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2026-2030年全球底部填充市場
市場調查報告書
商品編碼
2056274

2026-2030年全球底部填充市場

Global Underfill Market 2026-2030
出版日期: | 出版商: TechNavio | 英文 313 Pages | 訂單完成後即時交付

價格
簡介目錄

全球底部填充市場預計在 2025 年至 2030 年間成長至 3.395 億美元，預測期內複合年成長率為 7.3%。

本報告對全球底部填充市場進行了全面分析，包括市場規模和預測、趨勢、成長要素、挑戰以及對約 25 家公司的供應商分析。

本報告對當前市場狀況、最新趨勢和促進因素以及整體市場環境進行了最新分析。推動該市場發展的因素包括先進半導體封裝技術的擴展、小型化家用電子電器的普及以及汽車行業的電氣化和數位轉型。

本研究客觀地結合了一手和二手訊息，包括主要行業相關人員的意見。報告內容涵蓋主要公司分析、全面的市場規模數據、區域細分分析以及供應商格局。報告還包含歷史數據和預測數據。

市場範圍
基準年 2025
年末 2030
調查期 2026-2030
成長勢頭 加速度
2026 年同比比較 7.2%
複合年成長率 7.3%
增量 3.395億美元

本研究指出，環保底部填充樹脂的開發是未來幾年全球底部填充樹脂市場成長的主要驅動力之一。此外，人工智慧在點膠和固化製程的應用，以及用於高價值電子產品的可返工底部填充樹脂配方的進步，預計也將產生顯著的市場需求。

目錄

第1章：執行摘要

第2章 Technavio 分析

  • 分析定價、生命週期、顧客購買籃子、採用率和購買標準。
  • 輸入的重要性及差異化因素
  • 干擾因素
  • 促進因素和挑戰的影響

第3章 市場狀況

  • 市場生態系統
  • 市場特徵
  • 價值鏈分析

第4章 市場規模

  • 市場的定義
  • 市場區隔分析
  • 2025年市場規模
  • 市場展望，2025-2030年

第5章 市場規模與表現

  • 2020-2024年全球底部填充市場
  • 按類型分類的細分市場分析，2020-2024 年
  • 2020-2024年基於材料的細分市場分析
  • 基於應用領域的細分市場分析，2020-2024 年
  • 區域區隔市場分析，2020-2024 年
  • 2020-2024年各國細分市場分析

第6章 定性分析

  • 人工智慧的影響：全球底部填充市場
  • 地緣政治衝突的影響：全球底部填充市場

第7章：五力分析

第8章 市場區隔：依類型

  • 比較：按類型
  • 毛細管底部填充
  • 無流動底部填充
  • 模壓底部填充物
  • 其他
  • 市場機會：按類型分類

第9章 市場區隔：依材料

  • 對比：按材料
  • 環氧樹脂
  • 矽酮
  • 混合
  • 其他
  • 市場機會：依材料分類

第10章 市場區隔：依應用

  • 比較：透過應用
  • 半導體封裝
  • 車
  • 其他
  • 市場機會：依應用領域分類

第11章 客戶情況

第12章 區域情勢

  • 區域分類
  • 區域比較
  • 亞太地區
    • 台灣
    • 中國
    • 韓國
    • 日本
    • 澳洲
    • 印度
  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 法國
    • 英國
    • 義大利
    • 荷蘭
    • 西班牙
  • 中東和非洲
    • UAE
    • 以色列
    • 沙烏地阿拉伯
    • 南非
    • 土耳其
  • 南美洲
    • 巴西
    • 阿根廷
    • 哥倫比亞
  • 市場機會：按地區分類

第13章 促進因素、挑戰與機遇

  • 市場促進因素
  • 市場挑戰
  • 促進因素和挑戰的影響
  • 市場機遇

第14章 競爭格局

  • 概述
  • 競爭格局
  • 混亂局面
  • 產業風險

第15章 競爭分析

  • 公司簡介
  • 公司排名指標
  • 企業市場定位
  • Dow Chemical Co.
  • HB Fuller Co.
  • Henkel AG and Co. KGaA
  • Huntsman International LLC
  • Indium Corp.
  • MacDermid Alpha Elec. Sol.
  • Master Bond Inc.
  • NAMICS Corporation
  • Panasonic Holdings Corp.
  • Parker Hannifin Corp.
  • Resonac Holdings Corp.
  • SANYU REC.LTD
  • Shin Etsu Chemical Co. Ltd.
  • YINCAE Advanced Materials
  • Zymet

第16章附錄

簡介目錄
Product Code: IRTNTR81510

The global underfill market is forecasted to grow by USD 339.5 mn during 2025-2030, accelerating at a CAGR of 7.3% during the forecast period. The report on the global underfill market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by expansion of advanced semiconductor packaging, proliferation of miniaturized consumer electronics, electrification and digitalization of automotive sector.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.

