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1861296

扇出型晶圓層次電子構裝：全球市佔率和排名、總銷售額和需求預測（2025-2031 年）

Fan-Out Wafer Level Packaging - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031
出版日期: | 出版商: QYResearch | 英文 83 Pages | 商品交期: 2-3個工作天內

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全球扇出型晶圓層次電子構裝市場預計在 2024 年達到 5.99 億美元，預計到 2031 年將達到 15.81 億美元，2025 年至 2031 年的複合年成長率為 15.0%。

在扇出型晶圓級封裝（WLP）技術中，晶片在嵌入面板之前會被切割和分離。具體來說，晶片正面朝下貼附在載體上，晶片間距與電路設計的間距規格相符。然後，接收器進行成型以形成面板，接著進行分離、密封面板和密封面板轉移。這種晶圓形式（也稱為重構晶圓）可廣泛應用於標準晶圓工藝，電路設計必須形成在密封面板上。由於密封面板的面積大於晶片，因此可以將I/O觸點放置在扇入晶圓區域，或在塑膠模具上扇出以容納更多I/O觸點。

智慧型手機、平板電腦、穿戴式裝置和物聯網裝置的日益普及，推動了對更小、更輕、更節能的半導體封裝的需求。 FOWLP（面外晶圓級封裝）技術能夠實現纖薄設計和更小的封裝尺寸，使其成為緊湊型電子設備的理想選擇。隨著消費者對高性能、外觀時尚設備的需求不斷成長，製造商正在加速採用FOWLP解決方案。

5G智慧型手機、AR/ VR頭戴裝置和遊戲主機的興起推動了對速度更快、功耗更低、密度更高的半導體封裝的需求。扇出型板載封裝（FOWLP）能夠提高訊號完整性、縮短佈線距離並降低寄生電感，進而提升處理器、記憶體模組和感測器的效能。這一趨勢是推動扇出型封裝在先進行動和運算應用中普及的關鍵因素。

現代電子設備擴大將邏輯、記憶體、射頻組件和感測器等多種功能整合到單一封裝中。 FOWLP 支援異構整合，能夠有效率地封裝多個晶粒和組件。這種能力使製造商能夠生產出具有更佳溫度控管和可靠性的多功能高性能晶片，從而推動市場成長。

汽車產業，尤其是電動車 (EV) 和自動駕駛汽車 (AV)，越來越依賴先進的半導體封裝技術來整合感測器、電源管理、高級駕駛輔助系統 (ADAS) 和資訊娛樂系統。 FOWLP 封裝技術具有高密度整合和更優異的電氣性能，使其非常適合對空間、可靠性和散熱性能要求極高的汽車應用。

全球向 5G 網路和高速無線通訊的轉型正在推動對扇出型低功耗 (FOWLP) 封裝的需求。扇出型封裝能夠有效地路由高頻訊號，減少訊號損耗並提高整體射頻效能，使其成為 5G 收發器、物聯網閘道器和無線模組的理想解決方案。

本報告旨在按地區/國家、類型和應用對全球扇出型晶圓層次電子構裝市場進行全面分析，重點關注總收入、市場佔有率和主要企業的排名。

本報告以銷售收入為指標，對扇出晶圓層次電子構裝）市場規模、估算和預測進行了呈現，以2024年為基準年，並涵蓋了2020年至2031年的歷史數據和預測數據。定量和定性分析將幫助讀者制定業務和成長策略，評估市場競爭，分析自身在當前市場中的地位，並就扇出晶圓層次電子構裝做出明智的商業決策。

市場區隔

公司

  • TSMC
  • ASE Technology Holding Co.
  • JCET Group
  • Amkor Technology
  • Siliconware Technology（SuZhou）Co.
  • Nepes

