![]() |
市場調查報告書
商品編碼
1503365
到 2030 年 LTCC 和 HTCC 市場預測:按產品類型、製程類型、材料類型、應用、最終用戶和地區進行的全球分析LTCC And HTCC Market Forecasts to 2030 - Global Analysis By Product Type (Substrates, Packages and Modules), Process Type, Material Type, Application, End User and By Geography |
根據Stratistics MRC預測,2024年LTCC和HTCC的全球市場規模將達到31.4億美元,預計到2030年將達到43.4億美元,預測期內複合年成長率為5.5%。
低溫共燒陶瓷(LTCC)和高溫共燒陶瓷(HTCC)是用於電子元件生產的技術。 LTCC 使用可在 900°C 以下溫度共燒的陶瓷材料。這種方法允許將電阻器、電容器和電感器等被動元件整合在陶瓷基板內,使其適用於射頻模組和醫療設備等高頻、高密度應用。另一方面,HTCC 使用的陶瓷材料需要在 1600°C 以上的溫度下燒製。此製程通常用於需要更高熱穩定性和機械穩定性的應用,例如航太和軍用電子產品。
電子設備小型化的需求
LTCC 和 HTCC 受益於此趨勢,因為它們可以在較小的佔地面積內整合多個被動元件,使其成為智慧型手機、醫療植入和物聯網設備等小型設備的理想選擇。 LTCC 的低介電損耗和出色的熱性能也支援這些應用所需的性能和可靠性。這也包括航太、軍事和工業電子產品,其中 HTCC 出色的熱穩定性和機械穩定性至關重要。總體而言,對更小、更有效率的電子設備的推動正在加速 LTCC 和 HTCC 技術的進步和採用。
初始投資高
為這些先進陶瓷技術建立製造設施需要大量資本支出,用於專業設備、材料和熟練勞動力。這種財務障礙會阻礙中小企業(SME)進入市場並限制創新和競爭。此外,改進這些技術的研發 (R&D) 成本高昂,進一步加重了潛在投資者和製造商的負擔。結果是,擁有充足管理資源的大公司可能會壟斷市場,導致價格競爭力下降和進度延誤。
擴大通訊基礎設施
LTCC 技術受益於其處理高頻訊號的能力,使其成為 5G 網路和其他先進電訊系統中小型高效組件的理想選擇。這增加了對基於 LTCC 的濾波器、天線和模組的需求。同時,HTCC技術具有優異的熱穩定性和機械穩定性,支援高功率電訊應用,即使在惡劣條件下也能確保可靠的性能,推動市場成長。
僅提供有限的材料
高純度陶瓷或某些金屬膏等專用原料的短缺可能會導致供應鏈中斷和價格上漲,從而影響製造商滿足需求的能力。這些限制也會阻礙研究和開發,減緩創新和新產品的推出。因此,公司可能在擴大業務規模和維持有競爭力的定價方面面臨挑戰,這可能會阻礙市場成長。
COVID-19 的影響
疫情爆發導致供應鏈嚴重延誤,工廠不得不暫時關閉並保護員工。這種中斷導致 LTCC 和 HTCC 材料和組件的製造和交貨延遲,從而難以滿足需求和履行義務。此外,疫情帶來的景氣衰退改變了消費者的消費習慣和投資選擇,一些行業,如醫療保健、通訊、汽車、航太和汽車工業等,是LTCC和HTCC元件的重要用戶,這導致商品和服務需求下降。
多晶片模組市場預計在預測期內成為最大的市場
將多個半導體晶粒整合到單一封裝中的多晶片模組預計將成為預測期內最大的市場,因為它們需要先進的構裝基板來支援其緊湊性和高性能。 LTCC 和 HTCC 材料具有出色的熱穩定性、電氣性能以及與微型電子元件的兼容性,是這些基板的理想選擇。因此,在 MCM 中使用 LTCC 和 HTCC 可以增強功能、減少訊號損失並改善散熱,這對於高頻和高功率應用至關重要。
預計通訊業在預測期內的複合年成長率最高
由於LTCC技術在微波和毫米波頻段應用(例如藍牙模組、行動電話前端模組和WLAN)中的快速普及,預計通訊業的複合年成長率最高。此外,隨著各公司開發先進的 LTCC 產品,新的商機也等著。
由於該地區對基於 LTCC 的 PCB 的需求不斷成長以及無線通訊行業的崛起,預計北美將在預測期內佔據最大的市場佔有率。在歐洲,電動車產業的市場開拓是市場成長的因素。 2020年,歐洲將超越中國成為最大的電動車市場。 2020年電動車銷量為140萬輛,佔電動車總銷量的45.0%。電動車產業的成長預計將增加對汽車電子產品的需求,並對預測期內的產品需求產生正面影響。
由於印度、中國、韓國和日本等國家汽車、消費和工業電子產業的快速發展,預計亞太地區在預測期內將維持最高的複合年成長率。隨著世界各國政府實施電動車獎勵計劃,預計汽車電子產品製造商將被吸引到該地區。此外,隨著5G技術的出現,中國正在見證電力電子產業的投資,預計有助於市場成長。
According to Stratistics MRC, the Global LTCC And HTCC Market is accounted for $3.14 billion in 2024 and is expected to reach $4.34 billion by 2030 growing at a CAGR of 5.5% during the forecast period. Low-Temperature Co-fired Ceramics (LTCC) and High-Temperature Co-fired Ceramics (HTCC) are technologies used in the manufacturing of electronic components. LTCC involves the use of ceramic materials that can be co-fired at temperatures below 900°C. This method allows for the integration of passive components like resistors, capacitors, and inductors within the ceramic substrate, making it suitable for high-frequency and high-density applications, such as RF modules and medical devices. HTCC, on the other hand, uses ceramic materials that require firing at temperatures above 1600°C. This process is typically used for applications that demand higher thermal and mechanical stability, such as aerospace and military electronics.
