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市場調查報告書
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1651008

全球先進電子封裝市場

Advanced Electronic Packaging
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 78 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

預計到 2030 年全球先進電子封裝市場規模將達 132 億美元

2024 年全球先進電子封裝市場規模估計為 79 億美元，預計到 2030 年將達到 132 億美元，2024 年至 2030 年的複合年成長率為 9.0%。晶圓級晶片規模封裝是報告分析的細分市場之一，預計在分析期結束時複合年成長率為 8.5%，達到 75 億美元。在分析期間內，矽穿孔(Tsv) 封裝部分預計以 9.8% 的複合年成長率成長。

美國市場規模估計為 20 億美元，中國市場預估年複合成長率為 11.9%

預計 2024 年美國先進電子封裝市場規模將達 20 億美元。作為世界第二大經濟體的中國，預計到 2030 年市場規模將達到 30 億美元，2024-2030 年分析期內的複合年成長率為 11.9%。其他值得注意的區域市場包括日本和加拿大，預計在分析期間的複合年成長率分別為 5.8% 和 7.2%。在歐洲，預計德國的複合年成長率約為 6.8%。

全球先進電子封裝市場-主要趨勢與促進因素摘要

先進的電子封裝將如何改變半導體製造？

先進的電子封裝正在透過實現更高效、更強大、更緊湊的設備徹底改變半導體產業。涉及簡單的引線接合法技術的傳統封裝方法正在讓位於系統級封裝(SiP)、3D 堆疊和晶圓層次電子構裝(WLP) 等複雜的封裝解決方案。這些先進的封裝技術能夠在單一封裝內整合多個組件，從而提高性能並減少電子設備的整體佔用空間。這種演進對於滿足現代應用需要更快的處理速度、更低功耗和更小尺寸的需求至關重要。例如，智慧型手機、物聯網設備和高效能運算系統都受益於提供卓越溫度控管和訊號完整性的先進封裝技術。這些技術的整合不僅增強了設備功能，而且還推動了汽車、醫療保健和通訊等不同領域的創新。

哪些創新正在塑造先進的電子封裝？

技術創新是電子封裝進步的核心，推動效能、可靠性和擴充性的提升。一項關鍵突破是 3D IC（積體電路）技術的開發，該技術允許垂直堆疊多個半導體晶粒。這種 3D 方法顯著提高了處理能力和記憶體容量，同時降低了延遲。另一項關鍵創新是扇出型晶圓級封裝（FOWLP）的出現，它提供更高的整合密度和卓越的熱性能。此外，人們正在利用矽中介層和有機基板等先進材料來提高電氣性能和散熱性能。穿透矽通孔（TSV）和微凸塊技術的採用進一步提高了封裝的連接性和性能。這些技術進步對於滿足現代電子系統日益複雜的性能要求至關重要。

市場趨勢如何影響先進封裝解決方案的採用？

市場趨勢在先進封裝解決方案的採用中發揮著至關重要的作用。對更小、更快、更有效率的電子設備的需求不斷成長，推動著向先進封裝技術的轉變。家用電子電器，尤其是智慧型手機和穿戴式設備，需要高水準的整合度和性能，而這可以透過先進的封裝來實現。汽車產業對電動車 (EV) 和自動駕駛系統的發展也需要先進的封裝來支援這些應用所需的高效能運算和感測器整合。此外，5G 技術的日益普及也加速了對能夠支援更高頻率和資料速率的先進封裝解決方案的需求。資料中心和雲端處理基礎設施對改善溫度控管和電源效率的需求正在推動先進封裝的採用。這些趨勢正在塑造市場格局，鼓勵製造商創新並採用尖端的包裝技術。

