首頁 > 市場調查報告書 > 電子零件/半導體

半導體生產設備

市場調查報告書

商品編碼

1474063

全球光子 IC 市場 - 2024-2031

Global Photonic IC Market - 2024-2031

出版日期: 2024年05月02日 | 出版商:

DataM Intelligence | 英文 206 Pages | 商品交期: 最快1-2個工作天內

價格

※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

簡介目錄

概述

全球光子IC市場在2023年達到32億美元，預計2031年將達到317億美元，2024-2031年預測期間複合年成長率為33.2%。

推動光子積體電路市場的主要因素之一是對資料傳輸和高速通訊系統的需求不斷成長。光子積體電路對於資料中心、5G 網路、電信和高效能運算等應用至關重要，因為它們能夠利用光訊號快速發送資料。由於資料密集型應用程式的成長，對增加頻寬容量的需求始終存在。光子積體電路（IC）提供的高頻寬能力使得透過光網路有效傳輸大量資料成為可能。

主要關鍵參與者不斷推出的產品有助於推動預測期內的市場成長。例如，2021年9月28日，Freedom Photonics在市場上推出了2.5瓦衍射極限1550 nm半導體雷射和放大器。首批商用產品是 1550 nm 半導體雷射和半導體光放大器，可實現 2.5 W 連續波光功率、>25% E/O 效率和接近衍射極限的光束質量

由於光子 IC 公司之間的合作日益密切，北美成為市場的主導地區。例如，Synopsys, Inc. 和瞻博網路將於 2022 年 4 月 4 日成立一家新公司，為業界提供開放式矽光子平台，以滿足電信、資料通訊、LiDAR、人工智慧、醫療保健、高效能運算和光計算。新公司能夠以最低的功耗實現高性能光子積體電路的新整合水準。

動力學

對高速數據通訊和網際網路連接的需求不斷成長

由於網路流量的增加，資料中心營運商正在為其基礎設施建立更多空間，以滿足社交網路、雲端運算、串流視訊、電子商務和線上服務等數位應用不斷成長的需求。矽光子技術實現的高速光學互連、交換器和收發器可實現資料中心建築物內部和之間的有效資料傳輸，滿足當代資料中心的可擴展性和效能需求。希望可擴展、按需存取電腦資源、儲存和應用程式的企業組織和個人正在推動雲端運算服務使用的持續成長。

根據即時資料分析收集的資訊，超過60%的網站流量來自行動裝置。 92.3% 的網路使用者透過行動裝置存取網路。目前全球有43.2億個行動上網用戶。非洲行動裝置上網流量佔比最大，約佔69.13%。到 2025 年，全球 5G 連線數將超過 10 億。

5G網路和物聯網應用的興起

5G網路需要高速資料和高效率的傳輸能力，以支援連接設備和物聯網應用產生的大量資料。光子 IC 能夠使用光訊號高速傳輸資料，在頻寬方面具有優勢。對高速資料傳輸的需求推動了 5G 基礎設施和光互連中對 PIC 的需求。 5G 網路承諾超低延遲和即時通訊功能，這對於自動駕駛汽車、擴增實境和遠距醫療等應用至關重要。

光子 IC 在減少 5G 網路延遲、增強訊號處理和最佳化資料路由方面發揮著至關重要的作用，從而實現依賴即時資料處理和回應的無縫連接和高效能應用。根據GSM協會給出的資料，到2025年5G網路將覆蓋全球約1/3的人口。 5G為全球帶來13.1兆美元的經濟產出。到 2023 年，約 59% 的人口使用 5G 網路，亞太地區約 42% 的人口使用 5G 網路。

通用製造和製程技術缺乏標準化

如果沒有標準化的製造和製程技術，不同 PIC 之間的互通性就變得具有挑戰性。缺乏互通性阻礙了靈活性、可擴展性和相容性，從而限制了來自不同供應商或製造商的 PIC 無縫整合到更大的光學系統或網路中。缺乏標準化可能會導致設計複雜性，因為企業必須創建獨特的方法或修改現有方法，以解決組件規格、製造方法、材料和介面的差異。設計複雜性增加了開發時間、費用和風險，從而增加了企業快速有效地將基於 PIC 的產品推向市場的難度。

