嵌入式芯片封裝技術市場：2023-2028 年按平台、行業和地區劃分

到 2022 年，嵌入式芯片封裝技術的全球市場規模將達到 8100 萬美元。 展望未來，IMARC Group 預測到 2028 年將達到 1.7689 億美元，2023 年至 2028 年的增長率 (CAGR) 為 12.80%。

嵌入式芯片封裝技術用於通過多步製造工藝將組件嵌入基板中。 它由倒裝芯片級芯片級封裝（FC CSP）和晶圓級芯片級封裝（WL CSP）組成，以提高系統效率。 縮小整個印刷電路板 (PCB) 解決方案可為其他組件創造更多空間。 它還提供表面貼裝技術 (SMT) 集成和靈活的佈線解決方案，以減小印刷電路板 (PCB) 的尺寸。 它使靈活的設計能夠從 2D 過渡到 3D，同時減少失真和功率損耗。 因此，嵌入式芯片封裝技術在全球電子、信息技術 (IT)、汽車、醫療保健和電信行業得到廣泛應用。

嵌入式芯片封裝技術市場趨勢

• 目前，世界各地的微電子設備中的電子電路都變得越來越小。 這是隨著半導體行業的快速增長而推動市場的重要因素之一。 此外，嵌入式芯片封裝技術為 OEM 提供了多項優勢，例如改進的電氣和熱性能、混合裝載和簡化的物流，有助於市場增長。 自主機器人也越來越多地被部署在各個行業提供專業服務，為行業投資者提供有利可圖的增長機會。 此外，智能手機和可穿戴設備越來越多地使用嵌入式芯片封裝技術來擴展可用空間並集成更多組件，這對市場產生了積極影響。我來了。 此外，全球對集成物聯網 (IoT) 的嵌入式芯片封裝技術的需求也在不斷增長。 再加上筆記本電腦、電腦、平板電腦、電子閱讀器、智能手機、MP3 播放器、無人機和電子玩具等便攜式電子設備銷量的增長，正在推動市場增長。

主要市場細分

• IMARC Group 分析了全球嵌入式芯片封裝技術市場報告每個子部分的主要趨勢，並預測了 2023 年至 2028 年在全球、區域和國家層面的情況。 該報告根據平台和行業對市場進行分類。

按平台細分

• 將芯片嵌入 IC 封裝基板
• 剛性基板上的嵌入式芯片
• 內置柔性基板

各行業構成比例：

• 消費類電子產品
• IT/通信領域
• 車載
• 醫療保健
• 其他

按地區劃分

• 北美
• 美國
• 加拿大
• 亞太地區
• 中國
• 日本
• 印度
• 韓國
• 澳大利亞
• 印度尼西亞
• 其他
• 歐洲
• 德國
• 法國
• 英國
• 意大利
• 西班牙
• 俄羅斯
• 其他
• 拉丁美洲
• 巴西
• 墨西哥
• 其他
• 中東和非洲

本報告中回答的關鍵問題

• 1.2022 年全球嵌入式芯片封裝技術市場規模有多大？
• 2. 2023-2028年全球嵌入式芯片封裝技術市場的預期增長率是多少？
• 3. 推動全球嵌入式芯片封裝技術市場發展的關鍵因素是什麼？
• 4.COVID-19 對全球嵌入式芯片封裝技術市場有何影響？
• 5. 按平台劃分的全球嵌入式芯片封裝技術市場情況如何？
• 6. 嵌入式芯片封裝技術的全球細分市場有哪些？
• 7. 全球嵌入式芯片封裝技術市場的主要區域有哪些？
• 8. 全球嵌入式芯片封裝技術市場的主要參與者/公司有哪些？

內容

第一章前言

第 2 章研究方法和範圍

• 調查的目的
• 利益相關者
• 數據來源
  • 主要信息
  • 次要信息
• 市場評估
  • 自下而上的方法
  • 自上而下的方法
• 預測方法

第 3 章執行摘要

第四章介紹

• 概覽
• 主要行業趨勢

第 5 章嵌入式芯片封裝技術的全球市場

• 市場概覽
• 市場結果
• COVID-19 的影響
• 市場預測

第 6 章按平台劃分的市場細分

• 芯片嵌入型IC封裝基板
  • 市場趨勢
  • 市場展望
• 芯片鍵合到剛性基板
  • 市場趨勢
  • 市場展望
• 在柔性基板中嵌入模具
  • 市場趨勢
  • 市場展望