哪些因素推動了先進電子封裝市場的成長？

先進電子封裝市場的成長受到多種因素的推動。半導體製造和封裝技術的進步提高了電子設備的性能和可靠性，使其對最終用戶更具吸引力。家用電子電器、汽車系統和通訊設備的複雜性和功能性日益增加，對先進封裝解決方案的需求龐大。向 5G 網路和物聯網 (IoT) 的轉變為高效能、緊湊和節能的封裝技術創造了新的機會。此外，對電子設備的能源效率和溫度控管的日益重視也推動了尖端材料和封裝技術的採用。政府對半導體研發的措施和投資也促進了市場成長，特別是在尋求提高半導體製造能力的地區。這些因素，加上對小型化和性能提升的不懈追求，正在推動先進電子封裝市場向前發展。

部分

技術（晶圓級晶片規模封裝、矽通孔 (TSV) 封裝）

受訪企業範例（共38家）

  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Fujitsu Ltd.
  • Hitachi Ltd.
  • Ibiden Co., Ltd.
  • Infineon Technologies AG
  • Intel Corporation
  • Micron Technology, Inc.
  • Microsemi Corporation
  • Molex LLC
  • NXP Semiconductors NV
  • Orient Semiconductor Electronics Ltd.
  • Samsung Electronics Co., Ltd.
  • Semiconductor Manufacturing International Corporation（SMIC）
  • Semtech Corporation
  • STATS ChipPAC Pte., Ltd.
  • Taiwan Semiconductor Manufacturing Co., Ltd.（TSMC）
  • Texas Instruments, Inc.
  • Thomas & Betts Corporation
  • Toshiba America Electronic Components, Inc.
  • TSI Group Ltd.

目錄

第1章調查方法

第 2 章執行摘要

  • 市場概況
  • 主要企業
  • 市場趨勢和促進因素
  • 全球市場展望

第3章 市場分析

  • 美國
  • 加拿大
  • 日本
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 西班牙
  • 俄羅斯
  • 其他歐洲國家
  • 亞太地區
  • 澳洲
  • 印度
  • 韓國
  • 其他亞太地區
  • 拉丁美洲
  • 阿根廷
  • 巴西
  • 墨西哥
  • 其他拉丁美洲國家
  • 中東
  • 伊朗
  • 以色列
  • 沙烏地阿拉伯
  • 阿拉伯聯合大公國
  • 其他中東地區
  • 非洲

第4章 競賽

簡介目錄
Product Code: MCP-1203

Global Advanced Electronic Packaging Market to Reach US$13.2 Billion by 2030

The global market for Advanced Electronic Packaging estimated at US$7.9 Billion in the year 2024, is expected to reach US$13.2 Billion by 2030, growing at a CAGR of 9.0% over the analysis period 2024-2030. Wafer-Level Chip-Scale Packaging, one of the segments analyzed in the report, is expected to record a 8.5% CAGR and reach US$7.5 Billion by the end of the analysis period. Growth in the Through Silicon via (Tsv) Packaging segment is estimated at 9.8% CAGR over the analysis period.

The U.S. Market is Estimated at US$2.0 Billion While China is Forecast to Grow at 11.9% CAGR

The Advanced Electronic Packaging market in the U.S. is estimated at US$2.0 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$3.0 Billion by the year 2030 trailing a CAGR of 11.9% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 5.8% and 7.2% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 6.8% CAGR.

Global Advanced Electronic Packaging Market - Key Trends and Drivers Summarized

How Is Advanced Electronic Packaging Transforming Semiconductor Manufacturing?

Advanced electronic packaging is revolutionizing the semiconductor industry by enabling more efficient, powerful, and compact devices. Traditional packaging methods, which involved simple wire bonding techniques, are being replaced by sophisticated packaging solutions such as system-in-package (SiP), 3D stacking, and wafer-level packaging (WLP). These advanced techniques allow for the integration of multiple components within a single package, enhancing performance and reducing the overall footprint of electronic devices. This evolution is critical in meeting the demands of modern applications that require high-speed processing, low power consumption, and miniaturization. For instance, smartphones, IoT devices, and high-performance computing systems all benefit from advanced packaging technologies that provide superior thermal management and signal integrity. The integration of these technologies is not only enhancing device capabilities but also driving innovation across various sectors, including automotive, healthcare, and telecommunications.