Market Scope
Base Year2025
End Year2030
Series Year2026-2030
Growth MomentumAccelerate
YOY 20267.2%
CAGR7.3%
Incremental Value$339.5 mn

Technavio's global underfill market is segmented as below:

By Type

  • Capillary underfill
  • No-flow underfill
  • Molded underfill
  • Others

By Material

  • Epoxy
  • Silicone
  • Hybrid
  • Others

By Application

  • Semiconductor packaging
  • Automotive
  • Others

Geography

  • APAC
    • Taiwan
    • China
    • South Korea
    • Japan
    • Australia
    • India
  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • France
    • UK
    • Italy
    • The Netherlands
    • Spain
  • Middle East and Africa
    • UAE
    • South Africa
    • Turkey
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Rest of World (ROW)

This study identifies the development of environmentally sustainable underfill resins as one of the prime reasons driving the global underfill market growth during the next few years. Also, integration of ai in dispensing and curing operations and advancement in reworkable underfill formulations for high-value electronics will lead to sizable demand in the market.

The report on the global underfill market covers the following areas:

  • Global underfill market sizing
  • Global underfill market forecast
  • Global underfill market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading global underfill market vendors that include AI Technology Inc., AIM Solder Pvt. Ltd., Dow Chemical Co., H.B. Fuller Co., Henkel AG and Co. KGaA, Huntsman International LLC, Indium Corp., MacDermid Alpha Elec. Sol., Master Bond Inc., Meridian Adhesives Group, NAMICS Corporation, Nordson Corp., One Chemical Co. Ltd, Panasonic Holdings Corp., Parker Hannifin Corp., Resonac Holdings Corp., SANYU REC.LTD, Shin Etsu Chemical Co. Ltd., YINCAE Advanced Materials, Zymet. Also, the global underfill market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

  • 1.1 Market overview
    • Executive Summary - Chart on Market Overview
    • Executive Summary - Data Table on Market Overview
    • Executive Summary - Chart on Global Market Characteristics
    • Executive Summary - Chart on Market by Geography
    • Executive Summary - Chart on Market Segmentation by Type
    • Executive Summary - Chart on Market Segmentation by Material
    • Executive Summary - Chart on Market Segmentation by Application
    • Executive Summary - Chart on Incremental Growth
    • Executive Summary - Data Table on Incremental Growth
    • Executive Summary - Chart on Company Market Positioning

2 Technavio Analysis

  • 2.1 Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
    • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
  • 2.2 Criticality of inputs and Factors of differentiation
  • 2.3 Factors of disruption
  • 2.4 Impact of drivers and challenges

3 Market Landscape

  • 3.1 Market ecosystem
  • 3.2 Market characteristics
  • 3.3 Value chain analysis

4 Market Sizing

  • 4.1 Market definition
  • 4.2 Market segment analysis
    • Market segments
  • 4.3 Market size 2025
  • 4.4 Market outlook: Forecast for 2025-2030

5 Historic Market Size

  • 5.1 Global Underfill Market 2020 - 2024
    • Historic Market Size - Data Table on Global Underfill Market 2020 - 2024 ($ million)
  • 5.2 Type segment analysis 2020 - 2024
    • Historic Market Size - Type Segment 2020 - 2024 ($ million)
  • 5.3 Material segment analysis 2020 - 2024
    • Historic Market Size - Material Segment 2020 - 2024 ($ million)
  • 5.4 Application segment analysis 2020 - 2024
    • Historic Market Size - Application Segment 2020 - 2024 ($ million)
  • 5.5 Geography segment analysis 2020 - 2024
    • Historic Market Size - Geography Segment 2020 - 2024 ($ million)
  • 5.6 Country segment analysis 2020 - 2024
    • Historic Market Size - Country Segment 2020 - 2024 ($ million)

6 Qualitative Analysis

  • 6.1 Impact of AI on Global Underfill Market
  • 6.2 Impact of Geopolitical Conflicts on Global Underfill Market

7 Five Forces Analysis

  • 7.1 Five forces summary
    • Five forces analysis - Comparison between 2025 and 2030
  • 7.2 Bargaining power of buyers
    • Bargaining power of buyers - Impact of key factors 2025 and 2030
  • 7.3 Bargaining power of suppliers
    • Bargaining power of suppliers - Impact of key factors in 2025 and 2030
  • 7.4 Threat of new entrants
    • Threat of new entrants - Impact of key factors in 2025 and 2030
  • 7.5 Threat of substitutes
    • Threat of substitutes - Impact of key factors in 2025 and 2030
  • 7.6 Threat of rivalry
    • Threat of rivalry - Impact of key factors in 2025 and 2030
  • 7.7 Market condition