第 7 章行業市場細分

• 消費類電子產品
  • 市場趨勢
  • 市場預測
• IT/通信領域
  • 市場趨勢
  • 市場預測
• 汽車相關
  • 市場趨勢
  • 市場展望
• 醫療保健
  • 市場趨勢
  • 市場展望
• 其他
  • 市場趨勢
  • 市場預測

第 8 章按區域劃分的市場細分

• 北美
  • 美國
    • 市場趨勢
    • 市場預測
  • 加拿大
    • 市場趨勢
    • 市場展望
• 亞太地區
  • 中國
    • 市場趨勢
    • 市場展望
  • 日本
    • 市場趨勢
    • 市場預測
  • 印度
    • 市場趨勢
    • 市場展望
  • 韓國市場
    • 市場趨勢
    • 市場展望
  • 澳大利亞
    • 市場趨勢
    • 市場展望
  • 印度尼西亞
    • 市場趨勢
    • 市場展望
  • 其他
    • 市場趨勢
    • 市場預測
• 歐洲
  • 德國
    • 市場趨勢
    • 市場展望
  • 法國
    • 市場趨勢
    • 市場預測
  • 英國
    • 市場趨勢
    • 市場預測
  • 意大利
    • 市場趨勢
    • 市場展望
  • 西班牙
    • 市場趨勢
    • 市場展望
  • 俄羅斯
    • 市場趨勢
    • 市場展望
  • 其他
    • 市場趨勢
    • 市場預測
• 拉丁美洲
  • 巴西
    • 市場趨勢
    • 市場展望
  • 墨西哥
    • 市場趨勢
    • 市場展望
  • 其他
    • 市場趨勢
    • 市場預測
• 中東和非洲
  • 市場趨勢
  • 按國家/地區劃分的市場細分
  • 市場展望

第9章SWOT分析

• 概覽
• 強度
• 弱點
• 機會
• 威脅

第 10 章價值鏈分析

第11章波特五力分析

• 概覽
• 買家的議價能力
• 供應商的議價能力
• 競爭程度
• 新進入者的威脅
• 替代品的威脅

第 12 章：價格分析

第13章競爭格局

• 市場結構
• 主要公司
• 主要公司簡介
  • Amkor Technology Inc.
  • ASE Technology Holding Co. Ltd.
  • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
  • Fujikura Ltd.
  • Infineon Technologies AG
  • Microsemi Corporation（Microchip Technology Inc.）
  • Schweizer Electronic AG
  • TDK Electronics AG（TDK Corporation）

本報告中提及的公司名稱僅為部分，本報告中提及的所有公司名稱。

The global embedded die packaging technology market size reached US$ 81.0 Million in 2022. Looking forward, IMARC Group expects the market to reach US$ 176.89 Million by 2028, exhibiting a growth rate (CAGR) of 12.80% during 2023-2028.

Embedded die packaging technology is used to embed components inside the substrate via a multi-step manufacturing process. It comprises flip-chip chip scale packaging (FC CSP) and wafer-level chip scale packaging (WL CSP) to improve the efficiency of the system. It creates more space for other components by shrinking overall solutions in the printed circuit board (PCB). It also provides surface-mount technology (SMT) integration and a flexible routing solution to reduce printed circuit board (PCB) size. It offers design flexibility that shifts from 2D to 3D while reducing distortion and power loss. As a result, embedded die packaging technology finds extensive application in electronics, information and technology (IT), automotive, healthcare, and telecommunication industries across the globe.