What Technological Innovations Are Shaping Advanced Electronic Packaging?

Technological innovations are at the heart of advancements in electronic packaging, driving improvements in performance, reliability, and scalability. One of the significant breakthroughs is the development of 3D IC (integrated circuit) technology, which allows for the vertical stacking of multiple semiconductor dies. This 3D approach significantly enhances processing power and memory capacity while reducing latency. Another key innovation is the advent of fan-out wafer-level packaging (FOWLP), which offers higher integration density and better thermal performance. Additionally, advanced materials such as silicon interposers and organic substrates are being utilized to improve electrical performance and heat dissipation. The incorporation of through-silicon vias (TSVs) and micro-bumping techniques further enhances the connectivity and performance of these packages. These technological advancements are crucial in addressing the growing complexity and performance requirements of modern electronic systems.

How Are Market Trends Influencing the Adoption of Advanced Packaging Solutions?

Market trends are playing a pivotal role in influencing the adoption of advanced packaging solutions. The increasing demand for smaller, faster, and more efficient electronic devices is driving the shift towards advanced packaging technologies. Consumer electronics, particularly smartphones and wearable devices, require high levels of integration and performance, which advanced packaging can deliver. The automotive industry's push towards electric vehicles (EVs) and autonomous driving systems also necessitates advanced packaging to support the high-performance computing and sensor integration required in these applications. Additionally, the growing adoption of 5G technology is accelerating the demand for advanced packaging solutions that can handle higher frequencies and greater data rates. The need for improved thermal management and power efficiency in data centers and cloud computing infrastructures is further driving the adoption of advanced packaging. These trends are shaping the market landscape, pushing manufacturers to innovate and adopt cutting-edge packaging technologies.

What Factors Are Driving Growth in the Advanced Electronic Packaging Market?

The growth in the advanced electronic packaging market is driven by several factors. Technological advancements in semiconductor fabrication and packaging are enhancing the performance and reliability of electronic devices, making them more attractive to end-users. The increasing complexity and functionality of consumer electronics, automotive systems, and communication devices are generating significant demand for advanced packaging solutions. The shift towards 5G networks and the Internet of Things (IoT) is creating new opportunities for high-performance, compact, and energy-efficient packaging technologies. Additionally, the growing emphasis on energy efficiency and thermal management in electronic devices is driving the adoption of advanced materials and packaging methods. Government initiatives and investments in semiconductor research and development are also contributing to market growth, particularly in regions aiming to strengthen their semiconductor manufacturing capabilities. These factors, coupled with the relentless pursuit of miniaturization and enhanced performance, are propelling the advanced electronic packaging market forward.

SCOPE OF STUDY:

The report analyzes the Advanced Electronic Packaging market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Technology (Wafer-Level Chip-Scale Packaging, Through Silicon Via (TSV) Packaging)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 38 Featured) -

