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1474047

全球低溫共燒陶瓷 (LTCC) 和高溫共燒陶瓷 (HTCC) 市場 - 2024-2031

Global Low Temperature Co-Fired Ceramics (LTCC) And High Temperature Co-fired Ceramic (HTCC) Market - 2024-2031

出版日期: 2024年05月02日 | 出版商:

DataM Intelligence | 英文 193 Pages | 商品交期: 約2個工作天內

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簡介目錄

概述

2023年全球低溫共燒陶瓷（LTCC）和高溫共燒陶瓷（HTCC）市場規模達28億美元，預計到2031年將達到37億美元，預測期間複合年成長率為3.4% 2024 年至2031 年期間。

各行業對創新電子產品的需求不斷成長，是推動 LTCC 和 HTCC 市場的主要因素之一。隨著技術的發展，具有優異可靠性、熱穩定性和小型化特性的電子元件變得越來越必要。 LTCC 和 HTCC 材料能夠生產小型且極其高效的電子元件（包括電容器、電感器、電阻器和感測器），從而滿足這些需求。

5G 連接、物聯網 (IoT)、人工智慧 (AI) 和無人駕駛汽車等先進技術的快速發展和採用推動了對 LTCC 和 HTCC 材料的需求。利用 LTCC 和 HTCC 技術可以幫助實現這些技術對電氣元件的要求，提高效能、提高整合度和增強可靠性。

亞太地區是全球低溫共燒陶瓷（LTCC）和高溫共燒陶瓷（HTCC）市場的成長地區之一，佔了超過1/3的市場。全球一些產業對微型電子設備的需求正在成長，包括消費性電子、汽車、醫療保健和電信。這正在推動低溫共燒陶瓷和高溫共燒陶瓷市場的成長。

動力學

對更輕電子設備的需求不斷增加

各行業對小型電子設備的需求不斷成長，刺激了 LTCC 和 HTCC 市場的發展。隨著技術發展推動更小、更強大的電子元件的誕生，LTCC 和 HTCC 材料在尺寸縮小、整合和性能方面具有明顯的優勢。

此外，這些陶瓷還可以製造出小型且極其高效的電子零件，例如感測器、電感器和電容器元件，這些元件對於穿戴式裝置、智慧型手機、穿戴式科技、物聯網、汽車電子和醫療設備中的使用至關重要。由於客戶對高效能、輕量化和可攜式電子設備的需求不斷增加，市場正在不斷發展，這反過來又推動了 LTCC 和 HTCC 技術的採用。

電信基礎設施的快速發展

全球電信基礎設施的快速成長，特別是隨著5G網路的引入以及對高速資料傳輸的需求不斷成長，是推動LTCC和HTCC市場的另一個重要因素。在生產濾波器、收發器和天線等電信設備中的射頻和微波零件時，需要使用 LTCC 和 HTCC 材料。

例如，2023 年，塞拉尼斯在加州聖地牙哥舉行的 IMS 2023 上推出了 Micromax LF 系列導電油墨和 GreenTape LF95C 低溫共燒陶瓷 (LTCC) 材料系統。 LF95C 是著名 GreenTape 951 系統的無鉛版本，專為高頻、高可靠性應用（包括 5G 通訊）而客製化。 LF95C 專為高達 40 GHz 的電信應用而設計，為電路設計人員和製造商提供了針對磁帶和相容導體的創新解決方案。

初始投資成本高

建立生產設施和取得專用機械來製造這些陶瓷材料需要大量的前期支出，這是 LTCC 和 HTCC 市場的主要障礙。共燒陶瓷是一個需要專門設備、無塵室空間和訓練有素的勞動力的過程，所有這些都可能導致大量的前期費用。

初始投資費用可能會成為中小企業或新市場進入者的進入壁壘，限制他們成功參與市場的能力。尤其是在競爭激烈的市場環境下，創新和增強陶瓷材料的研發 (R&D) 所需的持續支出進一步加劇了財務負擔。