按類型分類的細分市場

  • 高密度扇出封裝
  • 核心扇出封裝

應用領域

  • CMOS影像感測器
  • 無線連線
  • 邏輯和記憶體積體電路
  • 微機電系統和感測器
  • 類比和混合積體電路
  • 其他

按地區

  • 北美洲
    • 美國
    • 加拿大
  • 亞太地區
    • 中國
    • 日本
    • 韓國
    • 東南亞
    • 印度
    • 澳洲
    • 亞太其他地區
  • 歐洲
    • 德國
    • 法國
    • 英國
    • 義大利
    • 荷蘭
    • 北歐國家
    • 其他歐洲
  • 拉丁美洲
    • 墨西哥
    • 巴西
    • 其他拉丁美洲
  • 中東和非洲
    • 土耳其
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 其他中東和非洲地區

The global market for Fan-Out Wafer Level Packaging was estimated to be worth US$ 599 million in 2024 and is forecast to a readjusted size of US$ 1581 million by 2031 with a CAGR of 15.0% during the forecast period 2025-2031.

The Fan-Out WLP technique involves cutting and separating the chip and then embedding the chip inside the panel. The procedure is to attach the chip face down to the Carrier, and the chip spacing should conform to the Pitch specification of the circuit design, while the receiver performs Molding to form a Panel. Follow-up will be separation, sealant panel and a vehicle for sealant panel Wafer shape, also called reconstruct Wafer (Reconstituted Wafer), can be widely used standard Wafer process, need is formed on the sealant panel circuit design. Since the area of the sealing panel is larger than that of the chip, not only can I/O contacts be made into the wafer area by Fan-In method; It can also be Fanned Out on a plastic mold to accommodate more I/O contacts.

The proliferation of smartphones, tablets, wearables, and IoT devices is driving the need for smaller, lighter, and more power-efficient semiconductor packages. FOWLP offers a thin form factor and reduced package size, making it ideal for compact electronics. As consumer demand for high-performance and aesthetically sleek devices rises, manufacturers are increasingly adopting FOWLP solutions.

The rise of 5G smartphones, AR/VR headsets, and gaming consoles requires high-speed, low-power, and high-density semiconductor packages. FOWLP provides improved signal integrity, shorter interconnects, and lower parasitic inductance, which enhance performance for processors, memory modules, and sensors. This trend is a key driver for the adoption of fan-out packaging in advanced mobile and computing applications.

Modern electronic devices increasingly integrate multiple functions such as logic, memory, RF components, and sensors within a single package. FOWLP supports heterogeneous integration, allowing multiple dies and components to be packaged together efficiently. This capability enables manufacturers to produce multi-functional, high-performance chips with enhanced thermal management and reliability, fueling market growth.

The automotive sector, particularly electric vehicles (EVs) and autonomous vehicles (AVs), is increasingly relying on advanced semiconductor packages for sensors, power management, ADAS (Advanced Driver Assistance Systems), and infotainment systems. FOWLP provides high-density integration and improved electrical performance, making it suitable for automotive applications where space constraints, reliability, and thermal performance are critical.

The global shift toward 5G networks and high-speed wireless communication is boosting demand for FOWLP. Fan-out packaging allows efficient routing of high-frequency signals, reduces signal loss, and enhances overall RF performance, making it an attractive solution for 5G transceivers, IoT gateways, and wireless modules.

This report aims to provide a comprehensive presentation of the global market for Fan-Out Wafer Level Packaging, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Fan-Out Wafer Level Packaging by region & country, by Type, and by Application.

The Fan-Out Wafer Level Packaging market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Fan-Out Wafer Level Packaging.

Market Segmentation

By Company

  • TSMC
  • ASE Technology Holding Co.
  • JCET Group
  • Amkor Technology
  • Siliconware Technology (SuZhou) Co.
  • Nepes

Segment by Type

  • High Density Fan-Out Package
  • Core Fan-Out Package

Segment by Application

  • CMOS Image Sensor
  • A Wireless Connection
  • Logic and Memory Integrated Circuits
  • Mems and Sensors
  • Analog and Hybrid Integrated Circuits
  • Others

