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2026-2030年全球LED封裝市場
市場調查報告書
商品編碼
2126056

2026-2030年全球LED封裝市場

Global LED Encapsulation Market 2026-2030
出版日期: | 出版商: TechNavio | 英文 310 Pages | 訂單完成後即時交付

價格
簡介目錄

全球 LED封裝市場預計將從 2025 年到 2030 年成長至 5.739 億美元，預測期內複合年成長率為 4.7%。

本報告對全球 LED封裝市場進行了全面分析，包括市場規模和預測、趨勢、成長要素、挑戰以及涵蓋約 25 家供應商的供應商分析。

本報告對當前市場狀況、最新趨勢和促進因素以及整體市場環境進行了最新分析。推動該市場成長的因素包括：先進顯示背光的微型化、環保包裝監管的推進以及智慧互聯照明的整合。

本研究客觀地結合了一手和二手訊息，包括來自主要行業相關人員的信息。報告內容涵蓋主要公司分析、全面的市場規模數據、區域細分分析以及供應商格局。報告包含歷史數據和預測數據。

市場範圍
基準年 2025
年末 2030
調查期 2026-2030
成長勢頭 加速度
2026 年同比比較 4.5%
複合年成長率 4.7%
增量 5.739億美元

本研究指出，晶片級技術的普及將是未來幾年全球LED封裝市場成長的主要驅動力之一。此外，量子點技術的應用和醫療照光治療設備的廣泛普及也將顯著提升市場需求。

目錄

第1章：執行摘要

第2章 Technavio 分析

  • 分析定價、生命週期、顧客購買籃子、採用率和購買標準。
  • 輸入的重要性及差異化因素
  • 干擾因素
  • 促進因素和挑戰的影響

第3章 市場狀況

  • 市場生態系統
  • 市場特徵
  • 價值鏈分析

第4章 市場規模

  • 市場的定義
  • 市場區隔分析
  • 2025年市場規模
  • 市場展望，2025-2030年

第5章 市場規模與表現

  • 2020-2024年全球LED封裝市場
  • 按類型分類的細分市場分析，2020-2024 年
  • 按包裝類型分類的細分市場分析：2020-2024 年
  • 2020-2024年基於技術的細分市場分析
  • 區域區隔市場分析，2020-2024 年
  • 2020-2024年各國細分市場分析

第6章 定性分析

  • 人工智慧的影響：全球LED封裝市場
  • 地緣政治衝突對全球LED封裝市場的影響。

第7章：五力分析

第8章 市場區隔：依類型

  • 比較：按類型
  • 環氧樹脂
  • 矽酮
  • 聚氨酯
  • 市場機會：按類型分類

第9章 按包裝類型分類的市場細分

  • 按包裝類型比較
  • 板載晶片
  • 表面黏著型元件
  • 晶片級封裝
  • 微型LED模組
  • 按包裝類型分類的市場機遇

第10章 市場區隔：依技術分類

  • 比較：按技術
  • 熱固性樹脂
  • 紫外光或LED光固化
  • 雙重固化系統
  • 室溫硫化（RTV）
  • 市場機會：依技術分類

第11章 客戶情況

第12章 區域情勢

  • 區域分類
  • 區域比較
  • 亞太地區
    • 中國
    • 日本
    • 印度
    • 韓國
    • 澳洲
    • 印尼
  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 法國
    • 義大利
    • 西班牙
    • 荷蘭
  • 南美洲
    • 巴西
    • 阿根廷
    • 智利
  • 中東和非洲
    • 沙烏地阿拉伯
    • UAE
    • 南非
    • 土耳其
    • 以色列
  • 市場機會：按地區分類