Embedded Die Packaging Technology Market Trends:

• At present, there is an increase in the miniaturization of electronic circuits in microelectronic devices around the world. This, along with the burgeoning semiconductor industry, represents one of the key factors driving the market. Moreover, embedded die packaging technology offers several benefits, such as upgraded electrical and thermal performance, heterogeneous integration, and streamlined logistics for original equipment manufacturers (OEMs), which are contributing to the growth of the market. In addition, the increasing adoption of autonomous robots for professional services in various industries is offering lucrative growth opportunities to industry investors. Besides this, the growing utilization of embedded die packaging technology in smartphones and wearable devices to enhance the available space and integrate more components is positively influencing the market. Additionally, there is a rise in the demand for embedded die packaging technology with integrated internet of things (IoT) across the globe. This, coupled with the increasing sales of portable electronic devices, such as laptops, computers, tablets, e-readers, smartphones, MP3 players, drones, and electronic toys, is bolstering the growth of the market.

Key Market Segmentation:

• IMARC Group provides an analysis of the key trends in each sub-segment of the global embedded die packaging technology market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on platform and industry vertical.

Breakup by Platform:

• Embedded Die in IC Package Substrate
• Embedded Die in Rigid Board
• Embedded Die in Flexible Board

Breakup by Industry Vertical:

• Consumer Electronics
• IT and Telecommunication
• Automotive
• Healthcare
• Others

Breakup by Region:

• North America
• United States
• Canada
• Asia-Pacific
• China
• Japan
• India
• South Korea
• Australia
• Indonesia
• Others
• Europe
• Germany
• France
• United Kingdom
• Italy
• Spain
• Russia
• Others
• Latin America
• Brazil
• Mexico
• Others
• Middle East and Africa

Competitive Landscape:

• The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., ASE Technology Holding Co. Ltd., AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Fujikura Ltd., Infineon Technologies AG, Microsemi Corporation (Microchip Technology Inc.), Schweizer Electronic AG and TDK Electronics AG (TDK Corporation). Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report.

Key Questions Answered in This Report:

• 1. What was the size of the global embedded die packaging technology market in 2022?
• 2. What is the expected growth rate of the global embedded die packaging technology market during 2023-2028?
• 3. What are the key factors driving the global embedded die packaging technology market?
• 4. What has been the impact of COVID-19 on the global embedded die packaging technology market?
• 5. What is the breakup of the global embedded die packaging technology market based on the platform?
• 6. What is the breakup of the global embedded die packaging technology market based on the industry vertical?
• 7. What are the key regions in the global embedded die packaging technology market?
• 8. Who are the key players/companies in the global embedded die packaging technology market?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global Embedded Die Packaging Technology Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Forecast

6 Market Breakup by Platform

• 6.1 Embedded Die in IC Package Substrate
  • 6.1.1 Market Trends
  • 6.1.2 Market Forecast
• 6.2 Embedded Die in Rigid Board
  • 6.2.1 Market Trends
  • 6.2.2 Market Forecast
• 6.3 Embedded Die in Flexible Board
  • 6.3.1 Market Trends
  • 6.3.2 Market Forecast

7 Market Breakup by Industry Vertical

• 7.1 Consumer Electronics
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 IT and Telecommunication
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast
• 7.3 Automotive
  • 7.3.1 Market Trends
  • 7.3.2 Market Forecast
• 7.4 Healthcare
  • 7.4.1 Market Trends
  • 7.4.2 Market Forecast
• 7.5 Others
  • 7.5.1 Market Trends
  • 7.5.2 Market Forecast