原料取得有限

陶瓷製造所需的專用原料供應有限是影響 LTCC 和 HTCC 市場的另一個障礙。由於地緣政治緊張局勢、貿易限制或環境法規等因素影響採礦和開採活動，LTCC 和HTCC 配方中使用的某些重要成分（例如高純度陶瓷、導電材料和介電材料）可能面臨供應限制或可用性波動。

此外，價格波動和供應中斷等供應鏈風險可能由過度依賴少數關鍵原物料供應商的企業承擔。尋找和審查替代原料以減少這些危害的難度可能會進一步增加生產成本和交貨時間，這將損害 LTCC 和 HTCC 產品的市場競爭力。

The growing demand for innovative electronic gadgets across a range of sectors is one of the main factors propelling the LTCC and HTCC markets. Electronic components with excellent dependability, thermal stability and downsizing characteristics are becoming more and more necessary as technology develops. By making it possible to produce small and incredibly effective electronic components including capacitors, inductors, resistors and sensors, LTCC and HTCC materials offer answers to these demands.

The demand for LTCC and HTCC materials is being driven by the quick development and uptake of advanced technologies including 5G connectivity, the Internet of Things (IoT), artificial intelligence (AI) and driverless cars. Utilizing LTCC and HTCC technologies can help accomplish the increased performance, greater integration and enhanced dependability that these technologies demand from their electrical components.

Asia-Pacific is among the growing regions in the global low temperature co-fired ceramics (LTCC) and high temperature co-fired ceramic (HTCC) market covering more than 1/3rd of the market. Global demand for miniaturized electronic devices is growing across some industries, including consumer electronics, automotive, healthcare and telecommunications. The is driving growth in the markets for low-temperature co-fired ceramics and high-temperature co-fired ceramics.

Dynamics

Increasing Demand for Lighter Electronic Devices

The market for LTCC and HTCC is being stimulated by the growing need for smaller electronic devices in a variety of sectors. LTCC and HTCC materials provide distinct benefits in terms of downsizing, integration and performance as technological developments propel the creation of smaller and more potent electronic components.

Additionally, these ceramics make it possible to create small, incredibly effective electronic parts like sensors, inductors and capacitors components that are crucial for use in wearables, smartphones, wearable technology, the Internet of Things, automotive electronics and medical equipment. The market is developing because of the increasing customer desire for high-performance, lightweight and portable electronic devices, which in turn drives the adoption of LTCC and HTCC technologies.

Rapid Infrastructure Development in Telecommunications

The fast growth of the global telecommunications infrastructure, especially with the introduction of 5G networks and the rising need for high-speed data transmission, is another important factor driving the LTCC and HTCC markets. When it comes to producing the RF and microwave parts that go into telecom devices like filters, transceivers and antennas, LTCC and HTCC materials are necessary.

For instance, in 2023, Celanese introduced its Micromax LF Series Conductive Inks and the GreenTape LF95C Low-Temperature Co-fired Ceramic (LTCC) materials system at IMS 2023 in San Diego, California. LF95C, a lead-free version of the renowned GreenTape 951 system, is tailored for high-frequency, high-reliability applications, including 5G communications. Designed for telecom applications up to 40 GHz, LF95C offers circuit designers and manufacturers an innovative solution for tapes and compatible conductors.

High Initial Investment Costs

The substantial upfront expenditures involved in establishing production facilities and obtaining specialized machinery to create these ceramic materials represent a major barrier for the LTCC and HTCC markets. Co-firing ceramics is a procedure that calls for specialized equipment, clean room spaces and trained labor all of which can lead to significant upfront expenses.

The initial investment expenses might operate as a barrier to entry for small and medium-sized firms (SMEs) or new market entrants, restricting their capacity to successfully participate in the market. To further compound the financial burden, especially in a highly competitive market scenario, is the ongoing expenditure required in research and development (R&D) to innovate and enhance ceramic materials.

Limited Accessibility to Raw Materials

The restricted supply of specialized raw materials needed for ceramic manufacture is another barrier impacting the LTCC and HTCC markets. Due to factors like geopolitical tensions, trade restrictions or environmental regulations impacting mining and extraction activities, certain essential components used in LTCC and HTCC formulations, such as high-purity ceramics, conductive materials and dielectric materials, may face supply constraints or fluctuations in availability.

