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1878107

半導體製造設備市場－2025年至2030年預測

Semiconductor Manufacturing Equipment Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 112 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

預計半導體製造設備市場將從 2025 年的 1,255.4 億美元成長到 2030 年的 2,104.1 億美元，複合年成長率為 10.88%。

半導體製造設備產業正處於關鍵時刻，面臨需求激增和營運瓶頸並存的雙重挑戰。人工智慧 (AI)、5G 基礎設施和高效能運算 (HPC) 的快速發展推動了對先進半導體的需求不斷成長，進而引發了全球對新建製造工廠 (晶圓廠) 的資本投資熱潮。這一成長對微影術、蝕刻、沉積、計量和測試設備的供應商提出了前所未有的要求，同時也帶來了供應鏈脆弱性、日益複雜的技術以及不斷加劇的地緣政治摩擦等挑戰。

主要市場成長促進因素

市場由多項相互關聯的技術變革所驅動。人工智慧的日益融合推動了對先進沉積和蝕刻設備的需求，因為晶片製造商正轉向更小的製程節點以處理神經網路處理的大量數據。這需要能夠以原子級精度沉積超薄膜的設備。同時，5G基礎設施的全球擴張推動了對微影術設備的需求。基地台需要具有卓越頻率響應特性的晶片，這就要求更精細的圖形化和更高的晶圓吞吐量。第三個主要促進因素是汽車電氣化，加速了計量和測試設備的應用。電動車需要可靠、無缺陷的半導體和功率模組，這推動了對先進後處理檢測和檢驗設備的需求，以確保其可靠性和性能。

重大挑戰與供應鏈限制因素

行業成長正受到一系列複雜挑戰的限制。地緣政治緊張局勢導致某些地區對先進設備出口實施限制，限制了關鍵供應商的市場進入，並可能延長依賴全球供應鏈的非監管晶圓廠的前置作業時間。此外，精密工程領域人才嚴重短缺阻礙了無塵室自動化的推廣，可能延緩設備的檢驗和部署。永續性法規也帶來了日益成長的壓力，特別是超純水等資源的消耗以及特種化學廢棄物的管理，這增加了營運成本和合規要求。

設備供應鏈本身就面臨巨大的壓力。它依賴某些特殊原料，例如特定的合金和光阻劑聚合物，而這些原料極易受到價格波動和採購瓶頸的影響，而採購瓶頸又是由生產集中度和地緣政治因素造成的。這些依賴性造成了脆弱性，單一供應商的斷供都可能導致全球晶圓廠產運作的嚴重中斷。從港口擁擠到國際貿易關稅等一系列物流挑戰，進一步加劇了這些高度複雜且精密設備的及時交付難度。

政府法規

世界各國政府的政策正積極塑造市場格局。例如，美國的《晶片與科學法案》和歐洲的《晶片法案》等舉措，為國內半導體製造能力注入了大量資金，直接推動了這些地區對先進設備的需求。然而，這些政策往往包含有利於本地供應商的條款，並實施出口限制，導致全球市場分散化。作為回應，其他國家也實施了旨在發展本國設備產業的補貼計畫和進口限制措施，在削弱現有全球供應商市場佔有率的同時，也創造了新的、受保護的國內市場。

市場區隔分析

在設備市場，微影術產業仍然主導著前端採購。受人工智慧處理器和高效能邏輯晶片需求的驅動，向極紫外線（EUV）光刻微影術的過渡對於尖端製程節點的圖形化至關重要。該領域佔設備總支出的大部分，並且是實現過程節點持續縮小的核心。

同時，測試設備領域正迅速崛起，成為關鍵成長點，尤其是在後端領域。隨著異質整合和3D封裝技術的興起，產量比率和可靠性變得日益重要，而這些技術對於先進的人工智慧和高效能運算模組至關重要。這推動了對先進測試和測量工具的大量投資，這些工具能夠檢驗複雜的多晶粒組件和功率裝置，應用於電動車等領域。

