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市場調查報告書
商品編碼
2039286

全球導電油墨市場（2026-2036 年）

The Global Conductive Inks Market 2026-2036
出版日期: | 出版商: Future Markets, Inc. | 英文 377 Pages, 143 Tables, 73 Figures | 訂單完成後即時交付

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導電油墨是一種功能性材料，它將導電填料（例如銀片、奈米顆粒、銅、炭黑、奈米碳管烯、碳奈米管、奈米銀線、導電聚合物、液態金屬和MXene等新型2D材料）與黏合劑、溶劑和流變改性劑結合在一起。這使得在剛性、軟性、可拉伸、3D和生物基板上形成電活性圖案成為可能。這些是印刷電子技術的基礎，位於材料化學、積層製造和終端裝置工程的交叉領域。

過去十年間，該產業已從光伏金屬化和薄膜開關印刷等狹窄的細分領域發展成為涵蓋20多個不同終端應用領域的龐大平台技術。儘管光伏仍然是最大的單一應用領域，但隨著晶體矽電池結構從PERC向TOPCon、異質結(HJT)和背接觸(BC)設計的轉變，以及首批商用鈣鈦礦串聯電池的上市，該行業正經歷著結構性變革。這些轉變促使每個電池的銀含量降低，為鍍銀銅漿、純銅油墨和無銀金屬化工藝創造了新的機會。

除了太陽能之外，汽車套模電子、電動汽車溫度控管、可折疊消費電子產品、5G-Advanced 和新型 6G 天線、AR/VR 透明導體、穿戴式醫療監測貼片、連續血糖監測、腦機介面、軟體機器人和人形觸覺皮膚、智慧農業和環境感測、智慧包裝和可回收 RFID 以及生物藥物等領域的整個產業同步成長。

多種交叉因素正在改變供應商格局。銀價波動和供應鏈日益緊張推動了向鍍銀銅、銅改性油墨和無雷射金屬碳化物導體的轉變。中國對鎵、銦和稀土元素的出口限制正在重塑液態金屬和透明導體的供應鏈。歐盟的法規，例如REACH PFAS法規、包裝和包裝廢棄物法規、關鍵原料法和通貨膨脹控制法，正在重塑產品系列和生產佈局。永續性正從差異化因素轉變為結構性要求，生物基油墨、可回收基板和生物可吸收導體等領域正在取得進展。

因此，該產業正經歷變革時期期。雖然傳統的銀墨和碳墨供應商仍然佔大部分收入，但成長最快的卻是那些能夠滿足十年前尚不存在的應用需求的新型化學成分。預計2026年至2036年這十年將是材料創新、應用拓展以及法規與供應鏈重組融合的時期。

本報告對全球導電油墨市場進行了分析，提供了詳細的市場規模、預測、技術評估、競爭分析和公司簡介。

目錄

第1章摘要整理

  • 2025-2026年市場展望
  • 2024 年版及以後的主要變化
  • 導電油墨的種類
  • 導電油墨的優勢
  • 導電油墨市場的成長與發展
  • 工業數位化
  • 印刷過程及印刷設備
  • 成本
  • 市場區隔
  • 全球市場—修訂預測

第2章：引言

  • 導電性要求
  • 印刷電子技術的發展
  • 導電油墨供應商

第3章：導電油墨的材料與技術

  • 概述
  • 片狀銀墨
  • 基於奈米顆粒的銀墨
  • 無顆粒油墨
  • 銅墨
  • 碳基油墨（含石墨烯和碳奈米管）
  • 可拉伸/熱成型油墨
  • 奈米銀線
  • 導電聚合物
  • MXene墨水
  • 液態金屬墨水
  • 導電水凝膠，OMIEC
  • 生物基永續導電油墨（大幅擴展）

第4章：導電油墨的市場與應用

  • 導電油墨主要應用概述
  • 導電油墨要求基準測試
  • 太陽能
  • 印刷加熱器
  • 軟性混合電子裝置（FHE）
  • 套模電子裝置（IME）
  • 3D電子
  • 電子紡織品
  • 電路原型製作
  • 印刷軟性感測器
  • 穿戴式電極
  • 電磁干擾屏蔽
  • 列印天線
  • 射頻識別和智慧包裝
  • 印刷電池
  • 5G/6G毫米波印刷天線（大幅擴展）
  • 用於 AR/VR 和智慧眼鏡的透明導電材料（大幅擴展）
  • 腦機介面，神經電極（顯著擴展）
  • 軟體機器人，人形觸覺皮膚（顯著擴展）
  • 鈣鈦礦串聯光電金屬化
  • 智慧農業、環境感知（顯著擴展）
  • 植入式設備、生物電子設備

第5章：供應鏈、原料與地緣政治

  • 概述
  • 白銀：需求、供給、價格
  • 銅：替代品和競爭對手
  • 重要礦物，特殊元素
  • 區域供應鏈策略
  • 關稅、出口限制、國內資金匯回
  • 關鍵原料的暴露：透過導電油墨的化學成分

第6章永續性和循環經濟

  • 概述和促進因素
  • 監理情勢
  • 永續處方途徑
  • 基板和二手系統
  • 使用後程式
  • 碳足跡和排放排放
  • 身份驗證和聲明管理

第7章：人工智慧驅動的油墨配方與製程最佳化

  • 概述
  • 人工智慧/機器學習在導電油墨產業的應用
  • 自動駕駛研究所
  • 商業軟體平台
  • 線上列印過程控制
  • 挑戰與風險

第8章：公司簡介（80家公司簡介）

第9章：調查方法

第10章 參考文獻

Conductive inks are functional materials that combine conductive fillers - silver flakes and nanoparticles, copper, carbon black, graphene, carbon nanotubes, silver nanowires, conductive polymers, liquid metals, and emerging two-dimensional materials such as MXene - with binder, solvent and rheology-modifier systems to enable the deposition of electrically active patterns onto rigid, flexible, stretchable, three-dimensional and biological substrates. They are the foundational technology of printed electronics, sitting at the intersection of materials chemistry, additive manufacturing and end-application device engineering.

The industry has evolved over the past decade from a narrow focus on photovoltaic metallisation and membrane-switch printing into a broad platform technology spanning more than twenty distinct end-use categories. Photovoltaics remains the single largest application, but the sector is undergoing a structural transition as crystalline-silicon cell architectures migrate from PERC to TOPCon, heterojunction (HJT) and back-contact (BC) designs, and as the first commercial perovskite-tandem cells reach market. These transitions are reducing silver intensity per cell and creating opportunity for silver-coated copper pastes, pure copper inks and silver-free metallisation routes.

