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市場調查報告書
商品編碼
1621668
金屬芯 PCB (MCPCB) 市場機會、成長促進因素、產業趨勢分析和 2024 年至 2032 年預測Metal Core PCB (MCPCB) Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 to 2032 |
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2023 年全球金屬芯 PCB (MCPCB) 市場估值為 137 億美元，預計 2024 年至 2032 年複合年成長率為 4%。二極體（LED）技術的需求顯著增加。金屬芯 PCB 在 LED 應用中至關重要，因為它們可以有效管理散熱。隨著 LED 照明系統在住宅、商業和汽車等各種環境中不斷取代螢光燈泡和傳統白熾燈，對具有增強熱管理功能的 MCPCB 的需求不斷增加。智慧照明和汽車照明的持續擴張，特別是在電動車的背景下，進一步推動了這一市場的成長，鞏固了 MCPCB 作為現代節能照明解決方案中重要組件的作用。
在汽車領域，由於產業技術的快速進步，對金屬芯PCB的需求也不斷增加。電動車 (EV)、自動駕駛系統和高級駕駛輔助系統 (ADAS) 等創新需要耐用且耐熱的電子元件。金屬芯 PCB 憑藉其卓越的散熱性能在這方面表現出色。汽車中高功率電子裝置的整合（包括電池管理和功率轉換系統）是 MCPCB 市場成長的重要推動力。
市場可依層類型分為單層、雙層和多層 MCPCB。預計單層 MCPCB 領域在預測期內的複合年成長率將超過 3%。單層 MCPCB 由安裝在金屬芯（通常是鋁或銅）上的單一導電銅層組成，其間有絕緣介電層。這些板非常適合以最小的電路複雜性優先考慮散熱的應用，使其成為 LED 照明、汽車照明和消費電子產品等行業的經濟高效的選擇。
| 市場範圍 | |
|---|---|
| 開始年份 | 2023年 |
| 預測年份 | 2024-2032 |
| 起始值 | 137 億美元 |
| 預測值 | 200億美元 |
| 複合年成長率 | 4% |
此外，市場可按芯材細分為鋁芯 PCB、銅芯 PCB 和其他金屬芯 PCB。到2032 年，鋁芯市場預計將達到90 億美元。選擇。 2023年，亞太地區引領全球MCPCB市場，佔總佔有率超過30%。該地區的主導地位歸功於其強大的電子和製造業，主要參與者依賴 MCPCB 進行有效的熱管理。
在汽車和電信產業需求不斷成長的推動下，美國市場也正在經歷強勁成長，尤其是與 5G 基礎設施和再生能源項目相關的需求。
目錄
第 1 章：方法與範圍
第 2 章：執行摘要
第 3 章：產業洞察
- 產業生態系統分析
- 影響價值鏈的因素
- 利潤率分析
- 干擾
- 未來展望
- 製造商
- 經銷商
- 供應商格局
- 利潤率分析
- 重要新聞和舉措
- 監管環境
- 衝擊力
- 成長動力
- LED照明需求不斷增加
- 汽車電子產品的採用率不斷上升
- 消費性電子市場的擴大
- 電信和 5G 基礎設施的進步
- 產業陷阱與挑戰
- 製造成本高
- 新興技術的競爭
- 成長動力
- 成長潛力分析
- 波特的分析
- PESTEL分析
第 4 章：競爭格局
- 介紹
- 公司市佔率分析
- 競爭定位矩陣
- 戰略展望矩陣
第 5 章：市場估計與預測：按類型，2021-2032 年
- 主要趨勢
- 鋁芯PCB
- 銅芯PCB
- 其他金屬芯PCB
第 6 章：市場估計與預測：按層類型，2021-2032
- 主要趨勢
- 單層 MCPCB
- 雙層 MCPCB
- 多層 MCPCB
第 7 章：市場估計與預測：按應用分類，2021-2032 年
- 主要趨勢
- LED照明
- 電源轉換器
- 電動車
- 太陽能板
- 電信設備
- 汽車電子
- 消費性電子產品
- 航太和國防
- 醫療器材
- 其他
第 8 章：市場估計與預測：按地區，2021-2032 年
- 主要趨勢
- 北美洲
- 美國
- 加拿大
- 歐洲
- 英國
- 德國
- 法國
- 義大利
- 西班牙
- 俄羅斯
- 亞太地區
- 中國
- 印度
- 日本
- 韓國
- 澳洲
- 拉丁美洲
- 巴西
- 墨西哥
- MEA
- 南非
- 沙烏地阿拉伯
- 阿拉伯聯合大公國
第 9 章：公司簡介
- ABP Electronics Limited
- Advanced Circuits, Inc.