第13章 促進因素、挑戰與機遇

  • 市場促進因素
  • 市場挑戰
  • 促進因素和挑戰的影響
  • 市場機遇

第14章 競爭格局

  • 概述
  • 競爭格局
  • 中斷狀況
  • 產業風險

第15章 競爭分析

  • 公司簡介
  • 公司排名指標
  • 企業市場定位
  • 3M Co.
  • Dow Chemical Co.
  • DuPont de Nemours Inc.
  • Elkem ASA
  • HB Fuller Co.
  • Henkel AG and Co. KGaA
  • Huntsman International LLC
  • Nagase and Co. Ltd.
  • Nitto Denko Corp.
  • Panasonic Holdings Corp.
  • Samsung Electronics Co. Ltd.
  • Shin Etsu Chemical Co. Ltd.
  • Stanley Electric Co. Ltd.
  • Toyoda Gosei Co. Ltd.
  • Wacker Chemie AG

第16章附錄

簡介目錄
Product Code: IRTNTR73057

The global LED encapsulation market is forecasted to grow by USD 573.9 mn during 2025-2030, accelerating at a CAGR of 4.7% during the forecast period. The report on the global LED encapsulation market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by miniaturization of advanced display backlighting, regulatory push for eco-friendly packaging, integration of smart connected lighting.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.

Market Scope
Base Year2025
End Year2030
Series Year2026-2030
Growth MomentumAccelerate
YOY 20264.5%
CAGR4.7%
Incremental Value$573.9 mn

Technavio's global LED encapsulation market is segmented as below:

By Type

  • Epoxy
  • Silicone
  • Polyurethane

By Type Of Packaging

  • Chip-on-board
  • Surface-mount device
  • Chip-scale package
  • Micro-LED modules

By Technology

  • Heat cure thermoset
  • UV or LED light cure
  • Dual cure systems
  • Room temperature vulcanization (RTV)

Geography

  • APAC
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Indonesia
  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • France
    • Italy
    • Spain
    • The Netherlands
  • South America
    • Brazil
    • Argentina
    • Chile
  • Middle East and Africa
    • UAE
    • South Africa
    • Turkey
  • Rest of World (ROW)

This study identifies the transition toward chip scale as one of the prime reasons driving the global led encapsulation market growth during the next few years. Also, integration of quantum dot enhancements and expansion of medical phototherapy devices will lead to sizable demand in the market.

The report on the global led encapsulation market covers the following areas:

  • Global led encapsulation market sizing
  • Global led encapsulation market forecast
  • Global led encapsulation market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading global led encapsulation market vendors that include 3M Co., Dow Chemical Co., DuPont de Nemours Inc., Elkem ASA, Epic Corp., H.B. Fuller Co., Henkel AG and Co. KGaA, Huntsman International LLC, Laird Performance Materials, Lumileds Holding BV, Momentive Materials Inc., Nagase and Co. Ltd., Nichia Corp., Nitto Denko Corp., Panasonic Holdings Corp., Samsung Electronics Co. Ltd., Shin Etsu Chemical Co. Ltd., SolEpoxy Inc., Stanley Electric Co. Ltd., Toyoda Gosei Co. Ltd., Wacker Chemie AG. Also, the global led encapsulation market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

  • 1.1 Market overview
    • Executive Summary - Chart on Market Overview
    • Executive Summary - Data Table on Market Overview
    • Executive Summary - Chart on Global Market Characteristics
    • Executive Summary - Chart on Market by Geography
    • Executive Summary - Chart on Market Segmentation by Type
    • Executive Summary - Chart on Market Segmentation by Type of Packaging
    • Executive Summary - Chart on Market Segmentation by Technology
    • Executive Summary - Chart on Incremental Growth
    • Executive Summary - Data Table on Incremental Growth
    • Executive Summary - Chart on Company Market Positioning

2 Technavio Analysis

  • 2.1 Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
    • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
  • 2.2 Criticality of inputs and Factors of differentiation
  • 2.3 Factors of disruption
  • 2.4 Impact of drivers and challenges

3 Market Landscape

  • 3.1 Market ecosystem
  • 3.2 Market characteristics
  • 3.3 Value chain analysis