競爭環境

競爭格局由一群專業化的全球性公司主導，每家公司都有獨特的優勢。 ASML Holdings NV 在重要的極微影術(EUV) 市場中佔據絕對主導地位。 Applied Materials 和 LAM Research 等公司提供涵蓋沉積、蝕刻和其他關鍵製程工具的廣泛產品組合。其他主要企業，例如東京電子和泰瑞達，分別在晶圓製造系統和後端測試設備等特定領域擁有強大的實力。這些公司面臨的策略挑戰在於，如何在抓住持續技術進步帶來的成長機會的同時，降低供應鏈中斷和日益複雜的地緣政治法規環境所帶來的風險。

本報告的主要優勢：

  • 深入分析：獲取主要和新興地區的深入市場洞察，重點關注客戶群、政府政策和社會經濟因素、消費者偏好、垂直行業和其他細分市場。
  • 競爭格局：了解全球主要企業的策略舉措，並了解透過正確的策略實現市場滲透的潛力。
  • 市場促進因素與未來趨勢：探索推動市場的動態因素和關鍵趨勢，以及它們將如何塑造未來的市場發展。
  • 可操作的建議：利用這些見解，在快速變化的環境中製定策略決策，發展新的商業機會和收入來源。
  • 受眾廣泛：適用於Start-Ups、研究機構、顧問公司、中小企業和大型企業，且經濟實惠。

企業使用我們的報告的目的是什麼？

產業與市場分析、機會評估、產品需求預測、打入市場策略、地理擴張、資本投資決策、法規結構及影響、新產品開發、競爭情報

報告範圍：

  • 2022年至2024年的歷史數據和2025年至2030年的預測數據
  • 成長機會、挑戰、供應鏈前景、法規結構與趨勢分析
  • 競爭定位、策略和市場佔有率分析
  • 按業務板塊和地區分類的收入成長和預測評估，包括國家/地區
  • 公司概況（策略、產品、財務資訊、關鍵發展等）

半導體製造設備市場區隔：

  • 按前端設備：
  • 水面處理設備
  • 清潔過程
  • 其他
  • 透過後端設備
  • 組裝和包裝
  • 黏合設備
  • 切丁設備
  • 測試設備
  • 測量設備
  • 按尺寸
  • 2D
  • 3D
  • 透過製造工廠
  • 自動化
  • 化學控制設備
  • 瓦斯控制設備
  • 其他
  • 按地區
  • 美洲
  • 美國
  • 其他
  • 歐洲、中東和非洲
  • 德國
  • 英國
  • 荷蘭
  • 其他
  • 亞太地區
  • 中國
  • 日本
  • 韓國
  • 印度
  • 其他

目錄

第1章執行摘要

第2章 市場概覽

  • 市場概覽
  • 市場定義
  • 調查範圍

第2章 4. 市場區隔

第3章 商業情境

  • 市場促進因素
  • 市場限制
  • 市場機遇
  • 波特五力分析
  • 產業價值鏈分析
  • 政策與法規
  • 策略建議

第4章 技術展望

第5章 半導體製造設備市場（依前端設備分類）

  • 介紹
  • 水處理設備
  • 清潔過程
  • 其他

第6章 半導體製造設備市場（依後端設備分類）

  • 介紹
  • 組裝和包裝
  • 黏合設備
  • 切丁設備
  • 測試設備
  • 測量設備

第7章 半導體製造設備市場（依尺寸分類）

  • 介紹
  • 2D
  • 3D

第8章 半導體製造設備市場（依製造工廠分類）

  • 介紹
  • 自動化
  • 化學控制設備
  • 瓦斯控制設備
  • 其他

第9章 半導體製造設備市場（按地區分類）

  • 介紹
  • 美洲
    • 美國
    • 其他
  • 歐洲、中東和非洲
    • 德國
    • 英國
    • 荷蘭
    • 其他
  • 亞太地區
    • 中國
    • 日本
    • 韓國
    • 印度
    • 其他

第10章 競爭格局與分析

  • 主要企業和策略分析
  • 市佔率分析
  • 合併、收購、協議和合作
  • 競爭對手儀錶板

第11章：公司簡介

  • Tokyo Seimitsu Co., Ltd.
  • Kokusai Electric Corporation
  • Terra Universal
  • Modutek Corporation
  • Hitachi High-Technologies Corporation
  • LAM Research Corporation
  • Applied Materials, Inc.
  • ASML Holdings NV
  • Tokyo Electron Limited
  • Teradyne, Inc.