客製化製造和製程技術通常會導致 PIC 的開發成本更高。公司需要投資適合其特定製造方法的專用設備、專業知識、設計工具、測試程序和品質控制措施。較高的成本可能會阻止小公司或新創公司進入 PIC 市場或擴大業務規模。標準化的缺乏限制了供應商或製造設施的可用性，無法滿足特定要求或生產具有所需性能特徵的 PIC。有限的供應商生態系統減少了市場競爭、選擇和創新，可能導致價格上漲、交貨時間延長和供應鏈脆弱性。

One major factor driving the photonic integrated circuit market is the increasing need for data transport and high-speed communication systems. Photonic integrated circuits are crucial for applications such as data centers, 5G networks, telecommunications and high-performance computing because they enable data to be sent at fast rates utilizing optical signals. The need for increasing bandwidth capacity is constant due to the growth of data-intensive applications. High bandwidth capabilities provided by photonic integrated circuits (ICs) make it possible to transmit massive amounts of data across optical networks effectively.

Growing product launches by major key players help to boost market growth over the forecast period. For instance, on September 28, 2021, Freedom Photonics launched 2.5-watt diffraction-limited 1550 nm Semiconductor Lasers and Amplifiers in the market. The first commercial offerings are 1550 nm semiconductor lasers and semiconductor optical amplifiers, which achieve 2.5 W continuous wave optical power with >25% E/O efficiency and nearly diffraction-limited beam quality

North America is a dominating region in the market due to the growing collaboration between the companies for photonic IC. For instance, on April 04, 2022, Synopsys, Inc. and Juniper Networks are going to open a new company that will provide the industry with an open silicon photonics platform to address the growing photonic requirements in applications such as telecom, datacom, LiDAR, AI, healthcare, HPC and optical computing. The new company can enable a new level of integration with the lowest power consumption for high-performance Photonic Integrated Circuits.

Dynamics

Increasing Demand for High-Speed Data Communication and Internet Connectivity

Due to a rise in internet traffic, data center operators are building more space for their infrastructure to meet the growing need for digital applications such as social networking, cloud computing, streaming video, e-commerce and online services. High-speed optical interconnects, switches and transceivers made possible by silicon photonics technology enable effective data transfer both inside and between data center buildings, meeting the scalability and performance demands of contemporary data centers. Businesses organizations and individuals wishing scalable, on-demand access to computer resources, storage and applications are driving the continued growth in the usage of cloud computing services.

According to information gathered through live data analysis, over 60% of website traffic comes from mobile devices. 92.3% of internet users receive their internet via a mobile device. There are currently 4.32 billion mobile internet users globally. The proportion of internet traffic via mobile devices is greatest in Africa which accounted for around 69.13%. There are around over 1 billion 5G connections globally by 2025. The increase in the adoption of the internet helps to boost the market growth of photonics IC.

Rise of 5G Networks and IoT Applications

5G networks require high-speed data and efficient transmission capabilities to support massive amounts of data generated by connected devices and IoT applications. Photonic ICs enable the transmission of data at high speeds using optical signals, offering advantages in terms of bandwidth. The requirement for high-speed data transmission drives the demand for PICs in 5G infrastructure and optical interconnects. 5G networks promise ultra-low latency and real-time communication capabilities essential for applications like autonomous vehicles, augmented reality and telemedicine.

Photonic ICs play a vital role in reducing latency, enhancing signal processing and optimizing data routing in 5G networks, enabling seamless connectivity and high-performance applications that rely on real-time data processing and response. According to the data given by GSM Association, by 2025 5G networks will cover around 1/3rd of the global population. 5G introduced 13.1 Trillion dollars of global economic output. In 2023 around 59% of the population is using 5G network and in Asia-Pacific around 42% of the population adopted 5G network.

Lack of Standardization in the Common Fabrication and Process Techniques

Without standardized fabrication and process techniques, interoperability between different PICs becomes challenging. Flexibility, scalability and compatibility are hindered by this lack of interoperability, which restricts the seamless integration of PICs from various providers or manufacturers into larger optical systems or networks. Lack of standardization can cause design complexity since businesses have to create distinctive approaches or modify existing ones to account for differences in component specifications, fabrication methods, materials and interfaces. Design complexity makes it more difficult for businesses to quickly and efficiently launch PIC-based products onto the market by raising development time, expenses and risks.

Customized fabrication and process techniques often result in higher development costs for PICs. Companies need to invest in specialized equipment, expertise, design tools, testing procedures and quality control measures tailored to their specific fabrication methods. The higher costs can deter smaller companies or startups from entering the PIC market or scaling their operations. The lack of standardization limits the availability of suppliers or fabrication facilities capable of meeting specific requirements or producing PICs with desired performance characteristics. The limited supplier ecosystem reduces market competition, choice and innovation, potentially leading to higher prices, longer lead times and supply chain vulnerabilities.

