先進IC封裝市場：按類型、應用分類 - 2024-2030 年全球預測

預計2023年先進IC封裝市場規模為450.2億美元，2024年預計將達485.1億美元，2030年將達785億美元，複合年成長率為8.26%。

全球先進IC封裝市場

FPNV定位矩陣

FPNV定位矩陣對於評估先進IC封裝市場至關重要。我們檢視與業務策略和產品滿意度相關的關鍵指標，以對供應商進行全面評估。這種深入的分析使用戶能夠根據自己的要求做出明智的決策。根據評估，供應商被分為四個成功程度不同的像限：前沿（F）、探路者（P）、利基（N）和重要（V）。

市場佔有率分析

市場佔有率分析是一種綜合工具，可以對先進IC封裝市場中供應商的現狀進行深入而深入的研究。全面比較和分析供應商在整體收益、基本客群和其他關鍵指標方面的貢獻，以便更好地了解公司的績效及其在爭奪市場佔有率時面臨的挑戰。此外，該分析還提供了對該行業競爭特徵的寶貴見解，包括在研究基準年觀察到的累積、分散主導地位和合併特徵等因素。這種詳細程度的提高使供應商能夠做出更明智的決策並制定有效的策略，從而在市場上獲得競爭優勢。

該報告對以下幾個方面提供了寶貴的見解：

1-市場滲透率：提供有關主要企業所服務的市場的全面資訊。

2-市場開拓：我們深入研究利潤豐厚的新興市場，並分析它們在成熟細分市場中的滲透率。

3- 市場多元化：提供有關新產品發布、開拓地區、最新發展和投資的詳細資訊。

4-競爭力評估與資訊：對主要企業的市場佔有率、策略、產品、認證、監管狀況、專利狀況、製造能力等進行全面評估。

5- 產品開發與創新：提供對未來技術、研發活動和突破性產品開發的見解。

本報告解決了以下關鍵問題：

1-先進IC封裝市場的市場規模與預測是多少？

2-先進IC封裝市場預測期間需要考慮投資的產品、細分市場、應用和領域有哪些？

3-先進IC封裝市場的技術趨勢和法律規範是什麼？

4-先進IC封裝市場主要廠商的市場佔有率是多少？

5-進入先進IC封裝市場的適當型態或策略手段是什麼？

目錄

第1章 前言

第2章調查方法

第3章執行摘要

第4章市場概況

第5章市場洞察

• 市場動態
  • 促進因素
    • 消費性電子產品的需求和採用增加
    • 國防領域對小型電子產品的需求不斷增加
    • 整個經濟領域正在推動交通運輸業的電氣化
  • 抑制因素
    • 先進IC封裝製程成本高
  • 機會
    • 新型先進IC封裝解決方案的演變與開發
    • 半導體製造業投資增加
  • 任務
    • 與先進IC封裝相關的可靠性、功耗和用電挑戰
• 市場區隔分析
• 市場趨勢分析
• 高通膨的累積效應
• 波特五力分析
• 價值鍊和關鍵路徑分析
• 法律規範

第6章先進IC封裝市場：依類型

• 2.5D積體電路
• 2D積體電路
• 3D積體電路
• 扇出矽封裝
• 扇出晶圓級封裝
• 覆晶
• 晶圓級晶片尺寸封裝

第7章先進IC封裝市場：依應用分類

• 航太和國防
• 汽車和交通
• 家用電器
• 資訊科技與電信

第8章美洲先進IC封裝市場

• 阿根廷
• 巴西
• 加拿大
• 墨西哥
• 美國

第9章亞太地區先進IC封裝市場

• 澳洲
• 中國
• 印度
• 印尼
• 日本
• 馬來西亞
• 菲律賓
• 新加坡
• 韓國
• 台灣
• 泰國
• 越南

第10章 歐洲、中東和非洲先進IC封裝市場

• 丹麥
• 埃及
• 芬蘭
• 法國
• 德國
• 以色列
• 義大利
• 荷蘭
• 奈及利亞
• 挪威
• 波蘭
• 卡達
• 俄羅斯
• 沙烏地阿拉伯
• 南非
• 西班牙
• 瑞典
• 瑞士
• 土耳其
• 阿拉伯聯合大公國
• 英國

