2026-2030年全球碳化矽（SiC）市場

全球碳化矽 (SiC) 市場預計將從 2025 年到 2030 年成長至 180.699 億美元，預測期內複合年成長率為 42.2%。

本報告對全球碳化矽 (SiC) 市場進行了全面分析，包括市場規模和預測、趨勢、成長要素、挑戰以及對約 25 家公司的供應商分析。

本報告對當前市場狀況、最新趨勢和促進因素以及整體市場環境進行了最新分析。推動市場發展的因素包括：為實現規模經濟而向8英寸晶圓製造的轉型、電動汽車中高壓架構的日益普及以及人工智慧資料中心對高密度電源的需求。

本研究客觀地結合了一手和二手訊息，包括來自主要行業相關人員的信息。報告內容涵蓋主要公司分析、全面的市場規模數據、區域細分分析以及供應商格局。報告同時呈現了歷史數據和預測數據。

本研究指出，人工智慧資料中心電源架構的快速成長是未來幾年全球碳化矽（SiC）市場成長的主要驅動力之一。此外，重工業和採礦機械的電氣化以及向大規模200毫米晶圓製造的轉變，預計也將產生顯著的市場需求。

目錄

第1章：執行摘要

第2章 Technavio 分析

• 分析定價、生命週期、顧客購買籃子、採用率和購買標準。
• 輸入的重要性及差異化因素
• 干擾因素
• 促進因素和挑戰的影響

第3章 市場狀況

• 市場生態系統
• 市場特徵
• 價值鏈分析

第4章 市場規模

• 市場的定義
• 市場區隔分析
• 2025年市場規模
• 市場展望，2025-2030年

第5章 市場規模與表現

• 2020-2024年全球碳化矽（SiC）市場
• 產品細分市場分析，2020-2024 年
• 基於應用領域的細分市場分析，2020-2024 年
• 基於設備的細分市場分析，2020-2024 年
• 按規模分類的細分市場分析，2020-2024 年
• 區域區隔市場分析，2020-2024 年
• 2020-2024年各國細分市場分析

第6章 定性分析

• 人工智慧的影響：全球碳化矽（SiC）市場
• 地緣政治衝突對全球碳化矽（SIC）市場的影響。

第7章：五力分析

第8章 市場區隔：依產品

• 比較：按產品
• 電力電子
• 光電裝置
• 頻率設備
• 市場機會：依產品分類

第9章 市場區隔：依應用

• 比較：按應用
• 車
• 能源與電力
• 航太/國防
• 數據和通訊設備
• 其他
• 市場機會：依應用領域分類

第10章 市場區隔：依設備

• 比較：按設備
• SiC 分立元件
• SiC模組
• 市場機會：依設備分類

第11章 市場區隔：依規模

• 比較：依尺寸
• 150毫米或更小
• 超過150毫米
• 市場機會：按規模分類

第12章 客戶狀況

第13章 區域情勢

• 區域細分
• 區域比較
• 亞太地區
  • 中國
  • 日本
  • 韓國
  • 印度
  • 澳洲
  • 印尼
• 北美洲
  • 美國
  • 加拿大
  • 墨西哥
• 歐洲
  • 德國
  • 法國
  • 英國
  • 義大利
  • 西班牙
  • 荷蘭
• 南美洲
  • 巴西
  • 阿根廷
  • 智利
• 中東和非洲
  • 沙烏地阿拉伯
  • UAE
  • 南非
  • 土耳其
  • 以色列
• 市場機會：按地區分類

第14章 促進因素、挑戰與機遇

• 市場促進因素
• 市場挑戰
• 促進因素和挑戰的影響
• 市場機遇

第15章 競爭格局

• 概述
• 競爭格局
• 混亂局面
• 產業風險

第16章 競爭分析

• 公司簡介
• 公司排名指標
• 企業市場定位
• AGSCO Corp.
• Asuzac Fine Ceramics Co Ltd
• CeramTec GmbH
• Compagnie de Saint Gobain SA
• CoorsTek Inc.
• Dow Chemical Co.
• Hongwu International Group Ltd.
• Imerys SA
• Infineon Technologies AG
• Mersen Corporate Services SAS
• Miller and Co.
• Morgan Advanced Materials
• Murugappa Group
• ON Semiconductor Corp.
• Tokai Carbon Co. Ltd.

第17章附錄

The global silicon carbide (SIC) market is forecasted to grow by USD 18069.9 mn during 2025-2030, accelerating at a CAGR of 42.2% during the forecast period. The report on the global silicon carbide (SIC) market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by transition toward eight-inch wafer manufacturing for economies of scale, escalation of high-voltage architecture adoption in electric mobility, demands of ai data centers for high-density power.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.

