Product Code: SR112023A5612
Market Overview:
The global advanced IC substrate market size reached US$ 9.4 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 13.8 Billion by 2028, exhibiting a growth rate (CAGR) of 6.2% during 2023-2028.
Advanced integrated circuit (IC) substrate is a baseboard used to connect the printed circuit boards (PCBs) to the semiconductor chips. It is compact, durable, lightweight, energy-efficient, and cost-effective and exhibits high thermal dissipation performance. In addition, it provides high reliability and outstanding electrical properties, reduces the overall weight of PCBs, and increases their functionality and dimensional control. As a result, it is currently widely used for manufacturing miniaturized electronic products with the latest functions.
Advanced IC Substrate Market Trends:
The escalating demand for miniaturized consumer electronic products, such as tablets, laptops, smartphones, and personal computers (PCs), represents one of the key factors impelling the market growth. Moreover, the rising need for remote-controlled electrical equipment in industrial applications is contributing to the market growth. Apart from this, defense departments in various countries rely on several microelectronics, such as nuclear-armed bombers, submarines, intercontinental ballistic missiles, and space-based sensors, to make deterrence strategies that protect deployed forces, allies, and partners. Furthermore, as sensitive microelectronics are vulnerable to high levels of ionizing radiation, defense agencies are deploying advanced IC substrates to protect them in hazardous conditions. Besides this, a wide range of applications of handheld, portable, and implantable medical electronic devices in the diagnosis and treatment of various critical diseases is catalyzing the demand for advanced IC substrates in the healthcare industry. In line with this, the growing trend of cars with driverless and safety features and innovative infotainment systems are contributing to the adoption of advanced IC substrates in the automotive industry. This can also be accredited with efforts undertaken by governing agencies of numerous countries to promote green, electric vehicles (EVs) and minimize greenhouse (GHG) emissions of automobiles.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global advanced IC substrate market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on type and application.
Breakup by Type:
Breakup by Application:
- Consumer Electronics
- Automotive and Transportation
- IT and Telecom
- Others
Breakup by Region:
- North America
- Asia-Pacific
- China
- Japan
- India
- South Korea
- Australia
- Indonesia
- Others
- Europe
- Germany
- France
- United Kingdom
- Italy
- Spain
- Russia
- Others
- Latin America
- Middle East and Africa
Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being ASE Group, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Fujitsu Limited, Ibiden Co. Ltd., JCET Group Co. Ltd, Kinsus Interconnect Technology Corp., Korea Circuit Co. Ltd., KYOCERA Corporation, LG Innotek Co. Ltd., Nan Ya PCB Co. Ltd. (Nan Ya Plastics Corporation), TTM Technologies Inc. and Unimicron Technology Corporation (United Microelectronics Corporation).
Key Questions Answered in This Report:
- How has the global advanced IC substrate market performed so far and how will it perform in the coming years?
- What has been the impact of COVID-19 on the global advanced IC substrate market?
- What are the key regional markets?
- What is the breakup of the market based on the type?
- What is the breakup of the market based on the application?
- What are the various stages in the value chain of the industry?
- What are the key driving factors and challenges in the industry?
- What is the structure of the global advanced IC substrate market and who are the key players?
- What is the degree of competition in the industry?
Table of Contents
1 Preface
2 Scope and Methodology
- 2.1 Objectives of the Study
- 2.2 Stakeholders
- 2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
- 2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
