智慧卡 IC 市場機會、成長動力、產業趨勢分析及 2025 - 2034 年預測

2024 年全球智慧卡 IC 市場價值為 32 億美元，預計到 2034 年將以 6.6% 的複合年成長率成長至 61 億美元。隨著全球各產業的數位轉型加速，市場發展勢頭強勁。對電子化政府、電子運輸、非接觸式支付系統等技術的日益依賴以及物聯網設備的廣泛採用，推動了對更智慧、更快速、更安全的識別和交易方法的需求。隨著各行各業持續數位營運以及政府推動增強公民服務，對智慧卡 IC 的需求正在大幅成長。對網路安全威脅的日益擔憂以及對萬無一失的身份驗證解決方案的需求進一步擴大了市場成長。生物辨識身份驗證、基於區塊鏈的安全功能以及多應用智慧卡在銀行、醫療保健和交通運輸等領域的廣泛使用，也加劇了強勁的需求。即使全球經濟壓力和監管變化影響製造和供應鏈，智慧卡 IC 市場仍然保持彈性，這得益於晶片技術的創新和領先企業的策略擴張。

對安全且高效的身份識別解決方案的需求，加上非接觸式支付和驗證系統的擴展，正在推動智慧卡積體電路市場向前發展。儘管貿易限制，尤其是川普時代對中國進口產品徵收的關稅，導致市場經歷了動盪，但市場仍保持穩定成長的勢頭。這些關稅增加了原料和包裝零件的成本，導致供應鏈中斷。嚴重依賴中國供應商的公司面臨更高的成本，不得不將生產轉移到台灣、墨西哥和越南等其他地區以降低風險。雖然這些調整增強了供應鏈的長期韌性，但也導致了短期採購延遲和營運成本上升。

智慧卡IC市場涵蓋各種類型，旨在滿足特定的安全需求和應用。其中，接觸式IC市場在2024年創造了10.8億美元的市場規模。這類IC需要與讀卡機進行實體接觸才能進行通訊，廣泛應用於安全環境，包括國民身分證、銀行卡和門禁系統。它們能夠安全地儲存和傳輸敏感資料，使其成為安全至關重要的行業中不可或缺的組成部分。

基於微控制器的積體電路 (IC) 市場在 2024 年實現了 17 億美元的收入。這些 IC 主要用於符合 EMV 標準的金融卡。它們採用嵌入式微控制器，支援安全的卡上資料處理、加密和身份驗證。隨著網路威脅的日益加劇，對強大安全措施的需求也日益成長，這使得基於微控制器的 IC 成為安全交易和身分保護的關鍵元件。

2024年，美國智慧卡IC市場規模達7.469億美元，得益於政府和私營部門對數位身分系統、物聯網支付解決方案和安全存取控制技術不斷增加的投資，該市場正呈現強勁成長動能。美國政府致力於提升網路安全水平，並實施先進的身份驗證計劃（例如REAL ID），這推動了智慧卡IC在聯邦和州政府計劃中的應用。隨著各行各業對安全數位交易和身分管理的重視，美國對智慧卡IC的需求持續成長。

全球智慧卡 IC 市場的主要參與者包括英飛凌科技股份公司、恩智浦半導體公司和義法半導體公司。這些公司在安全支付、身份驗證和數位服務領域引領創新。他們專注於增強產品安全性，擴展晶片功能，與銀行、電信和政府部門建立戰略合作夥伴關係，並大力投資研發具有先進加密技術、更高耐用性和更快處理速度的下一代晶片。在低成本地區建立製造中心有助於他們控制生產成本並簡化供應鏈，同時，行銷工作也持續提升全球對安全數位支付系統和政府身分證專案的認知度。

