全球 ESD 封裝市場 - 2023-2030

概述

全球ESD封裝市場在2022年達到22億美元，預計2030年將達到34億美元，2023-2030年預測期間年複合成長率為5.7%。

ESD（靜電放電）封裝市場預計將受到電子產業的重大進步和創新的推動。智慧型 ESD 解決方案已經出現，可以即時檢測和中和靜電，增強保護並提高效率。奈米技術正在利用奈米材料徹底改變 ESD 保護，在保持纖薄外形的同時提供卓越的保護。

此外，物聯網整合允許在包裝解決方案中使用智慧感測器，從而實現即時監控和警報，以確保元件始終處於安全的靜電環境中。此外，先進的 ESD 材料越來越受到關注，提供卓越的保護和長期的耐用性。這些發展對於保護敏感電子元件和適應電子產業不斷變化的需求至關重要，例如 Malaster 的 ESD 安全橡皮筋和先進 ESD 材料等產品。

在電子產業的擴張和發展的推動下，亞太地區的ESD封裝市場一直在經歷顯著的成長。中國政府於2022年宣佈到2023年將國內電子元件市場擴大至2.1兆元人民幣（3,270億美元）。其雄心勃勃的目標反映了電子產業的巨大成長潛力，而電子產業是ESD封裝市場的主要驅動力。中國政府的目標是培育15家具有全球競爭力、年銷售額100億元以上的電子元件企業。它注重競爭力，需要嚴格的品質控制和 ESD 保護，從而推動 ESD 封裝市場的發展。

動力學

半導體產業推動先進 ESD 封裝的需求

ESD 封裝市場預計將隨著全球半導體封裝產業的成長而受到推動。根據半導體產業協會預測，該產業預計將在 2024 年反彈，預計將成長 11.9%。電子元件變得越來越敏感，任何靜電放電都可能導致無法修復的損壞。因此，半導體製造商和供應商正在轉向先進的 ESD 封裝解決方案，以在儲存和運輸過程中保護其產品。

此外，半導體產業的波動和對敏感電子元件的需求推動了透過專業封裝解決方案提供有效 ESD 保護的需求。隨著半導體市場的復甦和擴大，對ESD封裝材料和解決方案的需求預計將同步成長，為ESD封裝市場提供機會，以滿足半導體產業不斷變化的需求。

永續發展推動電子產業對環保 ESD 封裝的需求

對永續性的日益重視正在推動電子產業對靜電放電包裝解決方案的需求激增。隨著環境問題和企業永續發展目標成為焦點，製造商和供應商正在尋求符合環保實踐的 ESD 包裝選項。永續的 ESD 包裝材料（通常是可生物分解或可回收的）越來越受到關注，因為它們減少了與傳統的不可生物分解材料（如泡沫和塑膠）相關的環境影響。

科德寶高性能材料公司推出了 Evolon ESD，這是一種技術包裝紡織品，旨在防止靜電放電並保護敏感表面，特別是在汽車和工業領域。 Evolon ESD 為裝飾線、儀表板、後視鏡和方向盤等組件提供保護，同時還可以防止微刮痕和絨毛污染。這種永續的解決方案有助於減少廢物，經久耐用，並由再生聚酯製成。

日益成長的環境問題

隨著日益成長的環境問題和消費者對環保包裝的偏好，特別是包裝中常用的 PET 等材料的環境影響，ESD 包裝市場可能會受到重大影響。 PET 是一種塑膠，常用於 ESD 包裝，它不可生物分解，會造成塑膠污染。 PET 和其他塑膠分解後會形成微塑膠，很容易擴散到海洋和其他水體。

此外，這些微塑膠被水生生物消耗，最終進入食物鏈，並可能透過海鮮消費到達人類。人們對環境的關注引發了有關 ESD 包裝材料的永續性和長期影響的問題，促使業界探索更環保的替代品來緩解這些環境挑戰。