Segment Analysis

The global photonic ic market is segmented based on component, raw material, integration, application, end-user and region.

Growing Adoption of Interposer Approach Type Photonic ICs

Based on the Application, the Photonic IC market is segmented into optical communications, sensing, optical signal processing and biophotonics.

The biophotonics application segment accounted the largest share of the market due to the growing emergence of nanotechnology in biophotonics. Due to the government's efforts to advance the biophotonics sector, US is a significant market for the business. Additionally, the biophotonics business in US has been pushed by the development of nanotechnology. The Jenoptik Light and Optics Biophotonics business received many new development orders in North America in November 2020. The initial challenge is to create a camera system for medical equipment that will be utilized in a robotic surgical instrument.

The major players in the market launched new products in the market which helps to boost regional market growth. For instance, in March 2021, Zeiss expanded its presence in North America by launching a new research & development, sales and customer service center in U.S. with an investment of US$ 180 Billion. The new site will incorporate the X-ray microscopy business along with the ZEISS Microscopy Customer Center to provide support for opportunities in materials research, life sciences and industrial applications.

Geographical Penetration

North America is Dominating the Photonic IC Market

A robust ecosystem of universities and research centers is present in North America, propelling technical innovation in integrated circuits and photonics. Entrepreneurship are highly valued in the region and this has led to breakthroughs in manufacturing processes and system integration. North America receives the benefits of broad industry-academia-government agency-research group collaboration and partnerships. Working together makes it easier to share expertise, transfer technology and conduct joint research initiatives aimed at creating cutting-edge PIC solutions for a range of sectors, including data centers, telecommunications, healthcare, aerospace, defense and the automotive sector.

Growing major key players' focus on the photonic IC helps to boost regional market growth over the forecast period. For instance, on October 16, 2022, Enosemi completed a commercial agreement with Luminous Computing to license and sell the silicon photonics design IP originally developed at Luminous, a key technology for AI supercomputing applications. The management team of Enosemi is experienced in silicon photonics, analog mixed signals, lasers, packaging, control and system hardware.

Competitive Landscape

The major global players in the market include Intel Corporation, Cisco Systems, Inc., Infinera Corporation, Polariton Technologies AG, teem photonics, Lumentum Holdings Inc., Luxtera, Inc., LIGENTEC SA, Acacia Communications, Inc., Kaiam Corporation and TCG Crest.

COVID-19 Impact Analysis

Global supply networks in the semiconductor sector were impacted by the pandemic. Production and shipping of PICs and related components were delayed as a result of reduced capacity and logistical difficulties. Disruptions in the supply chain impacted the supply of raw materials, manufacturing testing and packaging, which in turn hampered the availability of PICs in the market and the overall efficiency of the supply chain.

Shifts in the economy and lockdowns brought on by the epidemic prompted changes in the market need for PICs. PIC-based solutions were in higher demand in some industries such as data centers and healthcare to facilitate remote work and healthcare technology. In contrast, demand in other industries such as consumer electronics-was lower as a result of slower manufacturing and lower consumer expenditure. The need for high-speed data transmission and communication infrastructure broadened during the pandemic due to developments in telemedicine, distant work and digital collaboration. PICs played an important role in supporting these applications by enabling high-speed optical communication, signal processing, data routing and network connectivity, driving market growth in telecommunication and data center segments.

Russia-Ukraine War Impact Analysis

The semiconductor industry is one of the globally supply chains impacted by the war between Russia and Ukraine. via companies such as EpiLas GmbH, which in the semiconductor supply chain produces epitaxial wafers for optoelectronic devices. Any interruptions in the transportation of essential components or materials from Ukraine might have an impact on PIC production and availability, potentially leading to delays or shortages in the market. A rise in demand for data center infrastructure, particularly optical communication systems based on PICs occurs as corporations and organizations emphasize data protection and continuity in unpredictable geopolitical times.

Major key players in the semiconductor industry reassess their manufacturing strategies in response to geopolitical risks. The led to a diversification of manufacturing locations, increased investment in domestic and efforts to secure alternative suppliers for critical components used in PICs. Geopolitical tensions contribute to market volatility, impacting the pricing of PICs. Uncertainty in material costs and trade tariffs leads to fluctuations in component prices, affecting the profitability of companies involved in the PIC market.