第11章競爭形勢

• FPNV定位矩陣
• 市場佔有率分析：主要企業
• 主要企業競爭情境分析

第12章競爭產品組合

• 主要公司簡介
  • Amkor Technology, Inc.
  • ASE Technology Holding Co, Ltd.
  • ASMPT
  • Broadcom, Inc.
  • Cadence Design Systems, Inc.
  • Carsem（M）Sdn Bhd
  • Faraday Technology Corporation
  • FormFactor, Inc.
  • Intel Corporation
  • Jiangsu Changdian Technology Co., Ltd.
  • KYOCERA Corporation
  • Microchip Technology Inc.
  • Micross Components, Inc.
  • NHanced Semiconductors, Inc.
  • NXP Semiconductors NV
  • Optima Technology Associates, Inc.
  • Pac Tech-Packaging Technologies GmbH
  • Powertech Technology Inc.
  • Renesas Electronics Corporation
  • Samsung Electronics Co., Ltd.
  • Taiwan Semiconductor Manufacturing Company, Ltd.
  • Tektronix, Inc.
  • Texas Instruments Incorporated
  • United Microelectronics Corporation
• 主要產品系列

第13章附錄

• 討論指南
• 關於許可證和定價

[197 Pages Report] The Advanced IC Packaging Market size was estimated at USD 45.02 billion in 2023 and expected to reach USD 48.51 billion in 2024, at a CAGR 8.26% to reach USD 78.50 billion by 2030.

Global Advanced IC Packaging Market

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the Advanced IC Packaging Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Advanced IC Packaging Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the Advanced IC Packaging Market, highlighting leading vendors and their innovative profiles. These include Amkor Technology, Inc., ASE Technology Holding Co, Ltd., ASMPT, Broadcom, Inc., Cadence Design Systems, Inc., Carsem (M) Sdn Bhd, Faraday Technology Corporation, FormFactor, Inc., Intel Corporation, Jiangsu Changdian Technology Co., Ltd., KYOCERA Corporation, Microchip Technology Inc., Micross Components, Inc., NHanced Semiconductors, Inc., NXP Semiconductors N.V., Optima Technology Associates, Inc., Pac Tech - Packaging Technologies GmbH, Powertech Technology Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company, Ltd., Tektronix, Inc., Texas Instruments Incorporated, and United Microelectronics Corporation.

Market Segmentation & Coverage

This research report categorizes the Advanced IC Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:

• Type
  • 2.5D Integrated Circuit
  • 2D Integrated Circuit
  • 3D Integrated Circuit
  • Fan Out Silicon In Package
  • Fan Out Wafer Level Package
  • Flip Chip
  • Wafer Level Chip Scale Package
• Application
  • Aerospace & Defense
  • Automotive & Transportation
  • Consumer Electronics
  • IT & Telecom
• Region
  • Americas
    • Argentina
    • Brazil
    • Canada
    • Mexico
    • United States
      • California
      • Florida
      • Illinois
      • New York
      • Ohio
      • Pennsylvania
      • Texas
  • Asia-Pacific
    • Australia
    • China
    • India
    • Indonesia
    • Japan
    • Malaysia
    • Philippines
    • Singapore
    • South Korea
    • Taiwan
    • Thailand
    • Vietnam
  • Europe, Middle East & Africa
    • Denmark
    • Egypt
    • Finland
    • France
    • Germany
    • Israel
    • Italy
    • Netherlands
    • Nigeria
    • Norway
    • Poland
    • Qatar
    • Russia
    • Saudi Arabia
    • South Africa
    • Spain
    • Sweden
    • Switzerland
    • Turkey
    • United Arab Emirates
    • United Kingdom

The report offers valuable insights on the following aspects:

1. Market Penetration: It presents comprehensive information on the market provided by key players.

2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.

3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.

4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.

5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

1. What is the market size and forecast of the Advanced IC Packaging Market?

2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Advanced IC Packaging Market?