目錄

第 1 章：方法與範圍

• 研究方法論
• 報告的研究目的和範圍

第 2 章：定義與概述

第 3 章：執行摘要

• 產品片段
• 按材料摘錄
• 按 ESD 分類
• 按應用片段
• 最終使用者的片段
• 按地區分類

第 4 章：動力學

• 影響因素
  • 促進要素
    • 半導體產業推動先進 ESD 封裝的需求
    • 永續發展推動電子產業對環保 ESD 封裝的需求
  • 限制
    • 日益成長的環境問題
  • 機會
  • 影響分析

第 5 章：產業分析

• 波特五力分析
• 供應鏈分析
• 定價分析
• 監管分析
• 俄羅斯-烏克蘭戰爭分析
• DMI 意見

第 6 章：COVID-19 分析

• COVID-19 分析
  • 新冠疫情爆發前的情景
  • 新冠疫情期間的情景
  • 新冠疫情後的情景
• COVID-19 期間的定價動態
• 供需譜
• 疫情期間政府與市場相關的舉措
• 製造商策略舉措
• 結論

第 7 章：依產品

• 包包
• 托盤
• 盒子和容器
• 防靜電泡沫
• 防靜電薄膜
• 其他

第 8 章：按材料

• 導電塑膠
• 金屬
• 聚乙烯（PE）
• 聚丙烯（PP）
• 聚氯乙烯
• 其他

第 9 章：依 ESD 分類

• 防靜電
• 靜電耗散
• 導電

第 10 章：按應用

• 電氣電子元件
• 裝置
• 炸藥粉
• 藥品

第 11 章：最終用戶

• 網路及電信業
• 消費性電子及電腦週邊
• 汽車產業
• 軍事與國防
• 衛生保健
• 航太
• 其他

第 12 章：按地區

• 北美洲
  • 美國
  • 加拿大
  • 墨西哥
• 歐洲
  • 德國
  • 英國
  • 法國
  • 義大利
  • 俄羅斯
  • 歐洲其他地區
• 南美洲
  • 巴西
  • 阿根廷
  • 南美洲其他地區
• 亞太
  • 中國
  • 印度
  • 日本
  • 澳洲
  • 亞太其他地區
• 中東和非洲

第13章：競爭格局

• 競爭場景
• 市場定位/佔有率分析
• 併購分析

第 14 章：公司簡介

• Nefab
• 公司簡介
• 產品組合和描述
• 財務概覽
• 主要進展
• Desco Industries, Inc.
• Protektive Pak
• Conductive Containers, Inc.
• ACL Staticide
• Teknis Limited
• Statclean Technology (S) Pte Ltd
• GWP Group
• DS Smith plc
• Sealed Air Corporation

第 15 章：附錄

Overview

Global ESD Packaging Market reached US$ 2.2 billion in 2022 and is expected to reach US$ 3.4 billion by 2030, growing with a CAGR of 5.7% during the forecast period 2023-2030.

The ESD (Electrostatic Discharge) packaging market is expected to be driven with significant advancements and innovations in the electronics industry. Smart ESD solutions have emerged, offering real-time detection and neutralization of static charges, enhancing protection and improving efficiency. Nanotechnology is revolutionizing ESD protection with nanomaterials that provide superior protection while maintaining a slim profile.

Furthermore, IoT integration allows for smart sensors in packaging solutions, enabling real-time monitoring and alerts to ensure components are always in a safe electrostatic environment. Additionally, advanced ESD materials are gaining traction, offering both superior protection and long-term durability. The developments, exemplified by products like Malaster's ESD Safe Rubber Bands and Advanced ESD Materials, are essential for safeguarding sensitive electronic components and adapting to the evolving needs of the electronics industry.

The ESD packaging market in the Asia-Pacific has been experiencing significant growth driven by the expansion and development of the electronics industry. The Chinese government in 2022 announced to expand the domestic market for electronic components to 2.1 trillion yuan (US$ 327 billion) by 2023. Its ambitious goal reflects the substantial growth potential in the electronics sector, which is a major driver of the ESD packaging market. The Chinese government aims to develop 15 globally competitive electronic components makers with annual sales of 10 billion yuan or more. It focusses on competitiveness requires stringent quality control and ESD protection, boosting the ESD packaging market.

