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市場調查報告書

商品編碼

1878119

電子設計自動化 (EDA) 市場 - 2025 年至 2030 年預測

Electronic Design Automation Market - Forecasts from 2025 to 2030

出版日期: 2025年10月22日 | 出版商:

Knowledge Sourcing Intelligence | 英文 144 Pages | 商品交期: 最快1-2個工作天內

價格

簡介目錄

電子設計自動化 (EDA) 市場預計將從 2025 年的 161.34 億美元成長到 2030 年的 275.51 億美元，複合年成長率為 11.30%。

電子設計自動化 (EDA) 市場提供支撐整個半導體產業的關鍵軟體、硬體和智慧財產權 (IP)。當前市場動態的特徵是底層技術變革與宏觀經濟因素波動相互交織。該行業正經歷一場根本性的變革，從碎片化的晶片級設計轉向整體的「從矽到系統」方法。這一轉變由先進製程節點的推進和人工智慧的系統性整合所驅動，從而導致對先進 EDA 許可證和平台的持續高價值需求。

核心市場動態：促進因素與必要條件

市場發展軌跡正受到多個強大且相互關聯的促進因素的影響。其中最主要的是向異構運算和晶片組架構的決定性轉變。隨著傳統單片式晶片設計在5奈米及以下製程節點面臨物理和經濟的限制，晶片組正成為主要的演進路徑。這種架構轉變立即催生了對創新EDA解決方案的迫切需求，這些解決方案能夠解決整個封裝內的晶粒通訊、電源完整性和溫度控管。尤其值得一提的是，它加速了對先進的2.5D/3D IC物理設計和檢驗工具以及用於多物理場模擬的CAE軟體的需求，這些工具對於模擬定義晶片組性能的高頻寬、低延遲通訊至關重要。

同時，人工智慧 (AI) 和機器學習 (ML) 整合到 EDA 工作流程中本身正成為一個重要的需求促進因素。隨著設計複雜性超越手動最佳化的極限，AI 驅動的生成式 IC 設計和多重運行檢驗解決方案對於維持設計品質和縮短週期時間至關重要。這並非普遍趨勢，而是推動高階軟體授權的特異性因素，這些軟體利用大規模運算資源進行自主設計空間探索，從而直接轉化為 AI 賦能 EDA 平台的高價值訂閱。

汽車產業是需求特別強勁的領域。向軟體定義汽車 (SDV) 的轉型以及高級駕駛輔助系統 (ADAS) 和自動駕駛平台的開發，對電子元件的整合提出了前所未有的要求。這需要具備混合訊號設計、強大的多物理場模擬和全面的功能安全檢驗等專業功能的電子設計自動化 (EDA) 工具，以滿足 ISO 26262 等嚴格標準。

重大挑戰及相關機遇

儘管市場需求強勁，仍面臨許多不利因素。主要挑戰在於圍繞雲端基礎EDA部署的持續安全性和資料主權問題。雖然雲端平台能夠為運算密集型任務提供可擴展性，但企業不願將關鍵業務IP遷移到外部，這直接抑制了對雲端基礎模式的需求，並增加了對資本密集型本地基礎設施的依賴。然而，這種限制也為供應商提供了一個絕佳的機會，讓他們可以投資並提供具有檢驗加密和存取控制的高度安全的混合雲端架構，從而釋放潛在需求。

第二個挑戰是高技能EDA工程人才日益短缺。新一代工具的日益複雜化造成了技能缺口，並增加了EDA解決方案的整體擁有成本。這項挑戰也為EDA供應商帶來了機會：客戶對承包系統設計和分析工具以及專業服務的需求不斷成長，以彌補其內部人才缺口。

地緣政治和監管影響

市場越來越容易受到政府政策和地緣政治緊張局勢的影響。美國實施的出口限制是主要的波動因素，不僅會即時對EDA公司的收入造成衝擊，還會促使受影響地區積極投資於國內EDA替代技術，從而導致長期全球需求發生戰略性轉變。