- 2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
- 4.1 Overview
- 4.2 Key Industry Trends
5 Global Advanced IC Substrate Market
- 5.1 Market Overview
- 5.2 Market Performance
- 5.3 Impact of COVID-19
- 5.4 Market Forecast
6 Market Breakup by Type
- 6.1 FC BGA
- 6.1.1 Market Trends
- 6.1.2 Market Forecast
- 6.2 FC CSP
- 6.2.1 Market Trends
- 6.2.2 Market Forecast
7 Market Breakup by Application
- 7.1 Consumer Electronics
- 7.1.1 Market Trends
- 7.1.2 Market Forecast
- 7.2 Automotive and Transportation
- 7.2.1 Market Trends
- 7.2.2 Market Forecast
- 7.3 IT and Telecom
- 7.3.1 Market Trends
- 7.3.2 Market Forecast
- 7.4 Others
- 7.4.1 Market Trends
- 7.4.2 Market Forecast
8 Market Breakup by Region
- 8.1 North America
- 8.1.1 United States
- 8.1.1.1 Market Trends
- 8.1.1.2 Market Forecast
- 8.1.2 Canada
- 8.1.2.1 Market Trends
- 8.1.2.2 Market Forecast
- 8.2 Asia-Pacific
- 8.2.1 China
- 8.2.1.1 Market Trends
- 8.2.1.2 Market Forecast
- 8.2.2 Japan
- 8.2.2.1 Market Trends
- 8.2.2.2 Market Forecast
- 8.2.3 India
- 8.2.3.1 Market Trends
- 8.2.3.2 Market Forecast
- 8.2.4 South Korea
- 8.2.4.1 Market Trends
- 8.2.4.2 Market Forecast
- 8.2.5 Australia
- 8.2.5.1 Market Trends
- 8.2.5.2 Market Forecast
- 8.2.6 Indonesia
- 8.2.6.1 Market Trends
- 8.2.6.2 Market Forecast
- 8.2.7 Others
- 8.2.7.1 Market Trends
- 8.2.7.2 Market Forecast
- 8.3 Europe
- 8.3.1 Germany
- 8.3.1.1 Market Trends
- 8.3.1.2 Market Forecast
- 8.3.2 France
- 8.3.2.1 Market Trends
- 8.3.2.2 Market Forecast
- 8.3.3 United Kingdom
- 8.3.3.1 Market Trends
- 8.3.3.2 Market Forecast
- 8.3.4 Italy
- 8.3.4.1 Market Trends
- 8.3.4.2 Market Forecast
- 8.3.5 Spain
- 8.3.5.1 Market Trends
- 8.3.5.2 Market Forecast
- 8.3.6 Russia
- 8.3.6.1 Market Trends
- 8.3.6.2 Market Forecast
- 8.3.7 Others
- 8.3.7.1 Market Trends
- 8.3.7.2 Market Forecast
- 8.4 Latin America
- 8.4.1 Brazil
- 8.4.1.1 Market Trends
- 8.4.1.2 Market Forecast
- 8.4.2 Mexico
- 8.4.2.1 Market Trends
- 8.4.2.2 Market Forecast
- 8.4.3 Others
- 8.4.3.1 Market Trends
- 8.4.3.2 Market Forecast
- 8.5 Middle East and Africa
- 8.5.1 Market Trends
- 8.5.2 Market Breakup by Country
- 8.5.3 Market Forecast
9 SWOT Analysis
- 9.1 Overview
- 9.2 Strengths
- 9.3 Weaknesses
- 9.4 Opportunities
- 9.5 Threats
10 Value Chain Analysis
11 Porters Five Forces Analysis
- 11.1 Overview
- 11.2 Bargaining Power of Buyers
- 11.3 Bargaining Power of Suppliers
- 11.4 Degree of Competition
- 11.5 Threat of New Entrants
- 11.6 Threat of Substitutes
12 Price Analysis
13 Competitive Landscape
- 13.1 Market Structure
- 13.2 Key Players
- 13.3 Profiles of Key Players
- 13.3.1 ASE Group
- 13.3.1.1 Company Overview
- 13.3.1.2 Product Portfolio
- 13.3.1.3 Financials
- 13.3.2 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- 13.3.2.1 Company Overview
- 13.3.2.2 Product Portfolio
- 13.3.2.3 Financials
- 13.3.3 Fujitsu Limited
- 13.3.3.1 Company Overview
- 13.3.3.2 Product Portfolio
- 13.3.3.3 Financials
- 13.3.3.4 SWOT Analysis
- 13.3.4 Ibiden Co. Ltd.
- 13.3.4.1 Company Overview
- 13.3.4.2 Product Portfolio
- 13.3.4.3 Financials
- 13.3.4.4 SWOT Analysis
- 13.3.5 JCET Group Co. Ltd
- 13.3.5.1 Company Overview
- 13.3.5.2 Product Portfolio
- 13.3.5.3 Financials
- 13.3.6 Kinsus Interconnect Technology Corp.
- 13.3.6.1 Company Overview
- 13.3.6.2 Product Portfolio
- 13.3.6.3 Financials
- 13.3.7 Korea Circuit Co. Ltd.
- 13.3.7.1 Company Overview
- 13.3.7.2 Product Portfolio
- 13.3.7.3 Financials
- 13.3.8 KYOCERA Corporation
- 13.3.8.1 Company Overview
- 13.3.8.2 Product Portfolio
- 13.3.8.3 Financials
- 13.3.8.4 SWOT Analysis
- 13.3.9 LG Innotek Co. Ltd.
- 13.3.9.1 Company Overview
- 13.3.9.2 Product Portfolio
- 13.3.9.3 Financials
- 13.3.9.4 SWOT Analysis
- 13.3.10 Nan Ya PCB Co. Ltd. (Nan Ya Plastics Corporation)
- 13.3.10.1 Company Overview
- 13.3.10.2 Product Portfolio
- 13.3.10.3 Financials
- 13.3.11 TTM Technologies Inc.
- 13.3.11.1 Company Overview
- 13.3.11.2 Product Portfolio
- 13.3.11.3 Financials
- 13.3.11.4 SWOT Analysis
- 13.3.12 Unimicron Technology Corporation (United Microelectronics Corporation)
- 13.3.12.1 Company Overview
- 13.3.12.2 Product Portfolio
- 13.3.12.3 Financials