市場調查報告書
商品編碼
1403888
200mm 半導體的全球市場 - 預測期:2024-2030200mm Semiconductor Market - Forecast Period 2024-2030 |
2030年,全球200毫米半導體市場規模預計將達到58.603億美元,2024-2030年預測期間複合年增長率為5.82%。
由於電子產品的小型化、全球智慧型手機和穿戴式科技消費的增加,預計該市場將在整個預測期內穩步擴張。半導體材料薄片(稱為半導體晶圓)用於製造積體電路、記憶體晶片和感測器等電子元件。電子設備在消費性電子、汽車、航空航太和醫療等各領域的使用不斷增加,推動了對 200mm 半導體晶圓的需求。隨著這些行業的不斷擴張和技術創新的進步,對尖端半導體晶圓的需求不斷增加。對更多整合電子產品的需求正在推動小型化。這是200mm半導體晶圓市場的主要驅動因素之一。此外,半導體晶圓在太陽能電池、積體電路、電磁電池、智慧型手機、平板電腦、智慧穿戴、微晶片、電晶體、二極體、整流器等領域的接受度不斷提高,也支撐著半導體晶圓市場的擴張。
研發方面的巨額投資和技術進步是200mm半導體市場的主要驅動因素。得益於半導體產業,電子、交通和自動化都取得了重大進步,半導體技術逐漸成為所有現代技術的支柱。該領域的發現和改進對所有下游技術產生直接影響。特別是,代工廠越來越多地投資基於矽晶圓的增強型封裝技術。使用 2D 材料而不是矽來開發單晶片 3D 積體電路是代工廠商正在探索的一種提高電晶體密度的方法。例如,TSMC的 COWS 技術創造了世界上最大的矽中介層,在一個封裝中容納了兩個極其強大的處理器和八個 HBM 記憶體。2022 年 9 月,全球碳化矽技術領導者 Wolfspeed, Inc. 宣佈在北卡羅來納州查塔姆縣建設一座耗資數十億美元的最先進材料製造工廠。Wolfspeed 宣布對一家專注於 200mm 晶圓的 SiC 材料製造工廠進行初始投資 13 億美元。施工預計將於 2024 年完成。該廠將主要生產200毫米碳化矽晶圓。該晶圓比 150mm 晶圓大 1.7 倍,增加了每個晶圓的晶片數量,最終降低了裝置成本。這些晶圓將供應給 Wolfspeed 的Mohawk Valley Fab,該工廠於今年稍早開業,是世界上第一家、最大且唯一的全自動 200 毫米碳化矽製造工廠。
本報告研究了全球 200mm 半導體市場,並提供了市場份額、驅動因素、細分市場、地區和主要參與者的分析。
The 200mm Semiconductor market size is forecast to reach USD 5,860.3 million by 2030, after growing at a CAGR of 5.82% during the forecast period 2024-2030. A 200mm semiconductor typically refers to the diameter of the silicon wafers used in semiconductor manufacturing. The term specifically indicates that the wafers have a diameter of 200 millimeters or approximately 7.87 inches. These wafers are a standardized size used in the fabrication of integrated circuits and other semiconductor devices.There is a sustained demand for 200mm wafers in various industries, including automotive,industrial, and consumer electronics. These sectors often require components and chips that can be efficiently manufactured on 200mm wafers.
The report, "200mm Semiconductor Market- Forecast (2024-2030)", by IndustryARC, covers an in-depth analysis of the following segments of 200mm Semiconductor.
By Semiconductor wafers Type: Undoped 200mm Semiconductors Wafers, Doped 200mm semiconductor wafers
By Product Type: 200mm Silicon Carbide Wafer, 200mm Silicon Wafer
By Application: Analog, Display Drivers, Power Management ICs (PMICs), RF Devices And Others
By End User: Communication, Consumer Electronics, Automotive, Industrial Others
By Geography: North America, South America, Europe, APAC, Middle East & Africa
Doped 200mm semiconductor wafers led the market with a 78% market share in 2022 andare predicted to increase at the same pace owing to their ability to modify the conductivit of the material. Since more sophisticated electronics are being used in a wider range of applications, including consumer electronics, industrial automation, and automotive, the market for highly doped silicon wafers has expanded dramatically in recent years. The demand for Analog ICs that require 200mm semiconductor wafers is predicted to drive the growth of the doped 200mm semiconductor wafers market during the forecast period 2024-2030. Moreover, the rapid advancement of IoT necessitates the growth of ICs in a variety of domains such as information systems, health care, and energy management. Analog circuits and integration technologies have made significant contributions in these sectors in recent years.
The Power Management ICs (PMICs ) accounted for the largest share with a market share of 35% in 2023. As major players are trying to push the boundaries of power through new process, packaging, and circuit design technologies-including the incorporation of 200 mm semiconductors to deliver devices that are appropriate for the application-the market for Power Management Integrated Circuits has been growing. The development of automobiles and their manufacture is another factor fueling the demand for small, energy-efficient electronics. Some of the main factors driving the need for power management integrated circuits (ICs) in the automotive industry are the expanding production of automobiles and the addition of advanced features. The growth of the 200mm semiconductors market is driven by the PMICS that are used in automotive applications. For example, the International Energy Agency (IEA) estimates that there will be about 25.9 million electric vehicles globally in 2022. In that year, approximately 69.5% of plug-in electric vehicles were all-electric.
