關注的IC:AI，5G，CMOS影像感測器，記憶體晶片的市場分析

Hot ICs: A Market Analysis of Artificial Intelligence (AI), 5G, Automotive and Memory Chips

出版日期: 2024年03月01日 | 出版商:

Information Network | 英文 | 商品交期: 2-3個工作天內

價格

簡介目錄圖表

本報告提供AI，5G, CMOS影像感測器，記憶體晶片(DRAM，NAND，NVM)調查分析，詳細的說明，及IC與其用途的市場預測，各部門的市場佔有率等資訊。

汽車產業的指標
汽車半導體產業
- 汽車用記憶體半導體
- 汽車半導體:各類型
主要的技術和零組件的供應商
- NXP
- STMicroelectronics
- Renesas Electronics
- Nvidia
- Intel (Mobileye and Moovit)
- Skyworks
- Qualcomm
- onsemi
- Texas Instruments
- Analog Devices
汽車/ADAS
- 替代汽車AI晶片的競爭
  - Intel-Mobileye
  - Qualcomm
  - Nvidia
  - Huawei
  - Horizon Robotics
  - Black SesameTechnologies
  - Xin Chi Technology
  - Tesla
LiDAR感測器
- LiDAR - 成本的考慮事項
- 汽車用途
- LiDAR供應商
  - Velodyne
  - Luminar
  - Aeva
  - Ouster
  - Innoviz
  - Hesai
  - Livox
  - Innovusion

第3章 5G

5G晶片的技術和趨勢
用途
- 行動電話
- 跨學科的連接
市場分析
- 市場預測
- 5G和4G的新的零組件
5G晶片供應商的產品和簡介
- Analog Devices
- Anokiware
- Apple
- Broadcom
- Huawei
- Infineon
- Intel
- Inphi
- Microchip
- MediaTek
- Marvell
- M/A-Com
- NXP Semiconductor
- Onsemi
- Qualcomm
- Qorvo
- Samsung Electronics
- Sivers IMA
- Skyworks Solutions
- STMicroelectronics
- Teradyne
- Texas Instruments
- Win Semiconductors
- Xilinx

第4章 AI

AI的技術和趨勢
- 雲端AI運算
- 邊緣AI運算
- AI的要素
市場分析
- AI晶片的收益預測
用途
- AI的產業用途
- AI裝載設備
- 軍事/防衛用途
- AI晶片的收益預測
AI晶片技術
- GPU
- FPGA
- ASIC
- 神經形態晶片
- DPU
AI晶片供應商的產品和簡介
- IC供應商
  - Achronix
  - AMD
  - Ampere
  - Biren Technology
  - Flex Logix
  - IBM
  - Intel
  - MediaTek
  - Nvidia
  - NXP
  - Qualcomm
  - Rockchip
  - Samsung Electronics
  - STMicroelectronics
  - Tentsorrent
  - Xilinx
- 雲端供應商 - 技術領導者
  - Alibaba
  - Alibaba Cloud
  - Amazon
  - Apple
  - Baidu
  - Meta
  - Fujitsu
  - Google
  - Huawei Cloud
  - Microsoft
  - Nokia
  - Tencent Cloud
  - Tesla
- IP供應商
  - ARM
  - CEVA
  - Imagination
  - VeriSilicon
  - Videantis
- 全球Start-Ups
  - Adapteva
  - aiCTX
  - AImotive
  - AlphaICs
  - Anari AI
  - Blaize
  - BrainChip
  - Cerebras Systems
  - Cornami
  - DeepScale
  - Anari AI
  - Esperanto Technologies
  - Graphcore
  - GreenWaves Technology
  - Groq
  - Hailo AI
  - KAIST
  - Kalray
  - Kneron
  - Knowm
  - Koniku
  - Mythic
  - SambaNova Systems
  - Tachyum
  - Via
  - videantis
  - Wave Computing
- 中國的Start-Ups
  - AISpeech
  - Bitmain
  - Cambricon
  - Chipintelli
  - DeePhi Tech
  - Horizon Robotics
  - NextVPU
  - Rokid
  - Thinkforce
  - Unisound

第5章記憶體晶片

記憶體的技術和趨勢
- DRAM
- NAND
- NVRAM - MRAM，RRAM，FERAM
用途
- DRAM
- NAND
市場分析
記憶體晶片供應商的產品和簡介
- CXMT
- Fujian
- GigaDevice Semiconductor
- Intel
- Micron Technology
- Nanya
- Powerchip Technology
- Samsung Electronics
- SK Hynix
- Toshiba (Kloxia)
- Tsinghua Chongqing
- Western Digital
- Winbond
- YMTC

簡介目錄圖表

Not only are these ICs the "hottest" part of the highest growing technology sectors, they are, in fact, interrelated.

