速應用,催生了對先進自動化解決方案的強勁需求。這種需求直接轉換為無線晶片組消耗量的成長,而無線晶片組正是互聯系統通訊的基礎。自動化整合帶來了許多顯著優勢,包括提高生產力、增強適應性和可靠性、強化安全通訊協定、提升產量、加快資料處理速度、提高便利性以及顯著降低成本。因此,覆蓋各行各業的物聯網連接網路預計將在不久的將來成為推動無線晶片組市場成長的核心支柱。

區域市場展望

亞太地區預計將佔據全球無線連接晶片組市場的主要佔有率,並有望保持這一地位。這一主導地位得益於多項區域趨勢。消費者偏好轉向螢幕大小更大、更實用的設備,例如平板電腦和智慧型手機,正在推動對支援這些設備的無線連接晶片組的需求。此外,教育科技公司致力於將數位設備融入學習課程,這也促進了連網設備的普及,並刺激了對這些關鍵組件的需求。

亞太地區網路服務需求的快速成長也推動了無線連接晶片組的普及。包括5G在內的先進網路服務的持續推廣和消費者接受度預計將帶來顯著的社會和經濟效益。這項技術升級週期為需要先進連接技術的設備的激增創造了理想環境,鞏固了亞太地區作為全球無線晶片組市場關鍵成長引擎的地位。設備擁有量的成長、教育領域的數位化以及下一代網路的部署,共同使亞太地區處於市場擴張的前沿。

本報告的主要優勢:

  • 深入分析:提供對主要和新興地區的深入市場洞察,重點關注客戶群、政府政策和社會經濟因素、消費者偏好、垂直行業和其他細分市場。
  • 競爭格局:了解全球主要企業的策略舉措,並了解透過正確的策略進入市場的可能性。
  • 市場促進因素與未來趨勢:探討影響市場的動態因素和關鍵趨勢及其對未來市場發展的影響。
  • 可操作的建議:利用洞察力,做出策略決策,在動態環境中發展新的業務流和收入來源。
  • 受眾廣泛:適用於Start-Ups、研究機構、顧問公司、中小企業和大型企業,且經濟實惠。

以下是一些公司如何使用這份報告的範例

產業與市場分析、機會評估、產品需求預測、打入市場策略、地理擴張、資本投資決策、法規結構及影響、新產品開發、競爭情報

報告範圍:

  • 2022-2024年實際數據及2025-2030年預測數據
  • 成長機會、挑戰、供應鏈前景、法規結構與趨勢分析
  • 競爭定位、策略和市場佔有率分析
  • 按業務板塊和地區分類的收入成長和預測評估,包括國家/地區
  • 公司概況(策略、產品、財務資訊、關鍵發展等)

目錄

第1章執行摘要

第2章 市場概覽

  • 市場概覽
  • 市場定義
  • 調查範圍

第2章 市場區隔

第3章 商業情境

  • 市場促進因素
  • 市場限制
  • 市場機遇
  • 波特五力分析
  • 產業價值鏈分析
  • 政策與法規
  • 策略建議

第4章 技術展望

5. 無線連接晶片組市場(依技術分類)

  • 介紹
  • Wi-Fi
  • Bluetooth
  • NFC(近距離場通訊)
  • 細胞
  • 其他

6. 依架構分類的無線連接晶片組市場

  • 介紹
  • 獨立版
  • 託管

7. 無線連接晶片組市場(依應用領域分類)

  • 介紹
  • 家用電子電器
  • 醫療保健
  • 工業的
  • 其他

8. 無線連接晶片組市場(依地區分類)

  • 介紹
  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他
  • 歐洲
    • 德國
    • 法國
    • 英國
    • 西班牙
    • 義大利
    • 其他
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 其他
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 台灣
    • 其他