Consumer Electronics occupied a dominant position with a market share of 38% in the 200mm Semiconductor market in 2023. Numerous 200mm semiconductor components, including memory chips, power management ICs, sensors, and microcontrollers, are utilized in consumer electronics and are produced utilizing well-proven, well-established techniques that are tailored for 200mm wafers. Smaller, more compact components are frequently required for consumer devices. The 200mm wafer size is ideal for creating tiny semiconductor devices that match the form factors of contemporary electronics, such as wearables, tablets, smartphones, and Internet of Things gadgets. For instance, According to Invest India, India's exports of electronic items grew at a 30% compound annual growth rate, from $5 billion in FY17 to $24 billion in FY23. By FY26, the nation's electronics exports are predicted to total $120 billion. By FY26, India is predicted to have a $1 trillion digital economy. India's electronics sector is currently estimated to be worth $155 billion, of which 65% is produced domestically. The market for 200mm semiconductors has been made possible by the thriving consumer electronics sector.
The APAC region in the 200mm Semiconductor market is dominated the market with the market share of 35% in 2023. APAC Countries such as China, Japan, and Korea driving the market. For instance, China is predicted to contribute the most to the 200mm capacity boost, with a 22 percent increase. China is expected to have a large proportion of 200mm semiconductor capacity by 2023. China's primary strengths include a significant chip market demand, a high number of qualified engineers in chip design and logic process technologies, and government assistance. The essential inputs, EDA, and especially capital equipment are China's industrial shortcomings. The US-China tech conflict is likely to force global semiconductor makers to break production, design, and sales into separate organizations. The COVID-19 epidemic is anticipated to hasten the long-term movement of low-value-added manufacturing away from China and toward Southeast Asia. As a result, OEM and ODM diversification is ongoing. China has a "Big Fund" of $50 billion for the growth of its domestic semiconductor industry, which will be leveraged in two phases. Nonetheless, it may not be large enough in the long run to generate the required cash.
The Global market for 200mm semiconductors is expected to increase steadily throughout the forecast period, owing to the miniaturization of electronic products and the increasing global consumption of smartphones and wearable technology. Thin slices of semiconductor material known as semiconductor wafers are used to create electronic components like integrated circuits, memory chips, and sensors. The increasing use of electronic devices across a range of sectors, including consumer electronics, automotive, aerospace, and healthcare, is driving up demand for 200mm semiconductor wafers. The demand for cutting-edge semiconductor wafers is rising along with these industries' continued expansion and innovation. The necessity for more integrated electronics has resulted in increased miniaturization. This is one of the primary drivers of the 200mm semiconductor wafer market. Furthermore, the growing acceptance of semiconductor wafers in solar cells, integrated circuits, electromagnetic cells, smartphones, tablets, smart wear, microchips, transistors, diodes, andrectifiers is likely to drive semiconductor wafer market expansion.
Significant investments in R&D and technological advancements are the key drivers of the 200mm semiconductors market. Electronics, transportation, and automation have all witnessed great advances, owing in large part to the semiconductor sector, with semiconductor technology emerging as the backbone of all modern technologies. The discoveries and improvements in this discipline have a direct impact on all downstream technologies. In particular, silicon wafer-based enhanced packaging techniques, foundries are investing more and more. The development of monolithic three-dimensional integrated circuits using two-dimensional materials rather than silicon is one method being investigated by foundry vendors to increase transistor density. For instance, the chip on wafer on substrate (COWS) technology from TSMC created the largest silicon interposer in the world, housing two extremely powerful processors along with eight HBM memory devices in a single package. In September 2022, Wolfspeed, Inc., one of the global leaders in Silicon Carbide technology, announced it will build a new, state-of-the-art, multi-billion-dollar Materials manufacturing facility in Chatham County, North Carolina. Wolfspeed announced a $1.3B investment initially for a SiC materials manufacturing facility, primarily 200mm wafers. The phase construction is anticipated to be complete in 2024. The facility will primarily produce 200mm Silicon Carbide wafers, which are 1.7x larger than 150mm wafers, translating into more chips per wafer and ultimately, lower device costs. These wafers will be used to supply Wolfspeed's Mohawk Valley Fab, which opened earlier this year as the world's first, largest, and only fully automated 200mm Silicon Carbide fabrication facility.
About 2 million integrated circuits are typically produced each month in a typical semiconductor facility, using more than 20 million gallons of water. Industrial wastewater must ultimately be discharged in order for this to occur. Wafer producers also use a lot of hazardous chemicals that are bad for the environment. As a result, producers are receiving a lot of criticism from authorities and environmentalists, which is anticipated to limit the long-term growth potential of 200mm semiconductor wafers globally. High-frequency limitations are also leading to environmental issues. Manufacturing processes that are precise and dependable are commonly required for high-frequency applications. Even minor adjustments to factors like doping concentration, oxide thickness, or etching depth can have a big effect on performance in high-frequency devices. Heat dissipation is the main challenge in high-frequency applications. To prevent device degradation or failure as frequency and power densities increase, effective thermal management is essential.
While the semiconductor industry faces significant challenges in terms of sustainability, it is taking steps to address these issues and move towards a more sustainable future. For instance, STMicroelectronics Published a 2023 Sustainability Report. The company is track to become carbon neutral by 2027 with global sourcing of electricity from renewable energy growing to 62% in 2022, from 51% in 2021.
One of the challenges is the high expense of converting to renewable energy sources. While solar electricity has the potential to be incredibly successful, it is presently somewhat pricey. To make solar electricity more inexpensive, the semiconductor sector will need to invest in research and development
In 2022, the top ten players in the 200mm Semiconductor market share accounted for 54.2% of the share. Major players in the 200mm Semiconductor market are STMicroelectronics, Infineon, Texas Instruments, SMIC, Vanguard, NXP, ON Semi, Toshiba, Wolfspeed, Inc, Mitsubishi Electric Corporation, Robert Bosch GmbH and Others.
(Company Revenue, Products, M&A, Developments)
"*Financials would be provided on a best-efforts basis for private companies"