第12章附錄

  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要收益
  • 調查方法
  • 簡稱
簡介目錄
Product Code: KSI061611948

Semiconductor Manufacturing Equipment Market, with a 10.88% CAGR, is anticipated to reach USD 210.401 billion in 2030 from USD 125.540 billion in 2025.

The semiconductor manufacturing equipment industry is at a pivotal juncture, characterized by intense demand and significant operational constraints. Escalating requirements for advanced semiconductors, driven by the proliferation of Artificial Intelligence (AI), 5G infrastructure, and high-performance computing (HPC), are triggering a global wave of capital expenditure in new fabrication facilities (fabs). This surge places unprecedented demands on suppliers of lithography, etch, deposition, metrology, and test tools, who are simultaneously challenged by supply chain fragility, escalating technological complexity, and increasing geopolitical friction.

Primary Market Growth Drivers

The market is propelled by several interconnected technological shifts. The rising integration of AI is propelling demand for advanced deposition and etching equipment, as chipmakers scale to increasingly minute nodes to handle massive data throughput in neural networks. This necessitates tools capable of depositing ultra-thin films with atomic-level precision. Concurrently, the global expansion of 5G infrastructure is catalyzing acquisitions of lithography tools, as base stations require chips with superior frequency response, driving the need for finer patterning and higher wafer throughput. A third major driver is automotive electrification, which is accelerating the uptake of metrology and testing equipment. Electric vehicles require robust, defect-free semiconductors and power modules, boosting demand for sophisticated back-end inspection and validation tools to ensure reliability and performance.

Critical Challenges and Supply Chain Constraints

The industry's growth is tempered by a complex set of challenges. Geopolitical tensions are manifesting as export controls on advanced tools to certain regions, which constrains market access for major suppliers and can elongate lead times for non-restricted fabs reliant on the global supply chain. Furthermore, a significant talent shortage in precision engineering is impeding the scaling of cleanroom automation, leading to potential delays in equipment validation and deployment. Sustainability mandates are also applying pressure, particularly concerning the intensive consumption of resources like ultrapure water and the management of specialized chemical waste, driving up operational costs and compliance requirements.

The equipment supply chain itself is under considerable stress. It relies on specialized raw materials, including certain alloys and photoresist polymers, which are vulnerable to price volatility and sourcing bottlenecks due to concentrated production and geopolitical factors. These dependencies create vulnerabilities, where a disruption at a single supplier can idle significant global fab capacity. Logistical strains, from port congestion to international trade tariffs, further complicate the timely delivery of these highly complex and sensitive tools.

Government Regulatory Landscape

Government policies worldwide are actively shaping the market. Initiatives like the U.S. CHIPS and Science Act and the European Chips Act are injecting substantial funding to bolster domestic semiconductor manufacturing capacity, directly driving demand for advanced equipment within these regions. Conversely, such policies often include provisions that prioritize local suppliers or impose export controls, creating a fragmented global market. In response, other nations are implementing their own subsidy programs and import restrictions to foster indigenous equipment industries, which simultaneously erodes the market share of established global suppliers while creating new, protected domestic markets.

Market Segment Analysis

Within the equipment landscape, the lithography segment continues to dominate front-end procurement. The industry's transition to Extreme Ultraviolet (EUV) lithography is critical for patterning at the most advanced nodes, driven by the demands of AI processors and other high-performance logic chips. This segment commands a significant portion of total equipment spend and is central to enabling continued node scaling.

Simultaneously, the testing equipment segment is emerging as a critical growth area, particularly in the back-end. The rise of heterogeneous integration and 3D packaging, essential for advanced AI and HPC modules, places a premium on ensuring yield and reliability. This is driving substantial investment in sophisticated testing and metrology tools to validate complex multi-die assemblies and power devices for applications like electric vehicles.