法規也在間接推動需求成長。例如，歐盟提案的人工智慧法案側重於高風險人工智慧應用的透明度和安全性，從而催生了對能夠提供審核檢驗流程的EDA工具的合規主導需求。同時，印度的「設計關聯獎勵」（DLI）計畫則直接獎勵策略了這一需求，為新興的國內設計公司創造了EDA軟體授權的補貼需求管道，使該地區成為一個充滿活力的成長區域。

競爭格局：面向系統的整合

EDA市場實際上處於寡占狀態，高度集中於三家全端供應商：摘要、Cadence Design Systems和Siemens EDA。競爭格局正從純粹的晶片設計轉向提供整合、認證流程的能力，以應對晶片之外的系統級挑戰，例如封裝、熱設計和結構分析。如今，競爭的焦點在於如何將AI/ML功能整合到設計中，以及如何透過策略性收購將供應商的整體市場潛力擴展到系統級實體領域。

這一點在主要企業的策略方向上顯而易見。 Cadence 的「智慧型系統設計」策略專注於端到端解決方案，並透過收購一家核心多實體場模擬軟體公司，進一步拓展至結構分析領域，從而強化了這一策略。同樣，摘要也完成了一項變革性收購，將世界一流的模擬和分析能力直接整合到其核心晶片設計平台中，鞏固了其市場領導地位和「從晶片到系統」的理念。這些舉措反映了市場的核心需求，即實現對大規模電子系統（例如自動駕駛汽車和伺服器機架）中晶片性能的模擬。

結論

EDA市場正處於一個轉折點，其角色正從支援晶片設計擴展到賦能整個電子系統。諸如晶片組等新型架構的需求、人工智慧的變革潛力以及汽車等產業的高要求，正推動EDA能力的根本性變革。儘管安全和人才方面的挑戰仍然存在，但它們也為創新和服務拓展提供了明確的機會。在此背景下，領先的供應商正透過策略性收購鞏固自身地位，彌合晶片與系統之間的鴻溝，確保EDA仍是全球技術進步不可或缺的重要基礎。

本報告的主要優勢：

深入分析：獲取主要和新興地區的深入市場洞察，重點關注客戶群、政府政策和社會經濟因素、消費者偏好、垂直行業和其他細分市場。
競爭格局：了解全球主要企業的策略舉措，並了解透過正確的策略實現市場滲透的潛力。
市場促進因素與未來趨勢：探索推動市場的動態因素和關鍵趨勢，以及它們將如何塑造未來的市場發展。
可操作的建議：利用這些見解，在動態環境中做出策略決策，並開拓新的商機和收入來源。
受眾廣泛：適用於Start-Ups、研究機構、顧問公司、中小企業和大型企業，且經濟實惠。

企業使用我們的報告的目的是什麼？

產業與市場分析、機會評估、產品需求預測、打入市場策略、地理擴張、資本投資決策、法規結構及影響、新產品開發、競爭情報

報告範圍：

2022年至2024年的歷史數據和2025年至2030年的預測數據
成長機會、挑戰、供應鏈前景、法規結構與趨勢分析
競爭定位、策略和市場佔有率分析
按業務板塊和地區分類的收入成長和預測評估，包括國家/地區
公司概況（策略、產品、財務資訊、關鍵發展等）

電子設計自動化（EDA）市場的市場區隔

按類型
電腦輔助工程（CAE）
積體電路物理設計與檢驗
印刷基板（PCB）和多晶片模組（MCM）
半導體智慧財產權（SIP）
其他
按實現類型
本地部署
雲端基礎的
透過使用
航太/國防
車
家用電子電器
產業
醫療保健
電訊
按地區
北美洲（美國、加拿大、墨西哥）
南美洲（巴西、阿根廷等）
歐洲（德國、法國、英國、西班牙等）
中東和非洲（沙烏地阿拉伯、阿拉伯聯合大公國等）
亞太地區（中國、印度、日本、韓國、印尼、泰國、世界其他地區）

The Electronic Design Automation (EDA) market provides the indispensable software, hardware, and intellectual property (IP) that underpin the entire semiconductor industry. The current market dynamic is defined by a convergence of foundational technology shifts and volatile macroeconomic forces. The industry is undergoing a fundamental evolution, moving from siloed chip-level design to a holistic "silicon-to-systems" approach. This transition, driven by the move to advanced nodes and the systemic integration of AI, is translating into sustained, high-value demand for advanced EDA licenses and platforms.

