全球導熱界面材料市場（2027-2037 年）

用於填充發熱元件和散熱表面之間微小縫隙的導熱材料，已從普通的通用耗材發展成為電子產品設計中的限速因素。其需求不再取決於裝置數量，而是取決於功率密度。運行人工智慧工作負載的GPU會產生約140 W/cm²的熱通量，但在3D堆疊架構中，平均熱通量可達近300 W/cm²，局部熱點區域甚至可達500-1000 W/cm²。當封裝發熱量約為100 W時，填充聚合物足以滿足需求；但隨著先進封裝的發熱量接近1000 W，填充聚合物的性能已接近極限。金屬介面，特別是銦合金，在功率範圍超過約 400 W 的裝置中正日益被採用。在此範圍內，從聚合物界面切換到金屬界面已被證明可將結溫降低 10 度C以上，考慮到溫度升高 10 度C通常會導致晶片壽命減半，這意義極為重大。

本報告對11個終端市場的導熱介面材料進行了全面的技術和商業性評估。報告從材料角度分析了市場。評估範圍涵蓋金屬界面材料，包括導熱矽脂和導熱膏、間隙墊片、點膠填充劑、灌封膠和封裝、膠帶、相變材料、焊料、燒結銀和銅以及液態金屬，以及所有碳基材料，從石墨片到垂直取向的奈米管陣列和石墨烯複合材料。報告分別討論了填料的化學性質，包括氧化鋁、氮化硼、氮化鋁、鑽石、石墨烯和氮化硼奈米管，並說明了每種填料的價格和應用​​障礙。

本書在專門章節中，將新興材料和工藝分類和說明，並非依據其化學性質，而是依據它們所解決的工程挑戰。這涵蓋了許多主題，例如TIM0至TIM3命名法、大型高性能計算模組中降低的允許壓力、混合和密封液態金屬架構、用於人工智慧伺服器晶片的抗翹曲相變材料、固定化奈米碳界面、超高密度石墨、砷化硼、液態注入奈米線複合材料、晶片背面供電、與數據浸式冷卻的兼容性、基於數據的規格、說明

每年都會以材料類型提供以下產業的市場預測：家用電子電器、電動車、資料中心、先進半導體封裝、ADAS感測器、電磁干擾屏蔽、5G基礎設施、航太與國防、工業材料類型、可再生能源和醫療用電子設備。除了伺服器基板、ADAS晶片貼裝、5G天線、基頻單元和電源的面積預測（平方公尺）外，還提供5G功耗模型。

本報告介紹了涵蓋整個價值鏈的118家公司的概況，從跨國複合材料製造商到創業投資支持的材料新創公司，內容包括近期產品發布、合作關係和公司發展趨勢。隨附的Excel工作簿包含所有基礎資料，並以即時可編輯模型的形式呈現。

目錄如下：

• 引言 - 主動和被動溫度控管、導熱界面材料的類型和導熱係數、性能比較、導熱墊和導熱矽脂的比較、各種導熱界面材料的優缺點、性能、價格、供應鏈、原料分析和定價、環境法規和永續性、系統級性能、導熱係數和熱阻的比較、導熱界面材料的化學性質
• 材料－先進及多功能導熱界面材料、填料及發展趨勢、潤滑脂和膏體、間隙墊片、間隙填充劑、灌封膠和封裝、膠帶、相變材料、金屬導熱界面材料、碳基導熱界面材料、超材料、自修復導熱界面材料、應用設備和方法
• 新興材料與製程－界面約束、TIM0-TIM3命名法、混合和受限液態金屬、下一代相變材料（PCM）、固定化奈米碳、石墨烯和VHD石墨、氮化硼和砷化硼、液態注入和奈米線複合材料、金屬TIM1、異質整合和背面供電、浸沒式冷卻、液態注入和奈米線複合材料、金屬TIM1、異質整合和背面供電、浸煡式冷卻、人工智慧主導的發現、永續性性與整合性測量
• 市場領域－家用電子電器、電動車、資料中心、先進半導體封裝、ADAS感測器、電磁干擾屏蔽、5G、航太與國防、工業電子、可再生能源、醫療用電子設備
• 118 家公司的公司簡介。參展公司包括：3M、ADA Technologies、Aismalibar、AI Technology、Alpha Assembly、AluChem、AOK Technologies、AOS Thermal Compounds、Arkema、Arieca、ATP Adhesive Systems、Aztrong、Bando Chemical Industries、Bdtronic、BestGraphene、BNNano、BNNT、Boston Materials、Boyd Corporation、BYK、Cambridge Nanotherm、Carbice、Carbon Waters、Carbodeon、CondAlign、Denka、Detakta、Dexerials、Deyang Carbonene Technology、Discovered Materials、Dow Corning、Dowa Electronics Materials、Dymax、Dynex Semiconductor (CRRC)、ELANTAS、Elkem Silcones、Enerdyne Thermal Solutions、Epoxies Etc.、First Graphene、Fujipoly、Fujitsu Laboratories、GCS Thermal、GLPOLY、Global Graphene Group、Goodfellow、Graphmatech、Green Critical Minerals、GuangDong KingBali New Material、HALA Contec、Hamamatsu Carbonics、H.B. Fuller、Henkel、Hitek Electronic Materials、Honeywell、Hongfucheng New Materials、Huber Martinswerk、HyMet Thermal Interfaces、Indium Corporation、Inkron、KB Element、Kerafol、Kitagaw等。