Beyond photovoltaics, the industry is being reshaped by parallel waves of demand from automotive in-mold electronics and electric-vehicle thermal management, foldable consumer electronics, 5G-Advanced and emerging 6G antennas, augmented-reality and virtual-reality transparent conductors, wearable medical-monitoring patches, continuous glucose monitoring, brain-computer interfaces, soft robotic and humanoid tactile skin, smart agriculture and environmental sensing, smart packaging and recyclable RFID, and bioelectronic medicines.

Several cross-cutting forces are reshaping the supplier landscape. Silver-price volatility and supply-chain tightness are driving substitution toward silver-coated copper, copper MOD inks and laser-carbonised metal-free conductors. China's export controls on gallium, indium and rare earths are reshaping the liquid-metal and transparent-conductor supply chain. Regulation including EU REACH PFAS restrictions, the Packaging and Packaging Waste Regulation, the Critical Raw Materials Act and the Inflation Reduction Act are reshaping product portfolios and manufacturing footprints. Sustainability has moved from differentiator to structural requirement, with bio-based inks, recyclable substrates and bioresorbable conductors all advancing.

The result is an industry in transition: established silver and carbon ink suppliers continue to dominate revenue, but the fastest growth is in emerging chemistries serving applications that did not exist a decade ago. The 2026–2036 decade will be defined by this convergence of materials innovation, application broadening, and regulatory and supply-chain restructuring.

The Global Conductive Inks Market 2026-2036 is a definitive industry analysis of the conductive ink, printed electronics, and functional materials sector across the next decade. This comprehensive market research report provides detailed market sizing, forecasts, technology assessment, competitive analysis, and company profiling across every major conductive ink chemistry and every commercial end-use application.

The report covers the full conductive ink technology portfolio: silver flake pastes, silver nanoparticle inks, particle-free silver and copper metal-organic-decomposition (MOD) inks, silver-coated copper (SCC) pastes, copper nanoparticle and copper plating systems, carbon black inks, carbon nanotube (CNT) inks, graphene and reduced graphene oxide (rGO) inks, silver nanowire (AgNW) transparent conductors, PEDOT:PSS and next-generation organic mixed ionic-electronic conductors (OMIECs), stretchable and thermoformable conductive inks, liquid metal gels including eutectic gallium-indium (EGaIn), MXene inks, conductive hydrogels, and bio-based and bioresorbable conductors.

Applications analysed in depth include photovoltaics (PERC, TOPCon, HJT, back-contact, perovskite tandem and flexible PV), printed heaters, flexible hybrid electronics (FHE), in-mold electronics (IME), 3D electronics, e-textiles, circuit prototyping, capacitive touch sensors, piezoresistive and piezoelectric pressure sensors, biosensors and continuous glucose monitors, strain sensors, wearable electrodes, EMI shielding (including conformal sprayed shielding and MXene-based shielding), 5G/6G mmWave printed antennas, AR/VR transparent conductors, brain-computer interfaces and neural electrodes, soft robotic and humanoid tactile skin, smart agriculture and environmental sensing, implantable and bioelectronic devices, RFID and recyclable smart packaging, and printed batteries.

Key topics covered include the silver supply squeeze and PV silver intensity trajectory, China's export controls on gallium, indium, germanium and rare earths, EU REACH PFAS restrictions and the Packaging and Packaging Waste Regulation (PPWR), the US Inflation Reduction Act §45X production tax credit, the EU Critical Raw Materials Act (CRMA), AI-driven ink formulation and self-driving laboratories, PV silver recycling and circular-economy supply chains, and bio-based sustainable conductive inks.

The report includes detailed market revenue and volume forecasts to 2036 by ink type, by application, by region and by sub-segment; analysis of more than 220 conductive ink suppliers and end-users worldwide; SWOT analyses for every major ink chemistry and application; technology readiness levels (TRL); benchmarking of conductive ink properties; pricing analysis; and supply-chain mapping. An essential resource for ink suppliers, end-user device manufacturers, investors, and policy makers.

Contents include:

  • The market for conductive inks: types, applications, advantages, growth and development
  • Opportunities in flexible and wearable electronics, smart packaging, automotive, medical devices, energy harvesting and storage, smart textiles, aerospace and defence
  • Digitisation of industry
  • Printing processes and equipment overview
  • Cost analysis and material prices
  • Market segmentation by materials, printing technology, applications and end-use industries
  • Global conductive ink revenues by ink type
  • Conductivity requirements and challenges
  • Converting conductivity to sheet resistance
  • Growth in printed electronics, antennas, EMI shielding
  • Conductive ink supplier landscape and market positioning
  • Suppliers segmented by conductive material (silver, copper, carbon/graphene, conductive polymers)
  • Suppliers segmented by ink composition (nanoparticle, particle-free, hybrid)
  • Conductive Ink Materials and Technology
    • Flake-based silver inks: value chain, producers, SWOT analysis
    • Nanoparticle-based silver inks: laser-generated inks, curing, production methods, applications
    • Particle-free inks: operating principle, conductivity, thermoformable variants, manufacturers
    • Copper inks: oxidation challenges, sintering, FHE and RFID applications, suppliers
    • Carbon-based inks including graphene and CNTs: transparent conductive variants, properties
    • Stretchable and thermoformable inks: metal gels, manufacturers
    • Silver nanowires: TCF benefits, durability, value chain, manufacturing, producers
    • Conductive polymers: n-type, biobased, applications in flexible devices and capacitive touch
  • Market and Applications for Conductive Inks
    • Photovoltaics: charge extraction, PERC, TOPCon, SHJ, alternative connection technologies
    • Printed heaters: automotive, building-integrated, wearable
    • Flexible hybrid electronics (FHE): wearable skin patches, condition monitoring, asset tracking
    • In-mold electronics (IME): manufacturing, value chain, silver flake-based inks
    • 3D electronics: partially and fully additive, fully 3D printed circuits
    • E-textiles: biometric monitoring, textile sensors
    • Circuit prototyping
    • Printed and flexible sensors: capacitive, pressure (piezoresistive, piezoelectric), biosensors, strain
    • Wearable electrodes: wet vs dry, skin patches, e-textiles
    • EMI shielding: sprayed, conformal, hybrid, particle-free Ag, heterogeneous integration
    • Printed antennas: automotive, building-integrated, consumer electronics, smart packaging
    • RFID and smart packaging
    • Printed batteries

Company Profiles (80+ companies) including ACI Materials, Advanced Material Development (AMD), Advanced Nano Products (ANP), Agfa-Gevaert NV, Asahi Chemical, Asahi Kasei Corporation, Bando Chemical, BlackLeaf, Brewer Science, C3 Nano, Cambridge Graphene Ltd., Cambrios Film Solutions Corp, Charm Graphene Co. Ltd., Chem3 LLC (ChemCubed), C-INK Corporation, Copprint, Copprium, Creative Materials Inc., Dae Joo Electronic Materials Co. Ltd., Daicel Corporation, Directa Plus plc, Dowa Electronics Materials Co. Ltd., DuPont Advanced Materials, Dycotec, E2IP Technologies, Elantas, Electrolube, Electroninks, EPTATech S.R.L., Fujikura Kasei Co Ltd, Fuji Pigment Co. Ltd., GenesInk and more....