- Aoshikang Technology Co., Ltd.
- AT&S Austria Technologie & Systemtechnik AG
- Best Technology
- Cirexx International
- Epec, LLC.
- ExPlus Co.
- Focus Technology Co., Ltd.
- Fujikura Ltd.
- HuanYu Future Technologies Co., Ltd.
- Infineon
- Insulectro
- Isola Group
- Meyer Burger Technology AG
- Mitsubishi Materials Corporation
- RIGIFLEX TECHNOLOGY INC.
- Sierra Circuits, Inc.
- Technotronix
- Viasion Technology Co., Ltd.
The Global Metal Core PCB (MCPCB) Market was valued at USD 13.7 billion in 2023 and is projected to grow at a CAGR of 4% from 2024 to 2032. This growth is primarily driven by the global shift towards energy-efficient lighting solutions, which has significantly increased the demand for Light Emitting Diode (LED) technology. Metal core PCBs are crucial in LED applications as they efficiently manage heat dissipation. As LED lighting systems continue to replace fluorescent bulbs and traditional incandescent in various settings, including residential, commercial, and automotive, the demand for MCPCBs with enhanced thermal management features is on the rise. The ongoing expansion of smart lighting and automotive lighting, especially in the context of electric vehicles, is further fueling this market growth, solidifying the role of MCPCBs as vital components in modern energy-efficient lighting solutions.
In the automotive sector, the demand for metal core PCBs is also increasing due to the industry's rapid technological advancements. Innovations such as electric vehicles (EVs), autonomous driving systems, and advanced driver-assistance systems (ADAS) require durable and heat-resistant electronic components. Metal core PCBs excel in this regard, thanks to their exceptional heat dissipation properties. The integration of high-power electronics in vehicles, including systems for battery management and power conversion, is a significant driver of growth within the MCPCB market.
The market can be categorized based on layer type into single-layer, double-layer, and multi-layer MCPCBs. The single-layer MCPCB segment is anticipated to grow at a CAGR of over 3% during the forecast period. Single-layer MCPCBs consist of a single conductive copper layer mounted on a metal core, typically aluminum or copper, with an insulating dielectric layer in between. These boards are ideal for applications that prioritize heat dissipation with minimal circuit complexity, making them a cost-effective choice for industries such as LED lighting, automotive lighting, and consumer electronics.
| Market Scope | |
|---|---|
| Start Year | 2023 |
| Forecast Year | 2024-2032 |
| Start Value | $13.7 Billion |
| Forecast Value | $ 20 Billion |
| CAGR | 4% |
Additionally, the market can be segmented by core material into aluminum core PCBs, copper core PCBs, and other metal core PCBs. The aluminum core segment is expected to reach USD 9 billion by 2032. Aluminum core PCBs are favored for their excellent thermal conductivity, lightweight nature, and cost-effectiveness, making them ideal for applications that require efficient heat dissipation without adding significant weight. The Asia-Pacific region led the global MCPCB market in 2023, accounting for over 30% of the total share. This region's dominance is attributed to its robust electronics and manufacturing sectors, with major players relying on MCPCBs for effective heat management.
The U.S. market is also experiencing strong growth, driven by increasing demand from the automotive and telecommunications industries, particularly related to 5G infrastructure and renewable energy projects.
