市場調查報告書
商品編碼
1370530
微控制器插座市場:2023-2028 年全球產業趨勢、佔有率、規模、成長、機會與預測Microcontroller Socket Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028 |
2022年全球微控制器插座市場規模達到11億美元。展望未來,IMARC Group預計到2028年市場規模將達到16億美元,2023-2028年的年複合成長率(CAGR)為5.5%。
微控制器插座也稱為積體電路 (IC) 插座,是專為低功耗設備設計的靜態連接器。四方扁平封裝 (QFP)、小外形封裝 (SOP)、雙列直插式封裝 (DIP)、球柵陣列 (BGA) 和小外形 IC (SOIC) 是一些標準產品變體。這些插座用於安全地插入和取出可能因焊接而損壞的 IC 晶片。微控制器插座具有許多優點,例如低功耗、最佳資料頻寬、靈活性、敏感度、高階使用者介面支援和低系統成本。因此,它們在汽車、消費性電子、工業、醫療、軍事和國防工業中得到了廣泛的應用。
該市場主要是由汽車行業廣泛採用的產品所推動的。微控制器插座用於支援車身電子、駕駛安全和資訊設備的小型設計和高整合度。與此一致的是,智慧能源對高精度計量和電力線通訊的需求不斷成長,進一步有助於提高電錶的性能,有利於市場成長。此外,對有助於小型化和數位化並促進技術領域動態發展的自動化的需求不斷成長,也是另一個成長誘導因素。除此之外,支援高性能、高密度需求並提供快速解決方案的小型化微控制器插座的推出也為市場成長提供了動力。此外,BGA 的廣泛採用通常是永久安裝設備(例如微處理器)的首選,並且用於 IC 和表面貼裝封裝的面積類型,正在推動市場成長。此外,主要參與者專注於開發 IC 封裝技術,以低成本、外形和功率設計提供高應用,這對市場成長產生了積極影響。這些因素,包括軍事和國防工業中廣泛採用產品以增強安全性以及廣泛的研發(R&D)活動,正在支持市場成長。
The global microcontroller socket market size reached US$ 1.1 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 1.6 Billion by 2028, exhibiting a growth rate (CAGR) of 5.5% during 2023-2028.
Microcontroller sockets, also known as integrated circuit (IC) sockets, are static connectors designed for low-power devices. Quad-flat package (QFP), small outline package (SOP), dual-in-line package (DIP), ball grid array (BGA), and small outline IC (SOIC) are some standard product variants. These sockets are used to safely insert and remove IC chips that may get damaged from soldering. Microcontroller sockets offer numerous advantages, such as low power consumption, optimal data bandwidth, flexibility, susceptibility, high-end user interface support, and low system cost. As a result, they find extensive applications across the automotive, consumer electronics, industrial, medical, military, and defense industries.
The market is primarily being driven by the widespread product adoption in the automotive industry. Microcontroller sockets are used to support the small design and high level of integration in body electronics, driving safety, and information devices. In line with this, the escalating demand for smart energy for metering and power line communications with high accuracy, further helping in improving the performance of meters, is favoring the market growth. Additionally, the increasing need for automation that assists in miniaturization and digitization and facilitates dynamics in the field of technology is acting as another growth-inducing factor. Apart from this, the introduction of miniaturized microcontroller sockets that supports high-performance, high-density demands and deliver fast solutions is providing an impetus to the market growth. Moreover, the widespread adoption of BGAs that are usually preferred for permanently mounted devices, such as microprocessors, and are used for ICs and area type of surface-mount packaging is propelling the market growth. Furthermore, key players are focusing on developing IC packaging techniques delivering a high application in a low-cost, -profile, and -power design is positively influencing the market growth. The factors, including the widespread product adoption in the military and defense industry for enhanced security and extensive research and development (R&D) activities, are supporting the market growth.
IMARC Group provides an analysis of the key trends in each sub-segment of the global microcontroller socket market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on product and application.
DIP
BGA
QFP
SOP
SOIC
Automotive
Consumer Electronics
Industrial
Medical Devices
Military and Defense
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The competitive landscape of the industry has also been examined along with the profiles of the key players being Advanced Interconnections, Andon Electronics, Aries Electronics Inc., Johnstech International Corporation, Loranger International Corporation, Microchip Technology, Mill-Max Mfg. Corp., PRECI-DIP SA, TE Connectivity and Texas Instruments Inc.