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市場調查報告書
商品編碼
1571984

高密度互連的全球市場

High Density Interconnect
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 92 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

到 2030 年，全球高密度互連市場預計將達到 449 億美元

全球高密度互連市場預計 2023 年為 209 億美元，預計到 2030 年將達到 449 億美元，2023-2030 年分析期間複合年成長率為 11.5%。 4-6 級是本報告分析的細分市場之一，預計複合年成長率為 9.6%，到分析期結束時將達到 104 億美元。在分析期間，8-10 層細分市場的複合年成長率預計為 11.6%。

美國市場預計57億美元，中國預計複合年成長率10.9%

預計 2023 年美國高密度互連市場規模將達 57 億美元。中國作為世界第二大經濟體，預計2030年市場規模將達到69億美元，2023-2030年分析期間複合年成長率為10.9%。其他值得注意的區域市場包括日本和加拿大，在分析期間預計複合年成長率分別為 9.7% 和 9.8%。在歐洲，德國的複合年成長率預計約為 8.2%。

全球高密度互連市場－主要趨勢與促進因素總結

為什麼高密度互連 (HDI) 技術對於電子產品至關重要？

高密度互連（HDI）技術已成為現代電子產品不可或缺的一部分，特別是在智慧型手機、筆記型電腦、穿戴式裝置、汽車電子和醫療設備中使用的印刷電路基板（PCB）的設計和製造中。 HDI PCB 透過整合更精細的線路和空間、更小的過孔和更密集的元件來實現更複雜的電路設計。這使得製造商能夠生產更小、更輕、更快的設備並提高效能。 HDI 技術對於開發需要大量運算能力和連接性的高效能電子產品至關重要，對於空間限制和可靠性至關重要的 IT/通訊、航太和汽車等產業也至關重要。

科技進步如何推動 HDI 市場？

電子設計的小型化和技術進步正在推動對 HDI 技術的需求。隨著家用電子電器變得更小、更強大，對更小、更有效率的 PCB 的需求也不斷增加。雷射鑽孔和堆疊微孔等先進製造技術的發展增強了 HDI PCB 的功能，使其能夠在不影響訊號完整性的情況下提高電路密度。此外，5G 網路和物聯網 (IoT) 的興起增加了對 HDI 技術的需求，因為裝置需要更快的資料傳輸和更高的連接性。這些進步也使得 HDI PCB 的製造更具成本效益，從而將其應用範圍擴大到更廣泛。

市場區隔如何定義 HDI 市場成長？

HDI類型包括4-6層、8-10層和10層以上，其中4-6層由於其應用於智慧型手機和平板電腦等家用電子電器而佔據主導地位。 HDI PCB 的最終用途產業包括通訊、汽車、航太、醫療保健和工業電子。在智慧型手機和 5G 基礎設施激增的推動下，通訊仍然是最大的細分市場。汽車產業也看到了 HDI 技術的快速採用，特別是在 ADAS（高級駕駛輔助系統）和電動車 (EV) 的開發中。從地區來看，亞太地區領先市場，中國、日本和韓國等國家是電子製造的主要中心。

推動高密度互連市場成長的因素有哪些？

高密度互連市場的成長受到多種因素的推動，包括對小型化電子產品的需求不斷成長、5G 網路的擴展以及 PCB 製造技術的進步。特別是智慧型手機和穿戴式裝置等家用電子電器領域是採用 HDI 的主要推動力，因為製造商致力於打造更小、更快、更高效能的裝置。在汽車產業，電氣化和自動化的發展正在推動對 HDI 技術的需求，因為 ADAS 和車載資訊娛樂系統需要複雜的電子設備。此外，5G 網路的推出增加了通訊基礎設施中對 HDI PCB 的需求，其中高速資料傳輸和低延遲至關重要。 HDI 製造中的技術創新，例如雷射鑽孔和材料改進，透過提高 HDI PCB 的性能和降低成本，進一步推動市場成長。

受訪企業範例（36家知名企業）

  • Austria Technologie & Systemtechnik
  • CMK
  • Compeq Co.,
  • Daeduck GDS Co.,
  • EPEC
  • Fujitsu Interconnect Technologies
  • Kingboard Holdings
  • Meiko Electronics Co.,
  • Multek
  • Ncab Group
  • Shenzhen Kinwong Electronic Co.,
  • Sierra Circuits
  • TTM Technologies
  • Unimicron
  • Zhen Ding Tech

目錄

第1章調查方法

第 2 章執行摘要

  • 市場概況
  • 主要企業
  • 市場趨勢和促進因素
  • 全球市場展望

第3章市場分析

  • 美國
  • 加拿大
  • 日本
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 其他歐洲國家
  • 亞太地區
  • 其他領域

第4章 比賽

簡介目錄
Product Code: MCP21955

Global High Density Interconnect Market to Reach US$44.9 Billion by 2030

The global market for High Density Interconnect estimated at US$20.9 Billion in the year 2023, is expected to reach US$44.9 Billion by 2030, growing at a CAGR of 11.5% over the analysis period 2023-2030. 4-6 Layers, one of the segments analyzed in the report, is expected to record a 9.6% CAGR and reach US$10.4 Billion by the end of the analysis period. Growth in the 8-10 Layers segment is estimated at 11.6% CAGR over the analysis period.