By Region

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Southeast Asia
    • India
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Netherlands
    • Nordic Countries
    • Rest of Europe
  • Latin America
    • Mexico
    • Brazil
    • Rest of Latin America
  • Middle East & Africa
    • Turkey
    • Saudi Arabia
    • UAE
    • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Fan-Out Wafer Level Packaging company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Revenue of Fan-Out Wafer Level Packaging in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Revenue of Fan-Out Wafer Level Packaging in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

  • 1.1 Fan-Out Wafer Level Packaging Product Introduction
  • 1.2 Global Fan-Out Wafer Level Packaging Market Size Forecast (2020-2031)
  • 1.3 Fan-Out Wafer Level Packaging Market Trends & Drivers
    • 1.3.1 Fan-Out Wafer Level Packaging Industry Trends
    • 1.3.2 Fan-Out Wafer Level Packaging Market Drivers & Opportunity
    • 1.3.3 Fan-Out Wafer Level Packaging Market Challenges
    • 1.3.4 Fan-Out Wafer Level Packaging Market Restraints
  • 1.4 Assumptions and Limitations
  • 1.5 Study Objectives
  • 1.6 Years Considered

2 Competitive Analysis by Company

  • 2.1 Global Fan-Out Wafer Level Packaging Players Revenue Ranking (2024)
  • 2.2 Global Fan-Out Wafer Level Packaging Revenue by Company (2020-2025)
  • 2.3 Key Companies Fan-Out Wafer Level Packaging Manufacturing Base Distribution and Headquarters
  • 2.4 Key Companies Fan-Out Wafer Level Packaging Product Offered
  • 2.5 Key Companies Time to Begin Mass Production of Fan-Out Wafer Level Packaging
  • 2.6 Fan-Out Wafer Level Packaging Market Competitive Analysis
    • 2.6.1 Fan-Out Wafer Level Packaging Market Concentration Rate (2020-2025)
    • 2.6.2 Global 5 and 10 Largest Companies by Fan-Out Wafer Level Packaging Revenue in 2024
    • 2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Fan-Out Wafer Level Packaging as of 2024)
  • 2.7 Mergers & Acquisitions, Expansion

3 Segmentation by Type

  • 3.1 Introduction by Type
    • 3.1.1 High Density Fan-Out Package
    • 3.1.2 Core Fan-Out Package
  • 3.2 Global Fan-Out Wafer Level Packaging Sales Value by Type
    • 3.2.1 Global Fan-Out Wafer Level Packaging Sales Value by Type (2020 VS 2024 VS 2031)
    • 3.2.2 Global Fan-Out Wafer Level Packaging Sales Value, by Type (2020-2031)
    • 3.2.3 Global Fan-Out Wafer Level Packaging Sales Value, by Type (%) (2020-2031)

4 Segmentation by Application

  • 4.1 Introduction by Application
    • 4.1.1 CMOS Image Sensor
    • 4.1.2 A Wireless Connection
    • 4.1.3 Logic and Memory Integrated Circuits
    • 4.1.4 Mems and Sensors
    • 4.1.5 Analog and Hybrid Integrated Circuits
    • 4.1.6 Others
  • 4.2 Global Fan-Out Wafer Level Packaging Sales Value by Application
    • 4.2.1 Global Fan-Out Wafer Level Packaging Sales Value by Application (2020 VS 2024 VS 2031)
    • 4.2.2 Global Fan-Out Wafer Level Packaging Sales Value, by Application (2020-2031)
    • 4.2.3 Global Fan-Out Wafer Level Packaging Sales Value, by Application (%) (2020-2031)