Core Market Dynamics: Drivers and Imperatives

The market's trajectory is being shaped by several powerful, interconnected drivers. Foremost among these is the decisive shift toward heterogeneous computing and chiplet-based architectures. As traditional monolithic chip design faces physical and economic constraints at sub-5nm nodes, chiplets have emerged as the dominant path forward. This architectural shift creates an urgent and direct demand for novel EDA solutions capable of addressing inter-die communication, power integrity, and thermal management across the entire package. This environment specifically propels demand for sophisticated 2.5D/3D IC physical design & verification tools and CAE software for multi-physics simulation, which are essential for modeling the high-bandwidth, low-latency communication that defines chiplet performance.

Concurrently, the integration of Artificial Intelligence (AI) and Machine Learning (ML) into EDA workflows is becoming a critical demand driver in its own right. As design complexity outstrips the capacity for manual optimization, AI-driven solutions for generative IC design and multi-run verification are becoming indispensable for maintaining design quality and reducing cycle times. This is not a generic trend but a specific driver for advanced software licenses that leverage massive compute resources for autonomous design space exploration, directly translating into higher-value subscriptions for AI-enabled EDA platforms.

The automotive sector represents a particularly potent source of demand. The transformation into Software-Defined Vehicles (SDVs), coupled with the development of ADAS and autonomous platforms, mandates an unprecedented integration of electronics. This creates a non-negotiable requirement for EDA tools that offer specialized capabilities for mixed-signal design, robust multiphysics simulation, and comprehensive functional safety verification to meet stringent standards like ISO 26262.

Critical Challenges and Consequent Opportunities

Despite strong demand, the market faces significant headwinds. The primary challenge is the persistent security and data sovereignty concern surrounding cloud-based EDA deployment. While the cloud offers scalability for compute-intensive tasks, the hesitation to migrate mission-critical IP off-premise directly suppresses demand for cloud-based models, reinforcing reliance on high-capital on-premise infrastructure. This constraint, however, presents a clear opportunity for vendors to invest in and offer highly secure, hybrid cloud architectures with verifiable encryption and access control, thereby unlocking pent-up demand.

A secondary challenge is the escalating scarcity of highly specialized EDA engineering talent. The sophistication of next-generation tools creates a skills gap that increases the total cost of ownership for EDA solutions. This challenge generates a parallel opportunity for EDA vendors to see higher demand for turnkey system design and analysis tools and professional services, which can compensate for the internal talent deficit of their customers.

Geopolitical and Regulatory Influences

The market is increasingly subject to the influence of government policy and geopolitical tensions. Export controls, such as those implemented by the US, introduce significant volatility, creating immediate revenue disruptions for EDA firms while simultaneously acting as a catalyst for affected jurisdictions to aggressively fund domestic EDA alternatives, strategically shifting long-term global demand.

Regulations are also creating indirect demand vectors. For instance, the European Union's proposed AI Act, with its focus on transparency and safety for high-risk AI applications, creates a compliance-driven imperative for EDA tools that provide verifiable and auditable design flows. In contrast, India's Design Linked Incentive (DLI) scheme represents a direct stimulus, creating a subsidized demand channel for EDA software licenses among emerging domestic design houses and making the region a highly dynamic growth area.

Competitive Landscape: The Consolidation toward Systems

The EDA market is an effective oligopoly, highly concentrated around three dominant, full-stack vendors: Synopsys, Cadence Design Systems, and Siemens EDA. Competition has shifted from pure chip design to the capability of delivering a unified, certified flow that addresses system-level challenges beyond the chip itself, such as packaging, thermal, and structural analysis. The primary competitive axes are now the integration of AI/ML capabilities for design autonomy and strategic acquisitions that extend the vendors' total addressable market into system-level physics.

