2026-2030 年全球 BLE 模組市場

全球 BLE 模組市場預計在 2025 年至 2030 年間成長至 565.644 億美元，預測期內複合年成長率為 18.6%。

本報告對全球 BLE 模組市場進行了全面分析，包括市場規模和預測、趨勢、成長要素、挑戰以及涵蓋約 25 家供應商的供應商分析。

本報告對當前市場狀況、最新趨勢和促進因素以及整體市場環境進行了最新分析。推動此市場發展的因素包括：物聯網生態系統在各行業的加速融合、對節能型電池供電通訊解決方案日益成長的需求，以及核心規範標準的持續技術進步。

本研究客觀地結合了一手和二手訊息，包括主要行業相關人員的意見。報告內容涵蓋主要公司分析、全面的市場規模數據、按區域分類的細分市場分析以及供應商格局。報告包含歷史數據和預測數據。

本研究指出，人工智慧和機器學習在邊緣端的整合將是未來幾年全球藍牙低功耗（BLE）模組市場成長的主要驅動力之一。此外，小型化、系統級封裝（SiP）技術的進步、網狀網路的擴展以及先進互通性協定的普及，預計也將顯著提升市場需求。

目錄

第1章：執行摘要

第2章 Technavio 分析

• 分析定價、生命週期、顧客購買籃子、採用率和購買標準。
• 輸入的重要性及差異化因素
• 干擾因素
• 促進因素和挑戰的影響

第3章 市場狀況

• 市場生態系統
• 市場特徵
• 價值鏈分析

第4章 市場規模

• 市場的定義
• 市場區隔分析
• 2025年市場規模
• 市場展望，2025-2030年

第5章 市場規模與表現

• 2020-2024年全球BLE模組市場
• 基於應用領域的細分市場分析，2020-2024 年
• 按類型分類的細分市場分析，2020-2024 年
• 基於設備的細分市場分析，2020-2024 年
• 區域區隔市場分析，2020-2024 年
• 2020-2024年各國細分市場分析

第6章 定性分析

• 人工智慧的影響：全球藍牙低功耗模組市場
• 地緣政治衝突的影響：全球藍牙低功耗模組市場

第7章：五力分析

第8章 市場區隔：按應用

• 比較：按應用
• 工業自動化
• 汽車追蹤系統
• 資產追蹤和近距離行銷
• 家用電子產品
• 其他
• 市場機會：依應用領域分類

第9章 市場細分：依類型

• 比較：按類型
• 單模
• 雙模
• 其他
• 市場機會：按類型分類

第10章 市場區隔：依設備

• 比較：按設備
• 計算設備
• 智慧型穿戴裝置
• 智慧家庭設備
• 其他
• 市場機會：依設備分類

第11章 客戶情況

第12章 區域情勢

• 區域分類
• 區域比較
• 亞太地區
  • 中國
  • 日本
  • 韓國
  • 印度
  • 印尼
  • 澳洲
• 北美洲
  • 美國
  • 加拿大
  • 墨西哥
• 歐洲
  • 德國
  • 英國
  • 法國
  • 義大利
  • 荷蘭
  • 西班牙
• 中東和非洲
  • 沙烏地阿拉伯
  • UAE
  • 南非
  • 以色列
  • 土耳其
• 南美洲
  • 巴西
  • 阿根廷
  • 智利
• 市場機會：按地區分類

第13章 促進因素、挑戰與機遇

• 市場促進因素
• 市場挑戰
• 促進因素和挑戰的影響
• 市場機遇

第14章 競爭格局

• 概述
• 競爭格局
• 中斷狀況
• 產業風險

第15章 競爭分析

• 公司簡介
• 公司排名指標
• 企業市場定位
• Alps Alpine Co. Ltd.
• Espressif Systems Shanghai
• Ezurio
• Infineon Technologies AG
• Microchip Technology Inc.
• Murata Manufacturing Co. Ltd.
• NXP Semiconductors NV
• Panasonic Holdings Corp.
• Renesas Electronics Corp.
• Silicon Laboratories Inc.
• STMicroelectronics NV
• TAIYO YUDEN Co. Ltd.
• Telit Cinterion
• Texas Instruments Inc.
• u blox AG

第16章附錄

The global BLE module market is forecasted to grow by USD 56564.4 mn during 2025-2030, accelerating at a CAGR of 18.6% during the forecast period. The report on the global BLE module market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by escalating integration of iot ecosystems across diverse industries, rising demand for energy efficient and battery operated communication solutions, continuous technological advancements in core specification standards.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.