8 Market Breakup by Region

• 8.1 North America
  • 8.1.1 United States
    • 8.1.1.1 Market Trends
    • 8.1.1.2 Market Forecast
  • 8.1.2 Canada
    • 8.1.2.1 Market Trends
    • 8.1.2.2 Market Forecast
• 8.2 Asia-Pacific
  • 8.2.1 China
    • 8.2.1.1 Market Trends
    • 8.2.1.2 Market Forecast
  • 8.2.2 Japan
    • 8.2.2.1 Market Trends
    • 8.2.2.2 Market Forecast
  • 8.2.3 India
    • 8.2.3.1 Market Trends
    • 8.2.3.2 Market Forecast
  • 8.2.4 South Korea
    • 8.2.4.1 Market Trends
    • 8.2.4.2 Market Forecast
  • 8.2.5 Australia
    • 8.2.5.1 Market Trends
    • 8.2.5.2 Market Forecast
  • 8.2.6 Indonesia
    • 8.2.6.1 Market Trends
    • 8.2.6.2 Market Forecast
  • 8.2.7 Others
    • 8.2.7.1 Market Trends
    • 8.2.7.2 Market Forecast
• 8.3 Europe
  • 8.3.1 Germany
    • 8.3.1.1 Market Trends
    • 8.3.1.2 Market Forecast
  • 8.3.2 France
    • 8.3.2.1 Market Trends
    • 8.3.2.2 Market Forecast
  • 8.3.3 United Kingdom
    • 8.3.3.1 Market Trends
    • 8.3.3.2 Market Forecast
  • 8.3.4 Italy
    • 8.3.4.1 Market Trends
    • 8.3.4.2 Market Forecast
  • 8.3.5 Spain
    • 8.3.5.1 Market Trends
    • 8.3.5.2 Market Forecast
  • 8.3.6 Russia
    • 8.3.6.1 Market Trends
    • 8.3.6.2 Market Forecast
  • 8.3.7 Others
    • 8.3.7.1 Market Trends
    • 8.3.7.2 Market Forecast
• 8.4 Latin America
  • 8.4.1 Brazil
    • 8.4.1.1 Market Trends
    • 8.4.1.2 Market Forecast
  • 8.4.2 Mexico
    • 8.4.2.1 Market Trends
    • 8.4.2.2 Market Forecast
  • 8.4.3 Others
    • 8.4.3.1 Market Trends
    • 8.4.3.2 Market Forecast
• 8.5 Middle East and Africa
  • 8.5.1 Market Trends
  • 8.5.2 Market Breakup by Country
  • 8.5.3 Market Forecast

9 SWOT Analysis

• 9.1 Overview
• 9.2 Strengths
• 9.3 Weaknesses
• 9.4 Opportunities
• 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

• 11.1 Overview
• 11.2 Bargaining Power of Buyers
• 11.3 Bargaining Power of Suppliers
• 11.4 Degree of Competition
• 11.5 Threat of New Entrants
• 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

• 13.1 Market Structure
• 13.2 Key Players
• 13.3 Profiles of Key Players
  • 13.3.1 Amkor Technology Inc.
    • 13.3.1.1 Company Overview
    • 13.3.1.2 Product Portfolio
    • 13.3.1.3 Financials
    • 13.3.1.4 SWOT Analysis
  • 13.3.2 ASE Technology Holding Co. Ltd.
    • 13.3.2.1 Company Overview
    • 13.3.2.2 Product Portfolio
    • 13.3.2.3 Financials
  • 13.3.3 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    • 13.3.3.1 Company Overview
    • 13.3.3.2 Product Portfolio
    • 13.3.3.3 Financials
  • 13.3.4 Fujikura Ltd.
    • 13.3.4.1 Company Overview
    • 13.3.4.2 Product Portfolio
    • 13.3.4.3 Financials
    • 13.3.4.4 SWOT Analysis
  • 13.3.5 Infineon Technologies AG
    • 13.3.5.1 Company Overview
    • 13.3.5.2 Product Portfolio
    • 13.3.5.3 Financials
    • 13.3.5.4 SWOT Analysis
  • 13.3.6 Microsemi Corporation (Microchip Technology Inc.)
    • 13.3.6.1 Company Overview
    • 13.3.6.2 Product Portfolio
    • 13.3.6.3 SWOT Analysis
  • 13.3.7 Schweizer Electronic AG
    • 13.3.7.1 Company Overview
    • 13.3.7.2 Product Portfolio
    • 13.3.7.3 Financials
  • 13.3.8 TDK Electronics AG (TDK Corporation)
    • 13.3.8.1 Company Overview
    • 13.3.8.2 Product Portfolio

Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report

List of Figures

• Figure 1: Global: Embedded Die Packaging Technology Market: Major Drivers and Challenges
• Figure 2: Global: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017-2022
• Figure 3: Global: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 4: Global: Embedded Die Packaging Technology Market: Breakup by Platform (in %), 2022
• Figure 5: Global: Embedded Die Packaging Technology Market: Breakup by Industry Vertical (in %), 2022
• Figure 6: Global: Embedded Die Packaging Technology Market: Breakup by Region (in %), 2022
• Figure 7: Global: Embedded Die Packaging Technology (Embedded Die in IC Package Substrate) Market: Sales Value (in Million US$), 2017 & 2022
• Figure 8: Global: Embedded Die Packaging Technology (Embedded Die in IC Package Substrate) Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 9: Global: Embedded Die Packaging Technology (Embedded Die in Rigid Board) Market: Sales Value (in Million US$), 2017 & 2022
• Figure 10: Global: Embedded Die Packaging Technology (Embedded Die in Rigid Board) Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 11: Global: Embedded Die Packaging Technology (Embedded Die in Flexible Board) Market: Sales Value (in Million US$), 2017 & 2022
• Figure 12: Global: Embedded Die Packaging Technology (Embedded Die in Flexible Board) Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 13: Global: Embedded Die Packaging Technology (Consumer Electronics) Market: Sales Value (in Million US$), 2017 & 2022
• Figure 14: Global: Embedded Die Packaging Technology (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 15: Global: Embedded Die Packaging Technology (IT and Telecommunication) Market: Sales Value (in Million US$), 2017 & 2022
• Figure 16: Global: Embedded Die Packaging Technology (IT and Telecommunication) Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 17: Global: Embedded Die Packaging Technology (Automotive) Market: Sales Value (in Million US$), 2017 & 2022
• Figure 18: Global: Embedded Die Packaging Technology (Automotive) Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 19: Global: Embedded Die Packaging Technology (Healthcare) Market: Sales Value (in Million US$), 2017 & 2022
• Figure 20: Global: Embedded Die Packaging Technology (Healthcare) Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 21: Global: Embedded Die Packaging Technology (Other Industry Verticals) Market: Sales Value (in Million US$), 2017 & 2022
• Figure 22: Global: Embedded Die Packaging Technology (Other Industry Verticals) Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 23: North America: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 24: North America: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 25: United States: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 26: United States: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 27: Canada: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 28: Canada: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 29: Asia-Pacific: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 30: Asia-Pacific: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 31: China: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 32: China: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 33: Japan: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 34: Japan: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 35: India: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 36: India: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 37: South Korea: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 38: South Korea: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 39: Australia: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 40: Australia: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 41: Indonesia: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 42: Indonesia: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 43: Others: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 44: Others: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 45: Europe: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 46: Europe: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 47: Germany: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 48: Germany: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 49: France: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 50: France: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 51: United Kingdom: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 52: United Kingdom: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 53: Italy: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 54: Italy: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 55: Spain: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 56: Spain: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 57: Russia: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 58: Russia: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 59: Others: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 60: Others: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 61: Latin America: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 62: Latin America: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 63: Brazil: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 64: Brazil: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 65: Mexico: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 66: Mexico: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 67: Others: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 68: Others: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 69: Middle East and Africa: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 70: Middle East and Africa: Embedded Die Packaging Technology Market: Breakup by Country (in %), 2022
• Figure 71: Middle East and Africa: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 72: Global: Embedded Die Packaging Technology Industry: SWOT Analysis
• Figure 73: Global: Embedded Die Packaging Technology Industry: Value Chain Analysis
• Figure 74: Global: Embedded Die Packaging Technology Industry: Porter's Five Forces Analysis

List of Tables

• Table 1: Global: Embedded Die Packaging Technology Market: Key Industry Highlights, 2022 & 2028
• Table 2: Global: Embedded Die Packaging Technology Market Forecast: Breakup by Platform (in Million US$), 2023-2028
• Table 3: Global: Embedded Die Packaging Technology Market Forecast: Breakup by Industry Vertical (in Million US$), 2023-2028
• Table 4: Global: Embedded Die Packaging Technology Market Forecast: Breakup by Region (in Million US$), 2023-2028
• Table 5: Global: Embedded Die Packaging Technology Market: Competitive Structure
• Table 6: Global: Embedded Die Packaging Technology Market: Key Players