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市場調查報告書
商品編碼
1681065

全球電氣和電子黏合劑市場規模研究，按產品（導熱、導電）、按應用（表面貼裝設備）和區域預測 2022-2032

Global Electrical and Electronic Adhesive Market Size Study, by Product (Thermal Conductive, Electrically Conductive), by Application (Surface-Mount Devices) and Regional Forecasts 2022-2032
出版日期: | 出版商: Bizwit Research & Consulting LLP | 英文 285 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2023 年全球電氣和電子膠合劑市場價值約為 58.1 億美元，預計在 2024-2032 年預測期內複合年成長率為 8.00%。電氣和電子產業對先進黏合劑解決方案的採用日益增多，特別是在電路組裝、半導體封裝和元件黏合領域，正在推動市場擴張。這些黏合劑以其優異的導電性、機械穩定性和耐熱性而聞名，正在日益取代傳統的焊接技術，確保電子製造中性能的提高、成本效益的提高和環境合規性。

黏合劑配方的快速創新，加上對小型化和高性能電子設備的需求激增，增強了對導熱和導電黏合劑的需求。在嚴格的RoHS和REACH法規的推動下，人們對無鉛和環保材料的偏好日益增加，進一步加速了下一代導電膠的採用。然而，材料成本高和極端條件下的性能限制等挑戰可能會抑制市場成長。儘管如此，正在進行的研發工作有望提高黏合劑的性能、可靠性和應用的多功能性，為持續擴張鋪平道路。

從區域來看，北美在市場上佔據主導地位，這得益於電子製造商的強大影響力、技術進步以及半導體領域的高研發投入。美國仍然是主要貢獻者，利用其強大的電子製造生態系統並增加軟性印刷電路板（FPCB）中導電黏合劑的部署。同時，歐洲緊隨其後，受益於對汽車電子、消費性電子和再生能源應用的日益重視。

受中國、日本、韓國和印度電子產業蓬勃發展的推動，亞太地區將在預測期內經歷最快的成長。該地區不斷擴大的半導體和消費性電子製造業，加上政府對 PCB 和微電子生產的支持力度不斷加大，預計將推動龐大的市場需求。此外，在工業化進程不斷擴大、基礎設施發展和智慧電子解決方案需求不斷成長的推動下，拉丁美洲、中東和非洲正在經歷穩步成長。

本報告包括的主要市場參與者：

  • 3M 公司
  • 漢高股份公司
  • HB Fuller 公司
  • 陶氏公司
  • 巴斯夫
  • 艾利丹尼森公司
  • 洛德公司
  • Permabond 工程膠黏劑
  • 主邦德公司
  • Aremco 產品公司
  • Panacol-Elosol 有限公司
  • DELO 工業用黏合劑
  • 派克漢尼汾公司
  • 信越化學工業株式會社
  • 博斯蒂克公司

市場的詳細細分和子細分解釋如下：

目錄

第 1 章：全球電氣和電子膠合劑市場執行摘要

  • 全球電氣及電子膠合劑市場規模及預測（2022-2032 年）
  • 區域概況
  • 節段概要
    • {按產品}
    • {按應用}
  • 主要趨勢
  • 經濟衰退的影響
  • 分析師建議與結論

第 2 章：全球電氣和電子膠合劑市場定義和研究假設

  • 研究目標
  • 市場定義
  • 研究假設
    • 包容與排斥
    • 限制
    • 供給側分析
      • 可用性
      • 基礎設施
      • 監管環境
      • 市場競爭
      • 經濟可行性（消費者的觀點）
    • 需求面分析
      • 監理框架
      • 技術進步
      • 環境考慮
      • 消費者認知與接受度
  • 估算方法
  • 研究涵蓋的年份
  • 貨幣兌換率

第 3 章：全球電氣和電子黏合劑市場動態

  • 市場促進因素
    • 先進黏合劑解決方案的採用日益增多
    • 創新黏合劑配方和監管壓力
    • 小型電子設備需求不斷成長
  • 市場挑戰
    • 材料成本高
    • 極端條件下的性能限制
  • 市場機會
    • 新興市場的擴張
    • 轉向無鉛和環保黏合劑
    • 半導體封裝和元件鍵結應用的成長

第4章：全球電氣和電子膠合劑市場產業分析

  • 波特五力模型
    • 供應商的議價能力
    • 買家的議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭對手
    • 波特五力模型的未來方法
    • 波特五力影響分析
  • PESTEL 分析
    • 政治的
    • 經濟
    • 社會的
    • 科技
    • 環境的
    • 合法的
  • 最佳投資機會
  • 最佳獲勝策略
  • 顛覆性趨勢
  • 產業專家觀點
  • 分析師建議與結論

第 5 章：全球電氣和電子膠合劑市場規模和預測：按產品 - 2022-2032 年

  • 細分儀表板
  • 全球電氣和電子黏合劑市場：{產品} 收入趨勢分析，2022 年和 2032 年（百萬美元/十億美元）
    • 熱傳導
    • 導電