5 Segmentation by Region

  • 5.1 Global Fan-Out Wafer Level Packaging Sales Value by Region
    • 5.1.1 Global Fan-Out Wafer Level Packaging Sales Value by Region: 2020 VS 2024 VS 2031
    • 5.1.2 Global Fan-Out Wafer Level Packaging Sales Value by Region (2020-2025)
    • 5.1.3 Global Fan-Out Wafer Level Packaging Sales Value by Region (2026-2031)
    • 5.1.4 Global Fan-Out Wafer Level Packaging Sales Value by Region (%), (2020-2031)
  • 5.2 North America
    • 5.2.1 North America Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 5.2.2 North America Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031
  • 5.3 Europe
    • 5.3.1 Europe Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 5.3.2 Europe Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031
  • 5.4 Asia Pacific
    • 5.4.1 Asia Pacific Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 5.4.2 Asia Pacific Fan-Out Wafer Level Packaging Sales Value by Region (%), 2024 VS 2031
  • 5.5 South America
    • 5.5.1 South America Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 5.5.2 South America Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031
  • 5.6 Middle East & Africa
    • 5.6.1 Middle East & Africa Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 5.6.2 Middle East & Africa Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

  • 6.1 Key Countries/Regions Fan-Out Wafer Level Packaging Sales Value Growth Trends, 2020 VS 2024 VS 2031
  • 6.2 Key Countries/Regions Fan-Out Wafer Level Packaging Sales Value, 2020-2031
  • 6.3 United States
    • 6.3.1 United States Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 6.3.2 United States Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
    • 6.3.3 United States Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031
  • 6.4 Europe
    • 6.4.1 Europe Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 6.4.2 Europe Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
    • 6.4.3 Europe Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031
  • 6.5 China
    • 6.5.1 China Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 6.5.2 China Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
    • 6.5.3 China Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031
  • 6.6 Japan
    • 6.6.1 Japan Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 6.6.2 Japan Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
    • 6.6.3 Japan Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031
  • 6.7 South Korea
    • 6.7.1 South Korea Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 6.7.2 South Korea Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
    • 6.7.3 South Korea Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031
  • 6.8 Southeast Asia
    • 6.8.1 Southeast Asia Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 6.8.2 Southeast Asia Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
    • 6.8.3 Southeast Asia Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031
  • 6.9 India
    • 6.9.1 India Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 6.9.2 India Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
    • 6.9.3 India Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031

7 Company Profiles

  • 7.1 TSMC
    • 7.1.1 TSMC Profile
    • 7.1.2 TSMC Main Business
    • 7.1.3 TSMC Fan-Out Wafer Level Packaging Products, Services and Solutions
    • 7.1.4 TSMC Fan-Out Wafer Level Packaging Revenue (US$ Million) & (2020-2025)
    • 7.1.5 TSMC Recent Developments
  • 7.2 ASE Technology Holding Co.
    • 7.2.1 ASE Technology Holding Co. Profile
    • 7.2.2 ASE Technology Holding Co. Main Business
    • 7.2.3 ASE Technology Holding Co. Fan-Out Wafer Level Packaging Products, Services and Solutions
    • 7.2.4 ASE Technology Holding Co. Fan-Out Wafer Level Packaging Revenue (US$ Million) & (2020-2025)
    • 7.2.5 ASE Technology Holding Co. Recent Developments
  • 7.3 JCET Group
    • 7.3.1 JCET Group Profile
    • 7.3.2 JCET Group Main Business
    • 7.3.3 JCET Group Fan-Out Wafer Level Packaging Products, Services and Solutions
    • 7.3.4 JCET Group Fan-Out Wafer Level Packaging Revenue (US$ Million) & (2020-2025)
    • 7.3.5 JCET Group Recent Developments
  • 7.4 Amkor Technology
    • 7.4.1 Amkor Technology Profile
    • 7.4.2 Amkor Technology Main Business
    • 7.4.3 Amkor Technology Fan-Out Wafer Level Packaging Products, Services and Solutions
    • 7.4.4 Amkor Technology Fan-Out Wafer Level Packaging Revenue (US$ Million) & (2020-2025)
    • 7.4.5 Amkor Technology Recent Developments
  • 7.5 Siliconware Technology (SuZhou) Co.
    • 7.5.1 Siliconware Technology (SuZhou) Co. Profile
    • 7.5.2 Siliconware Technology (SuZhou) Co. Main Business
    • 7.5.3 Siliconware Technology (SuZhou) Co. Fan-Out Wafer Level Packaging Products, Services and Solutions
    • 7.5.4 Siliconware Technology (SuZhou) Co. Fan-Out Wafer Level Packaging Revenue (US$ Million) & (2020-2025)
    • 7.5.5 Siliconware Technology (SuZhou) Co. Recent Developments
  • 7.6 Nepes
    • 7.6.1 Nepes Profile
    • 7.6.2 Nepes Main Business
    • 7.6.3 Nepes Fan-Out Wafer Level Packaging Products, Services and Solutions
    • 7.6.4 Nepes Fan-Out Wafer Level Packaging Revenue (US$ Million) & (2020-2025)
    • 7.6.5 Nepes Recent Developments