Dynamics

Semiconductor Industry Drives Demand for Advanced ESD Packaging

The ESD packaging market is expected to be driven with the growing semiconductor packaging industry globally. According to the Semiconductor Industry Association, the industry is expected to rebound with a projected growth of 11.9% in 2024. Electronic components are becoming increasingly sensitive and any electrostatic discharge can lead to irreparable damage. As a result, semiconductor manufacturers and suppliers are turning to advanced ESD packaging solutions to safeguard their products during storage and transportation.

Furthermore, the semiconductor industry's fluctuations and demand for sensitive electronic components drive the need for effective ESD protection through specialized packaging solutions. As the semiconductor market recovers and expands, the demand for ESD packaging materials and solutions is expected to grow in tandem, providing opportunities for the ESD packaging market to cater to the evolving needs of the semiconductor sector.

Sustainability Drive Boosts Demand for Eco-Friendly ESD Packaging in Electronic

The increasing emphasis on sustainability is driving a surge in demand for electrostatic discharge packaging solutions in the electronics industry. As environmental concerns and corporate sustainability objectives take center stage, manufacturers and suppliers are seeking ESD packaging options that align with eco-friendly practices. Sustainable ESD packaging materials, often biodegradable or recyclable, are gaining traction as they reduce the environmental impact associated with traditional non-biodegradable materials like foam and plastics.

Freudenberg Performance Materials has introduced Evolon ESD, a technical packaging textile designed to prevent electrostatic discharge and safeguard sensitive surfaces, particularly in the automotive and industrial sectors. Evolon ESD offers protection for components like trim lines, dashboards, mirrors and steering wheels, while also preventing micro-scratches and lint contamination. The sustainable solution contributes to waste reduction, is long-lasting and is made from recycled polyester.

Growing Environmental Concerns

The ESD packaging market can be significantly impacted with growing environmental concerns and consumer preferences for eco-friendly packaging, particularly the environmental impact of materials like PET commonly used in packaging. PET which is a type of plastic, commonly used in ESD packaging, is not biodegradable and contributes to plastic pollution. PET and other plastics when break down, they form microplastics, which are easily spreadable in oceans and other water bodies.

Furthermore, these microplastics are consumed by aquatic life, eventually entering the food chain and potentially reaching humans through seafood consumption. It environmental concern raises questions about the sustainability and long-term impact of ESD packaging materials, prompting the industry to explore more eco-friendly alternatives to mitigate these environmental challenges.

Segment Analysis

The global ESD packaging market is segmented based on product, material, ESD classification, application, end-user and region.

ESD Bags Dominate the ESD Packaging Market with Crucial Role in Component Protection

In the ESD packaging market, bags hold the largest product type segment with a significant role in protecting sensitive electronic components and devices from electrostatic discharge. Many industries, including electronics, aerospace and medical devices, have strict ESD control requirements and standards. ESD bags are designed to meet these industry standards, ensuring compliance with regulations.

Furthermore, some ESD bags are designed to be reusable, reducing waste and environmental impact. It sustainability aspect is increasingly important in today's manufacturing and packaging practices. EcoCortec's Eco-Corr Film ESD represents a significant breakthrough in the realm of ESD packaging. It offers an eco-friendly alternative to conventional polyethylene electrostatic dissipating (ESD) films, aligning with the growing global emphasis on sustainability and reducing plastic waste.

Geographical Penetration

Asia-Pacific ESD Packaging Market Surges Alongside Electronics Industry Growth

The ESD packaging market in the Asia-Pacific has been experiencing significant growth, driven by the booming electronics industry. As per International Labour Organization report, China's electronics industry has been on a rapid growth trajectory. In 2020, the industry's value reached nearly US$ 350 billion, constituting about 25% of the global assembly value. It substantial industry size creates a strong demand for ESD packaging to protect sensitive electronic components and devices during manufacturing, storage and transportation.