目錄

第1章：方法論與範圍

第2章：執行摘要

第3章：行業洞察

• 產業生態系統分析
• 川普政府關稅
  • 對貿易的影響
    • 貿易量中斷
    • 報復措施
  • 對產業的影響
    • 供給側影響（原料）
      • 主要材料價格波動
      • 供應鏈重組
      • 生產成本影響
    • 需求面影響（售價）
      • 價格傳導至終端市場
      • 市佔率動態
      • 消費者反應模式
  • 受影響的主要公司
  • 策略產業反應
    • 供應鏈重組
    • 定價和產品策略
    • 政策參與
  • 展望與未來考慮
• 供應商矩陣
• 利潤率分析
• 技術與創新格局
• 專利分析
• 重要新聞和舉措
• 產業衝擊力
  • 成長動力
    • 電子交通需求不斷成長
    • 日益重視電子化政府
    • 非接觸式支付的興起
    • 醫療保健領域的採用
    • 物聯網應用擴充
  • 產業陷阱與挑戰
    • 安全問題
    • 轉向數位支付系統
• 成長潛力分析
• 波特的分析
• PESTEL分析
• 未來市場趨勢
• 監管格局

第4章：市場估計與預測：依類型，2021 年至 2034 年

• 主要趨勢
• 接觸式積體電路
• 非接觸式積體電路
• 雙介面IC
• 混合積體電路

第5章：市場估計與預測：按比特大小，2021 年至 2034 年

• 主要趨勢
• 8位IC
• 16位IC
• 32位IC

第6章：市場估計與預測：按功能，2021 年至 2034 年

• 主要趨勢
• 基於微控制器的IC
• 基於記憶體的IC

第7章：市場估計與預測：依最終用途，2021 年至 2034 年

• 主要趨勢
• 電信
• 銀行、金融服務和保險
• 政府和公共部門
• 運輸
• 衛生保健
• 零售和忠誠度計劃
• 企業存取控制
• 其他

第8章：市場估計與預測：按地區，2021-2034 年

• 主要趨勢
• 北美洲
  • 美國
  • 加拿大
• 歐洲
  • 德國
  • 英國
  • 法國
  • 西班牙
  • 義大利
• 亞太地區
  • 日本
  • 中國
  • 印度
  • 韓國
  • 澳新銀行
• 拉丁美洲
  • 巴西
  • 墨西哥
• 中東和非洲
  • 南非
  • 阿拉伯聯合大公國
  • 沙烏地阿拉伯

第9章：公司簡介

• CPI Card Group Inc.
• Eastcompeace Technology Co., Ltd.
• EM Microelectronic-Marin SA (Swatch Group)
• Giesecke+Devrient GmbH (G+D)
• HED Technologies
• Hubei Dinglong Co., Ltd.
• IDEMIA
• Infineon Technologies AG
• Microchip Technology Inc.
• NXP Semiconductors NV
• Renesas ElectronICs Corporation
• Samsung ElectronICs Co., Ltd.
• Shanghai Fudan MicroelectronICs Group Co., Ltd.
• STMicroelectronICs NV
• Thales Group
• Unigroup Guoxin MicroelectronICs Co., Ltd.
• Watchdata Technologies
• Winbond ElectronICs Corporation
• Wuhan Tianyu Information Industry Co., Ltd.
• Xingtera Inc.

The Global Smart Card IC Market was valued at USD 3.2 billion in 2024 and is estimated to grow at a CAGR of 6.6% to reach USD 6.1 billion by 2034. The market is gaining momentum as digital transformation across sectors accelerates worldwide. Growing reliance on technologies such as e-governance, e-transportation, contactless payment systems, and the widespread adoption of IoT devices is driving the need for smarter, faster, and more secure identification and transaction methods. As industries continue to digitize operations and governments push for enhanced citizen services, the demand for smart card ICs is seeing a significant surge. Increasing concerns over cybersecurity threats and the need for foolproof authentication solutions further amplify market growth. The expanding use of biometric authentication, blockchain-based security features, and multi-application smart cards across sectors like banking, healthcare, and transportation adds to the strong demand. Even with global economic pressures and regulatory changes impacting manufacturing and supply chains, the Smart Card IC Market remains resilient, backed by innovations in chip technology and strategic expansions by leading players.