The U.S. Market is Estimated at US$5.7 Billion While China is Forecast to Grow at 10.9% CAGR

The High Density Interconnect market in the U.S. is estimated at US$5.7 Billion in the year 2023. China, the world's second largest economy, is forecast to reach a projected market size of US$6.9 Billion by the year 2030 trailing a CAGR of 10.9% over the analysis period 2023-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 9.7% and 9.8% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 8.2% CAGR.

Global High Density Interconnect Market - Key Trends and Drivers Summarized

Why Is High Density Interconnect (HDI) Technology Crucial for Electronics?

High Density Interconnect (HDI) technology has become an essential component of modern electronics, particularly in the design and manufacturing of printed circuit boards (PCBs) used in smartphones, laptops, wearables, automotive electronics, and medical devices. HDI PCBs allow for more complex circuit designs by incorporating finer lines and spaces, smaller vias, and more densely packed components. This enables manufacturers to produce smaller, lighter, and faster devices with enhanced performance. HDI technology is critical in the development of high-performance electronics that require significant computing power and connectivity, making it indispensable for industries like telecommunications, aerospace, and automotive, where space constraints and reliability are paramount.

How Are Technological Advancements Driving the HDI Market?

Technological advancements in miniaturization and electronic design are driving the demand for HDI technology. As consumer electronics become more compact and feature-rich, the need for smaller, more efficient PCBs has increased. The development of advanced fabrication techniques, such as laser drilling and stacked microvias, has enhanced the capabilities of HDI PCBs, allowing for higher circuit density without compromising signal integrity. Additionally, the rise of 5G networks and the Internet of Things (IoT) has increased the demand for HDI technology, as devices require faster data transmission and greater connectivity. These advancements are also making HDI PCBs more cost-effective to produce, expanding their adoption across a wider range of applications.

How Are Market Segments Defining the Growth of the HDI Market?

HDI types include 4-6 layers, 8-10 layers, and 10+ layers, with the 4-6 layer segment dominating due to its application in consumer electronics such as smartphones and tablets. The end-use industries for HDI PCBs include telecommunications, automotive, aerospace, healthcare, and industrial electronics. Telecommunications remains the largest segment, driven by the proliferation of smartphones and 5G infrastructure. The automotive industry is also witnessing rapid growth in the adoption of HDI technology, particularly in the development of advanced driver assistance systems (ADAS) and electric vehicles (EVs). Regionally, Asia-Pacific leads the market, with countries like China, Japan, and South Korea being major hubs for electronics manufacturing.

What Factors Are Driving the Growth in the High Density Interconnect Market?

The growth in the high density interconnect market is driven by several factors, including the increasing demand for miniaturized electronic devices, the expansion of 5G networks, and advancements in PCB fabrication technologies. The consumer electronics sector, particularly smartphones and wearables, is a major driver of HDI adoption as manufacturers seek to create smaller, faster, and more powerful devices. The automotive industry's push toward electrification and automation is also boosting demand for HDI technology, as more sophisticated electronics are required for ADAS and in-car infotainment systems. Additionally, the rollout of 5G networks is driving the need for HDI PCBs in telecommunications infrastructure, where high-speed data transmission and reduced latency are critical. Technological innovations in HDI fabrication, such as laser drilling and improved materials, are further propelling market growth by enhancing the performance and reducing the costs of HDI PCBs.

Select Competitors (Total 36 Featured) -

  • Austria Technologie & Systemtechnik
  • CMK
  • Compeq Co.,
  • Daeduck GDS Co.,
  • EPEC
  • Fujitsu Interconnect Technologies
  • Kingboard Holdings
  • Meiko Electronics Co.,
  • Multek
  • Ncab Group
  • Shenzhen Kinwong Electronic Co.,
  • Sierra Circuits
  • TTM Technologies
  • Unimicron
  • Zhen Ding Tech