Further, China consists of a substantial number of industrial enterprises in the electronics manufacturing sector. As of June 2020, there were 43,981 such enterprises in China, employing a total of 13.28 million workers. It extensive manufacturing base generates a continuous demand for ESD packaging materials and solutions to safeguard sensitive electronic products. Further more Make in India policy announced by government of India is also create=ing significant opportunities for the growth of ESD packaging market.

Competitive Landscape

The major global players in the market include: Nefab, Desco Industries, Inc., Protektive Pak, Conductive Containers, Inc., ACL Staticide, Teknis Limited, Statclean Technology (S) Pte Ltd, GWP Group, DS Smith plc and Sealed Air Corporation.

COVID-19 Impact Analysis:

The COVID-19 pandemic had a profound impact on the ESD packaging market, particularly on the electronics industry, bringing about significant changes and trends. As there was a surge in remote work, online education and increased time spent at home, people turned to electronic devices more than ever before which resulted in a booming electronics industry. Consumer habits shifted dramatically, with individuals spending increasingly more time online, which, in turn increases the demand for electronic devices.

However, there were also challenges, such as the rise of counterfeit electronics, disruptions in supply chains due to labor shortages and factory closures and the need for stringent quality control to maintain consumer trust. Despite these challenges, the electronics industry continues to thrive, with smartphones emerging as the dominating product, especially in initiatives related to COVID-19 contact tracing which the growth of ESD packaging demand at the times of pandemic.

Russia-Ukraine War Impact

The Russia-Ukraine war has a major impact on the ESD packaging market, particularly in the semiconductor sector. The immediate risk lies in the supply of specific raw materials used in semiconductor manufacturing, including neon and palladium. The materials are crucial for the production of semiconductor chips, which are integral to various electronic devices. The disruption in the semiconductor industry could significantly impact the ESD packaging market.

Furthermore, to mitigate potential supply chain disruptions, companies in the ESD packaging industry are constantly seeking alternative material sources, understanding their supply chains thoroughly, considering investments in recycling technologies and employing forward pricing strategies. The war's impact on the semiconductor supply chain underscores the importance of supply chain resilience in the industry.

By Product

• Bags
• Trays
• Boxes & Containers
• ESD Foam
• ESD Films
• Others

By Material

• Conductive Plastics
• Metal
• Polyethylene (PE)
• Polypropylene (PP)
• Polyvinyl Chloride
• Others

By ESD Classification

• Anti-Static
• Static Dissipative
• Conductive

By Application

• Electrical and Electronic Component
• Equipment
• Explosive Powder
• Drugs

By End-User

• Network and Telecommunication Industry
• Consumer Electronics & Computer Peripheral
• Automotive Industry
• Military and Defense
• Healthcare
• Aerospace
• Others

By Region

• North America
  • U.S.
  • Canada
  • Mexico

• Europe
  • Germany
  • UK
  • France
  • Italy
  • Russia
  • Rest of Europe

• South America
  • Brazil
  • Argentina
  • Rest of South America

• Asia-Pacific
  • China
  • India
  • Japan
  • Australia
  • Rest of Asia-Pacific