Technavio's global BLE module market is segmented as below:

By Application

• Industrial automation
• Automotive tracking
• Asset tracking and proximity marketing
• Consumer electronics
• Others

By Type

• Single mode
• Dual mode
• Others

By Device

• Computing devices
• Smart wearables
• Smart home appliances
• Others

Geography

• APAC
  • China
  • Japan
  • South Korea
  • India
  • Indonesia
  • Australia
• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • France
  • Italy
  • The Netherlands
  • Spain
• Middle East and Africa
  • UAE
  • South Africa
  • Turkey
• South America
  • Brazil
  • Argentina
  • Chile
• Rest of World (ROW)

This study identifies the integration of ai and ml at edge as one of the prime reasons driving the global ble module market growth during the next few years. Also, progressive miniaturization and system-in-package advancements and expansion of mesh networking and advanced interoperability protocols will lead to sizable demand in the market.

The report on the global ble module market covers the following areas:

• Global ble module market sizing
• Global ble module market forecast
• Global ble module market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading global ble module market vendors that include Alps Alpine Co. Ltd., BDE Technology, Espressif Systems Shanghai, Ezurio, FANSTEL Corp., Infineon Technologies AG, InsightSIP, LM Technologies Ltd, Microchip Technology Inc., Murata Manufacturing Co. Ltd., NXP Semiconductors NV, Panasonic Holdings Corp., Raytac Corp, Renesas Electronics Corp., Shenzhen Holyiot Technology Co., Shenzhen Minew Tech Co. Ltd., Silicon Laboratories Inc., STMicroelectronics NV, TAIYO YUDEN Co. Ltd., Telit Cinterion, Texas Instruments Inc., u blox AG. Also, the global ble module market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

• 1.1 Market overview
  • Executive Summary - Chart on Market Overview
  • Executive Summary - Data Table on Market Overview
  • Executive Summary - Chart on Global Market Characteristics
  • Executive Summary - Chart on Market by Geography
  • Executive Summary - Chart on Market Segmentation by Application
  • Executive Summary - Chart on Market Segmentation by Type
  • Executive Summary - Chart on Market Segmentation by Device
  • Executive Summary - Chart on Incremental Growth
  • Executive Summary - Data Table on Incremental Growth
  • Executive Summary - Chart on Company Market Positioning

2 Technavio Analysis

• 2.1 Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
  • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
• 2.2 Criticality of inputs and Factors of differentiation
• 2.3 Factors of disruption
• 2.4 Impact of drivers and challenges

3 Market Landscape

• 3.1 Market ecosystem
• 3.2 Market characteristics
• 3.3 Value chain analysis

4 Market Sizing

• 4.1 Market definition
• 4.2 Market segment analysis
  • Market segments
• 4.3 Market size 2025
• 4.4 Market outlook: Forecast for 2025-2030

5 Historic Market Size

• 5.1 Global BLE Module Market 2020 - 2024
  • Historic Market Size - Data Table on Global BLE Module Market 2020 - 2024 ($ million)
• 5.2 Application segment analysis 2020 - 2024
  • Historic Market Size - Application Segment 2020 - 2024 ($ million)
• 5.3 Type segment analysis 2020 - 2024
  • Historic Market Size - Type Segment 2020 - 2024 ($ million)
• 5.4 Device segment analysis 2020 - 2024
  • Historic Market Size - Device Segment 2020 - 2024 ($ million)
• 5.5 Geography segment analysis 2020 - 2024
  • Historic Market Size - Geography Segment 2020 - 2024 ($ million)
• 5.6 Country segment analysis 2020 - 2024
  • Historic Market Size - Country Segment 2020 - 2024 ($ million)

6 Qualitative Analysis

• 6.1 Impact of AI on global BLE module market
• 6.2 Impact of geopolitical conflicts on global BLE module market

7 Five Forces Analysis

• 7.1 Five forces summary
  • Five forces analysis - Comparison between 2025 and 2030
• 7.2 Bargaining power of buyers
  • Bargaining power of buyers - Impact of key factors 2025 and 2030
• 7.3 Bargaining power of suppliers
  • Bargaining power of suppliers - Impact of key factors in 2025 and 2030
• 7.4 Threat of new entrants
  • Threat of new entrants - Impact of key factors in 2025 and 2030
• 7.5 Threat of substitutes
  • Threat of substitutes - Impact of key factors in 2025 and 2030
• 7.6 Threat of rivalry
  • Threat of rivalry - Impact of key factors in 2025 and 2030
• 7.7 Market condition