第9章:競爭格局與分析

  • 主要企業和策略分析
  • 市佔率分析
  • 合併、收購、協議和合作
  • 競爭對手儀錶板

第10章:公司簡介

  • Broadcom Inc
  • Qualcomm Technologies, Inc.
  • MediaTek Inc
  • Intel Corporation
  • Texas Instruments Incorporated
  • STMicroelectronics
  • NXP Semiconductors NV
  • ONSEMI
  • Infineon Technologies AG
  • Qorvo Inc

第11章附錄

  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要收益
  • 調查方法
  • 簡稱
簡介目錄
Product Code: KSI061614992

Wireless Connectivity Chipset Market is expected to grow at a 9.17% CAGR, achieving USD 16.526 billion by 2030 from USD 10.656 billion in 2025.

The wireless connectivity chipset market is defined by components integral to the internal hardware of modern communication systems. These chipsets are engineered to enable devices to connect via wireless protocols, including Wi-Fi, Bluetooth, or a combination of both. The expansion of this market is primarily driven by the proliferating adoption of smart home automation in the consumer sector and the rising demand for enhanced connectivity within the automotive industry. As high-speed internet access becomes more widespread, particularly in regions such as Europe, North America, and Asia Pacific, the deployment of connected devices and smart home applications is accelerating. This ecosystem encompasses a growing array of products, including voice assistants, smart appliances, intelligent lighting, thermostats, and security cameras. However, this expansion also introduces increased network complexity and security considerations, as each connected device can potentially represent a new vector for cyber attacks.

The rapid integration of the Internet of Things (IoT) across residential, commercial, and industrial environments is a fundamental force fueling the need for advanced automation and, consequently, for wireless chipsets. The benefits of automation are multifaceted, leading to increased production, greater operational flexibility and reliability, enhanced security, faster processing speeds, more convenient living, and overall cost-effectiveness. The continued growth in IoT connections across various sectors is anticipated to be a persistent driver for the wireless chipset market in the coming years.

Primary Market Growth Drivers

A principal driver for the market is the escalating and transformative use of the internet in both households and businesses. The modern digital economy is characterized by a heavy reliance on internet connectivity, which in turn creates sustained demand for Wi-Fi chipsets and opportunities for manufacturers. Advancements in Wi-Fi network technology are delivering faster speeds and lower latency to users, enabling the widespread adoption of data-intensive services and applications. This trend is largely fueled by consumer appetite for high-definition video content and a broad movement-across both corporate and consumer segments-toward cloud-based services. These factors are generating a massive increase in the volume of data carried over Wi-Fi networks. This data deluge is creating a requirement for robust wireless connections that can support fast, high-capacity networks. The ongoing deployment of 5G, coupled with the future adoption of immersive technologies like augmented reality (AR) and virtual reality (VR), is expected to further accelerate data traffic and performance demands.

A second, interrelated driver is the broadening adoption of automation across multiple domains. The rapid proliferation of the Internet of Things in residential, commercial, and industrial settings has created a powerful demand for sophisticated automation solutions. This demand directly translates into increased consumption of wireless chipsets, which serve as the communication backbone for these interconnected systems. The integration of automation offers compelling advantages, including improved productivity, enhanced adaptability and dependability, stronger security protocols, increased output, faster data processing, greater convenience, and significant cost-effectiveness. The expanding web of IoT connections across diverse industries is therefore expected to be a central pillar propelling the growth of the wireless chipset market in the foreseeable future.

Geographical Market Outlook

The Asia Pacific region is projected to be the prominent shareholder in the global wireless connectivity chipset market and is anticipated to maintain this position. This dominance is supported by several regional dynamics. A shift in consumer preference towards devices with larger, more practical screen sizes, such as tablets and smartphones, is boosting demand for the wireless connectivity chipsets that enable them. Furthermore, initiatives by educational technology companies that integrate digital devices into learning curricula are contributing to the installed base of connected gadgets, thereby stimulating demand for these essential components.