8 Industry Chain Analysis

  • 8.1 Fan-Out Wafer Level Packaging Industrial Chain
  • 8.2 Fan-Out Wafer Level Packaging Upstream Analysis
    • 8.2.1 Key Raw Materials
    • 8.2.2 Raw Materials Key Suppliers
    • 8.2.3 Manufacturing Cost Structure
  • 8.3 Midstream Analysis
  • 8.4 Downstream Analysis (Customers Analysis)
  • 8.5 Sales Model and Sales Channels
    • 8.5.1 Fan-Out Wafer Level Packaging Sales Model
    • 8.5.2 Sales Channel
    • 8.5.3 Fan-Out Wafer Level Packaging Distributors

9 Research Findings and Conclusion

10 Appendix

  • 10.1 Research Methodology
    • 10.1.1 Methodology/Research Approach
      • 10.1.1.1 Research Programs/Design
      • 10.1.1.2 Market Size Estimation
      • 10.1.1.3 Market Breakdown and Data Triangulation
    • 10.1.2 Data Source
      • 10.1.2.1 Secondary Sources
      • 10.1.2.2 Primary Sources
  • 10.2 Author Details
  • 10.3 Disclaimer

List of Tables

  • Table 1. Fan-Out Wafer Level Packaging Market Trends
  • Table 2. Fan-Out Wafer Level Packaging Market Drivers & Opportunity
  • Table 3. Fan-Out Wafer Level Packaging Market Challenges
  • Table 4. Fan-Out Wafer Level Packaging Market Restraints
  • Table 5. Global Fan-Out Wafer Level Packaging Revenue by Company (2020-2025) & (US$ Million)
  • Table 6. Global Fan-Out Wafer Level Packaging Revenue Market Share by Company (2020-2025)
  • Table 7. Key Companies Fan-Out Wafer Level Packaging Manufacturing Base Distribution and Headquarters
  • Table 8. Key Companies Fan-Out Wafer Level Packaging Product Type
  • Table 9. Key Companies Time to Begin Mass Production of Fan-Out Wafer Level Packaging
  • Table 10. Global Fan-Out Wafer Level Packaging Companies Market Concentration Ratio (CR5 and HHI)
  • Table 11. Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Fan-Out Wafer Level Packaging as of 2024)
  • Table 12. Mergers & Acquisitions, Expansion Plans
  • Table 13. Global Fan-Out Wafer Level Packaging Sales Value by Type: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 14. Global Fan-Out Wafer Level Packaging Sales Value by Type (2020-2025) & (US$ Million)
  • Table 15. Global Fan-Out Wafer Level Packaging Sales Value by Type (2026-2031) & (US$ Million)
  • Table 16. Global Fan-Out Wafer Level Packaging Sales Market Share in Value by Type (2020-2025)
  • Table 17. Global Fan-Out Wafer Level Packaging Sales Market Share in Value by Type (2026-2031)
  • Table 18. Global Fan-Out Wafer Level Packaging Sales Value by Application: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 19. Global Fan-Out Wafer Level Packaging Sales Value by Application (2020-2025) & (US$ Million)
  • Table 20. Global Fan-Out Wafer Level Packaging Sales Value by Application (2026-2031) & (US$ Million)
  • Table 21. Global Fan-Out Wafer Level Packaging Sales Market Share in Value by Application (2020-2025)
  • Table 22. Global Fan-Out Wafer Level Packaging Sales Market Share in Value by Application (2026-2031)
  • Table 23. Global Fan-Out Wafer Level Packaging Sales Value by Region, (2020 VS 2024 VS 2031) & (US$ Million)
  • Table 24. Global Fan-Out Wafer Level Packaging Sales Value by Region (2020-2025) & (US$ Million)