By Component

Optical Laser
Modulator
Detector
Transceivers
Attenuators
Others

By Raw Material

Lithium Niobate
Indium Phosphide
Silica-on-Silicon
Gallium Arsenide
Silicon
Quantum Dots
Silicon-on-Insulator
Others

By Integration

Hybrid
Monolithic
Module

By Application

Optical Communications
Sensing
Optical Signal Processing
Bio Photonics

By End-User

Telecommunications
Biomedical
Data Centres
Others

By Region

North America
- U.S.
- Canada
- Mexico
Europe
- Germany
- UK
- France
- Italy
- Spain
- Rest of Europe
South America
- Brazil
- Argentina
- Rest of South America
Asia-Pacific
- China
- India
- Japan
- Australia
- Rest of Asia-Pacific
Middle East and Africa

Key Developments

On December 14, 2022, OpenLight launched First 800G DR8 Photonic Integrated Circuit Design for the Advance Global Datacenter Interconnect Industry. The new design provides consumers with an easy-to-use, validated approach to jump-start their transceiver production design.
On October 02, 2023, DustPhotonics launched Industry-First Merchant 800G Silicon Photonics Chip in the market for Hyperscale Data Centers and AI Applications. The new solution is suitable for DR8 and DR8+ applications which offers 8 optical channels independently modulated at 100Gb/s for an aggregate bandwidth of 800Gb/s.
On October 20, 2023, the Indian Institute of Technology Madras collaborated with the Ministry of Electronics & Information Technology for the launch of the Centre of Excellence for Silicon Photonics. Silicon photonic technology is suitable for various applications such as quantum computation, quantum key distribution and artificial intelligence.

Why Purchase the Report?

To visualize the global photonic IC market segmentation based on component, raw material, integration, application, end-user and region, as well as understand key commercial assets and players.
Identify commercial opportunities by analyzing trends and co-development.
Excel data sheet with numerous data points of photonic IC market-level with all segments.
PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
Product mapping available as excel consisting of key products of all the major players.

The global photonic IC market report would provide approximately 78 tables, 82 figures and 206 Pages.

Target Audience 2024

Manufacturers/ Buyers
Industry Investors/Investment Bankers
Research Professionals
Emerging Companies

1.Methodology and Scope

1.1.Research Methodology
1.2.Research Objective and Scope of the Report

2.Definition and Overview

3.Executive Summary

3.1.Snippet by Component
3.2.Snippet by Raw Material
3.3.Snippet by Integration
3.4.Snippet by Application
3.5.Snippet by End-User
3.6.Snippet by Region

4.Dynamics

4.1.Impacting Factors
- 4.1.1.Drivers
  - 4.1.1.1.Increasing Demand for High-Speed Data Communication and Internet Connectivity
  - 4.1.1.2.Rise of 5G Networks and IoT Applications
- 4.1.2.Restraints
  - 4.1.2.1.Lack of Standardization in the Common Fabrication and Process Techniques
- 4.1.3.Opportunity
- 4.1.4.Impact Analysis

5.Industry Analysis

5.1.Porter's Five Force Analysis
5.2.Supply Chain Analysis
5.3.Pricing Analysis
5.4.Regulatory Analysis
5.5.Russia-Ukraine War Impact Analysis
5.6.DMI Opinion

6.COVID-19 Analysis

6.1.Analysis of COVID-19
- 6.1.1.Scenario Before COVID-19
- 6.1.2.Scenario During COVID-19
- 6.1.3.Scenario Post COVID-19
6.2.Pricing Dynamics Amid COVID-19
6.3.Demand-Supply Spectrum
6.4.Government Initiatives Related to the Market During Pandemic
6.5.Manufacturers Strategic Initiatives
6.6.Conclusion

7.By Component

7.1.Introduction
- 7.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 7.1.2.Market Attractiveness Index, By Component
7.2.Optical Laser*
- 7.2.1.Introduction
- 7.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
7.3.Modulator
7.4.Detector
7.5.Transceivers
7.6.Attenuators
7.7.Others

8.By Raw Material

8.1.Introduction
- 8.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Raw Material
- 8.1.2.Market Attractiveness Index, By Raw Material
8.2.Lithium Niobate*
- 8.2.1.Introduction
- 8.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
8.3.Indium Phosphide
8.4.Silica-on-Silicon
8.5.Gallium Arsenide
8.6.Silicon
8.7.Quantum Dots
8.8.Silicon-on-Insulator
8.9.Others