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Global Economic Update
    • High Density Interconnect - Global Key Competitors Percentage Market Share in 2024 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2024 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Rising Demand for Miniaturized Electronic Devices Drives Growth in HDI Technology
    • Technological Advancements in PCB Manufacturing Propel Adoption of HDI Solutions
    • Increasing Focus on Lightweight and Compact Consumer Electronics Expands Addressable Market for HDI
    • Growing Adoption of HDI in Automotive Electronics Spurs Market Innovation
    • Surge in Demand for High-Speed and High-Performance PCBs Strengthens Business Case for HDI
    • Rising Use of HDI in Medical Devices and Wearable Electronics Propels Market Growth
    • Technological Integration of HDI with IoT and 5G Networks Expands Market Opportunities
    • Growing Focus on Reducing PCB Weight and Thickness Spurs Innovation in HDI Designs
    • Expansion of Advanced Driver Assistance Systems (ADAS) Drives Demand for HDI in Automotive Sector
    • Increasing Use of HDI in Aerospace and Defense Applications Sustains Market Growth
    • Rising Popularity of Flexible and Rigid-Flex HDI PCBs Expands Market Opportunities
    • Surge in Demand for Multilayer PCBs in Telecommunications Propels Growth in HDI Market
    • Regulatory Approvals for HDI PCBs in Medical and Automotive Sectors Drive Adoption
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Recent Past, Current & Future Analysis for High Density Interconnect by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 2: World Historic Review for High Density Interconnect by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 3: World 16-Year Perspective for High Density Interconnect by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2024 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for 4-6 Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 5: World Historic Review for 4-6 Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 6: World 16-Year Perspective for 4-6 Layers by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 7: World Recent Past, Current & Future Analysis for 8-10 Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 8: World Historic Review for 8-10 Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 9: World 16-Year Perspective for 8-10 Layers by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for 10+ Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 11: World Historic Review for 10+ Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 12: World 16-Year Perspective for 10+ Layers by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 13: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 14: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 15: World 16-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 16: World Recent Past, Current & Future Analysis for Computer & Display by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 17: World Historic Review for Computer & Display by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 18: World 16-Year Perspective for Computer & Display by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 19: World Recent Past, Current & Future Analysis for Communication Devices & Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 20: World Historic Review for Communication Devices & Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 21: World 16-Year Perspective for Communication Devices & Equipment by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 22: World Recent Past, Current & Future Analysis for Automotive Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 23: World Historic Review for Automotive Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 24: World 16-Year Perspective for Automotive Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 25: World Recent Past, Current & Future Analysis for Connected Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 26: World Historic Review for Connected Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 27: World 16-Year Perspective for Connected Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 28: World Recent Past, Current & Future Analysis for Wearable Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 29: World Historic Review for Wearable Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 30: World 16-Year Perspective for Wearable Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 31: World High Density Interconnect Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
    • TABLE 32: World Recent Past, Current & Future Analysis for Audio / Audiovisual (AV) Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 33: World Historic Review for Audio / Audiovisual (AV) Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 34: World 16-Year Perspective for Audio / Audiovisual (AV) Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
    • TABLE 35: USA Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 36: USA Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 37: USA 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 38: USA Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 39: USA Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 40: USA 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • CANADA
    • TABLE 41: Canada Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 42: Canada Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 43: Canada 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 44: Canada Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 45: Canada Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 46: Canada 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • JAPAN
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
    • TABLE 47: Japan Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 48: Japan Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 49: Japan 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 50: Japan Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 51: Japan Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 52: Japan 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • CHINA
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
    • TABLE 53: China Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 54: China Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 55: China 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 56: China Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 57: China Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 58: China 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • EUROPE
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
    • TABLE 59: Europe Recent Past, Current & Future Analysis for High Density Interconnect by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 60: Europe Historic Review for High Density Interconnect by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 61: Europe 16-Year Perspective for High Density Interconnect by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2014, 2024 & 2030
    • TABLE 62: Europe Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 63: Europe Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 64: Europe 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 65: Europe Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 66: Europe Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 67: Europe 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • FRANCE
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
    • TABLE 68: France Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 69: France Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 70: France 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 71: France Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 72: France Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 73: France 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • GERMANY
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
    • TABLE 74: Germany Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 75: Germany Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 76: Germany 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 77: Germany Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 78: Germany Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 79: Germany 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • ITALY
    • TABLE 80: Italy Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 81: Italy Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 82: Italy 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 83: Italy Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 84: Italy Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 85: Italy 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • UNITED KINGDOM
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
    • TABLE 86: UK Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 87: UK Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 88: UK 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 89: UK Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 90: UK Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 91: UK 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • REST OF EUROPE
    • TABLE 92: Rest of Europe Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 93: Rest of Europe Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 94: Rest of Europe 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 95: Rest of Europe Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 96: Rest of Europe Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 97: Rest of Europe 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • ASIA-PACIFIC
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
    • TABLE 98: Asia-Pacific Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 99: Asia-Pacific Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 100: Asia-Pacific 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 101: Asia-Pacific Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 102: Asia-Pacific Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 103: Asia-Pacific 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • REST OF WORLD
    • TABLE 104: Rest of World Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 105: Rest of World Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 106: Rest of World 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 107: Rest of World Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 108: Rest of World Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 109: Rest of World 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030

IV. COMPETITION