目錄

第1章摘要整理

第2章：引言

• 溫度控管—主動式和被動式
• 什麼是導熱界面材料（TIM）？
• TIM 比較特徵
• 導熱墊及導熱矽脂
• 不同類型導熱材料（TIM）的優缺點
• 表現
• 價格
• TIM領域的新興技術
• TIMs的供應鏈
• 原料的分析與定價
• 環境法規和永續性
• 系統級性能
• 熱導率和熱阻
• TIM化學

第3章 材料

• 先進的多功能導熱介面材料
• TIM填充材
• 導熱油脂和膏
• 導熱間隙墊
• 熱間隙填充材
• 灌封膠/封裝
• 膠帶
• 相變材料
• 金屬塗層
• 碳基導熱界面材料
• 超材料
• 自修復導熱界面材料
• TIM 分配

第4章：新材料和新工藝

• 為什麼介面會變成約束
• 命名法
• 混合型和受限型液態金屬結構
• 新一代相變材料
• 固定奈米碳界面
• 石墨烯、石墨、超高密度碳
• 氮化硼、砷化硼和人工填充材
• 液體注射型奈米線複合材料
• 金屬TIM1：燒結銦焊料
• 封裝架構：異質整合和後置電源
• 相容液冷式冷卻
• 人工智慧驅動的藥物發現
• 永續性和循環性
• 計量、可靠性和認證實踐
• 計算以外的熱需求：網路矽

第5章 導熱界面材料（TIM）市場

• 家用電器
• 電動車（EV）
• 資料中心
• 先進半導體封裝
• ADAS感測器
• 電磁干擾屏蔽
• 5G
• 航太/國防
• 工業電子設備
• 可再生能源
• 醫療用電子設備

第6章：公司簡介（119家公司簡介）

第7章：調查方法

第8章參考文獻

Thermal interface materials fill the microscopic voids between a heat-generating component and the surface carrying heat away, and they have moved from a commodity consumable to a rate-limiting factor in electronics design. Demand is set by power density rather than device count. GPUs running AI workloads dissipate heat fluxes on the order of 140 W/cm², while three-dimensional stacked architectures record average fluxes near 300 W/cm² with localised hotspots between 500 and 1,000 W/cm². Filled polymers, adequate when packages dissipated around 100 W, are reaching their ceiling as advanced packages approach 1,000 W. Metal interfaces, indium alloys in particular, are increasingly specified above roughly 400 W, where switching from polymer has been shown to cut junction temperature by more than 10°C - significant given a 10°C rise typically halves die lifetime.

This report provides a comprehensive technical and commercial assessment of thermal interface materials across eleven end markets. The market is analysed from the materials up. Coverage spans greases and pastes, gap pads, dispensed gap fillers, potting compounds and encapsulants, adhesive tapes, phase change materials, metal-based interfaces including solders, sintered silver and copper, and liquid metals, and the full range of carbon-based options from graphite sheet to vertically aligned nanotube arrays and graphene composites. Filler chemistry is treated separately, covering alumina, boron nitride, aluminium nitride, diamond, graphene and boron nitride nanotubes, with pricing and adoption barriers for each.

A dedicated chapter addresses emerging materials and processes, organised by the engineering problem each solves rather than by chemistry. It covers TIM0 through TIM3 nomenclature and the collapse in allowable application pressure for large HPC modules, hybrid and confined liquid metal architectures, warpage-tolerant phase change materials for AI server dies, anchored nanocarbon interfaces, very high density graphite, boron arsenide, liquid-infused nanowire composites, die backside power delivery, immersion cooling compatibility, AI-directed formulation discovery, circularity, and the shift from datasheet-based specification to knowledge-based qualification.

Market forecasts are provided for consumer electronics, electric vehicles, data centres, advanced semiconductor packaging, ADAS sensors, EMI shielding, 5G infrastructure, aerospace and defence, industrial electronics, renewable energy and medical electronics, segmented by material type at annual granularity. Area forecasts in m² are given for server boards, ADAS die attach, 5G antennas, baseband units and power supplies, alongside a 5G power consumption model.

The report profiles 118 companies across the value chain, from multinational formulators to venture-backed materials startups, with recent product launches, partnerships and corporate developments. An accompanying Excel workbook contains all underlying data as live, editable models.

Contents include:

• Introduction - active and passive thermal management, TIM types and thermal conductivity, comparative properties, pads versus grease, advantages and disadvantages by type, performance, prices, supply chain, raw material analysis and pricing, environmental regulations and sustainability, system-level performance, thermal conductivity versus thermal resistance, TIM chemistry
• Materials - advanced and multi-functional TIMs, fillers and trends, greases and pastes, gap pads, gap fillers, potting compounds and encapsulants, adhesive tapes, phase change materials, metal-based TIMs, carbon-based TIMs, metamaterials, self-healing TIMs, dispensing equipment and methods
• Emerging materials and processes - interface as constraint, TIM0-TIM3 nomenclature, hybrid and confined liquid metals, next-generation PCMs, anchored nanocarbon, graphene and VHD graphite, boron nitride and boron arsenide, liquid-infused and nanowire composites, metal TIM1, heterogeneous integration and backside power, immersion cooling, AI-directed discovery, sustainability and circularity, metrology and qualification, networking silicon
• Markets - consumer electronics, electric vehicles, data centres, advanced semiconductor packaging, ADAS sensors, EMI shielding, 5G, aerospace and defence, industrial electronics, renewable energy, medical electronics
• 118 Company profiles. Companies profiled include 3M, ADA Technologies, Aismalibar, AI Technology, Alpha Assembly, AluChem, AOK Technologies, AOS Thermal Compounds, Arkema, Arieca, ATP Adhesive Systems, Aztrong, Bando Chemical Industries, Bdtronic, BestGraphene, BNNano, BNNT, Boston Materials, Boyd Corporation, BYK, Cambridge Nanotherm, Carbice, Carbon Waters, Carbodeon, CondAlign, Denka, Detakta, Dexerials, Deyang Carbonene Technology, Discovered Materials, Dow Corning, Dowa Electronics Materials, Dymax, Dynex Semiconductor (CRRC), ELANTAS, Elkem Silcones, Enerdyne Thermal Solutions, Epoxies Etc., First Graphene, Fujipoly, Fujitsu Laboratories, GCS Thermal, GLPOLY, Global Graphene Group, Goodfellow, Graphmatech, Green Critical Minerals, GuangDong KingBali New Material, HALA Contec, Hamamatsu Carbonics, H.B. Fuller, Henkel, Hitek Electronic Materials, Honeywell, Hongfucheng New Materials, Huber Martinswerk, HyMet Thermal Interfaces, Indium Corporation, Inkron, KB Element, Kerafol, Kitagawa and more.....