• Middle East and Africa

Key Developments

• In September 2023, Alpha and Omega Semiconductor (AOS) has unveiled its MRigidCSP packaging technology, aimed at enhancing battery management applications. The technology is designed to reduce on-resistance while simultaneously increasing mechanical strength. Initially, AOS is offering MRigidCSP technology on its AOCR33105E, a 12V common-drain dual N-channel MOSFET. The packaging technology is well-suited for battery applications in devices like smartphones, tablets and ultra-thin notebooks.
• In November 2022, Cortec has introduced a sustainable solution in the form of EcoSonic ESD-safe bags, addressing challenges in electronic product packaging. The bags provide ESD protection to prevent damage from static charges and incorporate bubble wrap for impact protection. What sets them apart is the integration of Nano VpCl lining, which releases corrosion-resistant compounds into the bag's internal atmosphere, forming a protective molecular-scale layer around the product. It protects against moisture and corrosion without affecting solderability.
• In May 2023, Semtech has introduced its latest Transient Voltage Suppressors (TVS) product, the RClamp0822B, designed to offer high-performance electrostatic discharge (ESD) and surge protection. The versatile circuit protection platform aims to safeguard high-speed data interfaces across various circuit interfaces in industrial, data center and telecommunication applications. The RClamp0822B, with its very-low sub 1 picofarad loading capacitance, is ideal for protecting high-speed data lines from electrical transient threats. It also provides robust surge immunity and is packaged in a user-friendly SC-75 package, making it suitable for a wide range of industrial designs

Why Purchase the Report?

• To visualize the global ESD packaging market segmentation based on product, material, ESD classification, application, end-user and region, as well as understand key commercial assets and players.
• Identify commercial opportunities by analyzing trends and co-development.
• Excel data sheet with numerous data points of microwave packaging market-level with all segments.
• PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
• Product mapping available as excel consisting of key products of all the major players.

The global ESD packaging market report would provide approximately 60 tables, 65 figures and 206 Pages.

Target Audience 2023

• Manufacturers/ Buyers
• Industry Investors/Investment Bankers
• Research Professionals
• Emerging Companies

Table of Contents

1. Methodology and Scope

• 1.1. Research Methodology
• 1.2. Research Objective and Scope of the Report

2. Definition and Overview

3. Executive Summary

• 3.1. Snippet By Product
• 3.2. Snippet By Material
• 3.3. Snippet By ESD Classification
• 3.4. Snippet By Application
• 3.5. Snippet By End-User
• 3.6. Snippet by Region

4. Dynamics

• 4.1. Impacting Factors
  • 4.1.1. Drivers
    • 4.1.1.1. Semiconductor Industry Drives Demand for Advanced ESD Packaging
    • 4.1.1.2. Sustainability Drive Boosts Demand for Eco-Friendly ESD Packaging in Electronic
  • 4.1.2. Restraints
    • 4.1.2.1. Growing Environmental Concerns
  • 4.1.3. Opportunity
  • 4.1.4. Impact Analysis

5. Industry Analysis

• 5.1. Porter's Five Force Analysis
• 5.2. Supply Chain Analysis
• 5.3. Pricing Analysis
• 5.4. Regulatory Analysis
• 5.5. Russia - Ukraine War Analysis
• 5.6. DMI Opinion

6. COVID-19 Analysis

• 6.1. Analysis of COVID-19
  • 6.1.1. Scenario Before COVID
  • 6.1.2. Scenario During COVID
  • 6.1.3. Scenario Post COVID
• 6.2. Pricing Dynamics Amid COVID-19
• 6.3. Demand-Supply Spectrum
• 6.4. Government Initiatives Related to the Market During Pandemic
• 6.5. Manufacturers Strategic Initiatives
• 6.6. Conclusion

7. By Product

• 7.1. Introduction
  • 7.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
  • 7.1.2. Market Attractiveness Index, By Product
• 7.2. Bags*
  • 7.2.1. Introduction
  • 7.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
• 7.3. Trays
• 7.4. Boxes & Containers
• 7.5. ESD Foam
• 7.6. ESD Films
• 7.7. Others

8. By Material

• 8.1. Introduction
  • 8.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
  • 8.1.2. Market Attractiveness Index, By Material
• 8.2. Conductive Plastics*
  • 8.2.1. Introduction
  • 8.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
• 8.3. Metal
• 8.4. Polyethylene (PE)
• 8.5. Polypropylene (PP)
• 8.6. Polyvinyl Chloride
• 8.7. Others