Additionally, supply chain risks, such as price volatility and supply interruptions, can be borne by firms that rely too heavily on a small number of suppliers for key raw materials. The difficulty of finding and vetting substitute raw materials to reduce these hazards might further raise production costs and lead times, which will hurt LTCC and HTCC goods' ability to compete in the market.

Segment Analysis

The global low temperature co-fired ceramics (LTCC) and high temperature co-fired ceramic (HTCC) market is segmented based on process, material, application, end-user and region.

Rising Demand for LTCC and HRCC in Electronics Industry

The Electronics segment is among the growing regions in the global low temperature co-fired ceramics (LTCC) and high temperature co-fired ceramic (HTCC) market covering more than 1/3rd of the market. The global market for low-temperature co-fired ceramics (LTCC) and high-temperature co-fired ceramics (HTCC) is expanding primarily due to the rise of the electronics sector.

The demand for materials with high reliability, thermal stability and miniaturization capabilities all attributes of LTCC and HTCC technologies is growing as electronic devices get smaller and more advanced. The ceramics are widely used in the production of many electronic components, including sensors, inductors, resistors and capacitors. The components are crucial parts of wearable technology, wearable computers, tablets, smartphones and other consumer and business electronics.

Geographical Penetration

Growing Demand for Electronics Industry in Asia-Pacific

Asia-Pacific has been a dominant force in the global low temperature co-fired ceramics (LTCC) and high temperature co-fired ceramic (HTCC) market. Asia-Pacific is a major growth driver for the global market for low-temperature co-fired and high-temperature co-fired ceramics because it is a hub for electronics manufacturing. Major consumer electronics, telecommunications equipment and automotive electronics producers include China, Japan, South Korea and Taiwan.

The use of LTCC and HTCC materials, which have benefits including high reliability, outstanding thermal stability and integration capabilities, is fueled by the growing need in these sectors for high-performance electronic devices and downsized electronic components. Rapid infrastructural development and advances in technology are occurring throughout Asia-Pacific, especially in aircraft, automobiles and telecommunications industries.

Additionally, advanced electrical components and packaging solutions are needed for the rollout of 5G networks, the growth of satellite communication networks and the creation of driverless cars. LTCC and HTCC technologies excel in these areas. The need for LTCC and HTCC materials is anticipated to soar as these sectors develop more, therefore driving market expansion in the region.

Moreover, the growth of the LTCC and HTCC markets in Asia-Pacific is facilitated by government programs and expenditures in research and development (R&D) to support local manufacturing capacities and technical innovation. Strong R&D ecosystems backed by educational institutions, governmental organizations and business alliances are present in nations like China, Japan and South Korea, creating a favorable atmosphere for the creation and marketing of cutting-edge ceramic materials and electronic components.

COVID-19 Impact Analysis

The global market for high-temperature co-fired (HTCC) and low-temperature co-fired (LTCC) ceramics has been impacted by the COVID-19 epidemic in some ways. At first, the epidemic caused extensive supply chain delays since industrial plants had to close temporarily to comply with lockdown procedures and protect employees. The manufacture and delivery of LTCC and HTCC materials and components were delayed as a result of this interruption, making it difficult to satisfy demand and complete obligations.

In addition, the economic recession brought on by the pandemic changed consumer spending habits and investment choices, which resulted in a decline in demand for goods and services in some industries, including healthcare, telecommunications, automotive, aerospace and the automotive industry all of which are important users of LTCC and HTCC components.

Because of the decreased orders and income streams, producers of LTCC and HTCC materials had to modify their operating plans and production capabilities to cope with the shifting market conditions. The pandemic also brought attention to how important it is to have technology like telecom infrastructure for remote work and medical equipment for remote monitoring and diagnostics that are made possible by LTCC and HTCC materials.

Russia-Ukraine War Impact Analysis

The conflict between Russia and Ukraine has substantially impacted many businesses, including the globally market for high- and low-temperature co-fired ceramics (HTCC and LTCC). The supply chain is disrupted as one direct effect, especially for components and raw materials that are obtained from the area. Due to their respective importance as manufacturers of several minerals and metals required in ceramic manufacturing, Russia and Ukraine may experience shortages and price variations in the LTCC and HTCC markets if there are any delays in their production and transportation.