Table of Contents

1 EXECUTIVE SUMMARY

  • 1.1 The Market in 2025-2026
  • 1.2 Key shifts since the 2024 edition
  • 1.3 Types of Conductive Inks
  • 1.4 Advantages of Conductive Inks
  • 1.5 Growth and development of conductive inks market
    • 1.5.1 Market Evolution
    • 1.5.2 Opportunities in Conductive Inks
      • 1.5.2.1 Flexible and Wearable Electronics
      • 1.5.2.2 Smart Packaging
      • 1.5.2.3 Automotive Industry
      • 1.5.2.4 Medical Devices
      • 1.5.2.5 Energy Harvesting and Storage
      • 1.5.2.6 Smart Textiles
      • 1.5.2.7 Aerospace and Defence
  • 1.6 Digitization of industry
  • 1.7 Printing processes and equipment
  • 1.8 Costs
    • 1.8.1 Reducing costs
    • 1.8.2 Material prices
  • 1.9 Market segmentation
    • 1.9.1 Materials
    • 1.9.2 Printing Technology
    • 1.9.3 Application
    • 1.9.4 End-Use Industries
  • 1.10 Total global market - revised forecast

2 INTRODUCTION

  • 2.1 Conductivity requirements
    • 2.1.1 Challenges
    • 2.1.2 Converting conductivity to sheet resistance
  • 2.2 Growth in printed electronics
    • 2.2.1 Antennas
    • 2.2.2 EMI Shielding
  • 2.3 Conductive Ink Suppliers
    • 2.3.1 Market positioning
    • 2.3.2 Suppliers by Conductive Material
      • 2.3.2.1 Silver Inks
      • 2.3.2.2 Copper Inks
      • 2.3.2.3 Carbon/Graphene Inks
      • 2.3.2.4 Conductive Polymers
    • 2.3.3 Suppliers by Ink Composition
      • 2.3.3.1 Nanoparticle Inks
      • 2.3.3.2 Particle-free Inks
      • 2.3.3.3 Hybrid Inks

3 CONDUCTIVE INK MATERIALS AND TECHNOLOGY

  • 3.1 Overview
  • 3.2 Flake-based silver inks
    • 3.2.1 Overview
      • 3.2.1.1 Increased conductivity and improved durability
      • 3.2.1.2 High resolution functional screen printing
      • 3.2.1.3 Silver electromigration
    • 3.2.2 Flake-based silver ink value chain
    • 3.2.3 Comparison of flake-based silver inks
    • 3.2.4 Silver flake producers
    • 3.2.5 SWOT analysis
  • 3.3 Nanoparticle-based silver inks
    • 3.3.1 Overview
    • 3.3.2 Costs
    • 3.3.3 Increasing conductivity
    • 3.3.4 Laser-Generated Inks
      • 3.3.4.1 Key advantages
    • 3.3.5 Prices
    • 3.3.6 Ag nanoparticle inks curing
      • 3.3.6.1 Curing Temperature
      • 3.3.6.2 Curing Time
    • 3.3.7 Silver nanoparticle production
      • 3.3.7.1 Methods
      • 3.3.7.2 Benchmarking
      • 3.3.7.3 Nanoparticle ink manufacturers
    • 3.3.8 Applications
    • 3.3.9 Comparison of nanoparticle-based silver ink types
    • 3.3.10 SWOT analysis
  • 3.4 Particle-free inks
    • 3.4.1 Overview
      • 3.4.1.1 Operating principle
      • 3.4.1.2 Conductivity
      • 3.4.1.3 Benefits of particle-free inks
      • 3.4.1.4 Permeability
      • 3.4.1.5 Thermoformable particle-free inks
      • 3.4.1.6 Particle-free conductive inks based on sintering requirements
      • 3.4.1.7 Particle-free inks for different metals
      • 3.4.1.8 Properties of particle-free silver inks
    • 3.4.2 Applications
      • 3.4.2.1 Key application areas
      • 3.4.2.2 EMI shielding
    • 3.4.3 Particle free ink producers
    • 3.4.4 SWOT analysis
  • 3.5 Copper inks
    • 3.5.1 Overview
      • 3.5.1.1 Challenges
        • 3.5.1.1.1 Copper oxidation
    • 3.5.2 Sintering
    • 3.5.3 Applications
      • 3.5.3.1 Flexible and hybrid electronics (FHE)
      • 3.5.3.2 RFID
    • 3.5.4 Copper ink suppliers
    • 3.5.5 SWOT analysis
  • 3.6 Carbon-based inks (including graphene &CNTs)
    • 3.6.1 Overview
    • 3.6.2 Carbon Nanotube (CNT) Inks
      • 3.6.2.1 Transparent conductive CNT inks
    • 3.6.3 Graphene Inks
        • 3.6.3.1.1 Properties
    • 3.6.4 Graphene/CNT ink producers
    • 3.6.5 Comparative analysis
    • 3.6.6 Carbon Black Inks
      • 3.6.6.1 Applications
    • 3.6.7 SWOT analysis
  • 3.7 Stretchable/Thermoformable Inks
    • 3.7.1 Overview
      • 3.7.1.1 Stretchable vThermoformable conductive inks
      • 3.7.1.2 Size and morphology of conductive filler particles
    • 3.7.2 Applications and innovations
    • 3.7.3 Metal gels
      • 3.7.3.1 Description
      • 3.7.3.2 Advantages
    • 3.7.4 Stretchable/thermoformable ink manufacturers
    • 3.7.5 SWOT analysis
  • 3.8 Silver Nanowires
    • 3.8.1 Overview
      • 3.8.1.1 Benefits of silver nanowire TCFs
      • 3.8.1.2 Performance in TCFs
      • 3.8.1.3 Durability and flexibility
    • 3.8.2 Improving electrical and mechanical properties
    • 3.8.3 Coating and encapsulation
    • 3.8.4 Limitations and challenges
    • 3.8.5 Value chain
    • 3.8.6 Manufacturing processes
    • 3.8.7 Applications
      • 3.8.7.1 Capacitive touch sensors
      • 3.8.7.2 Touchscreens
      • 3.8.7.3 Transparent heaters
    • 3.8.8 Silver nanowire producers
    • 3.8.9 SWOT Analysis
  • 3.9 Conductive polymers
    • 3.9.1 Overview
      • 3.9.1.1 Commercial types
        • 3.9.1.1.1 n-type conductive polymers
        • 3.9.1.1.2 Biobased conductive polymer inks
      • 3.9.1.2 Advantages
    • 3.9.2 Applications
      • 3.9.2.1 Flexible devices
      • 3.9.2.2 Capacitive touch sensors
    • 3.9.3 SWOT analysis
  • 3.10 MXene inks
    • 3.10.1 Overview
    • 3.10.2 Materials chemistry and the MXene family
    • 3.10.3 Synthesis and manufacturing
    • 3.10.4 Properties and performance benchmarking
    • 3.10.5 Applications
    • 3.10.6 Conductive ink requirements by application
    • 3.10.7 Challenges
    • 3.10.8 SWOT analysis
    • 3.10.9 Market forecast
  • 3.11 Liquid metal inks
    • 3.11.1 Overview
    • 3.11.2 Materials chemistry and variants
    • 3.11.3 Patterning and printing
    • 3.11.4 Performance benchmarking
    • 3.11.5 Applications
    • 3.11.6 Conductive ink requirements
    • 3.11.7 Challenges
    • 3.11.8 SWOT analysis
    • 3.11.9 Market forecast
  • 3.12 Conductive hydrogels and OMIECs
    • 3.12.1 Overview
    • 3.12.2 Materials chemistry and formulations
    • 3.12.3 Performance benchmarking
    • 3.12.4 Applications
    • 3.12.5 Conductive ink requirements
    • 3.12.6 Challenges
    • 3.12.7 Regulatory and reimbursement environment
    • 3.12.8 SWOT analysis
    • 3.12.9 Market forecast
  • 3.13 Bio-based and sustainable conductive inks (greatly expanded)
    • 3.13.1 Overview and commercial drivers
    • 3.13.2 Technology routes
    • 3.13.3 Performance benchmarking
    • 3.13.4 Applications
    • 3.13.5 Conductive ink requirements
    • 3.13.6 Standards, certifications and claim management
    • 3.13.7 Challenges
    • 3.13.8 SWOT analysis
    • 3.13.9 Market forecast