This is evidenced by the strategic direction of the key players. Cadence's "Intelligent System Design" strategy focuses on end-to-end solutions, a direction reinforced by its move to acquire businesses with core multiphysics simulation software to expand into structural analysis. Similarly, Synopsys has fortified its leadership and "Silicon to Systems" approach by completing a transformative acquisition that integrates world-class simulation and analysis capabilities directly into its core silicon design platform. These moves are explicitly designed to enable customers to simulate chip performance within larger electronic systems, such as autonomous vehicles or server racks, reflecting the market's central imperative.

Conclusion

The EDA market is at an inflection point, where its role is expanding from enabling chip design to enabling entire electronic systems. The demands of new architectures like chiplets, the transformative potential of AI, and the stringent requirements of sectors like automotive are forcing a fundamental evolution in EDA capabilities. While challenges around security and talent persist, they present clear opportunities for innovation and service expansion. In this environment, the leading vendors are consolidating their positions through strategic acquisitions that bridge the gap between silicon and systems, ensuring that EDA remains the critical, non-negotiable foundation for global technological progress.

Key Benefits of this Report:

Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

Historical data from 2022 to 2024 & forecast data from 2025 to 2030
Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
Competitive Positioning, Strategies, and Market Share Analysis
Revenue Growth and Forecast Assessment of segments and regions including countries
Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Electronic Design Automation Market Segmentation

By Type
Computer-Aided Engineering (CAE)
IC Physical Design & Verification
Printed Circuit Board (PCB) and Multi-Chip Module (MCM)
Semiconductor Intellectual Property (SIP)
Others
By Deployment
On-Premise
Cloud-Based
By Application
Aerospace & Defence
Automotive
Consumer Electronics
Industrial
Medical
Telecommunications
By Geography
North America (USA, Canada, Mexico)
South America (Brazil, Argentina, Others)
Europe (Germany, France, United Kingdom, Spain, Others)
Middle East and Africa (Saudi Arabia, UAE, Others)
Asia Pacific (China, India, Japan, South Korea, Indonesia, Thailand, Others)

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

2.1. Market Overview
2.2. Market Definition
2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

3.1. Market Drivers
3.2. Market Restraints
3.3. Market Opportunities
3.4. Porter's Five Forces Analysis
3.5. Industry Value Chain Analysis
3.6. Policies and Regulations
3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. ELECTRONIC DESIGN AUTOMATION MARKET BY TYPE

5.1. Introduction
5.2. Computer-Aided Engineering (CAE)
5.3. IC Physical Design & Verification
5.4. Printed Circuit Board (PCB) and Multi-Chip Module (MCM
5.5. Semiconductor Intellectual Property (SIP),
5.6. Others

6. ELECTRONIC DESIGN MARKET BY DEPLOYMENT

6.1. Introduction
6.2. On-Premise
6.3. Cloud-Based

7. ELECTRONIC DESIGN MARKET BY APPLICATION

7.1. Introduction
7.2. Aerospace & Defence
7.3. Automotive
7.4. Consumer Electronics
7.5. Industrial
7.6. Medical
7.7. Telecommunications

8. ELECTRONIC DESIGN MARKET BY GEOGRAPHY

8.1. Introduction
8.2. North America
- 8.2.1. USA
- 8.2.2. Canada
- 8.2.3. Mexico
8.3. South America
- 8.3.1. Brazil
- 8.3.2. Argentina
- 8.3.3. Others
8.4. Europe
- 8.4.1. Germany
- 8.4.2. France
- 8.4.3. United Kingdom
- 8.4.4. Spain
- 8.4.5. Others
8.5. Middle East and Africa
- 8.5.1. Saudi Arabia
- 8.5.2. UAE
- 8.5.3. Others
8.6. Asia Pacific
- 8.6.1. China
- 8.6.2. India
- 8.6.3. Japan
- 8.6.4. South Korea
- 8.6.5. Indonesia
- 8.6.6. Thailand
- 8.6.7. Others