The demand for secure and efficient identification solutions, coupled with the expansion of contactless payment and verification systems, is propelling the smart card IC market forward. Although the market has experienced turbulence due to trade restrictions, especially the Trump-era tariffs on Chinese imports, it remains positioned for steady growth. These tariffs increased the cost of raw materials and packaging components, leading to supply chain disruptions. Companies heavily reliant on Chinese suppliers faced higher costs and shifted production to alternative regions such as Taiwan, Mexico, and Vietnam to mitigate risks. While these adjustments have strengthened long-term supply chain resilience, they caused short-term procurement delays and operational cost hikes.

The smart card IC market includes various types designed to meet specific security needs and applications. Among these, the contact-based ICs segment generated USD 1.08 billion in 2024. These ICs require physical contact with a reader for communication and are widely used in secure environments, including national identity cards, banking cards, and access control systems. Their ability to securely store and transmit sensitive data makes them indispensable across industries where security is critical.

The microcontroller-based ICs segment generated USD 1.7 billion in 2024. These ICs are predominantly used in financial cards adhering to EMV standards. Featuring embedded microcontrollers, they support secure on-card data processing, encryption, and identity verification. With rising cyber threats, the need for robust security measures is escalating, making microcontroller-based ICs a critical component for secure transactions and identity protection.

The U.S. Smart Card IC Market was valued at USD 746.9 million in 2024 and is seeing strong growth fueled by increasing investments from both government and private sectors in digital identity systems, IoT payment solutions, and secure access control technologies. The U.S. government's focus on improving cybersecurity and implementing advanced identity verification programs, such as REAL ID, is driving the adoption of smart card ICs across federal and state initiatives. As industries prioritize secure digital transactions and identity management, the demand for smart card ICs in the U.S. continues to rise.

Key players in the Global Smart Card IC Market include Infineon Technologies AG, NXP Semiconductors N.V., and STMicroelectronics N.V. These companies are leading innovations in secure payments, identity verification, and digital services. They are focusing on strengthening product security, expanding chip capabilities, forming strategic partnerships across banking, telecom, and government sectors, and investing heavily in R&D to develop next-generation chips with advanced encryption, greater durability, and faster processing speeds. The establishment of manufacturing hubs in low-cost regions is helping them control production costs and streamline supply chains, while marketing efforts continue to raise global awareness about secure digital payment systems and government ID programs.

Table of Contents

Chapter 1 Methodology & Scope

• 1.1 Market scope & definitions
• 1.2 Research design
  • 1.2.1 Research approach
  • 1.2.2 Data collection methods
• 1.3 Base estimates & calculations
  • 1.3.1 Base year calculation
  • 1.3.2 Key trends for market estimation
• 1.4 Forecast model
• 1.5 Primary research and validation
  • 1.5.1 Primary sources
  • 1.5.2 Data mining sources

Chapter 2 Executive Summary

• 2.1 Industry 360⁰ synopsis

Chapter 3 Industry Insights

• 3.1 Industry ecosystem analysis
• 3.2 Trump administration tariffs
  • 3.2.1 Impact on trade
    • 3.2.1.1 Trade volume disruptions
    • 3.2.1.2 Retaliatory measures
  • 3.2.2 Impact on the industry
    • 3.2.2.1 Supply-side impact (raw materials)
      • 3.2.2.1.1 Price volatility in key materials
      • 3.2.2.1.2 Supply chain restructuring
      • 3.2.2.1.3 Production cost implications
    • 3.2.2.2 Demand-side impact (selling price)
      • 3.2.2.2.1 Price transmission to end markets
      • 3.2.2.2.2 Market share dynamics
      • 3.2.2.2.3 Consumer response patterns
  • 3.2.3 Key companies impacted
  • 3.2.4 Strategic industry responses
    • 3.2.4.1 Supply chain reconfiguration
    • 3.2.4.2 Pricing and product strategies
    • 3.2.4.3 Policy engagement
  • 3.2.5 Outlook and future considerations
• 3.3 Vendor matrix
• 3.4 Profit margin analysis
• 3.5 Technology & innovation landscape
• 3.6 Patent analysis
• 3.7 Key news and initiatives
• 3.8 Industry impact forces
  • 3.8.1 Growth drivers
    • 3.8.1.1 Growing demand for e-transportation
    • 3.8.1.2 Growing emphasis on e-Governance
    • 3.8.1.3 Rise in contactless payments
    • 3.8.1.4 Adoption in the healthcare sector
    • 3.8.1.5 Expansion of IoT applications
  • 3.8.2 Industry pitfalls & challenges
    • 3.8.2.1 Security concerns
    • 3.8.2.2 Shift towards digital payment systems
• 3.9 Growth potential analysis
• 3.10 Porter's analysis
• 3.11 PESTEL analysis
• 3.12 Future market trends
• 3.13 Regulatory landscape