4 MARKET AND APPLICATIONS FOR CONDUCTIVE INKS

  • 4.1 Overview of key applications for conductive inks
  • 4.2 Benchmarking conductive ink requirements
    • 4.2.1 Technological and commercial readiness of key conductive ink applications
  • 4.3 Photovoltaics
    • 4.3.1 Technology overview
      • 4.3.1.1 Charge extraction
      • 4.3.1.2 Conductive pastes and inks in photovoltaic cells
    • 4.3.2 Costs
    • 4.3.3 Transitioning from PERC to TOPCon and SHJ
    • 4.3.4 Alternative solar cell connection technology
    • 4.3.5 Conductive ink requirements
    • 4.3.6 SWOT analysis
    • 4.3.7 Global market revenues, by ink type
  • 4.4 Printed Heaters
    • 4.4.1 Technology overview
    • 4.4.2 Applications
      • 4.4.2.1 Automotive
      • 4.4.2.2 Building-integrated solutions
      • 4.4.2.3 Wearable heaters
    • 4.4.3 Comparison for e-textile heating technologies
      • 4.4.3.1 Heated clothing
    • 4.4.4 Conductive ink requirements for printed heaters
    • 4.4.5 SWOT analysis
    • 4.4.6 Global market revenues, by ink type
  • 4.5 Flexible hybrid electronics (FHE)
    • 4.5.1 Technology overview
    • 4.5.2 Advantages
    • 4.5.3 FHE value chain
    • 4.5.4 Applications
      • 4.5.4.1 Wearable skin patches
      • 4.5.4.2 Condition monitoring
      • 4.5.4.3 Multi-sensor wireless asset tracking systems
    • 4.5.5 Conductive ink requirements
    • 4.5.6 SWOT analysis
    • 4.5.7 Global market revenues, by ink type
  • 4.6 In-mold electronics (IME)
    • 4.6.1 Technology overview
      • 4.6.1.1 Advantages
      • 4.6.1.2 IME manufacturing
      • 4.6.1.3 Materials
    • 4.6.2 IME value chain
    • 4.6.3 Silver flake-based ink
    • 4.6.4 Conductive ink requirements
    • 4.6.5 SWOT analysis
    • 4.6.6 Global market revenues, by ink type
  • 4.7 3D Electronics
    • 4.7.1 Technology overview
    • 4.7.2 Partially versus fully additive electronics
      • 4.7.2.1 Partially Additive Electronics
      • 4.7.2.2 Fully Additive Electronics
    • 4.7.3 Nanoscale to macroscale
    • 4.7.4 Fully 3D Printed Electronics
      • 4.7.4.1 Fully 3D printed circuits and electronic components
      • 4.7.4.2 Challenges
    • 4.7.5 Conductive Ink Requirements
    • 4.7.6 SWOT analysis
    • 4.7.7 Global market revenues, by ink type
  • 4.8 E-textiles
    • 4.8.1 Technology overview
      • 4.8.1.1 Integration of electronics into
      • 4.8.1.2 Challenges for E-Textiles
    • 4.8.2 Applications
      • 4.8.2.1 Biometric Monitoring
      • 4.8.2.2 Textile sensors
    • 4.8.3 Conductive Ink Requirements
    • 4.8.4 SWOT analysis
    • 4.8.5 Global market revenues, by ink type
  • 4.9 Circuit prototyping
    • 4.9.1 Technology overview
      • 4.9.1.1 PCB prototyping
      • 4.9.1.2 Circuit prototyping and 3D electronics
    • 4.9.2 Conductive ink requirements
    • 4.9.3 SWOT analysis
    • 4.9.4 Global market revenues, by ink type
  • 4.10 Printed and flexible sensors
    • 4.10.1 Key markets for printed/flexible sensors
    • 4.10.2 Capacitive sensing
      • 4.10.2.1 Working principle
      • 4.10.2.2 Printed capacitive sensor technologies
      • 4.10.2.3 3D Capacitive Sensing
      • 4.10.2.4 Current mode sensor readout
      • 4.10.2.5 Conductive ink requirements
      • 4.10.2.6 SWOT analysis
    • 4.10.3 Pressure sensors
      • 4.10.3.1 Force sensitive inks
      • 4.10.3.2 Manufacturing methods
        • 4.10.3.2.1 Roll-to-roll manufacturing technology
      • 4.10.3.3 Conductive ink requirements
      • 4.10.3.4 SWOT analysis
    • 4.10.4 Biosensors
      • 4.10.4.1 Electrochemical biosensors
        • 4.10.4.1.1 Fabrication of electrochemical biosensors
          • 4.10.4.1.1.1 Screen Printing
          • 4.10.4.1.1.2 Sputtering
        • 4.10.4.1.2 Challenges
      • 4.10.4.2 Printed pH sensors
      • 4.10.4.3 Conductive ink requirements
      • 4.10.4.4 SWOT analysis
    • 4.10.5 Strain sensors
      • 4.10.5.1 Overview
      • 4.10.5.2 Capacitive strain sensors
      • 4.10.5.3 Resistive strain sensors
      • 4.10.5.4 AR/VR
      • 4.10.5.5 Conductive ink requirements
      • 4.10.5.6 SWOT analysis
    • 4.10.6 Global market revenues, by ink type
  • 4.11 Wearable electrodes
    • 4.11.1 Technology overview
      • 4.11.1.1 Wet vs dry electrodes
    • 4.11.2 Requirements
    • 4.11.3 Applications
      • 4.11.3.1 Skin patches
      • 4.11.3.2 E-textiles
    • 4.11.4 Conductive ink requirements
    • 4.11.5 SWOT analysis
    • 4.11.6 Global market revenues, by ink type
  • 4.12 EMI Shielding
    • 4.12.1 Technology overview
    • 4.12.2 Process flow
    • 4.12.3 Sprayed EMI shielding
    • 4.12.4 Conformal shielding technologies
    • 4.12.5 Hybrid inks
    • 4.12.6 Particle-free Ag ink
    • 4.12.7 Heterogeneous integration
    • 4.12.8 Suppliers
    • 4.12.9 Conductive ink requirements
    • 4.12.10 SWOT analysis
    • 4.12.11 Global market revenues, by ink type
  • 4.13 Printed Antennas
    • 4.13.1 Technology overview
      • 4.13.1.1 Extruded conductive paste
    • 4.13.2 Applications
      • 4.13.2.1 Automotive transparent antennas
      • 4.13.2.2 Building integrated transparent antennas
      • 4.13.2.3 Consumer electronic devices
      • 4.13.2.4 Smart packaging
    • 4.13.3 Conductive ink requirements
    • 4.13.4 SWOT analysis
    • 4.13.5 Global market revenues, by ink type
  • 4.14 RFID &Smart Packaging
    • 4.14.1 Technology overview
    • 4.14.2 Applications
      • 4.14.2.1 Printed RFID antennas
      • 4.14.2.2 Smart packaging
      • 4.14.2.3 Sensor-less sensing
    • 4.14.3 Conductive ink requirements
    • 4.14.4 SWOT analysis
    • 4.14.5 Global market revenues, by ink type
  • 4.15 Printed batteries
    • 4.15.1 Technology overview
    • 4.15.2 Applications
    • 4.15.3 SWOT analysis
    • 4.15.4 Global market revenues, by ink type
  • 4.16 5G /6G and mmWave printed antennas (greatly expanded)
    • 4.16.1 Technology overview
    • 4.16.2 Antenna architectures and where printed inks fit
    • 4.16.3 Sub-applications and addressable market
    • 4.16.4 Conductive ink requirements
    • 4.16.5 Supplier landscape and value chain
    • 4.16.6 Standards and regulatory environment
    • 4.16.7 Market forecast
    • 4.16.8 SWOT analysis
  • 4.17 AR/VR and smart-glasses transparent conductors (greatly expanded)
    • 4.17.1 Technology overview
    • 4.17.2 Competing TCF platforms
    • 4.17.3 Sub-applications and unit-volume profile
    • 4.17.4 Conductive ink and film requirements
    • 4.17.5 Challenges
    • 4.17.6 Standards and regulatory environment
    • 4.17.7 Market forecast
    • 4.17.8 SWOT analysis
  • 4.18 Brain - computer interfaces and neural electrodes (greatly expanded)
    • 4.18.1 Technology overview
    • 4.18.2 Device classes and where conductive inks fit
    • 4.18.3 Clinical-stage indications
    • 4.18.4 Conductive ink requirements
    • 4.18.5 Regulatory and reimbursement
    • 4.18.6 Challenges
    • 4.18.7 Market forecast
    • 4.18.8 SWOT analysis
  • 4.19 Soft robotics and humanoid tactile skin (greatly expanded)
    • 4.19.1 Technology overview
    • 4.19.2 Sub-applications and sensor density
    • 4.19.3 Conductive ink requirements
    • 4.19.4 Standards and qualification
    • 4.19.5 Challenges
    • 4.19.6 Market forecast
    • 4.19.7 SWOT analysis
  • 4.20 Perovskite and tandem photovoltaic metallisation
    • 4.20.1 Technology overview
    • 4.20.2 Pilot and commercial deployments
    • 4.20.3 Conductive ink requirements
    • 4.20.4 Conductive ink platforms in tandem PV
    • 4.20.5 Standards and regulatory environment
    • 4.20.6 Challenges
    • 4.20.7 Market forecast
    • 4.20.8 SWOT analysis
  • 4.21 Smart agriculture and environmental sensing (greatly expanded)
    • 4.21.1 Technology overview
    • 4.21.2 -applications
    • 4.21.3 Conductive ink requirements
    • 4.21.4 Regulatory and standards environment
    • 4.21.5 Challenges
    • 4.21.6 Market forecast
    • 4.21.7 SWOT analysis
  • 4.22 Implantable and bioelectronic devices
    • 4.22.1 Technology overview
    • 4.22.2 Conductive ink requirements
    • 4.22.3 Standards and regulatory environment
    • 4.22.4 Challenges
    • 4.22.5 Market forecast
    • 4.22.6 SWOT analysis