Table of Contents
Chapter 1 Methodology & Scope
- 1.1 Market scope & definitions
- 1.2 Base estimates & calculations
- 1.3 Forecast calculations
- 1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
- 1.4.2.1 Paid sources
- 1.4.2.2 Public sources
Chapter 2 Executive Summary
- 2.1 Industry synopsis, 2021-2032
Chapter 3 Industry Insights
- 3.1 Industry ecosystem analysis
- 3.1.1 Factor affecting the value chain
- 3.1.2 Profit margin analysis
- 3.1.3 Disruptions
- 3.1.4 Future outlook
- 3.1.5 Manufacturers
- 3.1.6 Distributors
- 3.2 Supplier landscape
- 3.3 Profit margin analysis
- 3.4 Key news & initiatives
- 3.5 Regulatory landscape
- 3.6 Impact forces
- 3.6.1 Growth drivers
- 3.6.1.1 Increasing demand for LED lighting
- 3.6.1.2 Rising adoption in automotive electronics
- 3.6.1.3 Expansion of consumer electronics market
- 3.6.1.4 Advancements in telecommunications and 5G infrastructure
- 3.6.2 Industry pitfalls & challenges
- 3.6.2.1 High manufacturing costs
- 3.6.2.2 Competition of emerging technologies
- 3.6.1 Growth drivers
- 3.7 Growth potential analysis
- 3.8 Porter's analysis
- 3.9 PESTEL analysis
Chapter 4 Competitive Landscape, 2023
- 4.1 Introduction
- 4.2 Company market share analysis
- 4.3 Competitive positioning matrix
- 4.4 Strategic outlook matrix
Chapter 5 Market Estimates & Forecast, By Type, 2021-2032 (USD Million)
- 5.1 Key trends
- 5.2 Aluminum core PCBs
- 5.3 Copper core PCBs
- 5.4 Other metal core PCBs
Chapter 6 Market Estimates & Forecast, By Layer Type, 2021-2032 (USD Million)
- 6.1 Key trends
- 6.2 Single-Layer MCPCBs
- 6.3 Double-Layer MCPCBs
- 6.4 Multi-layer MCPCBs
Chapter 7 Market Estimates & Forecast, By Application, 2021-2032 (USD Million)
- 7.1 Key trends
- 7.2 LED lighting
- 7.3 Power converters
- 7.4 Electric vehicles
- 7.5 Solar panels
- 7.6 Telecommunications equipment
- 7.7 Automotive electronics
- 7.8 Consumer electronics
- 7.9 Aerospace and defense
- 7.10 Medical devices
- 7.11 Others
Chapter 8 Market Estimates & Forecast, By Region, 2021-2032 (USD Million)
- 8.1 Key trends
- 8.2 North America
- 8.2.1 U.S.
- 8.2.2 Canada
- 8.3 Europe
- 8.3.1 UK
- 8.3.2 Germany
- 8.3.3 France
- 8.3.4 Italy
- 8.3.5 Spain
- 8.3.6 Russia
- 8.4 Asia Pacific
- 8.4.1 China
- 8.4.2 India
- 8.4.3 Japan
- 8.4.4 South Korea
- 8.4.5 Australia
- 8.5 Latin America
- 8.5.1 Brazil
- 8.5.2 Mexico
- 8.6 MEA
- 8.6.1 South Africa
- 8.6.2 Saudi Arabia
- 8.6.3 UAE
Chapter 9 Company Profiles
- 9.1 ABP Electronics Limited
- 9.2 Advanced Circuits, Inc.
- 9.3 Aoshikang Technology Co., Ltd.
- 9.4 AT&S Austria Technologie & Systemtechnik AG
- 9.5 Best Technology
- 9.6 Cirexx International
- 9.7 Epec, LLC.
- 9.8 ExPlus Co.
- 9.9 Focus Technology Co., Ltd.
- 9.10 Fujikura Ltd.
- 9.11 HuanYu Future Technologies Co., Ltd.
- 9.12 Infineon
- 9.13 Insulectro
- 9.14 Isola Group
- 9.15 Meyer Burger Technology AG
- 9.16 Mitsubishi Materials Corporation
- 9.17 RIGIFLEX TECHNOLOGY INC.
- 9.18 Sierra Circuits, Inc.
- 9.19 Technotronix
- 9.20 Viasion Technology Co., Ltd.
