半導體行業的增材製造:技術擴散和路線圖
市場調查報告書
商品編碼
1167931

半導體行業的增材製造:技術擴散和路線圖

Additive Manufacturing in the Semiconductor Industry: Technology Penetration and Roadmap

出版日期: | 出版商: Frost & Sullivan | 英文 69 Pages | 商品交期: 最快1-2個工作天內

價格
簡介目錄

本報告分析了增材製造 (AM)(也稱為 3D 打印)在半導體行業中的市場機遇。 它詳細介紹了市場趨勢和驅動因素,總結了半導體行業到 2028 年的預測,並提供了主要參與者簡介等。

內容

戰略要務

  • 為什麼增長越來越難?
  • 戰略要務
  • 半導體行業增材製造三大戰略要務的影響
  • 增長機會加速增長管道引擎
  • 調查方法
  • 調查結果摘要

增長機會分析

  • 分析範圍
  • 受 AM 在半導體中的使用影響的終端市場細分
  • 增長動力
  • 抑制增長的因素

行業展望、技術與應用趨勢、招聘趨勢

  • 全球半導體行業展望
  • 2020 年至 2021 年 IC 短缺對汽車行業的影響
  • 大流行期間增材製造對半導體製造的影響
  • AM 製造的半導體零件
  • 氣溶膠噴射打印 (AJP) 和選擇性激光燒結 (SLS) 是能夠實現半導體製造的增材製造技術。
  • 立體光刻 (SLA) 和數字光處理 (DLP) 是能夠實現半導體製造的增材製造技術
  • 增材製造對六個終端市場半導體行業的影響分析
  • 半導體行業增材製造應用情況分析
  • 影響 3D 打印半導體採用的全球趨勢
  • 技術開發:專注於微型電子印刷和先進材料
  • 技術開發:專注於縮短打印交付週期和打印複雜零件
  • 3D 打印半導體零件的市場趨勢(按應用分類)

區域形勢與價值鏈分析

  • 區域採用情況:推動採用 3D 打印的因素
  • 全球競爭格局
  • 促進市場滲透和採用的新業務模式
  • 半導體 3D 打印工藝價值鏈
  • 市場發展戰略:按服務戰略進行地域擴張和消費者獲取
  • 用例 1:Nano Dimension(美國)和 Hensoldt(德國)- 多層電路板
  • 用例 2:Optomec(美國)和 Lite-On Technology Corporation(台灣):電子元件的可擴展打印
  • 用例 3:BotFactory(美國)- 溫度計的短交貨期 PCB 印刷

行業最佳實踐:領先企業的發展戰略

  • 戰略合作夥伴關係:進一步探索 3D 打印技術
  • 研發合作:5G 性能增強與半導體製造創新的融合
  • 政府倡議:有利的政策和研究合作,以探索芯片製造的新可能性
  • 併購:專注於使用先進材料和人工智能的精密半導體印刷
  • 新產品發布:使用微型導電墨水的微型半導體 3D 打印機
  • 為先進材料、新創新和市場擴張提供資金
  • 資金分析 (2020-2022):政府支持初創企業

技術路線圖

  • 半導體行業增材製造技術路線圖

活躍的公司

  • Nano Dimension
  • Optomec
  • Fabric8Labs
  • Scrona
  • ATLANT 3D Nanosystems

增長機會領域

  • 增長機會 1:戰略併購和合作夥伴關係
  • 增長機會 2:技術競爭力
  • 增長機會 3:標準化印刷流程和嚴格的質量控制

附錄

下一步

簡介目錄
Product Code: D9F2

Disruptive technologies are driving the adoption of 3D printing in the semiconductor industry

The research report analyzes the market opportunities for additive manufacturing (AM), also known as 3D printing, in the semiconductor industry. The study discusses technological development, including semiconductor 3D printing innovations. It elaborates on the market trends and drivers and charts the expected evolution of this technology in the semiconductor industry up to 2028. The ecosystem analysis includes research breakthroughs for semiconductor 3D printing and the profiles of some key players. The study also discusses market restraints that potentially hinder the adoption of semiconductor 3D printing. This report concludes with a growth opportunity analysis of related industries and recommendations for market players and stakeholders that will accelerate the growth of 3D printing in the semiconductor industry.

The commercialization of 3D printing for the semiconductor industry largely centers on printing electronic components, resistors, transistors, capacitors, antennas, radio frequency (RF) devices, etc. Researchers believe that 3D printing will enhance the 5G connection in mobile devices by enabling the manufacture of densely printed electronic components.