8 Market Segmentation by Application

• 8.1 Market segments
• 8.2 Comparison by Application
• 8.3 Industrial automation - Market size and forecast 2025-2030
• 8.4 Automotive tracking - Market size and forecast 2025-2030
• 8.5 Asset tracking and proximity marketing - Market size and forecast 2025-2030
• 8.6 Consumer electronics - Market size and forecast 2025-2030
• 8.7 Others - Market size and forecast 2025-2030
• 8.8 Market opportunity by Application
  • Market opportunity by Application ($ million)

9 Market Segmentation by Type

• 9.1 Market segments
• 9.2 Comparison by Type
• 9.3 Single mode - Market size and forecast 2025-2030
• 9.4 Dual mode - Market size and forecast 2025-2030
• 9.5 Others - Market size and forecast 2025-2030
• 9.6 Market opportunity by Type
  • Market opportunity by Type ($ million)

10 Market Segmentation by Device

• 10.1 Market segments
• 10.2 Comparison by Device
• 10.3 Computing devices - Market size and forecast 2025-2030
• 10.4 Smart wearables - Market size and forecast 2025-2030
• 10.5 Smart home appliances - Market size and forecast 2025-2030
• 10.6 Others - Market size and forecast 2025-2030
• 10.7 Market opportunity by Device
  • Market opportunity by Device ($ million)

11 Customer Landscape

• 11.1 Customer landscape overview
  • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

12 Geographic Landscape

• 12.1 Geographic segmentation
• 12.2 Geographic comparison
• 12.3 APAC - Market size and forecast 2025-2030
  • 12.3.1 China - Market size and forecast 2025-2030
  • 12.3.2 Japan - Market size and forecast 2025-2030
  • 12.3.3 South Korea - Market size and forecast 2025-2030
  • 12.3.4 India - Market size and forecast 2025-2030
  • 12.3.5 Indonesia - Market size and forecast 2025-2030
  • 12.3.6 Australia - Market size and forecast 2025-2030
• 12.4 North America - Market size and forecast 2025-2030
  • 12.4.1 US - Market size and forecast 2025-2030
  • 12.4.2 Canada - Market size and forecast 2025-2030
  • 12.4.3 Mexico - Market size and forecast 2025-2030
• 12.5 Europe - Market size and forecast 2025-2030
  • 12.5.1 Germany - Market size and forecast 2025-2030
  • 12.5.2 UK - Market size and forecast 2025-2030
  • 12.5.3 France - Market size and forecast 2025-2030
  • 12.5.4 Italy - Market size and forecast 2025-2030
  • 12.5.5 The Netherlands - Market size and forecast 2025-2030
  • 12.5.6 Spain - Market size and forecast 2025-2030
• 12.6 Middle East and Africa - Market size and forecast 2025-2030
  • 12.6.1 Saudi Arabia - Market size and forecast 2025-2030
  • 12.6.2 UAE - Market size and forecast 2025-2030
  • 12.6.3 South Africa - Market size and forecast 2025-2030
  • 12.6.4 Israel - Market size and forecast 2025-2030
  • 12.6.5 Turkey - Market size and forecast 2025-2030
• 12.7 South America - Market size and forecast 2025-2030
  • 12.7.1 Brazil - Market size and forecast 2025-2030
  • 12.7.2 Argentina - Market size and forecast 2025-2030
  • 12.7.3 Chile - Market size and forecast 2025-2030
• 12.8 Market opportunity by geography
  • Market opportunity by geography ($ million)
  • Data Tables on Market opportunity by geography ($ million)

13 Drivers, Challenges, and Opportunity

• 13.1 Market drivers
  • Escalating integration of IoT ecosystems across diverse industries
  • Rising demand for energy efficient and battery operated communication solutions
  • Continuous technological advancements in core specification standards
• 13.2 Market challenges
  • Stringent and fragmented global regulatory certification processes
  • Volatility in semiconductor supply chains and raw material procurement
  • Intense pricing pressures and severe margin compression
• 13.3 Impact of drivers and challenges
  • Impact of drivers and challenges in 2025 and 2030
• 13.4 Market opportunities
  • Integration of AI and ML at edge
  • Progressive miniaturization and system-in-package advancements
  • Expansion of mesh networking and advanced interoperability protocols

14 Competitive Landscape

• 14.1 Overview
• 14.2 Competitive Landscape
  • Overview on criticality of inputs and factors of differentiation
• 14.3 Landscape disruption
  • Overview on factors of disruption
• 14.4 Industry risks
  • Impact of key risks on business