Table of Contents

1 EXECUTIVE SUMMARY

• 1.1 Scope of this edition
• 1.2 Market size and growth
• 1.3 Key findings
• 1.4 Technology outlook to
• 1.5 What has changed in this edition

2 INTRODUCTION

• 2.1 Thermal Management-active and passive
• 2.2 What are Thermal Interface Materials (TIMs)?
  • 2.2.1 Types of TIMs
  • 2.2.2 Thermal conductivity
• 2.3 Comparative properties of TIMs
• 2.4 Thermal Pads and Thermal Grease
• 2.5 Advantages and Disadvantages of TIMs, by type
• 2.6 Performance
• 2.7 Prices
• 2.8 Emerging Technologies in TIMs
• 2.9 Supply Chain for TIMs
• 2.10 Raw Material Analysis and Pricing
• 2.11 Environmental Regulations and Sustainability
• 2.12 System Level Performance
• 2.13 Thermal Conductivity vs Thermal Resistance
• 2.14 TIM Chemistry

3 MATERIALS

• 3.1 Advanced and Multi-Functional TIMs
  • 3.1.1 Carbon-based TIMs
    • 3.1.1.1 Overview
  • 3.1.2 Thermal Conductivity By Filler Type
  • 3.1.3 Thermal Conductivity By Matrix
• 3.2 TIM fillers
  • 3.2.1 Trends
  • 3.2.2 Pros and Cons
  • 3.2.3 Thermal Conductivity
  • 3.2.4 Spherical Alumina
  • 3.2.5 Alumina Fillers
  • 3.2.6 Boron nitride (BN)
    • 3.2.6.1 Overview
    • 3.2.6.2 Suppliers
    • 3.2.6.3 Nano Boron Nitride
  • 3.2.7 Filler and polymer TIMs
  • 3.2.8 Diamond
  • 3.2.9 Filler Sizes
• 3.3 Thermal Greases and Pastes
  • 3.3.1 Overview and properties
  • 3.3.2 SWOT analysis
• 3.4 Thermal Gap Pads
  • 3.4.1 Overview and properties
  • 3.4.2 Application in EV Batteries
  • 3.4.3 Transitioning to Gap fillers from Pads
  • 3.4.4 SWOT analysis
• 3.5 Thermal Gap Fillers
  • 3.5.1 Overview and properties
  • 3.5.2 Products
  • 3.5.3 SWOT analysis
• 3.6 Potting Compounds/Encapsulants
  • 3.6.1 Overview and properties
  • 3.6.2 SWOT analysis
• 3.7 Adhesive Tapes
  • 3.7.1 Overview and properties
  • 3.7.2 Application in EV Batteries
  • 3.7.3 TCA Requirements
  • 3.7.4 SWOT analysis
• 3.8 Phase Change Materials
  • 3.8.1 Overview
  • 3.8.2 Products
  • 3.8.3 Properties
  • 3.8.4 Types
    • 3.8.4.1 Organic/biobased phase change materials
      • 3.8.4.1.1 Advantages and disadvantages
      • 3.8.4.1.2 Paraffin wax
      • 3.8.4.1.3 Non-Paraffins/Bio-based
    • 3.8.4.2 Inorganic phase change materials
      • 3.8.4.2.1 Salt hydrates
        • 3.8.4.2.1.1 Advantages and disadvantages
      • 3.8.4.2.2 Metal and metal alloy PCMs (High-temperature)
    • 3.8.4.3 Eutectic mixtures
    • 3.8.4.4 Encapsulation of PCMs
      • 3.8.4.4.1 Macroencapsulation
      • 3.8.4.4.2 Micro/nanoencapsulation
    • 3.8.4.5 Nanomaterial phase change materials
  • 3.8.5 Thermal energy storage (TES)
    • 3.8.5.1 Sensible heat storage
    • 3.8.5.2 Latent heat storage
  • 3.8.6 Application in TIMs
    • 3.8.6.1 Thermal pads
    • 3.8.6.2 Low Melting Alloys (LMAs)
    • 3.8.6.3 Thermal storage units
    • 3.8.6.4 Thermal energy storage panels
    • 3.8.6.5 Space systems
  • 3.8.7 SWOT analysis
• 3.9 Metal-based TIMs
  • 3.9.1 Overview
    • 3.9.1.1 Metal-Based TIM1 and TIM2
    • 3.9.1.2 Metal Filled Polymer TIMs
  • 3.9.2 Solders and low melting temperature alloy TIMs
    • 3.9.2.1 Solder TIM1
    • 3.9.2.2 Sintering
  • 3.9.3 Liquid metals
    • 3.9.3.1 Liquid metal for high-performance GPU
    • 3.9.3.2 Challenges
  • 3.9.4 Solid liquid hybrid (SLH) metals
    • 3.9.4.1 Hybrid liquid metal pastes
    • 3.9.4.2 SLH created during chip assembly (m2TIMs)
    • 3.9.4.3 Die-attach materials
      • 3.9.4.3.1 Solder Alloys and Conductive Adhesives
      • 3.9.4.3.2 Silver-Sintered Paste
      • 3.9.4.3.3 Copper (Cu) sintered TIMs
        • 3.9.4.3.3.1 TIM1 - Sintered Copper
        • 3.9.4.3.3.2 Cu Sinter Materials