9. By ESD Classification

• 9.1. Introduction
  • 9.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By ESD Classification
  • 9.1.2. Market Attractiveness Index, By ESD Classification
• 9.2. Anti-Static*
  • 9.2.1. Introduction
  • 9.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
• 9.3. Static Dissipative
• 9.4. Conductive

10. By Application

• 10.1. Introduction
  • 10.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
  • 10.1.2. Market Attractiveness Index, By Application
• 10.2. Electrical and Electronic Component*
  • 10.2.1. Introduction
  • 10.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
• 10.3. Equipment
• 10.4. Explosive Powder
• 10.5. Drugs

11. By End-User

• 11.1. Introduction
  • 11.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
  • 11.1.2. Market Attractiveness Index, By End-User
• 11.2. Network and Telecommunication Industry*
  • 11.2.1. Introduction
  • 11.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
• 11.3. Consumer Electronics & Computer Peripheral
• 11.4. Automotive Industry
• 11.5. Military and Defense
• 11.6. Healthcare
• 11.7. Aerospace
• 11.8. Others

12. By Region

• 12.1. Introduction
  • 12.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
  • 12.1.2. Market Attractiveness Index, By Region
• 12.2. North America
  • 12.2.1. Introduction
  • 12.2.2. Key Region-Specific Dynamics
  • 12.2.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
  • 12.2.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
  • 12.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By ESD Classification
  • 12.2.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
  • 12.2.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
  • 12.2.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
    • 12.2.8.1. U.S.
    • 12.2.8.2. Canada
    • 12.2.8.3. Mexico
• 12.3. Europe
  • 12.3.1. Introduction
  • 12.3.2. Key Region-Specific Dynamics
  • 12.3.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
  • 12.3.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
  • 12.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By ESD Classification
  • 12.3.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
  • 12.3.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
  • 12.3.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
    • 12.3.8.1. Germany
    • 12.3.8.2. UK
    • 12.3.8.3. France
    • 12.3.8.4. Italy
    • 12.3.8.5. Russia
    • 12.3.8.6. Rest of Europe
• 12.4. South America
  • 12.4.1. Introduction
  • 12.4.2. Key Region-Specific Dynamics
  • 12.4.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
  • 12.4.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
  • 12.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By ESD Classification
  • 12.4.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
  • 12.4.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
  • 12.4.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
    • 12.4.8.1. Brazil
    • 12.4.8.2. Argentina
    • 12.4.8.3. Rest of South America
• 12.5. Asia-Pacific
  • 12.5.1. Introduction
  • 12.5.2. Key Region-Specific Dynamics
  • 12.5.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
  • 12.5.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
  • 12.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By ESD Classification
  • 12.5.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
  • 12.5.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
  • 12.5.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
    • 12.5.8.1. China
    • 12.5.8.2. India
    • 12.5.8.3. Japan
    • 12.5.8.4. Australia
    • 12.5.8.5. Rest of Asia-Pacific
• 12.6. Middle East and Africa
  • 12.6.1. Introduction
  • 12.6.2. Key Region-Specific Dynamics
  • 12.6.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
  • 12.6.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
  • 12.6.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By ESD Classification
  • 12.6.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
  • 12.6.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

13. Competitive Landscape

• 13.1. Competitive Scenario
• 13.2. Market Positioning/Share Analysis
• 13.3. Mergers and Acquisitions Analysis

14. Company Profiles

• 14.1. Nefab*
  • 14.1.1. Company Overview
  • 14.1.2. Product Portfolio and Description
  • 14.1.3. Financial Overview
  • 14.1.4. Key Developments
• 14.2. Desco Industries, Inc.
• 14.3. Protektive Pak
• 14.4. Conductive Containers, Inc.
• 14.5. ACL Staticide
• 14.6. Teknis Limited
• 14.7. Statclean Technology (S) Pte Ltd
• 14.8. GWP Group
• 14.9. DS Smith plc
• 14.10. Sealed Air Corporation

LIST NOT EXHAUSTIVE

15. Appendix

• 15.1. About Us and Services
• 15.2. Contact Us