9.By Integration

9.1.Introduction
- 9.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Integration
- 9.1.2.Market Attractiveness Index, By Integration
9.2.Hybrid*
- 9.2.1.Introduction
- 9.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
9.3.Monolithic
9.4.Module

10.By Application

10.1.Introduction
- 10.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.1.2.Market Attractiveness Index, By Application
10.2.Optical Communications*
- 10.2.1.Introduction
- 10.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
10.3.Sensing
10.4.Optical Signal Processing
10.5.BioPhotonics

11.By End-User

11.1.Introduction
- 11.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.1.2.Market Attractiveness Index, By End-User
11.2.Telecommunications*
- 11.2.1.Introduction
- 11.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
11.3.Biomedical
11.4.Data Centres
11.5.Others

12.By Region

12.1.Introduction
- 12.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
- 12.1.2.Market Attractiveness Index, By Region
12.2.North America
- 12.2.1.Introduction
- 12.2.2.Key Region-Specific Dynamics
- 12.2.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 12.2.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Raw Material
- 12.2.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Integration
- 12.2.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 12.2.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 12.2.8.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 12.2.8.1.U.S.
  - 12.2.8.2.Canada
  - 12.2.8.3.Mexico
12.3.Europe
- 12.3.1.Introduction
- 12.3.2.Key Region-Specific Dynamics
- 12.3.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 12.3.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Raw Material
- 12.3.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Integration
- 12.3.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 12.3.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 12.3.8.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 12.3.8.1.Germany
  - 12.3.8.2.UK
  - 12.3.8.3.France
  - 12.3.8.4.Italy
  - 12.3.8.5.Spain
  - 12.3.8.6.Rest of Europe
12.4.South America
- 12.4.1.Introduction
- 12.4.2.Key Region-Specific Dynamics
- 12.4.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 12.4.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Raw Material
- 12.4.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Integration
- 12.4.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 12.4.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 12.4.8.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 12.4.8.1.Brazil
  - 12.4.8.2.Argentina
  - 12.4.8.3.Rest of South America
12.5.Asia-Pacific
- 12.5.1.Introduction
- 12.5.2.Key Region-Specific Dynamics
- 12.5.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 12.5.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Raw Material
- 12.5.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Integration
- 12.5.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 12.5.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 12.5.8.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 12.5.8.1.China
  - 12.5.8.2.India
  - 12.5.8.3.Japan
  - 12.5.8.4.Australia
  - 12.5.8.5.Rest of Asia-Pacific
12.6.Middle East and Africa
- 12.6.1.Introduction
- 12.6.2.Key Region-Specific Dynamics
- 12.6.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 12.6.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Raw Material
- 12.6.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Integration
- 12.6.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 12.6.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

13.Competitive Landscape

13.1.Competitive Scenario
13.2.Market Positioning/Share Analysis
13.3.Mergers and Acquisitions Analysis

14.Company Profiles

14.1.Intel Corporation*
- 14.1.1.Company Overview
- 14.1.2.Product Portfolio and Description
- 14.1.3.Financial Overview
- 14.1.4.Key Developments
14.2.Cisco Systems, Inc.
14.3.Infinera Corporation
14.4.Polariton Technologies AG
14.5.Teemphotonics
14.6.Lumentum Holdings Inc.
14.7.Luxtera, Inc.
14.8.LIGENTEC SA
14.9.Acacia Communications, Inc.
14.10.Kaiam Corporation

LIST NOT EXHAUSTIVE

15.Appendix

15.1.About Us and Services
15.2.Contact Us

02-2729-4219

+886-2-2729-4219

License/價格

相關商品

光子積體電路市場：按組件、按原料、按整合類型、按應用、按地區

光子積體電路 (PIC) 市場預測：~2030 年

光子IC的全球市場

FAQ

全球光子 IC 市場 - 2024-2031

Global Photonic IC Market - 2024-2031

目錄

第 1 章：方法與範圍

第 2 章：定義與概述

第 3 章：執行摘要

第 4 章：動力學

第 5 章：產業分析

第 6 章：COVID-19 分析

第 7 章：按組件

第 8 章：依原料分類

第 9 章：透過整合

第 10 章：按申請

第 11 章：最終用戶

第 12 章：按地區

第13章：競爭格局

第 14 章：公司簡介

第 15 章：附錄