        • 3.9.4.3.3.3 Copper Sintering Challenges
        • 3.9.4.3.3.4 Commercial Use
      • 3.9.4.3.4 Sintered Copper Die-Bonding Paste
        • 3.9.4.3.4.1 Commercial activity
      • 3.9.4.3.5 Graphene Enhanced Sintered Copper TIMs
    • 3.9.4.4 Laminar Metal Form With High Softness
  • 3.9.5 SWOT analysis
• 3.10 Carbon-based TIMs
  • 3.10.1 Carbon nanotube (CNT) TIM Fabrication
  • 3.10.2 Challenges
  • 3.10.3 Market players
  • 3.10.4 Multi-walled nanotubes (MWCNT)
    • 3.10.4.1 Properties
    • 3.10.4.2 Application as thermal interface materials
  • 3.10.5 Single-walled carbon nanotubes (SWCNTs)
    • 3.10.5.1 Properties
    • 3.10.5.2 Application as thermal interface materials
  • 3.10.6 Vertically aligned CNTs (VACNTs)
    • 3.10.6.1 Properties
    • 3.10.6.2 Applications
    • 3.10.6.3 Application as thermal interface materials
  • 3.10.7 BN nanotubes (BNNT) and nanosheets (BNNS)
    • 3.10.7.1 Properties
    • 3.10.7.2 Application as thermal interface materials
  • 3.10.8 Graphene
    • 3.10.8.1 Properties
    • 3.10.8.2 Application as thermal interface materials
      • 3.10.8.2.1 Graphene fillers
      • 3.10.8.2.2 Graphene foam
      • 3.10.8.2.3 Graphene aerogel
      • 3.10.8.2.4 Graphene Heat Spreaders
      • 3.10.8.2.5 Graphene in Thermal Interface Pads
    • 3.10.8.3 Advantages of Graphene
    • 3.10.8.4 Through-Plane Alignment
  • 3.10.9 Nanodiamonds
    • 3.10.9.1 Properties
    • 3.10.9.2 Application as thermal interface materials
  • 3.10.10 Graphite
    • 3.10.10.1 Properties
    • 3.10.10.2 Natural graphite
      • 3.10.10.2.1 Classification
      • 3.10.10.2.2 Processing
      • 3.10.10.2.3 Flake
        • 3.10.10.2.3.1 Grades
        • 3.10.10.2.3.2 Applications
    • 3.10.10.3 Synthetic graphite
      • 3.10.10.3.1 Classification
        • 3.10.10.3.1.1 Primary synthetic graphite
        • 3.10.10.3.1.2 Secondary synthetic graphite
        • 3.10.10.3.1.3 Processing
    • 3.10.10.4 Applications as thermal interface materials
      • 3.10.10.4.1 Graphite Sheets
      • 3.10.10.4.2 Vertical graphite
      • 3.10.10.4.3 Graphite pastes
    • 3.10.10.5 Challenges
      • 3.10.10.5.1 Through-plane thermal conductivity limitations
      • 3.10.10.5.2 Interfacing with Heat Source and Disrupting Alignment
  • 3.10.11 Hexagonal Boron Nitride
    • 3.10.11.1 Properties
    • 3.10.11.2 Application as thermal interface materials
  • 3.10.12 SWOT analysis
• 3.11 Metamaterials
  • 3.11.1 Types and properties
    • 3.11.1.1 Electromagnetic metamaterials
      • 3.11.1.1.1 Double negative (DNG) metamaterials
      • 3.11.1.1.2 Single negative metamaterials
      • 3.11.1.1.3 Electromagnetic bandgap metamaterials (EBG)
      • 3.11.1.1.4 Bi-isotropic and bianisotropic metamaterials
      • 3.11.1.1.5 Chiral metamaterials
      • 3.11.1.1.6 Electromagnetic “Invisibility” cloak
    • 3.11.1.2 Terahertz metamaterials
    • 3.11.1.3 Photonic metamaterials
    • 3.11.1.4 Tunable metamaterials
    • 3.11.1.5 Frequency selective surface (FSS) based metamaterials
    • 3.11.1.6 Nonlinear metamaterials
    • 3.11.1.7 Acoustic metamaterials
  • 3.11.2 Application as thermal interface materials
• 3.12 Self-healing thermal interface materials
  • 3.12.1 Extrinsic self-healing
  • 3.12.2 Capsule-based
  • 3.12.3 Vascular self-healing
  • 3.12.4 Intrinsic self-healing
  • 3.12.5 Healing volume
  • 3.12.6 Types of self-healing materials, polymers and coatings
  • 3.12.7 Applications in thermal interface materials
• 3.13 TIM Dispensing
  • 3.13.1 Low-volume Dispensing Methods
  • 3.13.2 High-volume Dispensing Methods
  • 3.13.3 Meter, Mix, Dispense (MMD) Systems
  • 3.13.4 TIM Dispensing Equipment Suppliers