Demand for miniaturized electronics
LTCC and HTCC benefits from this trend due to its capability to integrate multiple passive components within a small footprint, making it ideal for compact devices such as smartphones, medical implants, and IoT devices. The low dielectric loss and excellent thermal properties of LTCC also support the performance and reliability required in these applications. This includes aerospace, military, and industrial electronics, where HTCC's superior thermal and mechanical stability is essential. Overall, the push for smaller, more efficient electronic devices accelerates advancements and adoption in both LTCC and HTCC technologies
High Initial Investment
Setting up manufacturing facilities for these advanced ceramic technologies involves substantial capital expenditure on specialized equipment, materials, and skilled labor. This financial barrier can deter small and medium-sized enterprises (SMEs) from entering the market, limiting innovation and competition. Additionally, the significant costs associated with research and development (R&D) for improving these technologies further strain potential investors and manufacturers. As a result, the market can become dominated by larger companies with sufficient resources, potentially leading to less competitive pricing and slower advancements.
Telecom infrastructure expansion
LTCC technology benefits due to its capability to handle high-frequency signals, making it ideal for compact, efficient components in 5G networks and other advanced telecom systems. This drives demand for LTCC-based filters, antennas, and modules. On the other hand HTCC technology, with its superior thermal and mechanical stability, supports high-power telecom applications, ensuring reliable performance under demanding conditions propel the growth of the market.
Limited material availability
Scarcity of specialized raw materials, such as high-purity ceramics and specific metal pastes, can lead to supply chain disruptions and higher prices, affecting manufacturers' ability to meet demand. This limitation can also hinder research and development efforts, slowing innovation and the introduction of new products. Consequently, companies may face challenges in scaling their operations and maintaining competitive pricing, which can deter market growth
Covid-19 Impact
The epidemic caused extensive supply chain delays since industrial plants had to close temporarily to comply with lockdown procedures and protect employees. The manufacture and delivery of LTCC and HTCC materials and components were delayed as a result of this interruption, making it difficult to satisfy demand and complete obligations. In addition, the economic recession brought on by the pandemic changed consumer spending habits and investment choices, which resulted in a decline in demand for goods and services in some industries, including healthcare, telecommunications, automotive, aerospace and the automotive industry all of which are important users of LTCC and HTCC components.
The multi-chip modules segment is expected to be the largest during the forecast period
The multi-chip modules is expected to be the largest during the forecast period as which integrate multiple semiconductor dies into a single package, demand advanced substrates to support their compact and high-performance nature. LTCC and HTCC materials are ideal for these substrates due to their excellent thermal stability, electrical properties, and compatibility with miniaturized electronic components. Thus the use of LTCC and HTCC in MCMs enables enhanced functionality, reduced signal loss, and improved heat dissipation, which are crucial for high-frequency and high-power applications.
The telecommunications segment is expected to have the highest CAGR during the forecast period
The telecommunications segment is expected to have the highest CAGR during the forecast period due to the penetration of LTCC technology is rapidly increasing for applications in microwave and millimeter-wave frequency band in areas including Bluetooth module, front end module of mobile phones, and WLAN. Moreover, new opportunities lie ahead as various companies are developing advanced LTCC products, which are projected to benefit these companies to expand their footprint in 5G communication.
North America is projected to hold the largest market share during the forecast period attributed to the rising demand for LTCC based PCBs and the flourishing wireless communication industry in the region. In Europe, market growth is attributed to the development of the EV industry. In 2020, Europe exceeded China and became the largest EV market. With 1.4 million EVs sold, the region held a revenue share of 45.0% of EV sales in 2020. Growth in the EV industry will augment demand for auto electronics and positively influence product demand over the forecast period.
Asia Pacific is projected to hold the highest CAGR over the forecast period owing to the rapidly flourishing automotive, consumer, and industrial electronics sectors in countries such as India, China, South Korea, and Japan. The ongoing incentive schemes for EVs by governments of different countries are anticipated to attract auto-electronic product manufacturers to the region. Furthermore, with the advent of 5G technology, China is witnessing investments in its power electronics industry, which is anticipated to benefit market growth.
Key players in the market
Some of the key players in LTCC And HTCC market include ACX Corp., API Technologies, ECRI Microelectronics, Hitachi Metals Ltd, KOA Corporation, Kyocera Corporation, Maruwa Co. Ltd., Micro Systems Technologies, Murata Manufacturing Co., Ltd., NGK Spark Plug Ltd., NIKKO Company, Selmic Oy, Soar Technology Co., Ltd., TDK Corporation and Yokowo co., ltd
In June 2024, Kyocera launches new cut-off solution "KGZ" for small parts machining. In addition, there are some challenges regarding the workability of the machine, such as the need for a skilled operator to quickly and accurately replace and install inserts in a narrow space.
In June 2024, Kyocera Installs World's First*1 Fine Cordierite Ceramic Mirror for International Space Station's Experimental Optical Communications. This demonstration was conducted jointly by the National Institute of Information and Communications Technology
In June 2024, Hitachi Energy launches innovative oil-free and plug-and-play traction transformer. This plug-and-play solution is a breakthrough technology for dry-type on-board traction transformer.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.