Advanced driver-assistance systems (ADAS) are ubiquitous in autonomous vehicles. ADAS uses CMOS Integrated Sensors, memory, processing, and networking to detect road conditions and provide feedback to drivers-and in some cases to drive the vehicle off the road if there are unsafe conditions.

Besides powering ADAS and autonomous vehicles, AI is also a key enabler of voice recognition technologies, smart cities, and the Internet of Things (IoT). AI alongside the development of greater universal connectivity will enable new services that can benefit consumers in many ways.

Real-world fleets of autonomous vehicles are now ready for commercial deployment and many auto companies already provide some level of autonomous vehicle technology in their latest models. It is likely that on the show floor and in conference presentations we will see new uses for these AI-driven vehicles. We'll also see how possible problems are being tackled before the technology moves more into the consumer space.

The growth in mobile and personal devices, and their need for energy-efficient electronics, will lead to new ways to store information for immediate processing as well as long-term storage. The report details storage and memory products including those using traditional (NAND and DRAM) memories and emerging memories, such as phase change memory (PCM), magnetic random access memory (MRAM) or resistive random access memory. With the end of Moore's-law computer-lithography scaling, there is also a move to more specialized processing capability, tied to particular applications.

This report examines in detail Artificial Intelligence (AI), 5G, CMOS Image Sensor, and Memory Chips (DRAM, NAND, NVM). Markets for the ICs and their applications are forecast to 2025, and market shares given in each sector.

1.0. Executive Summary

2.0. Automotive

2.1. Automotive Industry Metrics
2.2. Automotive Semiconductor Industry
- 2.2.1. Automotive Memory Semiconductors
- 2.2.2. Automotive Semiconductors By Type
  - 2.2.2.1 Microcontrollers
  - 2.2.2.2 ASSP/ASICs
  - 2.2.2.3 Analog
  - 2.2.2.4 Discrete
2.3. Key Technology And Component Suppliers
- NXP
- STMicroelectronics
- Renesas Electronics
- Nvidia
- Intel (Mobileye and Moovit)
- Skyworks
- Qualcomm
- onsemi
- Texas Instruments
- Analog Devices
2.4. Automotive/ Advanced Driver Assistance Systems (ADAS)
- 2.4.1. Competition from Alternative Automotive AI Chips
  - Intel-Mobileye
  - Qualcomm
  - Nvidia
  - Huawei
  - Horizon Robotics
  - Black SesameTechnologies
  - Xin Chi Technology
  - Tesla
2.5. LiDAR Sensors
- 2.5.1. LiDAR - Cost Considerations
- 2.5.2. Automotive Applications
- 2.5.3. LiDAR Suppliers
  - Velodyne
  - Luminar
  - Aeva
  - Ouster
  - Innoviz
  - Hesai
  - Livox
  - Innovusion

3.0. 5G

3.1. 5G Chip Technology and Trends
3.2. Applications
- 3.2.1. Mobile Handsets
- 3.2.2. Interdisciplinary Connections
3.3. Market Analysis
- 3.3.1. Market Forecasts
- 3.3.2. New Components For 5G vs 4G
  - 3.3.2.1 5G Modem Chip Overview
  - 3.3.2.2 5G Chips
  - 3.3.2.3 mmWave Modules
  - 3.3.2.4 Traditional MIMO Antennas
3.4. 5G Chip Supplier Products and Profiles
- Analog Devices
- Anokiware
- Apple
- Broadcom
- Huawei
- Infineon
- Intel
- Inphi
- Microchip
- MediaTek
- Marvell
- M/A-Com
- NXP Semiconductor
- Onsemi
- Qualcomm
- Qorvo
- Samsung Electronics
- Sivers IMA
- Skyworks Solutions
- STMicroelectronics
- Teradyne
- Texas Instruments
- Win Semiconductors
- Xilinx