  • Table 25. Global Fan-Out Wafer Level Packaging Sales Value by Region (2026-2031) & (US$ Million)
  • Table 26. Global Fan-Out Wafer Level Packaging Sales Value by Region (2020-2025) & (%)
  • Table 27. Global Fan-Out Wafer Level Packaging Sales Value by Region (2026-2031) & (%)
  • Table 28. Key Countries/Regions Fan-Out Wafer Level Packaging Sales Value Growth Trends, (US$ Million): 2020 VS 2024 VS 2031
  • Table 29. Key Countries/Regions Fan-Out Wafer Level Packaging Sales Value, (2020-2025) & (US$ Million)
  • Table 30. Key Countries/Regions Fan-Out Wafer Level Packaging Sales Value, (2026-2031) & (US$ Million)
  • Table 31. TSMC Basic Information List
  • Table 32. TSMC Description and Business Overview
  • Table 33. TSMC Fan-Out Wafer Level Packaging Products, Services and Solutions
  • Table 34. Revenue (US$ Million) in Fan-Out Wafer Level Packaging Business of TSMC (2020-2025)
  • Table 35. TSMC Recent Developments
  • Table 36. ASE Technology Holding Co. Basic Information List
  • Table 37. ASE Technology Holding Co. Description and Business Overview
  • Table 38. ASE Technology Holding Co. Fan-Out Wafer Level Packaging Products, Services and Solutions
  • Table 39. Revenue (US$ Million) in Fan-Out Wafer Level Packaging Business of ASE Technology Holding Co. (2020-2025)
  • Table 40. ASE Technology Holding Co. Recent Developments
  • Table 41. JCET Group Basic Information List
  • Table 42. JCET Group Description and Business Overview
  • Table 43. JCET Group Fan-Out Wafer Level Packaging Products, Services and Solutions
  • Table 44. Revenue (US$ Million) in Fan-Out Wafer Level Packaging Business of JCET Group (2020-2025)
  • Table 45. JCET Group Recent Developments
  • Table 46. Amkor Technology Basic Information List
  • Table 47. Amkor Technology Description and Business Overview
  • Table 48. Amkor Technology Fan-Out Wafer Level Packaging Products, Services and Solutions
  • Table 49. Revenue (US$ Million) in Fan-Out Wafer Level Packaging Business of Amkor Technology (2020-2025)
  • Table 50. Amkor Technology Recent Developments
  • Table 51. Siliconware Technology (SuZhou) Co. Basic Information List
  • Table 52. Siliconware Technology (SuZhou) Co. Description and Business Overview
  • Table 53. Siliconware Technology (SuZhou) Co. Fan-Out Wafer Level Packaging Products, Services and Solutions
  • Table 54. Revenue (US$ Million) in Fan-Out Wafer Level Packaging Business of Siliconware Technology (SuZhou) Co. (2020-2025)
  • Table 55. Siliconware Technology (SuZhou) Co. Recent Developments
  • Table 56. Nepes Basic Information List
  • Table 57. Nepes Description and Business Overview
  • Table 58. Nepes Fan-Out Wafer Level Packaging Products, Services and Solutions
  • Table 59. Revenue (US$ Million) in Fan-Out Wafer Level Packaging Business of Nepes (2020-2025)
  • Table 60. Nepes Recent Developments
  • Table 61. Key Raw Materials Lists
  • Table 62. Raw Materials Key Suppliers Lists
  • Table 63. Fan-Out Wafer Level Packaging Downstream Customers
  • Table 64. Fan-Out Wafer Level Packaging Distributors List
  • Table 65. Research Programs/Design for This Report
  • Table 66. Key Data Information from Secondary Sources
  • Table 67. Key Data Information from Primary Sources