Technavio's global silicon carbide (SIC) market is segmented as below:

By Product

• Power electronics
• Optoelectronic devices
• Frequency devices

By Application

• Automotive
• Energy and power
• Aerospace and defense
• Data and communication devices
• Others

By Device

• SiC discrete device
• SiC module

By Measurement

• Up to 150mm
• Greater than 150mm

Geography

• APAC
  • China
  • Japan
  • South Korea
  • India
  • Australia
  • Indonesia
• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • France
  • UK
  • Italy
  • Spain
  • The Netherlands
• South America
  • Brazil
  • Argentina
  • Chile
• Middle East and Africa
  • UAE
  • South Africa
  • Turkey
• Rest of World (ROW)

This study identifies the surge in ai data center power architectures as one of the prime reasons driving the global silicon carbide (SIC) market growth during the next few years. Also, electrification of heavy industrial and mining machinery and transition to large scale 200mm wafer manufacturing will lead to sizable demand in the market.

The report on the global silicon carbide (SIC) market covers the following areas:

• Global silicon carbide (SIC) market sizing
• Global silicon carbide (SIC) market forecast
• Global silicon carbide (SIC) market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading global silicon carbide (SIC) market vendors that include AGSCO Corp., Asuzac Fine Ceramics Co Ltd, CeramTec GmbH, Compagnie de Saint Gobain SA, CoorsTek Inc., Dow Chemical Co., ESD SIC bv, ESK SiC GmbH, Hongwu International Group Ltd., Imerys S.A., Infineon Technologies AG, Kyocera Corp., Mersen Corporate Services SAS, Miller and Co., Morgan Advanced Materials, Murugappa Group, ON Semiconductor Corp., SNAM Abrasives Pvt. Ltd., Tokai Carbon Co. Ltd., Xiamen Powerway Co. Ltd.. Also, the global silicon carbide (SIC) market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

• 1.1 Market overview
  • Executive Summary - Chart on Market Overview
  • Executive Summary - Data Table on Market Overview
  • Executive Summary - Chart on Global Market Characteristics
  • Executive Summary - Chart on Market by Geography
  • Executive Summary - Chart on Market Segmentation by Product
  • Executive Summary - Chart on Market Segmentation by Application
  • Executive Summary - Chart on Market Segmentation by Device
  • Executive Summary - Chart on Market Segmentation by Measurement
  • Executive Summary - Chart on Incremental Growth
  • Executive Summary - Data Table on Incremental Growth
  • Executive Summary - Chart on Company Market Positioning

2 Technavio Analysis

• 2.1 Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
  • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
• 2.2 Criticality of inputs and Factors of differentiation
• 2.3 Factors of disruption
• 2.4 Impact of drivers and challenges

3 Market Landscape

• 3.1 Market ecosystem
• 3.2 Market characteristics
• 3.3 Value chain analysis

4 Market Sizing

• 4.1 Market definition
• 4.2 Market segment analysis
  • Market segments
• 4.3 Market size 2025
• 4.4 Market outlook: Forecast for 2025-2030

5 Historic Market Size

• 5.1 Global Silicon Carbide (SiC) Market 2020 - 2024
  • Historic Market Size - Data Table on Global Silicon Carbide (SiC) Market 2020 - 2024 ($ million)
• 5.2 Product segment analysis 2020 - 2024
  • Historic Market Size - Product Segment 2020 - 2024 ($ million)
• 5.3 Application segment analysis 2020 - 2024
  • Historic Market Size - Application Segment 2020 - 2024 ($ million)
• 5.4 Device segment analysis 2020 - 2024
  • Historic Market Size - Device Segment 2020 - 2024 ($ million)
• 5.5 Measurement segment analysis 2020 - 2024
  • Historic Market Size - Measurement Segment 2020 - 2024 ($ million)
• 5.6 Geography segment analysis 2020 - 2024
  • Historic Market Size - Geography Segment 2020 - 2024 ($ million)
• 5.7 Country segment analysis 2020 - 2024
  • Historic Market Size - Country Segment 2020 - 2024 ($ million)

6 Qualitative Analysis

• 6.1 Impact of AI in global silicon carbide (SiC) market
• 6.2 Impact of geopolitical conflict on global silicon carbide (SiC) market

7 Five Forces Analysis

• 7.1 Five forces summary
  • Five forces analysis - Comparison between 2025 and 2030
• 7.2 Bargaining power of buyers
  • Bargaining power of buyers - Impact of key factors 2025 and 2030
• 7.3 Bargaining power of suppliers
  • Bargaining power of suppliers - Impact of key factors in 2025 and 2030
• 7.4 Threat of new entrants
  • Threat of new entrants - Impact of key factors in 2025 and 2030
• 7.5 Threat of substitutes
  • Threat of substitutes - Impact of key factors in 2025 and 2030
• 7.6 Threat of rivalry
  • Threat of rivalry - Impact of key factors in 2025 and 2030
• 7.7 Market condition