4 Market Sizing

  • 4.1 Market definition
  • 4.2 Market segment analysis
    • Market segments
  • 4.3 Market size 2025
  • 4.4 Market outlook: Forecast for 2025-2030

5 Historic Market Size

  • 5.1 Global LED Encapsulation Market 2020 - 2024
    • Historic Market Size - Data Table on Global LED Encapsulation Market 2020 - 2024 ($ million)
  • 5.2 Type segment analysis 2020 - 2024
    • Historic Market Size - Type Segment 2020 - 2024 ($ million)
  • 5.3 Type of Packaging segment analysis 2020 - 2024
    • Historic Market Size - Type of Packaging Segment 2020 - 2024 ($ million)
  • 5.4 Technology segment analysis 2020 - 2024
    • Historic Market Size - Technology Segment 2020 - 2024 ($ million)
  • 5.5 Geography segment analysis 2020 - 2024
    • Historic Market Size - Geography Segment 2020 - 2024 ($ million)
  • 5.6 Country segment analysis 2020 - 2024
    • Historic Market Size - Country Segment 2020 - 2024 ($ million)

6 Qualitative Analysis

  • 6.1 Impact of AI on Global LED Encapsulation Market
  • 6.2 Impact of geopolitical conflicts on Global LED Encapsulation Market

7 Five Forces Analysis

  • 7.1 Five forces summary
    • Five forces analysis - Comparison between 2025 and 2030
  • 7.2 Bargaining power of buyers
    • Bargaining power of buyers - Impact of key factors 2025 and 2030
  • 7.3 Bargaining power of suppliers
    • Bargaining power of suppliers - Impact of key factors in 2025 and 2030
  • 7.4 Threat of new entrants
    • Threat of new entrants - Impact of key factors in 2025 and 2030
  • 7.5 Threat of substitutes
    • Threat of substitutes - Impact of key factors in 2025 and 2030
  • 7.6 Threat of rivalry
    • Threat of rivalry - Impact of key factors in 2025 and 2030
  • 7.7 Market condition

8 Market Segmentation by Type

  • 8.1 Market segments
  • 8.2 Comparison by Type
  • 8.3 Epoxy - Market size and forecast 2025-2030
  • 8.4 Silicone - Market size and forecast 2025-2030
  • 8.5 Polyurethane - Market size and forecast 2025-2030
  • 8.6 Market opportunity by Type
    • Market opportunity by Type ($ million)

9 Market Segmentation by Type of Packaging

  • 9.1 Market segments
  • 9.2 Comparison by Type of Packaging
  • 9.3 Chip-on-board - Market size and forecast 2025-2030
  • 9.4 Surface-mount device - Market size and forecast 2025-2030
  • 9.5 Chip-scale package - Market size and forecast 2025-2030
  • 9.6 Micro-LED modules - Market size and forecast 2025-2030
  • 9.7 Market opportunity by Type of Packaging
    • Market opportunity by Type of Packaging ($ million)

10 Market Segmentation by Technology

  • 10.1 Market segments
  • 10.2 Comparison by Technology
  • 10.3 Heat cure thermoset - Market size and forecast 2025-2030
  • 10.4 UV or LED light cure - Market size and forecast 2025-2030
  • 10.5 Dual cure systems - Market size and forecast 2025-2030
  • 10.6 Room temperature vulcanization (RTV) - Market size and forecast 2025-2030
  • 10.7 Market opportunity by Technology
    • Market opportunity by Technology ($ million)

11 Customer Landscape

  • 11.1 Customer landscape overview
    • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