8 Market Segmentation by Type

  • 8.1 Market segments
  • 8.2 Comparison by Type
  • 8.3 Capillary underfill - Market size and forecast 2025-2030
  • 8.4 No-flow underfill - Market size and forecast 2025-2030
  • 8.5 Molded underfill - Market size and forecast 2025-2030
  • 8.6 Others - Market size and forecast 2025-2030
  • 8.7 Market opportunity by Type
    • Market opportunity by Type ($ million)

9 Market Segmentation by Material

  • 9.1 Market segments
  • 9.2 Comparison by Material
  • 9.3 Epoxy - Market size and forecast 2025-2030
  • 9.4 Silicone - Market size and forecast 2025-2030
  • 9.5 Hybrid - Market size and forecast 2025-2030
  • 9.6 Others - Market size and forecast 2025-2030
  • 9.7 Market opportunity by Material
    • Market opportunity by Material ($ million)

10 Market Segmentation by Application

  • 10.1 Market segments
  • 10.2 Comparison by Application
  • 10.3 Semiconductor packaging - Market size and forecast 2025-2030
  • 10.4 Automotive - Market size and forecast 2025-2030
  • 10.5 Others - Market size and forecast 2025-2030
  • 10.6 Market opportunity by Application
    • Market opportunity by Application ($ million)

11 Customer Landscape

  • 11.1 Customer landscape overview
    • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

12 Geographic Landscape

  • 12.1 Geographic segmentation
  • 12.2 Geographic comparison
  • 12.3 APAC - Market size and forecast 2025-2030
    • 12.3.1 Taiwan - Market size and forecast 2025-2030
    • 12.3.2 China - Market size and forecast 2025-2030
    • 12.3.3 South Korea - Market size and forecast 2025-2030
    • 12.3.4 Japan - Market size and forecast 2025-2030
    • 12.3.5 Australia - Market size and forecast 2025-2030
    • 12.3.6 India - Market size and forecast 2025-2030
  • 12.4 North America - Market size and forecast 2025-2030
    • 12.4.1 US - Market size and forecast 2025-2030
    • 12.4.2 Canada - Market size and forecast 2025-2030
    • 12.4.3 Mexico - Market size and forecast 2025-2030
  • 12.5 Europe - Market size and forecast 2025-2030
    • 12.5.1 Germany - Market size and forecast 2025-2030
    • 12.5.2 France - Market size and forecast 2025-2030
    • 12.5.3 UK - Market size and forecast 2025-2030
    • 12.5.4 Italy - Market size and forecast 2025-2030
    • 12.5.5 The Netherlands - Market size and forecast 2025-2030
    • 12.5.6 Spain - Market size and forecast 2025-2030
  • 12.6 Middle East and Africa - Market size and forecast 2025-2030
    • 12.6.1 UAE - Market size and forecast 2025-2030
    • 12.6.2 Israel - Market size and forecast 2025-2030
    • 12.6.3 Saudi Arabia - Market size and forecast 2025-2030
    • 12.6.4 South Africa - Market size and forecast 2025-2030
    • 12.6.5 Turkey - Market size and forecast 2025-2030
  • 12.7 South America - Market size and forecast 2025-2030
    • 12.7.1 Brazil - Market size and forecast 2025-2030
    • 12.7.2 Argentina - Market size and forecast 2025-2030
    • 12.7.3 Colombia - Market size and forecast 2025-2030
  • 12.8 Market opportunity by geography
    • Market opportunity by geography ($ million)
    • Data Tables on Market opportunity by geography ($ million)

13 Drivers, Challenges, and Opportunity

  • 13.1 Market drivers
    • Expansion of advanced semiconductor packaging
    • Proliferation of miniaturized consumer electronics
    • Electrification and digitalization of automotive sector
  • 13.2 Market challenges
    • Complexities in thermal management and material performance
    • Supply chain volatility and raw material cost fluctuations
    • Stringent environmental regulations and toxicity concerns
  • 13.3 Impact of drivers and challenges
    • Impact of drivers and challenges in 2025 and 2030
  • 13.4 Market opportunities
    • Development of environmentally sustainable underfill resins
    • Integration of AI in dispensing and curing operations
    • Advancement in reworkable underfill formulations for high-value electronics

14 Competitive Landscape

  • 14.1 Overview
  • 14.2 Competitive Landscape
    • Overview on criticality of inputs and factors of differentiation
  • 14.3 Landscape disruption
    • Overview on factors of disruption
  • 14.4 Industry risks
    • Impact of key risks on business