4 EMERGING MATERIALS AND PROCESSES

• 4.1 Why the interface has become the constraint
• 4.2 Nomenclature
• 4.3 Hybrid and confined liquid metal architectures
  • 4.3.1 Fibre-reinforced liquid metal composites
  • 4.3.2 Liquid metal embedded elastomers
  • 4.3.3 Hybrid dam architectures
  • 4.3.4 Phase change metal alloys
• 4.4 Next-generation phase change materials
• 4.5 Anchored nanocarbon interfaces
• 4.6 Graphene, graphite and very high density carbon
• 4.7 Boron nitride, boron arsenide and engineered fillers
• 4.8 Liquid-infused and nanowire composites
• 4.9 Metal TIM1: solder, sintering and indium
• 4.10 Packaging architecture: heterogeneous integration and backside power
• 4.11 Immersion cooling compatibility
• 4.12 AI-directed formulation discovery
• 4.13 Sustainability and circularity
• 4.14 Metrology, reliability and qualification practice
• 4.15 Thermal demand beyond compute: networking silicon

5 MARKETS FOR THERMAL INTERFACE MATERIALS (TIMs)

• 5.1 Consumer Electronics
  • 5.1.1 Market overview
    • 5.1.1.1 Market drivers
    • 5.1.1.2 Applications
      • 5.1.1.2.1 Smartphones and tablets
        • 5.1.1.2.1.1 Graphitic Heat Spreaders
        • 5.1.1.2.1.2 Liquid metals
      • 5.1.1.2.2 Wearable electronics
  • 5.1.2 Global market 2022-2037, by TIM type
• 5.2 Electric Vehicles (EV)
  • 5.2.1 Market overview
    • 5.2.1.1 Market drivers
    • 5.2.1.2 Applications
      • 5.2.1.2.1 EV Battery Packs
        • 5.2.1.2.1.1 TIM Pack and Module
        • 5.2.1.2.1.2 TIM Application by Cell Format
        • 5.2.1.2.1.3 Thermal Interface Material Fillers for EV Batteries
        • 5.2.1.2.1.4 Factors Impacting TIM Pricing
        • 5.2.1.2.1.5 TIM Pricing
        • 5.2.1.2.1.6 Companies
      • 5.2.1.2.2 Lithium-ion batteries
        • 5.2.1.2.2.1 Cell-to-pack designs
        • 5.2.1.2.2.2 Cell-to-chassis/body
      • 5.2.1.2.3 Power electronics
        • 5.2.1.2.3.1 Types
        • 5.2.1.2.3.2 Trends
        • 5.2.1.2.3.3 Properties for TIM2 Properties in EV power electronics
        • 5.2.1.2.3.4 TIM1s
        • 5.2.1.2.3.5 TIM2 in SiC MOSFET
      • 5.2.1.2.4 Charging stations
  • 5.2.2 Global market 2022-2037, by TIM type
• 5.3 Data Centers
  • 5.3.1 Market overview
    • 5.3.1.1 Market drivers
    • 5.3.1.2 Applications
      • 5.3.1.2.1 Router, switches and line cards
        • 5.3.1.2.1.1 Transceivers
        • 5.3.1.2.1.2 Server Boards
        • 5.3.1.2.1.3 Switches and Routers
      • 5.3.1.2.2 AI Servers
        • 5.3.1.2.2.1 Overview
        • 5.3.1.2.2.2 Trends
        • 5.3.1.2.2.3 TRL
      • 5.3.1.2.3 Power supply converters
        • 5.3.1.2.3.1 Overview
        • 5.3.1.2.3.2 Laminar metal form TIMs
        • 5.3.1.2.3.3 TIM Consumption in Data Center Power Supplies
        • 5.3.1.2.3.4 Immersion cooling
  • 5.3.2 Global market 2022-2037, by TIM type
• 5.4 Advanced Semiconductor Packaging
  • 5.4.1 Market Overview
  • 5.4.2 TIM1
    • 5.4.2.1 Indium foil TIM1
    • 5.4.2.2 Products
      • 5.4.2.2.1 Thermal Gel
      • 5.4.2.2.2 Thermal grease
      • 5.4.2.2.3 Graphene
      • 5.4.2.2.4 Liquid metal