12 Geographic Landscape

  • 12.1 Geographic segmentation
  • 12.2 Geographic comparison
  • 12.3 APAC - Market size and forecast 2025-2030
    • 12.3.1 China - Market size and forecast 2025-2030
    • 12.3.2 Japan - Market size and forecast 2025-2030
    • 12.3.3 India - Market size and forecast 2025-2030
    • 12.3.4 South Korea - Market size and forecast 2025-2030
    • 12.3.5 Australia - Market size and forecast 2025-2030
    • 12.3.6 Indonesia - Market size and forecast 2025-2030
  • 12.4 North America - Market size and forecast 2025-2030
    • 12.4.1 US - Market size and forecast 2025-2030
    • 12.4.2 Canada - Market size and forecast 2025-2030
    • 12.4.3 Mexico - Market size and forecast 2025-2030
  • 12.5 Europe - Market size and forecast 2025-2030
    • 12.5.1 Germany - Market size and forecast 2025-2030
    • 12.5.2 UK - Market size and forecast 2025-2030
    • 12.5.3 France - Market size and forecast 2025-2030
    • 12.5.4 Italy - Market size and forecast 2025-2030
    • 12.5.5 Spain - Market size and forecast 2025-2030
    • 12.5.6 The Netherlands - Market size and forecast 2025-2030
  • 12.6 South America - Market size and forecast 2025-2030
    • 12.6.1 Brazil - Market size and forecast 2025-2030
    • 12.6.2 Argentina - Market size and forecast 2025-2030
    • 12.6.3 Chile - Market size and forecast 2025-2030
  • 12.7 Middle East and Africa - Market size and forecast 2025-2030
    • 12.7.1 Saudi Arabia - Market size and forecast 2025-2030
    • 12.7.2 UAE - Market size and forecast 2025-2030
    • 12.7.3 South Africa - Market size and forecast 2025-2030
    • 12.7.4 Turkey - Market size and forecast 2025-2030
    • 12.7.5 Israel - Market size and forecast 2025-2030
  • 12.8 Market opportunity by geography
    • Market opportunity by geography ($ million)
    • Data Tables on Market opportunity by geography ($ million)

13 Drivers, Challenges, and Opportunity

  • 13.1 Market drivers
    • Miniaturization of advanced display backlighting
    • Regulatory push for eco-friendly packaging
    • Integration of smart connected lighting
  • 13.2 Market challenges
    • Volatile silicone and epoxy feedstock pricing
    • Increasing OLED penetration in premium displays
    • Reliability concerns amid rising blue-light
  • 13.3 Impact of drivers and challenges
    • Impact of drivers and challenges in 2025 and 2030
  • 13.4 Market opportunities
    • Transition toward chip scale
    • Integration of quantum dot enhancements
    • Expansion of medical phototherapy devices

14 Competitive Landscape

  • 14.1 Overview
  • 14.2 Competitive Landscape
    • Overview on criticality of inputs and factors of differentiation
  • 14.3 Landscape disruption
    • Overview on factors of disruption
  • 14.4 Industry risks
    • Impact of key risks on business