3. What are the technology trends and regulatory frameworks in the Advanced IC Packaging Market?

4. What is the market share of the leading vendors in the Advanced IC Packaging Market?

5. Which modes and strategic moves are suitable for entering the Advanced IC Packaging Market?

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Limitations
• 1.7. Assumptions
• 1.8. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

• 4.1. Introduction
• 4.2. Advanced IC Packaging Market, by Region

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Increasing demand and adoption of consumer electronic devices
    • 5.1.1.2. Gowing demand for miniaturized electronic products from defense sector
    • 5.1.1.3. Ongoing electrification of transportation sector across economies
  • 5.1.2. Restraints
    • 5.1.2.1. High cost of advanced IC packaging processes
  • 5.1.3. Opportunities
    • 5.1.3.1. Evolution and development of new advanced IC packaging solutions
    • 5.1.3.2. Rising investment in semiconductor manufacturing industry
  • 5.1.4. Challenges
    • 5.1.4.1. Reliablity, power dissipation and power usage challenges associated with advanced IC packaging
• 5.2. Market Segmentation Analysis
• 5.3. Market Trend Analysis
• 5.4. Cumulative Impact of High Inflation
• 5.5. Porter's Five Forces Analysis
  • 5.5.1. Threat of New Entrants
  • 5.5.2. Threat of Substitutes
  • 5.5.3. Bargaining Power of Customers
  • 5.5.4. Bargaining Power of Suppliers
  • 5.5.5. Industry Rivalry
• 5.6. Value Chain & Critical Path Analysis
• 5.7. Regulatory Framework

6. Advanced IC Packaging Market, by Type

• 6.1. Introduction
• 6.2. 2.5D Integrated Circuit
• 6.3. 2D Integrated Circuit
• 6.4. 3D Integrated Circuit
• 6.5. Fan Out Silicon In Package
• 6.6. Fan Out Wafer Level Package
• 6.7. Flip Chip
• 6.8. Wafer Level Chip Scale Package

7. Advanced IC Packaging Market, by Application

• 7.1. Introduction
• 7.2. Aerospace & Defense
• 7.3. Automotive & Transportation
• 7.4. Consumer Electronics
• 7.5. IT & Telecom

8. Americas Advanced IC Packaging Market

• 8.1. Introduction
• 8.2. Argentina
• 8.3. Brazil
• 8.4. Canada
• 8.5. Mexico
• 8.6. United States

9. Asia-Pacific Advanced IC Packaging Market

• 9.1. Introduction
• 9.2. Australia
• 9.3. China
• 9.4. India
• 9.5. Indonesia
• 9.6. Japan
• 9.7. Malaysia
• 9.8. Philippines
• 9.9. Singapore
• 9.10. South Korea
• 9.11. Taiwan
• 9.12. Thailand
• 9.13. Vietnam

10. Europe, Middle East & Africa Advanced IC Packaging Market

• 10.1. Introduction
• 10.2. Denmark
• 10.3. Egypt
• 10.4. Finland
• 10.5. France
• 10.6. Germany
• 10.7. Israel
• 10.8. Italy
• 10.9. Netherlands
• 10.10. Nigeria
• 10.11. Norway
• 10.12. Poland
• 10.13. Qatar
• 10.14. Russia
• 10.15. Saudi Arabia
• 10.16. South Africa
• 10.17. Spain
• 10.18. Sweden
• 10.19. Switzerland
• 10.20. Turkey
• 10.21. United Arab Emirates
• 10.22. United Kingdom

11. Competitive Landscape

• 11.1. FPNV Positioning Matrix
• 11.2. Market Share Analysis, By Key Player
• 11.3. Competitive Scenario Analysis, By Key Player

12. Competitive Portfolio

• 12.1. Key Company Profiles
  • 12.1.1. Amkor Technology, Inc.
  • 12.1.2. ASE Technology Holding Co, Ltd.
  • 12.1.3. ASMPT
  • 12.1.4. Broadcom, Inc.
  • 12.1.5. Cadence Design Systems, Inc.
  • 12.1.6. Carsem (M) Sdn Bhd
  • 12.1.7. Faraday Technology Corporation
  • 12.1.8. FormFactor, Inc.
  • 12.1.9. Intel Corporation
  • 12.1.10. Jiangsu Changdian Technology Co., Ltd.
  • 12.1.11. KYOCERA Corporation
  • 12.1.12. Microchip Technology Inc.
  • 12.1.13. Micross Components, Inc.
  • 12.1.14. NHanced Semiconductors, Inc.
  • 12.1.15. NXP Semiconductors N.V.
  • 12.1.16. Optima Technology Associates, Inc.
  • 12.1.17. Pac Tech - Packaging Technologies GmbH
  • 12.1.18. Powertech Technology Inc.
  • 12.1.19. Renesas Electronics Corporation
  • 12.1.20. Samsung Electronics Co., Ltd.
  • 12.1.21. Taiwan Semiconductor Manufacturing Company, Ltd.
  • 12.1.22. Tektronix, Inc.
  • 12.1.23. Texas Instruments Incorporated
  • 12.1.24. United Microelectronics Corporation
• 12.2. Key Product Portfolio