15 Competitive Analysis

• 15.1 Companies profiled
  • Companies covered
• 15.2 Company ranking index
  • Company ranking index
• 15.3 Market positioning of companies
  • Matrix on companies position and classification
• 15.4 Alps Alpine Co. Ltd.
  • Alps Alpine Co. Ltd. - Overview
  • Alps Alpine Co. Ltd. - Business segments
  • Alps Alpine Co. Ltd. - Key offerings
  • Alps Alpine Co. Ltd. - Segment focus
  • SWOT
• 15.5 Espressif Systems Shanghai
  • Espressif Systems Shanghai - Overview
  • Espressif Systems Shanghai - Product / Service
  • Espressif Systems Shanghai - Key offerings
  • SWOT
• 15.6 Ezurio
  • Ezurio - Overview
  • Ezurio - Product / Service
  • Ezurio - Key offerings
  • SWOT
• 15.7 Infineon Technologies AG
  • Infineon Technologies AG - Overview
  • Infineon Technologies AG - Business segments
  • Infineon Technologies AG - Key news
  • Infineon Technologies AG - Key offerings
  • Infineon Technologies AG - Segment focus
  • SWOT
• 15.8 Microchip Technology Inc.
  • Microchip Technology Inc. - Overview
  • Microchip Technology Inc. - Business segments
  • Microchip Technology Inc. - Key offerings
  • Microchip Technology Inc. - Segment focus
  • SWOT
• 15.9 Murata Manufacturing Co. Ltd.
  • Murata Manufacturing Co. Ltd. - Overview
  • Murata Manufacturing Co. Ltd. - Business segments
  • Murata Manufacturing Co. Ltd. - Key offerings
  • Murata Manufacturing Co. Ltd. - Segment focus
  • SWOT
• 15.10 NXP Semiconductors NV
  • NXP Semiconductors NV - Overview
  • NXP Semiconductors NV - Business segments
  • NXP Semiconductors NV - Key news
  • NXP Semiconductors NV - Key offerings
  • NXP Semiconductors NV - Segment focus
  • SWOT
• 15.11 Panasonic Holdings Corp.
  • Panasonic Holdings Corp. - Overview
  • Panasonic Holdings Corp. - Business segments
  • Panasonic Holdings Corp. - Key news
  • Panasonic Holdings Corp. - Key offerings
  • Panasonic Holdings Corp. - Segment focus
  • SWOT
• 15.12 Renesas Electronics Corp.
  • Renesas Electronics Corp. - Overview
  • Renesas Electronics Corp. - Business segments
  • Renesas Electronics Corp. - Key news
  • Renesas Electronics Corp. - Key offerings
  • Renesas Electronics Corp. - Segment focus
  • SWOT
• 15.13 Silicon Laboratories Inc.
  • Silicon Laboratories Inc. - Overview
  • Silicon Laboratories Inc. - Product / Service
  • Silicon Laboratories Inc. - Key news
  • Silicon Laboratories Inc. - Key offerings
  • SWOT
• 15.14 STMicroelectronics NV
  • STMicroelectronics NV - Overview
  • STMicroelectronics NV - Business segments
  • STMicroelectronics NV - Key news
  • STMicroelectronics NV - Key offerings
  • STMicroelectronics NV - Segment focus
  • SWOT
• 15.15 TAIYO YUDEN Co. Ltd.
  • TAIYO YUDEN Co. Ltd. - Overview
  • TAIYO YUDEN Co. Ltd. - Product / Service
  • TAIYO YUDEN Co. Ltd. - Key offerings
  • SWOT
• 15.16 Telit Cinterion
  • Telit Cinterion - Overview
  • Telit Cinterion - Product / Service
  • Telit Cinterion - Key offerings
  • SWOT
• 15.17 Texas Instruments Inc.
  • Texas Instruments Inc. - Overview
  • Texas Instruments Inc. - Business segments
  • Texas Instruments Inc. - Key news
  • Texas Instruments Inc. - Key offerings
  • Texas Instruments Inc. - Segment focus
  • SWOT
• 15.18 u blox AG
  • u blox AG - Overview
  • u blox AG - Business segments
  • u blox AG - Key offerings
  • u blox AG - Segment focus
  • SWOT

16 Appendix

• 16.1 Scope of the report
  • Market definition
  • Objectives
  • Notes and caveats
• 16.2 Inclusions and exclusions checklist
  • Inclusions checklist
  • Exclusions checklist
• 16.3 Currency conversion rates for US$
  • Currency conversion rates for US$
• 16.4 Research methodology
  • Research methodology
• 16.5 Data procurement
  • Information sources
• 16.6 Data validation
  • Data validation
• 16.7 Validation techniques employed for market sizing
  • Validation techniques employed for market sizing
• 16.8 Data synthesis
  • Data synthesis
• 16.9 360 degree market analysis
  • 360 degree market analysis
• 16.10 List of abbreviations
  • List of abbreviations