      • 5.4.2.2.5 Diamond thermal interface materials in TIM0 applications
      • 5.4.2.2.6 Integrated silicon micro-cooler systems
      • 5.4.2.2.7 Copper nanowire (CuNWs)
  • 5.4.3 Global market 2022-2037, by TIM type
• 5.5 ADAS Sensors
  • 5.5.1 Market overview
    • 5.5.1.1 Market drivers
      • 5.5.1.1.1 Sensor Suite for Autonomous Cars
      • 5.5.1.1.2 Thermal Management in ADAS Sensors
    • 5.5.1.2 Applications
      • 5.5.1.2.1 ADAS Cameras
        • 5.5.1.2.1.1 Commercial examples
      • 5.5.1.2.2 ADAS Radar
        • 5.5.1.2.2.1 Radar technology
        • 5.5.1.2.2.2 Radar boards
        • 5.5.1.2.2.3 Commercial examples
      • 5.5.1.2.3 ADAS LiDAR
        • 5.5.1.2.3.1 Role of TIMs
        • 5.5.1.2.3.2 Commercial examples
      • 5.5.1.2.4 Electronic control units (ECUs) and computers
        • 5.5.1.2.4.1 Overview
        • 5.5.1.2.4.2 Commercial examples
      • 5.5.1.2.5 Die attach materials
        • 5.5.1.2.5.1 Overview
        • 5.5.1.2.5.2 Commercial examples
    • 5.5.1.3 Companies
  • 5.5.2 Global market 2022-2037, by TIM type
• 5.6 EMI shielding
  • 5.6.1 Market overview
    • 5.6.1.1 Market drivers
    • 5.6.1.2 Applications
      • 5.6.1.2.1 Dielectric Constant
      • 5.6.1.2.2 ADAS
        • 5.6.1.2.2.1 Radar
        • 5.6.1.2.2.2 5G
      • 5.6.1.2.3 Commercial examples
• 5.7 5G
  • 5.7.1 Market overview
    • 5.7.1.1 Market drivers
    • 5.7.1.2 Applications
      • 5.7.1.2.1 EMI shielding and EMI gaskets
      • 5.7.1.2.2 Antenna
      • 5.7.1.2.3 Base Band Unit (BBU)
      • 5.7.1.2.4 Liquid TIMs
      • 5.7.1.2.5 Power supplies
        • 5.7.1.2.5.1 Increased power consumption in 5G
  • 5.7.2 Market players
  • 5.7.3 Global market 2022-2037, by TIM type
• 5.8 Aerospace & Defense
  • 5.8.1 Market overview
    • 5.8.1.1 Market drivers
    • 5.8.1.2 Applications
      • 5.8.1.2.1 Satellite thermal management
        • 5.8.1.2.1.1 Temperature range
        • 5.8.1.2.1.2 Heat Spreaders
        • 5.8.1.2.1.3 Carbon fiber reinforced TIM
        • 5.8.1.2.1.4 Thermal pads
        • 5.8.1.2.1.5 Thermal straps
        • 5.8.1.2.1.6 Graphene
        • 5.8.1.2.1.7 Challenges
      • 5.8.1.2.2 Avionics cooling
      • 5.8.1.2.3 Military electronics
    • 5.8.1.3 Global market 2022-2037, by TIM type
• 5.9 Industrial Electronics
  • 5.9.1 Market overview
    • 5.9.1.1 Market drivers
    • 5.9.1.2 Applications
      • 5.9.1.2.1 Industrial automation
      • 5.9.1.2.2 Power supplies
      • 5.9.1.2.3 Motor drives
      • 5.9.1.2.4 LED lighting
  • 5.9.2 Global market 2022-2037, by TIM type
• 5.10 Renewable Energy
  • 5.10.1 Market overview
    • 5.10.1.1 Market drivers
    • 5.10.1.2 Applications
      • 5.10.1.2.1 Solar inverters
      • 5.10.1.2.2 Wind power electronics
      • 5.10.1.2.3 Energy storage systems
  • 5.10.2 Global market 2022-2037, by TIM type
• 5.11 Medical Electronics
  • 5.11.1 Market overview
    • 5.11.1.1 Market drivers
    • 5.11.1.2 Applications
      • 5.11.1.2.1 Diagnostic equipment
      • 5.11.1.2.2 Medical imaging systems
      • 5.11.1.2.3 Patient monitoring devices
  • 5.11.2 Global market 2022-2037, by TIM type