In addition, geopolitical tensions have affected investor confidence and company choices by bringing uncertainty and volatility to the world's markets. Planning and forecasting may be difficult for businesses in the LTCC and HTCC supply chains as conditions change and geopolitical threats linger. The LTCC and HTCC markets' growth trajectory may be impacted soon by delays in project execution, expansion plans and investment choices brought on by this uncertainty.

Furthermore, worries about the war's wider economic effects, such as possible interruptions to the oil supply and inflationary pressures, have grown. For LTCC and HTCC producers, increased manufacturing costs might result in higher final consumer pricing due to inflation and rising energy expenses. To further complicate international company operations, geopolitical conflicts may also lead to changes in trade legislation and practices.

By Process

High-Temperature Co-fired Ceramic (HTCC)
Low-Temperature Co-fired Ceramic (LTCC)

By Material

Glass-Ceramic
Ceramic

By Application

MEMS Sensor Package
RF SiP/FEM Substrate
Frequency Device Package
Medical Equipment
Industrial Equipment
LED Chip Carrier
Others

By End-User

Automotive
Telecommunications
Aerospace and Defense
Medical
Electronics
Others

By Region

North America
- U.S.
- Canada
- Mexico
Europe
- Germany
- UK
- France
- Italy
- Russia
- Rest of Europe
South America
- Brazil
- Argentina
- Rest of South America
Asia-Pacific
- China
- India
- Japan
- Australia
- Rest of Asia-Pacific
Middle East and Africa

Key Developments

On June 12, 2023, Celanese introduced its Micromax LF Series Conductive Inks and the GreenTape LF95C Low-Temperature Co-fired Ceramic (LTCC) materials system at IMS 2023 in San Diego, California. LF95C, a lead-free version of the renowned GreenTape 951 system, is tailored for high-frequency, high-reliability applications, including 5G communications. Designed for telecom applications up to 40 GHz, LF95C offers circuit designers and manufacturers an innovative solution for tapes and compatible conductors.

Competitive Landscape

The major global players in the market include KYOCERA Corporation, Murata Manufacturing Co., Ltd, DowDuPont Inc., Heraeus Holding, KOA Corporation, Yokowo co., ltd., Micro Systems Technologies, Soar Technology Co., Ltd., NEOTech and TDK Corporation.

Why Purchase the Report?

To visualize the global low temperature co-fired ceramics (LTCC) and high temperature co-fired ceramic (HTCC) market segmentation based on process, material, application, end-user and region, as well as understand key commercial assets and players.
Identify commercial opportunities by analyzing trends and co-development.
Excel data sheet with numerous data points of low-temperature co-fired ceramics (LTCC) and high temperature co-fired ceramic (HTCC) market-level with all segments.
PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
Process mapping available as Excel consisting of key process of all the major players.

The global low temperature co-fired ceramics (LTCC) and high temperature co-fired ceramic (HTCC) market report would provide approximately 70 tables, 67 figures and 193 Pages.

Target Audience 2024

Manufacturers/ Buyers
Industry Investors/Investment Bankers
Research Professionals
Emerging Companies

1.Methodology and Scope

1.1.Research Methodology
1.2.Research Objective and Scope of the Report

2.Definition and Overview

3.Executive Summary

3.1.Snippet by Process
3.2.Snippet by Material
3.3.Snippet by Application
3.4.Snippet by End-User
3.5.Snippet by Region

4.Dynamics

4.1.Impacting Factors
- 4.1.1.Drivers
  - 4.1.1.1.Increasing Demand for Lighter Electronic Devices
  - 4.1.1.2.Rapid Infrastructure Development in Telecommunications
- 4.1.2.Restraints
  - 4.1.2.1.High Initial Investment Costs
  - 4.1.2.2.Limited Accessibility to Raw Materials
- 4.1.3.Opportunity
- 4.1.4.Impact Analysis

5.Industry Analysis

5.1.Porter's Five Force Analysis
5.2.Supply Chain Analysis
5.3.Pricing Analysis
5.4.Regulatory Analysis
5.5.Russia-Ukraine War Impact Analysis
5.6.DMI Opinion