8 Market Segmentation by Product

• 8.1 Market segments
• 8.2 Comparison by Product
• 8.3 Power electronics - Market size and forecast 2025-2030
• 8.4 Optoelectronic devices - Market size and forecast 2025-2030
• 8.5 Frequency devices - Market size and forecast 2025-2030
• 8.6 Market opportunity by Product
  • Market opportunity by Product ($ million)

9 Market Segmentation by Application

• 9.1 Market segments
• 9.2 Comparison by Application
• 9.3 Automotive - Market size and forecast 2025-2030
• 9.4 Energy and power - Market size and forecast 2025-2030
• 9.5 Aerospace and defense - Market size and forecast 2025-2030
• 9.6 Data and communication devices - Market size and forecast 2025-2030
• 9.7 Others - Market size and forecast 2025-2030
• 9.8 Market opportunity by Application
  • Market opportunity by Application ($ million)

10 Market Segmentation by Device

• 10.1 Market segments
• 10.2 Comparison by Device
• 10.3 SiC discrete device - Market size and forecast 2025-2030
• 10.4 SiC module - Market size and forecast 2025-2030
• 10.5 Market opportunity by Device
  • Market opportunity by Device ($ million)

11 Market Segmentation by Measurement

• 11.1 Market segments
• 11.2 Comparison by Measurement
• 11.3 Up to 150mm - Market size and forecast 2025-2030
• 11.4 Greater than 150mm - Market size and forecast 2025-2030
• 11.5 Market opportunity by Measurement
  • Market opportunity by Measurement ($ million)

12 Customer Landscape

• 12.1 Customer landscape overview
  • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

13 Geographic Landscape

• 13.1 Geographic segmentation
• 13.2 Geographic comparison
• 13.3 APAC - Market size and forecast 2025-2030
  • 13.3.1 China - Market size and forecast 2025-2030
  • 13.3.2 Japan - Market size and forecast 2025-2030
  • 13.3.3 South Korea - Market size and forecast 2025-2030
  • 13.3.4 India - Market size and forecast 2025-2030
  • 13.3.5 Australia - Market size and forecast 2025-2030
  • 13.3.6 Indonesia - Market size and forecast 2025-2030
• 13.4 North America - Market size and forecast 2025-2030
  • 13.4.1 US - Market size and forecast 2025-2030
  • 13.4.2 Canada - Market size and forecast 2025-2030
  • 13.4.3 Mexico - Market size and forecast 2025-2030
• 13.5 Europe - Market size and forecast 2025-2030
  • 13.5.1 Germany - Market size and forecast 2025-2030
  • 13.5.2 France - Market size and forecast 2025-2030
  • 13.5.3 UK - Market size and forecast 2025-2030
  • 13.5.4 Italy - Market size and forecast 2025-2030
  • 13.5.5 Spain - Market size and forecast 2025-2030
  • 13.5.6 The Netherlands - Market size and forecast 2025-2030
• 13.6 South America - Market size and forecast 2025-2030
  • 13.6.1 Brazil - Market size and forecast 2025-2030
  • 13.6.2 Argentina - Market size and forecast 2025-2030
  • 13.6.3 Chile - Market size and forecast 2025-2030
• 13.7 Middle East and Africa - Market size and forecast 2025-2030
  • 13.7.1 Saudi Arabia - Market size and forecast 2025-2030
  • 13.7.2 UAE - Market size and forecast 2025-2030
  • 13.7.3 South Africa - Market size and forecast 2025-2030
  • 13.7.4 Turkey - Market size and forecast 2025-2030
  • 13.7.5 Israel - Market size and forecast 2025-2030
• 13.8 Market opportunity by geography
  • Market opportunity by geography ($ million)
  • Data Tables on Market opportunity by geography ($ million)

14 Drivers, Challenges, and Opportunity

• 14.1 Market drivers
  • Transition toward eight-inch wafer manufacturing for economies of scale
  • Escalation of high-voltage architecture adoption in electric mobility
  • Demands of AI data centers for high-density power
• 14.2 Market challenges
  • Manufacturing complexity and yield limitations in large-diameter wafers
  • Structural vulnerabilities and geographic concentration of raw feedstocks
  • Lengthy qualification cycles and evolving global regulatory frameworks
• 14.3 Impact of drivers and challenges
  • Impact of drivers and challenges in 2025 and 2030
• 14.4 Market opportunities
  • Surge in AI data center power architectures
  • Electrification of heavy industrial and mining machinery
  • Transition to large scale 200mm wafer manufacturing