6 COMPANY PROFILES (119 company profiles)

7 RESEARCH METHODOLOGY

8 REFERENCES

List of Tables

• Table 1. Global market for thermal interface materials by application, 2026-2037 (millions USD).
• Table 2. Thermal conductivities (κ) of common metallic, carbon, and ceramic fillers employed in TIMs.
• Table 3. Commercial TIMs and their properties.
• Table 4. Advantages and disadvantages of TIMs, by type.
• Table 5. Key Factors in System Level Performance for TIMs.
• Table 6. TIM Materials by Thermal, Mechanical, and Application Properties
• Table 7. Thermal interface materials prices.
• Table 8. Comparisons of Price and Thermal Conductivity for TIMs.
• Table 9. Price Comparison of TIM Fillers.
• Table 10. Raw Material Analysis and Pricing.
• Table 11. System Level Performance Comparison.
• Table 12. Thermal Conductivity vs Thermal Resistance Comparison.
• Table 13. TIM Chemistry Comparison
• Table 14. Characteristics of some typical TIMs.
• Table 15. Carbon-Based TIM Performance.
• Table 16. Thermal Conductivity By Filler Type
• Table 17. Thermal Conductivity By Matrix.
• Table 18. Trends on TIM Fillers.
• Table 19. Pros and Cons of TIM Fillers.
• Table 20. Thermal Conductivity Comparison ATH and Al2O3.
• Table 21. BNNT Companies and Prices.
• Table 22.BNNT Property Variation.
• Table 23. Diamond fillers with varied sizes for thermal interface materials.
• Table 24. Commercial thermal paste products.
• Table 25.Commercial thermal gap pads (thermal interface materials).
• Table 26. Commercial thermal gap fillers products.
• Table 27. Types of Potting Compounds/Encapsulants.
• Table 28. TIM adhesives tapes.
• Table 29. Commercial phase change materials (PCM) thermal interface materials (TIMs) products.
• Table 30. Properties of PCMs.
• Table 31. PCM Types and properties.
• Table 32. Advantages and disadvantages of organic PCMs.
• Table 33. Advantages and disadvantages of organic PCM Fatty Acids.
• Table 34. Advantages and disadvantages of salt hydrates
• Table 35. Advantages and disadvantages of low melting point metals.
• Table 36. Advantages and disadvantages of eutectics.
• Table 37. Benefits and drawbacks of PCMs in TIMs.
• Table 38. PCM Selection Criteria and Considerations for Space Systems.
• Table 39. PCM selection criteria and considerations for space systems.
• Table 40. Liquid Metal Challenges.
• Table 41. Copper Sintering Technical Challenges.
• Table 42. Technology Readiness Level (TRL) for Carbon Materials in Thermal Management
• Table 43. Challenges with CNT-TIMs.
• Table 44. Market players in CNT-TIMs.
• Table 45. Properties of CNTs and comparable materials.
• Table 46. Typical properties of SWCNT and MWCNT.
• Table 47. Comparison of carbon-based additives in terms of the main parameters influencing their value proposition as a conductive additive.
• Table 48. Thermal conductivity of CNT-based polymer composites.
• Table 49. Comparative properties of BNNTs and CNTs.
• Table 50. Properties of graphene, properties of competing materials, applications thereof.
• Table 51. Graphene Heat Spreaders Performance.
• Table 52. Comparison of Conventional and Graphene-Enhanced Thermal Pads.
• Table 53. Advantages of Graphene in Thermal Interface Materials
• Table 54. Properties of nanodiamonds.
• Table 55. Comparison between Natural and Synthetic Graphite.
• Table 56. Thermal Conductivity Comparison of Graphite TIMs.
• Table 57. Classification of natural graphite with its characteristics.
• Table 58. Characteristics of synthetic graphite.
• Table 59. Thermal Conductivity Comparison of Graphite TIMs.
• Table 60. Properties of hexagonal boron nitride (h-BN).
• Table 61. Comparison of self-healing systems.
• Table 62. Types of self-healing coatings and materials.
• Table 63. Comparative properties of self-healing materials.
• Table 64. Challenges for Dispensing TIM.
• Table 65. Thermal Management Application Areas in Consumer Electronics.
• Table 66. Thermal Management Differences: 4G vs 5G Smartphones.
• Table 67. Trends in Smartphone Thermal Materials.
• Table 68. Thermal Management approaches in commercial Smartphones.
• Table 69. Global market in consumer electronics 2022-2037, by TIM type (millions USD).
• Table 70. Material Options and Market Comparison.
• Table 71. TIM Filler Comparison and Adoption.
• Table 72. Thermal Conductivity Comparison of Suppliers for EV Batteries.
• Table 73. TIM Pricing by Supplier.
• Table 74. Thermal Conductivity Comparison of TIM1s.
• Table 75. Global market in electric vehicles 2022-2037, by TIM type (millions USD).
• Table 76. Types of TIMs in Data Centers.
• Table 77. Area of TIM per Switch.
• Table 78. Leaf and Spine Switch TIM Areas.
• Table 79. Novel TIM Technologies in Data Centers.
• Table 80. Emerging Trends in TIM Materials for AI Servers.
• Table 81. Applications of TIM Materials in AI Servers with Technology Readiness Levels (TRL).
• Table 82. Companies Utilizing and Providing TIM Materials for AI Servers
• Table 83. TIM Trends in Data Centers.
• Table 84. TIM Area Forecast in Server Boards: 2022-2037 (m2).
• Table 85. Global market in data centers 2022-2037, by TIM type (millions USD).
• Table 86. Global market in advanced semiconductor packaging 2022-2037, by TIM type (millions USD).
• Table 87. Autonomous Vehicle Sensor Suite TIM Requirements.
• Table 88. TIM Players in ADAS.
• Table 89. TIM Players in ADAS.
• Table 90. Die Attach for ADAS Sensors.
• Table 91. Die Attach Area Forecast for Key Components Within ADAS Sensors: 2022-2037 (m2).
• Table 92. TIM Players in ADAS
• Table 93. Global market in ADAS sensors 2022-2037, by TIM type (millions USD).
• Table 94. Applications of TIMs in EMI Shielding for ADAS Radars.
• Table 95. TIM Area Forecast for 5G Antennas by Station Size: 2022-2037 (m2).
• Table 96. TIM Area Forecast for 5G Antennas by Station Frequency: 2022-2037 (m2).
• Table 97. TIMS in BBU.
• Table 98. 5G BBY models.
• Table 99. TIM Area Forecast for 5G BBU: 2022-2037 (m2).
• Table 100. Power Consumption Forecast for 5G: 2022-2037 (GW).
• Table 101. TIM Area Forecast for Power Supplies: 2022-2037 (m2).
• Table 102. TIM market players in 5G.
• Table 103. Global market in 5G 2022-2037, by TIM type (millions USD).
• Table 104. Market Drivers for TIMS in aerospace and defense.
• Table 105. Applications for TIMS in aerospace and defense.
• Table 106. Temperature range of space subsystems and passive cooling approaches.
• Table 107. TIMs for space satellites - challenges and considerations.
• Table 108. Global Market for TIMs in aerospace and defense 2022-2037, by TIM Type (Millions USD).
• Table 109. Market Drivers for TIMs in industrial electronics.
• Table 110. Applications for TIMs in industrial electronics.
• Table 111. Global Market 2022-2037, by TIM Type in Industrial Electronics (Millions USD).
• Table 112. Market Drivers for TIMs in renewable energy.
• Table 113. Applications for TIMs in renewable energy.
• Table 114. Global Market for TIMs in Renewable Energy 2022-2037 (Millions USD).
• Table 115. Market Drivers for TIMs in medical electronics.
• Table 116. Applications for TIMs in medical electronics.
• Table 117. Global Market 2022-2037 for TIMs in Medical Electronics (Millions USD).