Many 3D printing companies are pioneering advanced chip packaging technologies as the conventional method is labor-intensive and time-consuming. In terms of applications, 3D semiconductor printing impacts many industries, especially the automotive, consumer electronics, and medical industries, with large-scale adoption expected in the next 2 to 5 years resulting from improved functional requirements of 3D-printed electronic parts.

Key questions this study will answer:

  • 1. What is the outlook of the global semiconductor industry? What impact has the chip shortage had on the automotive industry?
  • 2. What impact has 3D printing had on the global semiconductor sector and the key emerging application landscape of semiconductor 3D printing across different industry verticals?
  • 3. What are the influencing factors driving the opportunities for semiconductor 3D printing? What do the competitive landscape and regional adoption scenario look like?
  • 4. What developmental strategies have companies adopted to leverage 3D printing technology and enhance market penetration?

Table of Contents

Strategic Imperatives

  • Why Is It Increasingly Difficult to Grow?The Strategic Imperative 8™: Factors Creating Pressure on Growth
  • The Strategic Imperative 8™
  • The Impact of the Top 3 Strategic Imperatives of Additive Manufacturing (AM) in the Semiconductor Industry
  • Growth Opportunities Fuel the Growth Pipeline Engine™
  • Research Methodology
  • Summary of Findings

Growth Opportunity Analysis

  • Scope of Analysis
  • Segmentation of End Markets that the Use of AM in Semiconductors has Impacted
  • Growth Drivers
  • Growth Restraints

Industry Outlook, Technology and Application Landscape, and Adoption Trends

  • Global Semiconductor Sector Outlook
  • The Impact of the IC Shortage on the Automotive Industry between 2020 and 2021
  • The Impact of AM on Semiconductor Production During the Pandemic
  • Semiconductor Components Manufactured Using AM
  • Aerosol Jet Printing (AJP) and Selective Laser Sintering (SLS) are AM Technologies Enabling Semiconductor Manufacturing
  • Stereolithography (SLA) and Digital Light Processing (DLP) are AM Technologies that Enable Semiconductor Manufacturing
  • Impact Analysis of AM on the Semiconductor Industry across 6 End Markets
  • Application Landscape Analysis of AM in the Semiconductor Industry
  • Global Trends Influencing 3D-printed Semiconductor Adoption
  • Technology Development: A Focus on Micro-sized Electronic Printing and Advanced Materials
  • Technology Development: A Focus on Shorter Printing Lead Time and Intricate Part Printing
  • Market Trends by Application of 3D-printed Semiconductor Components

Regional Landscape and Value Chain Analysis

  • Regional Adoption Scenario: Factors Driving the Adoption of 3D Printing
  • Global Competitive Landscape
  • Emerging Business Models Encouraging Market Penetration and Adoption
  • Process Value Chain of Semiconductor 3D Printing
  • Go-to-market Strategy: Consumer Acquisition through Geographical Expansion and Service Strategy
  • Use Case 1: Nano Dimension (United States) and Hensoldt (Germany)-The Multilayered Circuit Board
  • Use Case 2: Optomec (United States) and Lite-On Technology Corporation (Taiwan): Printing Electronic Parts at Scalable Volumes
  • Use Case 3: BotFactory (United States)-Short Lead Time PCB Printing for Thermometers

Industry Best Practices: Developmental Strategies Adopted by Key Players

  • Strategic Partnership: Further Exploration in 3D Printing Technology
  • R&D Collaboration: Convergence to 5G Performance Enhancement and Innovation in Semiconductor Production
  • Government Initiatives: Favorable Policies and Research Collaboration to Explore New Possibilities in Chip Manufacturing
  • M&As: A Focus on Precision Semiconductor Printing Using Advanced Material and AI
  • New Product Launches: 3D Printers for Miniaturized Semiconductors Using Micro-sized Conductive Ink
  • Funding for Advanced Material, New Innovations, and Market Expansion
  • Funding Analysis from 2020 to 2022: Governments Support Start-ups

Technology Roadmap

  • Technology Roadmap of AM in the Semiconductor Industry

Companies to Action

  • Nano Dimension, United States
  • Optomec, United States
  • Fabric8Labs, United States
  • Scrona, Switzerland
  • ATLANT 3D Nanosystems, Denmark

Growth Opportunity Universe

  • Growth Opportunity 1: Strategic M&As and Partnerships
  • Growth Opportunity 1: Strategic M&As and Partnerships (continued)
  • Growth Opportunity 2: Technology Competitiveness
  • Growth Opportunity 2: Technology Competitiveness (continued)
  • Growth Opportunity 3: Standardized Printing Process and Stringent Quality Control
  • Growth Opportunity 3: Standardized Printing Process and Stringent Quality Control (continued)

Appendix

  • Technology Readiness Levels (TRL): Explanation

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