15 Competitive Analysis

  • 15.1 Companies profiled
    • Companies covered
  • 15.2 Company ranking index
    • Company ranking index
  • 15.3 Market positioning of companies
    • Matrix on companies position and classification
  • 15.4 3M Co.
    • 3M Co. - Overview
    • 3M Co. - Business segments
    • 3M Co. - Key news
    • 3M Co. - Key offerings
    • 3M Co. - Segment focus
    • SWOT
  • 15.5 Dow Chemical Co.
    • Dow Chemical Co. - Overview
    • Dow Chemical Co. - Business segments
    • Dow Chemical Co. - Key news
    • Dow Chemical Co. - Key offerings
    • Dow Chemical Co. - Segment focus
    • SWOT
  • 15.6 DuPont de Nemours Inc.
    • DuPont de Nemours Inc. - Overview
    • DuPont de Nemours Inc. - Business segments
    • DuPont de Nemours Inc. - Key news
    • DuPont de Nemours Inc. - Key offerings
    • DuPont de Nemours Inc. - Segment focus
    • SWOT
  • 15.7 Elkem ASA
    • Elkem ASA - Overview
    • Elkem ASA - Business segments
    • Elkem ASA - Key offerings
    • Elkem ASA - Segment focus
    • SWOT
  • 15.8 H.B. Fuller Co.
    • H.B. Fuller Co. - Overview
    • H.B. Fuller Co. - Business segments
    • H.B. Fuller Co. - Key offerings
    • H.B. Fuller Co. - Segment focus
    • SWOT
  • 15.9 Henkel AG and Co. KGaA
    • Henkel AG and Co. KGaA - Overview
    • Henkel AG and Co. KGaA - Business segments
    • Henkel AG and Co. KGaA - Key offerings
    • Henkel AG and Co. KGaA - Segment focus
    • SWOT
  • 15.10 Huntsman International LLC
    • Huntsman International LLC - Overview
    • Huntsman International LLC - Business segments
    • Huntsman International LLC - Key news
    • Huntsman International LLC - Key offerings
    • Huntsman International LLC - Segment focus
    • SWOT
  • 15.11 Nagase and Co. Ltd.
    • Nagase and Co. Ltd. - Overview
    • Nagase and Co. Ltd. - Business segments
    • Nagase and Co. Ltd. - Key offerings
    • Nagase and Co. Ltd. - Segment focus
    • SWOT
  • 15.12 Nitto Denko Corp.
    • Nitto Denko Corp. - Overview
    • Nitto Denko Corp. - Business segments
    • Nitto Denko Corp. - Key offerings
    • Nitto Denko Corp. - Segment focus
    • SWOT
  • 15.13 Panasonic Holdings Corp.
    • Panasonic Holdings Corp. - Overview
    • Panasonic Holdings Corp. - Business segments
    • Panasonic Holdings Corp. - Key news
    • Panasonic Holdings Corp. - Key offerings
    • Panasonic Holdings Corp. - Segment focus
    • SWOT
  • 15.14 Samsung Electronics Co. Ltd.
    • Samsung Electronics Co. Ltd. - Overview
    • Samsung Electronics Co. Ltd. - Business segments
    • Samsung Electronics Co. Ltd. - Key news
    • Samsung Electronics Co. Ltd. - Key offerings
    • Samsung Electronics Co. Ltd. - Segment focus
    • SWOT
  • 15.15 Shin Etsu Chemical Co. Ltd.
    • Shin Etsu Chemical Co. Ltd. - Overview
    • Shin Etsu Chemical Co. Ltd. - Business segments
    • Shin Etsu Chemical Co. Ltd. - Key offerings
    • Shin Etsu Chemical Co. Ltd. - Segment focus
    • SWOT
  • 15.16 Stanley Electric Co. Ltd.
    • Stanley Electric Co. Ltd. - Overview
    • Stanley Electric Co. Ltd. - Business segments
    • Stanley Electric Co. Ltd. - Key offerings
    • Stanley Electric Co. Ltd. - Segment focus
    • SWOT
  • 15.17 Toyoda Gosei Co. Ltd.
    • Toyoda Gosei Co. Ltd. - Overview
    • Toyoda Gosei Co. Ltd. - Business segments
    • Toyoda Gosei Co. Ltd. - Key offerings
    • Toyoda Gosei Co. Ltd. - Segment focus
    • SWOT
  • 15.18 Wacker Chemie AG
    • Wacker Chemie AG - Overview
    • Wacker Chemie AG - Business segments
    • Wacker Chemie AG - Key offerings
    • Wacker Chemie AG - Segment focus
    • SWOT

16 Appendix

  • 16.1 Scope of the report
    • Market definition
    • Objectives
    • Notes and caveats
  • 16.2 Inclusions and exclusions checklist
    • Inclusions checklist
    • Exclusions checklist
  • 16.3 Currency conversion rates for US$
    • Currency conversion rates for US$
  • 16.4 Research methodology
    • Research methodology
  • 16.5 Data procurement
    • Information sources
  • 16.6 Data validation
    • Data validation
  • 16.7 Validation techniques employed for market sizing
    • Validation techniques employed for market sizing
  • 16.8 Data synthesis
    • Data synthesis
  • 16.9 360 degree market analysis
    • 360 degree market analysis
  • 16.10 List of abbreviations
    • List of abbreviations