List of Figures

• Figure 1. (L-R) Surface of a commercial heatsink surface at progressively higher magnifications, showing tool marks that create a rough surface and a need for a thermal interface material.
• Figure 2. Schematic of thermal interface materials used in a flip chip package.
• Figure 3. Thermal grease.
• Figure 4. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module.
• Figure 5. Supply Chain for TIMs.
• Figure 6. Commercial thermal paste products.
• Figure 7. Application of thermal silicone grease.
• Figure 8. A range of thermal grease products.
• Figure 9. SWOT analysis for thermal greases and pastes.
• Figure 10. Thermal Pad.
• Figure 11. SWOT analysis for thermal gap pads.
• Figure 12. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module.
• Figure 13. SWOT analysis for thermal gap fillers.
• Figure 14. SWOT analysis for Potting compounds/encapsulants.
• Figure 15. Thermal adhesive products.
• Figure 16. SWOT analysis for TIM adhesives tapes.
• Figure 17. Phase-change TIM products.
• Figure 18. PCM mode of operation.
• Figure 19. Classification of PCMs.
• Figure 20. Phase-change materials in their original states.
• Figure 21. Thermal energy storage materials.
• Figure 22. Phase Change Material transient behaviour.
• Figure 23. PCM TIMs.
• Figure 24. Phase Change Material - die cut pads ready for assembly.
• Figure 25. SWOT analysis for phase change materials.
• Figure 26. Typical IC package construction identifying TIM1 and TIM2
• Figure 27. Liquid metal TIM product.
• Figure 28. Pre-mixed SLH.
• Figure 29. HLM paste and Liquid Metal Before and After Thermal Cycling.
• Figure 30. SLH with Solid Solder Preform.
• Figure 31. Automated process for SLH with solid solder preforms and liquid metal.
• Figure 32. SWOT analysis for metal-based TIMs.
• Figure 33. Schematic of single-walled carbon nanotube.
• Figure 34. Types of single-walled carbon nanotubes.
• Figure 35. Schematic of a vertically aligned carbon nanotube (VACNT) membrane used for water treatment.
• Figure 36. Schematic of Boron Nitride nanotubes (BNNTs). Alternating B and N atoms are shown in blue and red.
• Figure 37. Graphene layer structure schematic.
• Figure 38. Illustrative procedure of the Scotch-tape based micromechanical cleavage of HOPG.
• Figure 39. Graphene and its descendants: top right: graphene; top left: graphite = stacked graphene; bottom right: nanotube=rolled graphene; bottom left: fullerene=wrapped graphene.
• Figure 40. Graphene Thermal Management Applications Roadmap.
• Figure 41. Flake graphite.
• Figure 42. Applications of flake graphite.
• Figure 43. Graphite-based TIM products.
• Figure 44. Structure of hexagonal boron nitride.
• Figure 45. SWOT analysis for carbon-based TIMs.
• Figure 46. Classification of metamaterials based on functionalities.
• Figure 47. Electromagnetic metamaterial.
• Figure 48. Schematic of Electromagnetic Band Gap (EBG) structure.
• Figure 49. Schematic of chiral metamaterials.
• Figure 50. Nonlinear metamaterials- 400-nm thick nonlinear mirror that reflects frequency-doubled output using input light intensity as small as that of a laser pointer.
• Figure 51. Schematic of self-healing polymers. Capsule based (a), vascular (b), and intrinsic (c) schemes for self-healing materials. Red and blue colours indicate chemical species which react (purple) to heal damage.
• Figure 52. Stages of self-healing mechanism.
• Figure 53. Self-healing mechanism in vascular self-healing systems.
• Figure 54. Schematic of TIM operation in electronic devices.
• Figure 55. Schematic of Thermal Management Materials in smartphone.
• Figure 56. Wearable technology inventions.
• Figure 57. Global market in consumer electronics 2022-2037, by TIM type (millions USD).
• Figure 58. Application of thermal interface materials in automobiles.
• Figure 59. EV battery components including TIMs.
• Figure 60. Battery pack with a cell-to-pack design and prismatic cells.
• Figure 61. Cell-to-chassis battery pack.
• Figure 62. TIMS in EV charging station.
• Figure 63. Global market in electric vehicles 2022-2037, by TIM type (millions USD).
• Figure 64. Image of data center layout.
• Figure 65. Application of TIMs in line card.
• Figure 66. Global market in data centers 2022-2037, by TIM type (millions USD).
• Figure 67. Global market in advanced semiconductor packaging 2022-2037, by TIM type (millions USD).
• Figure 68. ADAS radar unit incorporating TIMs.
• Figure 69. Global market in ADAS sensors 2022-2037, by TIM type (millions USD).
• Figure 70. Coolzorb 5G.
• Figure 71. TIMs in Base Band Unit (BBU).
• Figure 72. Global market in 5G 2022-2037, by TIM type (millions USD).
• Figure 73. Global Market for TIMs in aerospace and defense 2022-2037, by TIM Type (Millions USD).
• Figure 74. Global Market 2022-2037, by TIM Type in Industrial Electronics (Millions USD).
• Figure 75. Global Market for TIMs in Renewable Energy 2022-2037 (Millions USD).
• Figure 76. Global Market 2022-2037 for TIMs in Medical Electronics (Millions USD).
• Figure 77. Boron Nitride Nanotubes products.
• Figure 78. Transtherm® PCMs.
• Figure 79. Carbice carbon nanotubes.
• Figure 80. Internal structure of carbon nanotube adhesive sheet.
• Figure 81. Carbon nanotube adhesive sheet.
• Figure 82. HI-FLOW Phase Change Materials.
• Figure 83. Thermoelectric foil, consists of a sequence of semiconductor elements connected with conductive metal. At the top (in red) is the thermal interface.
• Figure 84. Parker Chomerics THERM-A-GAP GEL.
• Figure 85. Metamaterial structure used to control thermal emission.
• Figure 86. Shinko Carbon Nanotube TIM product.
• Figure 87. The Sixth Element graphene products.
• Figure 88. Thermal conductive graphene film.
• Figure 89. VB Series of TIMS from Zeon.