6.COVID-19 Analysis

6.1.Analysis of COVID
- 6.1.1.Scenario Before COVID
- 6.1.2.Scenario During COVID
- 6.1.3.Scenario Post COVID
6.2.Pricing Dynamics Amid COVID
6.3.Demand-Supply Spectrum
6.4.Government Initiatives Related to the Market During Pandemic
6.5.Manufacturers Strategic Initiatives
6.6.Conclusion

7.By Process

7.1.Introduction
- 7.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 7.1.2.Market Attractiveness Index, By Process
7.2.High-Temperature Co-Fired Ceramic (HTCC)*
- 7.2.1.Introduction
- 7.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
7.3.Low-Temperature Co-Fired Ceramic (LTCC)

8.By Material

8.1.Introduction
- 8.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
- 8.1.2.Market Attractiveness Index, By Material
8.2.Glass-Ceramic*
- 8.2.1.Introduction
- 8.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
8.3.Ceramic

9.By Application

9.1.Introduction
- 9.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 9.1.2.Market Attractiveness Index, By Application
9.2.MEMS Sensor Package*
- 9.2.1.Introduction
- 9.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
9.3.RF SiP/FEM Substrate
9.4.Frequency Device Package
9.5.Medical Equipment
9.6.Industrial Equipment
9.7.LED Chip Carrier
9.8.Others

10.By End-User

10.1.Introduction
- 10.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.1.2.Market Attractiveness Index, By End-User
10.2.Automotive*
- 10.2.1.Introduction
- 10.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
10.3.Telecommunications
10.4.Aerospace and Defense
10.5.Medical
10.6.Electronics
10.7.Others

11.By Region

11.1.Introduction
- 11.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
- 11.1.2.Market Attractiveness Index, By Region
11.2.North America
- 11.2.1.Introduction
- 11.2.2.Key Region-Specific Dynamics
- 11.2.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 11.2.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
- 11.2.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.2.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.2.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.2.7.1.U.S.
  - 11.2.7.2.Canada
  - 11.2.7.3.Mexico
11.3.Europe
- 11.3.1.Introduction
- 11.3.2.Key Region-Specific Dynamics
- 11.3.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 11.3.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
- 11.3.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.3.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.3.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.3.7.1.Germany
  - 11.3.7.2.UK
  - 11.3.7.3.France
  - 11.3.7.4.Russia
  - 11.3.7.5.Spain
  - 11.3.7.6.Rest of Europe
11.4.South America
- 11.4.1.Introduction
- 11.4.2.Key Region-Specific Dynamics
- 11.4.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 11.4.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
- 11.4.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.4.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.4.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.4.7.1.Brazil
  - 11.4.7.2.Argentina
  - 11.4.7.3.Rest of South America
11.5.Asia-Pacific
- 11.5.1.Introduction
- 11.5.2.Key Region-Specific Dynamics
- 11.5.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 11.5.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
- 11.5.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.5.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.5.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.5.7.1.China
  - 11.5.7.2.India
  - 11.5.7.3.Japan
  - 11.5.7.4.Australia
  - 11.5.7.5.Rest of Asia-Pacific
11.6.Middle East and Africa
- 11.6.1.Introduction
- 11.6.2.Key Region-Specific Dynamics
- 11.6.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 11.6.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
- 11.6.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.6.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

12.Competitive Landscape

12.1.Competitive Scenario
12.2.Market Positioning/Share Analysis
12.3.Mergers and Acquisitions Analysis

13.Company Profiles

13.1.KYOCERA Corporation*
- 13.1.1.Company Overview
- 13.1.2.Process Portfolio and Description
- 13.1.3.Financial Overview
- 13.1.4.Key Developments
13.2.Murata Manufacturing Co., Ltd
13.3.DowDuPont Inc.
13.4.Heraeus Holding
13.5.KOA Corporation
13.6.Yokowo co., ltd.
13.7.Micro Systems Technologies
13.8.Soar Technology Co., Ltd.
13.9.NEOTech
13.10.TDK Corporation

LIST NOT EXHAUSTIVE