5 SUPPLY CHAIN, RAW MATERIALS AND GEOPOLITICS

  • 5.1 Overview
  • 5.2 Silver: supply, demand and price
    • 5.2.1 Global silver supply
    • 5.2.2 Silver mining geography
    • 5.2.3 PV silver intensity trajectory
    • 5.2.4 PV silver recycling
  • 5.3 Copper: an alternative and acompetitor
  • 5.4 Critical minerals and specialty elements
    • 5.4.1 Gallium and indium - the EGaIn supply-chain question
    • 5.4.2 Rare-earth controls
  • 5.5 Regional supply-chain strategies
    • 5.5.1 United States
    • 5.5.2 European Union
    • 5.5.3 Asia-Pacific
  • 5.6 Tariffs, export controls and reshoring
  • 5.7 Critical raw-material exposure by conductive-ink chemistry

6 SUSTAINABILITY AND CIRCULAR ECONOMY

  • 6.1 Overview and drivers
  • 6.2 Regulatory landscape
  • 6.3 Sustainable formulation routes
    • 6.3.1 Water-based and solvent-free silver inks
    • 6.3.2 PFAS-free formulations
    • 6.3.3 Bio-derived PEDOT and OMIECs
    • 6.3.4 Lignin-derived carbon and cellulose-PEDOT composites
    • 6.3.5 Pulp-based, metal-free RFID
    • 6.3.6 Bioresorbable and transient conductors
  • 6.4 Substrate and end-of-life systems
  • 6.5 End-of-life flows
  • 6.6 Carbon footprint and embodied emissions
  • 6.7 Certifications and claim management

7 AI-DRIVEN INK FORMULATION AND PROCESS OPTIMISATION

  • 7.1 Overview
  • 7.2 Applications of AI/ML in the conductive-ink industry
  • 7.3 Self-driving laboratories
  • 7.4 Commercial software platforms
  • 7.5 In-line printing-process control
  • 7.6 Challenges and risks