第 6 章：全球電氣和電子膠合劑市場規模和預測：按應用 - 2022-2032 年

  • 細分儀表板
  • 全球電氣和電子黏合劑市場：{應用} 收入趨勢分析，2022 年和 2032 年（百萬美元/十億美元）
    • 表面貼裝元件

第 7 章：全球電氣和電子膠合劑市場規模和預測：按地區 - 2022-2032 年

  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 西班牙
    • 義大利
    • 歐洲其他地區
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 澳洲
    • 韓國
    • 亞太其他地區
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地區
  • 中東和非洲
    • 沙烏地阿拉伯
    • 南非
    • 中東和非洲其他地區

第 8 章：競爭情報

  • 重點公司 SWOT 分析
    • 3M Company
    • Henkel AG & Co. KGaA
    • HB Fuller Company
  • 頂級市場策略
  • 公司簡介
    • 3M Company
      • 關鍵訊息
      • 概述
      • 財務（取決於數據可用性）
      • 產品概述
      • 市場策略
    • Dow Inc.
    • BASF SE
    • Avery Dennison Corporation
    • Lord Corporation
    • Permabond Engineering Adhesives
    • Master Bond Inc.
    • Aremco Products Inc.
    • Panacol-Elosol GmbH
    • DELO Industrial Adhesives
    • Parker Hannifin Corporation
    • Shin-Etsu Chemical Co., Ltd.
    • Bostik SA

第9章：研究過程

  • 研究進程
    • 資料探勘
    • 分析
    • 市場評估
    • 驗證
    • 出版
  • 研究屬性
簡介目錄

The Global Electrical and Electronic Adhesive Market was valued at approximately USD 5.81 billion in 2023 and is anticipated to grow at a CAGR of 8.00% over the forecast period 2024-2032. The escalating adoption of advanced adhesive solutions in the electrical and electronics industry, particularly for circuit assembly, semiconductor packaging, and component bonding, is fueling market expansion. These adhesives, known for their superior conductivity, mechanical stability, and thermal resistance, are increasingly replacing traditional soldering techniques, ensuring enhanced performance, cost-effectiveness, and environmental compliance in electronic manufacturing.

Rapid innovations in adhesive formulations, coupled with the surging demand for miniaturized and high-performance electronic devices, are reinforcing the need for thermally conductive and electrically conductive adhesives. The increasing preference for lead-free and environmentally friendly materials, driven by stringent RoHS and REACH regulations, has further accelerated the adoption of next-generation conductive adhesives. However, challenges such as high material costs and performance limitations in extreme conditions may restrain market growth. Nonetheless, ongoing R&D efforts are poised to enhance adhesive properties, reliability, and application versatility, paving the way for sustained expansion.

Regionally, North America holds a dominant position in the market, driven by the strong presence of electronics manufacturers, technological advancements, and high R&D investments in the semiconductor sector. The United States remains a key contributor, leveraging its robust electronic manufacturing ecosystem and increasing deployment of electrically conductive adhesives in flexible printed circuit boards (FPCBs). Meanwhile, Europe follows closely, benefitting from the rising emphasis on automotive electronics, consumer electronics, and renewable energy applications.

The Asia-Pacific region is set to experience the fastest growth over the forecast period, fueled by the booming electronics industry in China, Japan, South Korea, and India. The region's expanding semiconductor and consumer electronics manufacturing sector, coupled with increasing government support for PCB and microelectronics production, is expected to drive substantial market demand. Additionally, Latin America and the Middle East & Africa are witnessing steady growth, supported by expanding industrialization, infrastructure development, and growing demand for smart electronic solutions.

Major Market Players Included in This Report:

  • 3M Company
  • Henkel AG & Co. KGaA
  • H.B. Fuller Company
  • Dow Inc.
  • BASF SE
  • Avery Dennison Corporation
  • Lord Corporation
  • Permabond Engineering Adhesives
  • Master Bond Inc.
  • Aremco Products Inc.
  • Panacol-Elosol GmbH
  • DELO Industrial Adhesives
  • Parker Hannifin Corporation
  • Shin-Etsu Chemical Co., Ltd.
  • Bostik SA

The Detailed Segments and Sub-Segments of the Market Are Explained Below:

By Product:

  • Thermal Conductive
  • Electrically Conductive

By Application:

  • Surface-Mount Devices

By Region:

North America:

  • U.S.
  • Canada

Europe:

  • UK
  • Germany
  • France
  • Spain
  • Italy
  • Rest of Europe

Asia Pacific:

  • China
  • India
  • Japan
  • Australia
  • South Korea
  • Rest of Asia Pacific

Latin America:

  • Brazil
  • Mexico
  • Rest of Latin America

Middle East & Africa:

  • Saudi Arabia
  • South Africa
  • Rest of Middle East & Africa

Years Considered for the Study:

  • Historical Year: 2022
  • Base Year: 2023
  • Forecast Period: 2024 to 2032

Key Takeaways:

  • Market estimates & forecasts for 10 years (2022-2032).
  • Annualized revenue breakdown and regional-level analysis for each market segment.
  • Detailed geographical assessment with country-level insights.
  • Competitive landscape overview with insights on major industry players.
  • Analysis of key business strategies and recommendations for future market expansion.
  • Evaluation of market structure and competition in the electrical and electronic adhesive sector.
  • Demand-side and supply-side dynamics analysis.