13. Appendix

• 13.1. Discussion Guide
• 13.2. License & Pricing

LIST OF FIGURES

• FIGURE 1. ADVANCED IC PACKAGING MARKET RESEARCH PROCESS
• FIGURE 2. ADVANCED IC PACKAGING MARKET SIZE, 2023 VS 2030
• FIGURE 3. ADVANCED IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
• FIGURE 4. ADVANCED IC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2030 (%)
• FIGURE 5. ADVANCED IC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 6. ADVANCED IC PACKAGING MARKET DYNAMICS
• FIGURE 7. ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2023 VS 2030 (%)
• FIGURE 8. ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 9. ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
• FIGURE 10. ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 11. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 12. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 13. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2030 (%)
• FIGURE 14. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 15. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 16. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 17. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 18. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 19. ADVANCED IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023
• FIGURE 20. ADVANCED IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023

LIST OF TABLES

• TABLE 1. ADVANCED IC PACKAGING MARKET SEGMENTATION & COVERAGE
• TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
• TABLE 3. ADVANCED IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
• TABLE 4. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 5. ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 6. ADVANCED IC PACKAGING MARKET SIZE, BY 2.5D INTEGRATED CIRCUIT, BY REGION, 2018-2030 (USD MILLION)
• TABLE 7. ADVANCED IC PACKAGING MARKET SIZE, BY 2D INTEGRATED CIRCUIT, BY REGION, 2018-2030 (USD MILLION)
• TABLE 8. ADVANCED IC PACKAGING MARKET SIZE, BY 3D INTEGRATED CIRCUIT, BY REGION, 2018-2030 (USD MILLION)
• TABLE 9. ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT SILICON IN PACKAGE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 10. ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT WAFER LEVEL PACKAGE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 11. ADVANCED IC PACKAGING MARKET SIZE, BY FLIP CHIP, BY REGION, 2018-2030 (USD MILLION)
• TABLE 12. ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL CHIP SCALE PACKAGE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 13. ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 14. ADVANCED IC PACKAGING MARKET SIZE, BY AEROSPACE & DEFENSE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 15. ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE & TRANSPORTATION, BY REGION, 2018-2030 (USD MILLION)
• TABLE 16. ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 17. ADVANCED IC PACKAGING MARKET SIZE, BY IT & TELECOM, BY REGION, 2018-2030 (USD MILLION)
• TABLE 18. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 19. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 20. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 21. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 22. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 23. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 24. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 25. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 26. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 27. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 28. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 29. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 30. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 31. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
• TABLE 32. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 33. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 34. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 35. AUSTRALIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 36. AUSTRALIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 37. CHINA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 38. CHINA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 39. INDIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 40. INDIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 41. INDONESIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 42. INDONESIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 43. JAPAN ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 44. JAPAN ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 45. MALAYSIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 46. MALAYSIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 47. PHILIPPINES ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 48. PHILIPPINES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 49. SINGAPORE ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 50. SINGAPORE ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 51. SOUTH KOREA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 52. SOUTH KOREA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 53. TAIWAN ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 54. TAIWAN ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 55. THAILAND ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 56. THAILAND ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 57. VIETNAM ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 58. VIETNAM ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 59. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 60. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 61. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 62. DENMARK ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 63. DENMARK ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 64. EGYPT ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 65. EGYPT ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 66. FINLAND ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 67. FINLAND ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 68. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 69. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 70. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 71. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 72. ISRAEL ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 73. ISRAEL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 74. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 75. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 76. NETHERLANDS ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 77. NETHERLANDS ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 78. NIGERIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 79. NIGERIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 80. NORWAY ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 81. NORWAY ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 82. POLAND ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 83. POLAND ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 84. QATAR ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 85. QATAR ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 86. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 87. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 88. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 89. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 90. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 91. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 92. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 93. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 94. SWEDEN ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 95. SWEDEN ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 96. SWITZERLAND ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 97. SWITZERLAND ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 98. TURKEY ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 99. TURKEY ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 100. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 101. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 102. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 103. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 104. ADVANCED IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023
• TABLE 105. ADVANCED IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
• TABLE 106. ADVANCED IC PACKAGING MARKET LICENSE & PRICING