Chapter 4 Market Estimates and Forecast, by Type, 2021 – 2034 (USD Bn & Mn Units)

• 4.1 Key trends
• 4.2 Contact-based ICs
• 4.3 Contactless ICs
• 4.4 Dual interface ICs
• 4.5 Hybrid ICs

Chapter 5 Market Estimates and Forecast, by Bit Size, 2021 – 2034 (USD Bn & Mn Units)

• 5.1 Key trends
• 5.2 8-bit ICs
• 5.3 16-bit ICs
• 5.4 32-bit ICs

Chapter 6 Market Estimates and Forecast, by Functionality, 2021 – 2034 (USD Bn & Mn Units)

• 6.1 Key trends
• 6.2 Microcontroller-based ICs
• 6.3 Memory-based ICs

Chapter 7 Market Estimates and Forecast, by End Use, 2021 – 2034 (USD Bn & Mn Units)

• 7.1 Key trends
• 7.2 Telecommunications
• 7.3 Banking, financial services & insurance
• 7.4 Government & public sector
• 7.5 Transportation
• 7.6 Healthcare
• 7.7 Retail & loyalty programs
• 7.8 Enterprise access control
• 7.9 Others

Chapter 8 Market Estimates and Forecast, By Region, 2021– 2034 (USD Bn & Mn Units)

• 8.1 Key trends
• 8.2 North America
  • 8.2.1 U.S.
  • 8.2.2 Canada
• 8.3 Europe
  • 8.3.1 Germany
  • 8.3.2 UK
  • 8.3.3 France
  • 8.3.4 Spain
  • 8.3.5 Italy
• 8.4 Asia Pacific
  • 8.4.1 Japan
  • 8.4.2 China
  • 8.4.3 India
  • 8.4.4 South Korea
  • 8.4.5 ANZ
• 8.5 Latin America
  • 8.5.1 Brazil
  • 8.5.2 Mexico
• 8.6 Middle East and Africa
  • 8.6.1 South Africa
  • 8.6.2 UAE
  • 8.6.3 Saudi Arabia

Chapter 9 Company Profile

• 9.1 CPI Card Group Inc.
• 9.2 Eastcompeace Technology Co., Ltd.
• 9.3 EM Microelectronic-Marin SA (Swatch Group)
• 9.4 Giesecke+Devrient GmbH (G+D)
• 9.5 HED Technologies
• 9.6 Hubei Dinglong Co., Ltd.
• 9.7 IDEMIA
• 9.8 Infineon Technologies AG
• 9.9 Microchip Technology Inc.
• 9.10 NXP Semiconductors N.V.
• 9.11 Renesas ElectronICs Corporation
• 9.12 Samsung ElectronICs Co., Ltd.
• 9.13 Shanghai Fudan MicroelectronICs Group Co., Ltd.
• 9.14 STMicroelectronICs N.V.
• 9.15 Thales Group
• 9.16 Unigroup Guoxin MicroelectronICs Co., Ltd.
• 9.17 Watchdata Technologies
• 9.18 Winbond ElectronICs Corporation
• 9.19 Wuhan Tianyu Information Industry Co., Ltd.
• 9.20 Xingtera Inc.