The adoption of wireless connectivity chipsets is also being propelled by the rapidly growing demand for internet services across the Asia-Pacific region. The ongoing rollout and consumer adoption of advanced internet services, including 5G, are anticipated to unlock significant societal and economic benefits. This technological upgrade cycle creates a fertile environment for the proliferation of devices requiring advanced connectivity, thereby cementing the region's role as a critical growth engine for the global wireless chipset market. The confluence of rising device ownership, digitalization in education, and next-generation network deployment positions Asia Pacific at the forefront of market expansion.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Wireless Connectivity Chipset Market Segmentation:

  • WIRELESS CONNECTIVITY CHIPSET MARKET BY TECHNOLOGY
  • Wi-Fi
  • Bluetooth
  • NFC (Near Field Communication)
  • Cellular
  • Others
  • WIRELESS CONNECTIVITY CHIPSET MARKET BY ARCHITECTURE
  • Standalone
  • Hosted
  • WIRELESS CONNECTIVITY CHIPSET MARKET BY APPLICATION
  • Consumer Electronics
  • Automotive
  • Medical & Healthcare
  • Industrial
  • Others
  • WIRELESS CONNECTIVITY CHIPSET MARKET BY GEOGRAPHY
  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Spain
  • Italy
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Taiwan
  • Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

  • 2.1. Market Overview
  • 2.2. Market Definition
  • 2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

  • 3.1. Market Drivers
  • 3.2. Market Restraints
  • 3.3. Market Opportunities
  • 3.4. Porter's Five Forces Analysis
  • 3.5. Industry Value Chain Analysis
  • 3.6. Policies and Regulations
  • 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. WIRELESS CONNECTIVITY CHIPSET MARKET BY TECHNOLOGY

  • 5.1. Introduction
  • 5.2. Wi-Fi
  • 5.3. Bluetooth
  • 5.4. NFC (Near Field Communication)
  • 5.5. Cellular
  • 5.6. Others

6. WIRELESS CONNECTIVITY CHIPSET MARKET BY ARCHITECTURE

  • 6.1. Introduction
  • 6.2. Standalone
  • 6.3. Hosted

7. WIRELESS CONNECTIVITY CHIPSET MARKET BY APPLICATION

  • 7.1. Introduction
  • 7.2. Consumer Electronics
  • 7.3. Automotive
  • 7.4. Medical & Healthcare
  • 7.5. Industrial
  • 7.6. Others

8. WIRELESS CONNECTIVITY CHIPSET MARKET BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. North America
    • 8.2.1. USA
    • 8.2.2. Canada
    • 8.2.3. Mexico
  • 8.3. South America
    • 8.3.1. Brazil
    • 8.3.2. Argentina
    • 8.3.3. Others
  • 8.4. Europe
    • 8.4.1. Germany
    • 8.4.2. France
    • 8.4.3. United Kingdom
    • 8.4.4. Spain
    • 8.4.5. Italy
    • 8.4.6. Others
  • 8.5. Middle East and Africa
    • 8.5.1. Saudi Arabia
    • 8.5.2. UAE
    • 8.5.3. Others
  • 8.6. Asia Pacific
    • 8.6.1. China
    • 8.6.2. India
    • 8.6.3. Japan
    • 8.6.4. South Korea
    • 8.6.5. Taiwan
    • 8.6.6. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Competitive Dashboard

10. COMPANY PROFILES

  • 10.1. Broadcom Inc
  • 10.2. Qualcomm Technologies, Inc.
  • 10.3. MediaTek Inc
  • 10.4. Intel Corporation
  • 10.5. Texas Instruments Incorporated
  • 10.6. STMicroelectronics
  • 10.7. NXP Semiconductors NV
  • 10.8. ONSEMI
  • 10.9. Infineon Technologies AG
  • 10.10. Qorvo Inc

11. APPENDIX

  • 11.1. Currency
  • 11.2. Assumptions
  • 11.3. Base and Forecast Years Timeline
  • 11.4. Key Benefits for the Stakeholders
  • 11.5. Research Methodology
  • 11.6. Abbreviations