4.0. Artificial Intelligence (AI)

4.1. AI Technology and Trends
- 4.1.1. Cloud AI Computing
- 4.1.2. Edge AI Computing
- 4.1.3 The Elements Of Artificial Intelligence
  - 4.1.3.1 Importance Of Training And Inference
  - 4.1.3.2 The Growing Importance Of Accelerators In Dc Spending
  - 4.1.3.3 Training Costs
  - 4.1.3.4 Generative AI
4.2. Market Analysis
- 4.2.1. AI Chip Revenue Forecast
4.3. Applications
- 4.3.1. Industry Applications of AI
  - 4.3.1.1 Smart Healthcare
  - 4.3.1.2 Smart Security
  - 4.3.1.3 Smart Finance
  - 4.3.1.4 Smart Grid
  - 4.3.1.5 Smart Hone
- 4.3.2. AI-Powered Devices
  - 4.3.2.1 Smart Speakers
  - 4.3.2.2 Drones
  - 4.3.2.3 Intelligent Robots
- 4.3.3 Military/Defense Applications
  - 4.3.3.1 China's AI Plan
  - 4.3.2.1 Driverless Vehicles
  - 4.3.2.2 Computer Chips
  - 4.3.2.3 Financial
  - 4.3.2.4 Facial Recognition
  - 4.3.2.5 Retail
  - 4.3.2.6 Robots
- 4.3.3. AI Chip Revenue Forecast
4.4. AI Chip Technology
- 4.4.1. Graphics Processing Unit (GPU)
- 4.4.2. Field Programmable Gate Array (FPGA)
- 4.4.3. Application Specific Integrated Circuits (ASIC)
- 4.4.4. Neuromorphic Chips
- 4.4.5. Data Processing Units (DPUs)
4.5. AI Chip Supplier Products and Profiles
- 4.5.1. IC Vendors
  - Achronix
  - AMD
  - Ampere
  - Biren Technology
  - Flex Logix
  - IBM
  - Intel
  - MediaTek
  - Nvidia
  - NXP
  - Qualcomm
  - Rockchip
  - Samsung Electronics
  - STMicroelectronics
  - Tentsorrent
  - Xilinx
- 4.5.2. Cloud Providers - Tech Leaders
  - Alibaba
  - Alibaba Cloud
  - Amazon
  - Apple
  - Baidu
  - Meta
  - Fujitsu
  - Google
  - Huawei Cloud
  - Microsoft
  - Nokia
  - Tencent Cloud
  - Tesla
- 4.5.3. IP Vendors
  - ARM
  - CEVA
  - Imagination
  - VeriSilicon
  - Videantis
- 4.5.4. Startups Worldwide
  - Adapteva
  - aiCTX
  - AImotive
  - AlphaICs
  - Anari AI
  - Blaize
  - BrainChip
  - Cerebras Systems
  - Cornami
  - DeepScale
  - Anari AI
  - Esperanto Technologies
  - Graphcore
  - GreenWaves Technology
  - Groq
  - Hailo AI
  - KAIST
  - Kalray
  - Kneron
  - Knowm
  - Koniku
  - Mythic
  - SambaNova Systems
  - Tachyum
  - Via
  - videantis
  - Wave Computing
- 4.5.5. Startups in China
  - AISpeech
  - Bitmain
  - Cambricon
  - Chipintelli
  - DeePhi Tech
  - Horizon Robotics
  - NextVPU
  - Rokid
  - Thinkforce
  - Unisound

5.0. Memory Chips

5.1. Memory Technology and Trends
- 5.1.1. DRAM
- 5.1.2. NAND
- 5.1.3. NVRAM - MRAM, RRAM, and FERAM
5.2. Applications
- 5.2.1. DRAM
  - 5.2.1.1 Server
  - 5.2.1.2 PC
  - 5.2.1.3 Graphics
  - 5.2.1.4 Mobile
  - 5.2.1.5 Consumer
- 5.2.2. NAND
  - 5.2.2.1 SSD
  - 5.2.2.2 PC
  - 5.2.2.3 TV
  - 5.2.2.4 Mobile
  - 5.2.2.5 USB
5.3. Market Analysis
5.4. Memory Chip Supplier Products and Profiles
- CXMT
- Fujian
- GigaDevice Semiconductor
- Intel
- Micron Technology
- Nanya
- Powerchip Technology
- Samsung Electronics
- SK Hynix
- Toshiba (Kloxia)
- Tsinghua Chongqing
- Western Digital
- Winbond
- YMTC