15 Competitive Analysis

  • 15.1 Companies profiled
    • Companies covered
  • 15.2 Company ranking index
    • Company ranking index
  • 15.3 Market positioning of companies
    • Matrix on companies position and classification
  • 15.4 Dow Chemical Co.
    • Dow Chemical Co. - Overview
    • Dow Chemical Co. - Business segments
    • Dow Chemical Co. - Key offerings
    • Dow Chemical Co. - Segment focus
    • SWOT
  • 15.5 H.B. Fuller Co.
    • H.B. Fuller Co. - Overview
    • H.B. Fuller Co. - Business segments
    • H.B. Fuller Co. - Key offerings
    • H.B. Fuller Co. - Segment focus
    • SWOT
  • 15.6 Henkel AG and Co. KGaA
    • Henkel AG and Co. KGaA - Overview
    • Henkel AG and Co. KGaA - Business segments
    • Henkel AG and Co. KGaA - Key offerings
    • Henkel AG and Co. KGaA - Segment focus
    • SWOT
  • 15.7 Huntsman International LLC
    • Huntsman International LLC - Overview
    • Huntsman International LLC - Business segments
    • Huntsman International LLC - Key offerings
    • Huntsman International LLC - Segment focus
    • SWOT
  • 15.8 Indium Corp.
    • Indium Corp. - Overview
    • Indium Corp. - Product / Service
    • Indium Corp. - Key offerings
    • SWOT
  • 15.9 MacDermid Alpha Elec. Sol.
    • MacDermid Alpha Elec. Sol. - Overview
    • MacDermid Alpha Elec. Sol. - Product / Service
    • MacDermid Alpha Elec. Sol. - Key offerings
    • SWOT
  • 15.10 Master Bond Inc.
    • Master Bond Inc. - Overview
    • Master Bond Inc. - Product / Service
    • Master Bond Inc. - Key offerings
    • SWOT
  • 15.11 NAMICS Corporation
    • NAMICS Corporation - Overview
    • NAMICS Corporation - Product / Service
    • NAMICS Corporation - Key offerings
    • SWOT
  • 15.12 Panasonic Holdings Corp.
    • Panasonic Holdings Corp. - Overview
    • Panasonic Holdings Corp. - Business segments
    • Panasonic Holdings Corp. - Key news
    • Panasonic Holdings Corp. - Key offerings
    • Panasonic Holdings Corp. - Segment focus
    • SWOT
  • 15.13 Parker Hannifin Corp.
    • Parker Hannifin Corp. - Overview
    • Parker Hannifin Corp. - Business segments
    • Parker Hannifin Corp. - Key offerings
    • Parker Hannifin Corp. - Segment focus
    • SWOT
  • 15.14 Resonac Holdings Corp.
    • Resonac Holdings Corp. - Overview
    • Resonac Holdings Corp. - Business segments
    • Resonac Holdings Corp. - Key offerings
    • Resonac Holdings Corp. - Segment focus
    • SWOT
  • 15.15 SANYU REC.LTD
    • SANYU REC.LTD - Overview
    • SANYU REC.LTD - Product / Service
    • SANYU REC.LTD - Key offerings
    • SWOT
  • 15.16 Shin Etsu Chemical Co. Ltd.
    • Shin Etsu Chemical Co. Ltd. - Overview
    • Shin Etsu Chemical Co. Ltd. - Business segments
    • Shin Etsu Chemical Co. Ltd. - Key offerings
    • Shin Etsu Chemical Co. Ltd. - Segment focus
    • SWOT
  • 15.17 YINCAE Advanced Materials
    • YINCAE Advanced Materials - Overview
    • YINCAE Advanced Materials - Product / Service
    • YINCAE Advanced Materials - Key offerings
    • SWOT
  • 15.18 Zymet
    • Zymet - Overview
    • Zymet - Product / Service
    • Zymet - Key offerings
    • SWOT

16 Appendix

  • 16.1 Scope of the report
    • Market definition
    • Objectives
    • Notes and caveats
  • 16.2 Inclusions and exclusions checklist
    • Inclusions checklist
    • Exclusions checklist
  • 16.3 Currency conversion rates for US$
    • Currency conversion rates for US$
  • 16.4 Research methodology
    • Research methodology
  • 16.5 Data procurement
    • Information sources
  • 16.6 Data validation
    • Data validation
  • 16.7 Validation techniques employed for market sizing
    • Validation techniques employed for market sizing
  • 16.8 Data synthesis
    • Data synthesis
  • 16.9 360 degree market analysis
    • 360 degree market analysis
  • 16.10 List of abbreviations
    • List of abbreviations