8 COMPANY PROFILES (80 company profiles)

9 RESEARCH METHODOLOGY

10 REFERENCES

List of Tables

  • Table 1. Key shifts since the 2024 edition
  • Table 2. Conductivity of some functional materials used in conductive inks.
  • Table 3. Advantages of conductive ink, by type.
  • Table 4. Key Growth Markets for Conductive Inks.
  • Table 5. Material Type.
  • Table 6. Technology Readiness Level (TRL) of different conductive ink types.TR: 1 = basic principles
  • Table 7. Printing technologies
  • Table 8. Technology Readiness Level (TRL) of different printing technologies.
  • Table 9. Applications for conductive inks,
  • Table 10. Technology Readiness Level (TRL) of conductive ink applications.
  • Table 11. End-Use Industries for conductive inks.
  • Table 12. Global conductive ink revenues by ink type, 2024–2036 (US$ millions)
  • Table 13. Conductivity Requirements by Application.
  • Table 14. Suppliers by Conductive Material.
  • Table 15. Suppliers by Ink Composition.
  • Table 16. Benchmarking conductive ink properties.
  • Table 17. Properties of various flake-based silver inks.
  • Table 18. Silver Flake Producers and Products.
  • Table 19. Prices of various silver nanoparticle products and ink formulations.
  • Table 20. Comparative analysis of Silver Nanoparticle Production Methods.
  • Table 21. Benchmarking Parameters for Silver Nanoparticle Production Methods.
  • Table 22. Nanoparticle ink manufacturers.
  • Table 23. Application Opportunities for Nanoparticle Inks.
  • Table 24. Comparing properties of nanoparticle-based silver inks.
  • Table 25. Key benefits of particle-free inks.
  • Table 26. Particle-free conductive inks based on their sintering requirements.
  • Table 27. Particle-free conductive inks for different metals.
  • Table 28. Properties of different particle-free silver ink systems.
  • Table 29. Key application areas and the potential benefits of using particle-free inks.
  • Table 30. Particle-Free Ink Manufacturers and Products.
  • Table 31. Challenges in developing copper inks.
  • Table 32. Particle-free conductive inks based on their sintering requirements.
  • Table 33. Copper ink suppliers.
  • Table 34. Comparison table of various carbon conductive inks.
  • Table 35. Properties for various transparent conductive materials.
  • Table 36. Graphene-based conductive inks applications.
  • Table 37. Graphene/CNT ink producers.
  • Table 38. Properties of graphene and CNT inks.
  • Table 39. Commercially available carbon black grades.
  • Table 40. Stretchable v Thermoformable conductive inks.
  • Table 41. TRL for stretchable and thermoformable electronics.
  • Table 42. Properties of selected stretchable and thermoformable conductive inks.
  • Table 43. Stretchable/Thermoformable Ink Manufacturers.
  • Table 44. Key benefits of silver nanowires.
  • Table 45. Applications of silver nanowires.
  • Table 46. TRL of silver nanowire technology.
  • Table 47. Silver nanowire producers.
  • Table 48.Biobased conductive polymer inks.
  • Table 49. Applications of conductive polymers in flexible electronics.
  • Table 50. Performance benchmark — MXene inks against competing conductive-ink chemistries (2025–2026).
  • Table 51. MXene-ink requirements by application format.
  • Table 52. MXene-ink market by application, 2025–2036 (US$ millions).
  • Table 53. Liquid-metal conductive ink variants and properties, 2026.
  • Table 54. Liquid-metal-ink performance benchmark against alternative stretchable conductors.
  • Table 55. Conductive ink requirements for liquid-metal applications.
  • Table 56. Liquid-metal conductive ink market by application, 2025–2036 (US$ millions).
  • Table 57. Performance benchmark — conductive hydrogels and OMIECs against alternative bioelectronic interfaces.
  • Table 58. Conductive ink requirements for hydrogel and OMIEC bioelectronic applications.
  • Table 59. Conductive hydrogel and OMIEC market by application, 2025–2036 (US$ millions).
  • Table 60. Performance benchmark — bio-based and sustainable conductive inks against incumbents.
  • Table 61. Conductive ink requirements for sustainable applications.
  • Table 62. Bio-based and sustainable conductive-ink market by sub-application, 2025–2036 (US$ millions).
  • Table 63. Key applications of conductive inks.
  • Table 64. Benchmarking conductive ink requirements by application.
  • Table 65. Technological and commercial readiness levels of various conductive ink applications.
  • Table 66. Conductive ink requirements for photovoltaics.
  • Table 67. Global market for conductive inks in photovoltaics (conventional / rigid c-Si), 2024–2036 (US$ millions).
  • Table 68. Global market for conductive inks in photovoltaics (flexible PV — thin-film, OPV, perovskite single-junction), 2024–2036 (US$ millions).
  • Table 69. Building-integrated solutions for printed heaters.
  • Table 70. Key characteristics of e-textile heating technologies.
  • Table 71. Conductive ink requirements for printed heaters.
  • Table 72. Global market for conductive inks in printed heaters, 2024–2036 (US$ millions).
  • Table 73. Conductive ink requirements in FHE.
  • Table 74. Global market for conductive inks in flexible hybrid electronics (FHE), 2024–2036 (US$ millions).
  • Table 75. Key requirements for conductive inks in IME applications.
  • Table 76. Global market for conductive inks in in-mold electronics (IME), 2024–2036 (US$ millions).
  • Table 77. Advantages of fully additively manufactured 3D electronics:
  • Table 78. Fully 3D printed circuits and electronic components.
  • Table 79. Requirements for conductive inks in 3D electronics:
  • Table 80. Global market for conductive inks in 3D electronics, 2024–2036 (US$ millions).
  • Table 81. Requirements for conductive inks in e-textiles applications.
  • Table 82. Global market for conductive inks in e-textiles, 2024–2036 (US$ millions).
  • Table 83. Global market for conductive inks in circuit prototyping (PCB and 3D), 2024–2036 (US$ millions).
  • Table 84. Key markets for printed/flexible sensors.
  • Table 85. Printed capacitive sensor technologies.
  • Table 86. Technology Readiness level of printed capacitive touch sensors materials and technologies.
  • Table 87. Technology Readiness Levels (TRLs) for printed piezoresistive pressure sensors and printed piezoelectric sensors.
  • Table 88. Manufacturing of printed piezoresistive sensors.
  • Table 89. Conductive ink requirements for printed piezoresistive pressure sensors and printed piezoelectric sensors.
  • Table 90. Global market for conductive inks in printed and flexible sensors (aggregate), 2024–2036 (US$ millions).
  • Table 91. Comparison of Wet and Dry Electrodes in Wearable Electrodes.
  • Table 92. Requirements of wearable electrodes.
  • Table 93. Markets, applications and product types for wearable electrodes.
  • Table 94. Technology readiness level of printed wearable electrodes.
  • Table 95. Conductive ink requirements for printed wearable electrodes.
  • Table 96. Global market for conductive inks in wearable electrodes, 2024–2036 (US$ millions).
  • Table 97. Ink-based conformal EMI shielding companies.
  • Table 98. Conductive ink requirements for EMI shielding.
  • Table 99. Global market for conductive inks in EMI shielding, 2024–2036 (US$ millions).
  • Table 100. Addressable Markets for Transparent Antennas.
  • Table 101. Global market for conductive inks in printed antennas (sub-7 GHz, traditional), 2024–2036 (US$ millions).
  • Table 103. Conductive ink requirements for RFID and smart packaging.
  • Table 104. Global market for conductive inks in RFID and smart packaging, 2024–2036 (US$ millions).
  • Table 105. Global market for conductive inks in printed batteries, 2024–2036 (US$ millions).
  • Table 106. 5G/6G and mmWave antenna architectures, dominant materials and conductive-ink opportunity.
  • Table 107. Conductive-ink performance requirements for printed antennas by frequency band, 2026.
  • Table 109. Global market for conductive inks in 5G/6G and mmWave printed antennas, 2026–2036 (US$ millions).
  • Table 110. SWOT analysis — conductive inks in 5G/6G and mmWave printed antennas.
  • Table 111. Performance benchmark — transparent conductive film technologies for AR/VR.
  • Table 112. AR/VR and smart-eyewear form factors, TCF function and unit-volume profile.
  • Table 113. Conductive ink and film requirements for AR/VR TCFs by application function.
  • Table 114. Global market for conductive inks in AR/VR transparent conductors, 2026–2036 (US$ millions).
  • Table 115. SWOT analysis — AR/VR transparent conductors.
  • Table 116. BCI and neural-electrode applications and clinical stage, 2026.
  • Table 117.Conductive ink requirements for BCI and neural electrodes.
  • Table 118. Global market for conductive inks in BCI and neural electrodes, 2026–2036 (US$ millions).
  • Table 119. SWOT analysis — BCI and neural electrodes.
  • Table 120. Conductive-ink applications in soft robotic and humanoid skin, with sensor density per platform.
  • Table 121. Conductive ink requirements for soft-robotic skin.
  • Table 122. Global market for conductive inks in soft robotics and humanoid tactile skin, 2026–2036 (US$ millions).
  • Table 123. SWOT analysis — conductive inks in soft robotics and humanoid skin.
  • Table 124. Perovskite and tandem PV producers, status 2026.
  • Table 125. Conductive ink requirements for perovskite and tandem PV.
  • Table 126. Global market for conductive inks in perovskite and tandem photovoltaics, 2026–2036 (US$ millions).
  • Table 127. SWOT analysis — perovskite and tandem photovoltaic metallisation.
  • Table 128. Smart-agriculture sensor categories and deployment density.
  • Table 129. Conductive ink requirements for smart-agriculture sensors.
  • Table 130. Global market for conductive inks in smart agriculture and environmental sensing, 2026–2036 (US$ millions).
  • Table 131. SWOT analysis — smart-agriculture sensors.
  • Table 132. Conductive ink requirements for implantable and bioelectronic devices.
  • Table 133. Global market for conductive inks in implantable and bioelectronic devices (excluding BCI/neural), 2026–2036 (US$ millions).
  • Table 134. SWOT analysis — implantable and bioelectronic devices.
  • Table 135. Global silver supply and demand summary, 2023–2030.
  • Table 136. Table 135. PV silver intensity by cell architecture and forecast trajectory.
  • Table 137. Critical raw materials and processing concentration for conductive-ink chemistries, 2026.
  • Table 138. Major tariff and export-control measures affecting conductive-ink supply chain, 2023–2026.
  • Table 139. Critical raw-material exposure by conductive-ink chemistry.
  • Table 140. Regulatory framework affecting conductive-ink sustainability, 2024–2030.
  • Table 141. End-of-life pathways for conductive-ink-containing products, 2026.
  • Table 142. AI / ML applications across the conductive-ink value chain, 2026.
  • Table 143. Commercial materials-informatics and AI-formulation platforms used in conductive-ink R&D, 2026.