  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Fujitsu Ltd.
  • Hitachi Ltd.
  • Ibiden Co., Ltd.
  • Infineon Technologies AG
  • Intel Corporation
  • Micron Technology, Inc.
  • Microsemi Corporation
  • Molex LLC
  • NXP Semiconductors NV
  • Orient Semiconductor Electronics Ltd.
  • Samsung Electronics Co., Ltd.
  • Semiconductor Manufacturing International Corporation (SMIC)
  • Semtech Corporation
  • STATS ChipPAC Pte., Ltd.
  • Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)
  • Texas Instruments, Inc.
  • Thomas & Betts Corporation
  • Toshiba America Electronic Components, Inc.
  • TSI Group Ltd.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • Global Economic Update
    • Advanced Electronic Packaging - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Rising Demand for Miniaturization Throws the Spotlight on Advanced Packaging Solutions
    • Integration of Advanced Materials Expands Addressable Market Opportunity
    • Adoption of Fan-Out Wafer-Level Packaging (FOWLP) Spurs Growth in High-Density Applications
    • Technological Innovations Propel Growth in 3D IC Technology
    • Growing Prevalence of 5G Technology Strengthens Business Case for Advanced Packaging
    • Shift Towards Electric Vehicles (EVs) and Autonomous Driving Generates Demand for High-Performance Packaging
    • Increased Complexity in Consumer Electronics Drives Adoption of Advanced Packaging Technologies
    • Need for Improved Thermal Management in Data Centers Propels Growth in Advanced Packaging
    • Emergence of Internet of Things (IoT) Expands Addressable Market Opportunity for Compact and Efficient Packaging
    • Advancements in Through-Silicon Vias (TSVs) and Micro-Bumping Techniques Drive Market Expansion
    • Technological Integration in Automotive Systems Generates Demand for Robust Packaging Solutions
    • Increasing Use of Wearable Devices and Smart Gadgets Throws the Spotlight on Miniaturized Packaging
    • Expansion of Cloud Computing and AI Applications Propels Growth in Advanced Electronic Packaging
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Advanced Electronic Packaging Market Analysis of Annual Sales in US$ Million for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World 6-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2025 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for Wafer-Level Chip-Scale Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 5: World 6-Year Perspective for Wafer-Level Chip-Scale Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 6: World Recent Past, Current & Future Analysis for Through Silicon via (Tsv) Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 7: World 6-Year Perspective for Through Silicon via (Tsv) Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 8: USA Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 9: USA 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • CANADA
    • TABLE 10: Canada Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 11: Canada 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • JAPAN
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 12: Japan Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 13: Japan 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • CHINA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 14: China Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 15: China 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • EUROPE
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 16: Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 17: Europe 6-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2025 & 2030
    • TABLE 18: Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 19: Europe 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • FRANCE
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 20: France Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 21: France 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • GERMANY
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 22: Germany Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 23: Germany 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • ITALY
    • TABLE 24: Italy Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 25: Italy 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • UNITED KINGDOM
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 26: UK Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 27: UK 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • SPAIN
    • TABLE 28: Spain Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 29: Spain 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • RUSSIA
    • TABLE 30: Russia Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 31: Russia 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • REST OF EUROPE
    • TABLE 32: Rest of Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 33: Rest of Europe 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • ASIA-PACIFIC
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 34: Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 35: Asia-Pacific 6-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2025 & 2030
    • TABLE 36: Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 37: Asia-Pacific 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • AUSTRALIA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
    • TABLE 38: Australia Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 39: Australia 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • INDIA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
    • TABLE 40: India Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 41: India 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • SOUTH KOREA
    • TABLE 42: South Korea Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 43: South Korea 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • REST OF ASIA-PACIFIC
    • TABLE 44: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: Rest of Asia-Pacific 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • LATIN AMERICA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
    • TABLE 46: Latin America Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 47: Latin America 6-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2025 & 2030
    • TABLE 48: Latin America Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 49: Latin America 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • ARGENTINA
    • TABLE 50: Argentina Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Argentina 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • BRAZIL
    • TABLE 52: Brazil Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 53: Brazil 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • MEXICO
    • TABLE 54: Mexico Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 55: Mexico 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • REST OF LATIN AMERICA
    • TABLE 56: Rest of Latin America Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Rest of Latin America 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • MIDDLE EAST
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
    • TABLE 58: Middle East Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 59: Middle East 6-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2025 & 2030
    • TABLE 60: Middle East Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 61: Middle East 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • IRAN
    • TABLE 62: Iran Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Iran 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • ISRAEL
    • TABLE 64: Israel Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 65: Israel 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • SAUDI ARABIA
    • TABLE 66: Saudi Arabia Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 67: Saudi Arabia 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • UNITED ARAB EMIRATES
    • TABLE 68: UAE Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: UAE 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • REST OF MIDDLE EAST
    • TABLE 70: Rest of Middle East Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 71: Rest of Middle East 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • AFRICA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
    • TABLE 72: Africa Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 73: Africa 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030

IV. COMPETITION