15 Competitive Landscape

• 15.1 Overview
• 15.2 Competitive Landscape
  • Overview on criticality of inputs and factors of differentiation
• 15.3 Landscape disruption
  • Overview on factors of disruption
• 15.4 Industry risks
  • Impact of key risks on business

16 Competitive Analysis

• 16.1 Companies profiled
  • Companies covered
• 16.2 Company ranking index
  • Company ranking index
• 16.3 Market positioning of companies
  • Matrix on companies position and classification
• 16.4 AGSCO Corp.
  • AGSCO Corp. - Overview
  • AGSCO Corp. - Product / Service
  • AGSCO Corp. - Key offerings
  • SWOT
• 16.5 Asuzac Fine Ceramics Co Ltd
  • Asuzac Fine Ceramics Co Ltd - Overview
  • Asuzac Fine Ceramics Co Ltd - Product / Service
  • Asuzac Fine Ceramics Co Ltd - Key offerings
  • SWOT
• 16.6 CeramTec GmbH
  • CeramTec GmbH - Overview
  • CeramTec GmbH - Business segments
  • CeramTec GmbH - Key offerings
  • CeramTec GmbH - Segment focus
  • SWOT
• 16.7 Compagnie de Saint Gobain SA
  • Compagnie de Saint Gobain SA - Overview
  • Compagnie de Saint Gobain SA - Business segments
  • Compagnie de Saint Gobain SA - Key offerings
  • Compagnie de Saint Gobain SA - Segment focus
  • SWOT
• 16.8 CoorsTek Inc.
  • CoorsTek Inc. - Overview
  • CoorsTek Inc. - Product / Service
  • CoorsTek Inc. - Key offerings
  • SWOT
• 16.9 Dow Chemical Co.
  • Dow Chemical Co. - Overview
  • Dow Chemical Co. - Business segments
  • Dow Chemical Co. - Key offerings
  • Dow Chemical Co. - Segment focus
  • SWOT
• 16.10 Hongwu International Group Ltd.
  • Hongwu International Group Ltd. - Overview
  • Hongwu International Group Ltd. - Product / Service
  • Hongwu International Group Ltd. - Key offerings
  • SWOT
• 16.11 Imerys S.A.
  • Imerys S.A. - Overview
  • Imerys S.A. - Business segments
  • Imerys S.A. - Key news
  • Imerys S.A. - Key offerings
  • Imerys S.A. - Segment focus
  • SWOT
• 16.12 Infineon Technologies AG
  • Infineon Technologies AG - Overview
  • Infineon Technologies AG - Business segments
  • Infineon Technologies AG - Key news
  • Infineon Technologies AG - Key offerings
  • Infineon Technologies AG - Segment focus
  • SWOT
• 16.13 Mersen Corporate Services SAS
  • Mersen Corporate Services SAS - Overview
  • Mersen Corporate Services SAS - Business segments
  • Mersen Corporate Services SAS - Key offerings
  • Mersen Corporate Services SAS - Segment focus
  • SWOT
• 16.14 Miller and Co.
  • Miller and Co. - Overview
  • Miller and Co. - Product / Service
  • Miller and Co. - Key offerings
  • SWOT
• 16.15 Morgan Advanced Materials
  • Morgan Advanced Materials - Overview
  • Morgan Advanced Materials - Business segments
  • Morgan Advanced Materials - Key offerings
  • Morgan Advanced Materials - Segment focus
  • SWOT
• 16.16 Murugappa Group
  • Murugappa Group - Overview
  • Murugappa Group - Product / Service
  • Murugappa Group - Key offerings
  • SWOT
• 16.17 ON Semiconductor Corp.
  • ON Semiconductor Corp. - Overview
  • ON Semiconductor Corp. - Business segments
  • ON Semiconductor Corp. - Key news
  • ON Semiconductor Corp. - Key offerings
  • ON Semiconductor Corp. - Segment focus
  • SWOT
• 16.18 Tokai Carbon Co. Ltd.
  • Tokai Carbon Co. Ltd. - Overview
  • Tokai Carbon Co. Ltd. - Product / Service
  • Tokai Carbon Co. Ltd. - Key offerings
  • SWOT

17 Appendix

• 17.1 Scope of the report
  • Market definition
  • Objectives
  • Notes and caveats
• 17.2 Inclusions and exclusions checklist
  • Inclusions checklist
  • Exclusions checklist
• 17.3 Currency conversion rates for US$
  • Currency conversion rates for US$
• 17.4 Research methodology
  • Research methodology
• 17.5 Data procurement
  • Information sources
• 17.6 Data validation
  • Data validation
• 17.7 Validation techniques employed for market sizing
  • Validation techniques employed for market sizing
• 17.8 Data synthesis
  • Data synthesis
• 17.9 360 degree market analysis
  • 360 degree market analysis
• 17.10 List of abbreviations
  • List of abbreviations