List of Figures

  • Figure 1. Printed electronics for smart automotive interiors.
  • Figure 2. E-textile with printed antenna.
  • Figure 3. Total conductive ink revenues 2024–2036 (US$ millions).
  • Figure 4. Global conductive ink revenues by ink type, 2024-2036 (US$ Millions)
  • Figure 5. Flexible RFID antenna printed using conductive ink.
  • Figure 6. Flake-Based Silver Ink Value Chain.
  • Figure 7. SWOT analysis for Flake-based silver inks.
  • Figure 8. SWOT analysis for Nanoparticle inks.
  • Figure 9. SWOT analysis for Particle-free conductive inks
  • Figure 10. RFID Tag with Nano Copper Antenna on Paper.
  • Figure 11. SWOT analysis for Copper-based inks
  • Figure 12. SWOT analysis for Carbon black conductive inks.
  • Figure 13. SWOT analysis for Nanostructured carbon conductive inks.
  • Figure 14. Stretchable conductive ink containing liquid-metal particles prototype.
  • Figure 15. SWOT analysis for Stretchable/thermoformable inks.
  • Figure 16. Silver nanowires value chain.
  • Figure 17. SWOT analysis for Silver nanowires.
  • Figure 18. SWOT analysis: conductive polymer inks.
  • Figure 19.SWOT analysis — MXene inks.
  • Figure 20.SWOT analysis — liquid-metal conductive inks.
  • Figure 21. SWOT analysis — conductive hydrogels and OMIECs.
  • Figure 22. SWOT analysis — bio-based and sustainable conductive inks.
  • Figure 23. Emerging conductive ink materials — revenue forecast, 2025–2036 (US$ millions).
  • Figure 24. SWOT analysis for Conductive ink in Photovoltaics.
  • Figure 25. Global market for conductive inks in photovoltaics (rigid c-Si) by ink type, 2024–2036 (US$ millions).
  • Figure 26. Global market for conductive inks in photovoltaics (flexible PV) by ink type, 2024–2036 (US$ millions).
  • Figure 27. Haydale 'Hot Seat'.
  • Figure 28. SWOT analysis for Conductive inks in Printed heaters.
  • Figure 29. Global market for conductive inks in printed heaters by ink type, 2024–2036 (US$ millions).
  • Figure 30. SWOT analysis: Conductive inks in Flexible hybrid electronics (FHE).
  • Figure 31. Global market for conductive inks in flexible hybrid electronics (FHE) by ink type, 2024–2036 (US$ millions).
  • Figure 32. In-Mold Electronics (IME) examples.
  • Figure 33. IME value chain.
  • Figure 34. SWOT analysis for Conductive inks in In-mold electronics (IME).
  • Figure 35. Global market for conductive inks in in-mold electronics (IME) by ink type, 2024–2036 (US$ millions).
  • Figure 36. SWOT analysis for Conductive inks in 3D electronics.
  • Figure 37. Global market for conductive inks in 3D electronics by ink type, 2024–2036 (US$ millions).
  • Figure 38. SWOT analysis for Conductive inks in e-textiles.
  • Figure 39. Global market for conductive inks in e-textiles by ink type, 2024–2036 (US$ millions).
  • Figure 40. SWOT analysis for conductive inks in circuit prototyping.
  • Figure 41. Global market for conductive inks in circuit prototyping by ink type, 2024–2036 (US$ millions).
  • Figure 42. SWOT analysis: Conductive inks in capacitive sensors.
  • Figure 43. SWOT analysis for Piezoresistive sensors.
  • Figure 44. SWOT analysis for Piezoelectric sensors.
  • Figure 45. SWOT analysis for Conductive inks in Printed biosensors.
  • Figure 46. Conductive Inks in printed strain sensors.
  • Figure 47. Global market for conductive inks in printed and flexible sensors by sub-category, 2024–2036 (US$ millions).
  • Figure 48. SWOT analysis for Printed wearable electrodes
  • Figure 49. Global market for conductive inks in wearable electrodes by ink type, 2024–2036 (US$ millions).
  • Figure 50. SWOT analysis for Conductive inks in EMI shielding.
  • Figure 51.Global market for conductive inks in EMI shielding by ink type, 2024–2036 (US$ millions).
  • Figure 52. SWOT analysis for Printed antennas.
  • Figure 53. Global market for conductive inks in printed antennas (sub-7 GHz, traditional) by ink type, 2024–2036 (US$ millions).
  • Figure 54. Chip-less RFID tags.
  • Figure 55. SWOT analysis for conductive inks in RFID and smart packaging.
  • Figure 56. Global market for conductive inks in RFID and smart packaging by ink type, 2024–2036 (US$ millions).
  • Figure 57. SWOT analysis for conductive inks in printed batteries.
  • Figure 58. Global market for conductive inks in printed batteries by ink type, 2024–2036 (US$ millions).
  • Figure 59. Global market for conductive inks in 5G/6G and mmWave printed antennas by frequency band, 2026–2036 (US$ millions).
  • Figure 60. Global market for conductive inks in AR/VR transparent conductors by platform, 2026–2036 (US$ millions).
  • Figure 61.Global market for conductive inks in BCI and neural electrodes, 2026–2036 (US$ millions).
  • Figure 62. Global market for conductive inks in soft robotics and humanoid tactile skin, 2026–2036 (US$ millions).
  • Figure 63.Global market for conductive inks in perovskite and tandem photovoltaics by ink platform, 2026–2036 (US$ millions).
  • Figure 64. Global market for conductive inks in smart agriculture and environmental sensing, 2026–2036 (US$ millions).
  • Figure 65. Global market for conductive inks in implantable and bioelectronic devices (excluding BCI/neural), 2026–2036 (US$ millions).
  • Figure 66. Bando conductive ink product.
  • Figure 67. DryCure J Ag Nanoink for Inkjet Printing.
  • Figure 68. Copprium copper ink product.
  • Figure 69. Fuji carbon nanotube products.
  • Figure 70. A RF antenna printed on the DragonFly IV.
  • Figure 71. (A) Thick-Film Conductive Ink. (B) Flexible substrate with patterns printed on its surface using the thick-film conductive ink. (C) Variety of metal complex inks that are used to synthesize the thick-film conductive ink. (D) Copper particles.
  • Figure 72. PulpaTronics' paper RFID tag.
  • Figure 73. Saral StretchSilver 500 printed on a textile substrate.