Competitive Environment

The competitive landscape is dominated by a group of specialized global players, each with distinct strengths. ASML Holdings N.V. maintains a unique, dominant position in the critical EUV lithography market. Companies like Applied Materials, Inc. and LAM Research Corporation offer broad portfolios across deposition, etch, and other critical process tools. Other significant players, including Tokyo Electron and Teradyne, Inc., hold strong positions in specific domains such as wafer fabrication systems and back-end test equipment, respectively. The strategic imperative for these firms is to navigate the dual challenges of capturing growth from relentless technological advancement while mitigating risks associated with supply chain disruptions and an increasingly complex geopolitical regulatory environment.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Semiconductor Manufacturing Equipment Market Segmentation:

  • BY FRONT END EQUIPMENT:
  • Water Surface Conditioning Equipment
  • Cleaning Process
  • Others
  • BY BACK END EQUIPMENT
  • Assembling and Packaging
  • Bonding Equipment
  • Dicing Equipment
  • Testing Equipment
  • Metrology Equipment
  • BY DIMENSION
  • 2D
  • 3D
  • BY FAB FACILITY
  • Automation
  • Chemical Control Equipment
  • Gas Control Equipment
  • Others
  • BY GEOGRAPHY
  • Americas
  • United States
  • Others
  • Europe, the Middle East, and Africa
  • Germany
  • United Kingdom
  • Netherlands
  • Others
  • Asia Pacific
  • China
  • Japan
  • South Korea
  • India
  • Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

  • 2.1. Market Overview
  • 2.2. Market Definition
  • 2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

  • 3.1. Market Drivers
  • 3.2. Market Restraints
  • 3.3. Market Opportunities
  • 3.4. Porter's Five Forces Analysis
  • 3.5. Industry Value Chain Analysis
  • 3.6. Policies and Regulations
  • 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY FRONT-END EQUIPMENT

  • 5.1. Introduction
  • 5.2. Water Surface Conditioning Equipment
  • 5.3. Cleaning Process
  • 5.4. Others

6. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY BACK-END EQUIPMENT

  • 6.1. Introduction
  • 6.2. Assembling and Packaging
  • 6.3. Bonding Equipment
  • 6.4. Dicing Equipment
  • 6.5. Testing Equipment
  • 6.6. Metrology Equipment

7. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY DIMENSION

  • 7.1. Introduction
  • 7.2. 2D
  • 7.3. 3D

8. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY FAB FACILITY

  • 8.1. Introduction
  • 8.2. Automation
  • 8.3. Chemical Control Equipment
  • 8.4. Gas Control Equipment
  • 8.5. Others

9. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY GEOGRAPHY

  • 9.1. Introduction
  • 9.2. Americas
    • 9.2.1. United States
    • 9.2.2. Others
  • 9.3. Europe, the Middle East, and Africa
    • 9.3.1. Germany
    • 9.3.2. United Kingdom
    • 9.3.3. Netherlands
    • 9.3.4. Others
  • 9.4. Asia Pacific
    • 9.4.1. China
    • 9.4.2. Japan
    • 9.4.3. South Korea
    • 9.4.4. India
    • 9.4.5. Others

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 10.1. Major Players and Strategy Analysis
  • 10.2. Market Share Analysis
  • 10.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 10.4. Competitive Dashboard

11. COMPANY PROFILES

  • 11.1. Tokyo Seimitsu Co., Ltd.
  • 11.2. Kokusai Electric Corporation
  • 11.3. Terra Universal
  • 11.4. Modutek Corporation
  • 11.5. Hitachi High-Technologies Corporation
  • 11.6. LAM Research Corporation
  • 11.7. Applied Materials, Inc.
  • 11.8. ASML Holdings N.V
  • 11.9. Tokyo Electron Limited
  • 11.10. Teradyne, Inc.

12. APPENDIX

  • 12.1. Currency
  • 12.2. Assumptions
  • 12.3. Base and Forecast Years Timeline
  • 12.4. Key Benefits for the Stakeholders
  • 12.5. Research Methodology
  • 12.6. Abbreviations