List of Figures

  • Figure 1. Fan-Out Wafer Level Packaging Product Picture
  • Figure 2. Global Fan-Out Wafer Level Packaging Sales Value, 2020 VS 2024 VS 2031 (US$ Million)
  • Figure 3. Global Fan-Out Wafer Level Packaging Sales Value (2020-2031) & (US$ Million)
  • Figure 4. Fan-Out Wafer Level Packaging Report Years Considered
  • Figure 5. Global Fan-Out Wafer Level Packaging Players Revenue Ranking (2024) & (US$ Million)
  • Figure 6. The 5 and 10 Largest Companies in the World: Market Share by Fan-Out Wafer Level Packaging Revenue in 2024
  • Figure 7. Fan-Out Wafer Level Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
  • Figure 8. High Density Fan-Out Package Picture
  • Figure 9. Core Fan-Out Package Picture
  • Figure 10. Global Fan-Out Wafer Level Packaging Sales Value by Type (2020 VS 2024 VS 2031) & (US$ Million)
  • Figure 11. Global Fan-Out Wafer Level Packaging Sales Value Market Share by Type, 2024 & 2031
  • Figure 12. Product Picture of CMOS Image Sensor
  • Figure 13. Product Picture of A Wireless Connection
  • Figure 14. Product Picture of Logic and Memory Integrated Circuits
  • Figure 15. Product Picture of Mems and Sensors
  • Figure 16. Product Picture of Analog and Hybrid Integrated Circuits
  • Figure 17. Product Picture of Others
  • Figure 18. Global Fan-Out Wafer Level Packaging Sales Value by Application (2020 VS 2024 VS 2031) & (US$ Million)
  • Figure 19. Global Fan-Out Wafer Level Packaging Sales Value Market Share by Application, 2024 & 2031
  • Figure 20. North America Fan-Out Wafer Level Packaging Sales Value (2020-2031) & (US$ Million)
  • Figure 21. North America Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031
  • Figure 22. Europe Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 23. Europe Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031
  • Figure 24. Asia Pacific Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 25. Asia Pacific Fan-Out Wafer Level Packaging Sales Value by Region (%), 2024 VS 2031
  • Figure 26. South America Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 27. South America Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031
  • Figure 28. Middle East & Africa Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 29. Middle East & Africa Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031
  • Figure 30. Key Countries/Regions Fan-Out Wafer Level Packaging Sales Value (%), (2020-2031)
  • Figure 31. United States Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 32. United States Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
  • Figure 33. United States Fan-Out Wafer Level Packaging Sales Value by Application (%), 2024 VS 2031
  • Figure 34. Europe Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 35. Europe Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
  • Figure 36. Europe Fan-Out Wafer Level Packaging Sales Value by Application (%), 2024 VS 2031
  • Figure 37. China Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 38. China Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
  • Figure 39. China Fan-Out Wafer Level Packaging Sales Value by Application (%), 2024 VS 2031
  • Figure 40. Japan Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 41. Japan Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
  • Figure 42. Japan Fan-Out Wafer Level Packaging Sales Value by Application (%), 2024 VS 2031
  • Figure 43. South Korea Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 44. South Korea Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
  • Figure 45. South Korea Fan-Out Wafer Level Packaging Sales Value by Application (%), 2024 VS 2031
  • Figure 46. Southeast Asia Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 47. Southeast Asia Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
  • Figure 48. Southeast Asia Fan-Out Wafer Level Packaging Sales Value by Application (%), 2024 VS 2031
  • Figure 49. India Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 50. India Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
  • Figure 51. India Fan-Out Wafer Level Packaging Sales Value by Application (%), 2024 VS 2031
  • Figure 52. Fan-Out Wafer Level Packaging Industrial Chain
  • Figure 53. Fan-Out Wafer Level Packaging Manufacturing Cost Structure
  • Figure 54. Channels of Distribution (Direct Sales, and Distribution)
  • Figure 55. Bottom-up and Top-down Approaches for This Report
  • Figure 56. Data Triangulation
  • Figure 57. Key Executives Interviewed