Table of Contents

Chapter 1. Global Electrical and Electronic Adhesive Market Executive Summary

  • 1.1. Global Electrical and Electronic Adhesive Market Size & Forecast (2022-2032)
  • 1.2. Regional Summary
  • 1.3. Segmental Summary
    • 1.3.1. {By Product}
    • 1.3.2. {By Application}
  • 1.4. Key Trends
  • 1.5. Recession Impact
  • 1.6. Analyst Recommendation & Conclusion

Chapter 2. Global Electrical and Electronic Adhesive Market Definition and Research Assumptions

  • 2.1. Research Objective
  • 2.2. Market Definition
  • 2.3. Research Assumptions
    • 2.3.1. Inclusion & Exclusion
    • 2.3.2. Limitations
    • 2.3.3. Supply Side Analysis
      • 2.3.3.1. Availability
      • 2.3.3.2. Infrastructure
      • 2.3.3.3. Regulatory Environment
      • 2.3.3.4. Market Competition
      • 2.3.3.5. Economic Viability (Consumer's Perspective)
    • 2.3.4. Demand Side Analysis
      • 2.3.4.1. Regulatory Frameworks
      • 2.3.4.2. Technological Advancements
      • 2.3.4.3. Environmental Considerations
      • 2.3.4.4. Consumer Awareness & Acceptance
  • 2.4. Estimation Methodology
  • 2.5. Years Considered for the Study
  • 2.6. Currency Conversion Rates

Chapter 3. Global Electrical and Electronic Adhesive Market Dynamics

  • 3.1. Market Drivers
    • 3.1.1. Escalating Adoption of Advanced Adhesive Solutions
    • 3.1.2. Innovative Adhesive Formulations and Regulatory Pressures
    • 3.1.3. Rising Demand for Miniaturized Electronic Devices
  • 3.2. Market Challenges
    • 3.2.1. High Material Costs
    • 3.2.2. Performance Limitations under Extreme Conditions
  • 3.3. Market Opportunities
    • 3.3.1. Expansion in Emerging Markets
    • 3.3.2. Shift towards Lead-Free and Environmentally Friendly Adhesives
    • 3.3.3. Growth in Semiconductor Packaging and Component Bonding Applications

Chapter 4. Global Electrical and Electronic Adhesive Market Industry Analysis

  • 4.1. Porter's 5 Force Model
    • 4.1.1. Bargaining Power of Suppliers
    • 4.1.2. Bargaining Power of Buyers
    • 4.1.3. Threat of New Entrants
    • 4.1.4. Threat of Substitutes
    • 4.1.5. Competitive Rivalry
    • 4.1.6. Futuristic Approach to Porter's 5 Force Model
    • 4.1.7. Porter's 5 Force Impact Analysis
  • 4.2. PESTEL Analysis
    • 4.2.1. Political
    • 4.2.2. Economical
    • 4.2.3. Social
    • 4.2.4. Technological
    • 4.2.5. Environmental
    • 4.2.6. Legal
  • 4.3. Top Investment Opportunity
  • 4.4. Top Winning Strategies
  • 4.5. Disruptive Trends
  • 4.6. Industry Expert Perspective
  • 4.7. Analyst Recommendation & Conclusion

Chapter 5. Global Electrical and Electronic Adhesive Market Size & Forecasts by Product 2022-2032

  • 5.1. Segment Dashboard
  • 5.2. Global Electrical and Electronic Adhesive Market: {Product} Revenue Trend Analysis, 2022 & 2032 (USD Million/Billion)
    • 5.2.1. Thermal Conductive
    • 5.2.2. Electrically Conductive

Chapter 6. Global Electrical and Electronic Adhesive Market Size & Forecasts by Application 2022-2032

  • 6.1. Segment Dashboard
  • 6.2. Global Electrical and Electronic Adhesive Market: {Application} Revenue Trend Analysis, 2022 & 2032 (USD Million/Billion)
    • 6.2.1. Surface-Mount Devices

Chapter 7. Global Electrical and Electronic Adhesive Market Size & Forecasts by Region 2022-2032

  • 7.1. North America Electrical and Electronic Adhesive Market
    • 7.1.1. U.S. Electrical and Electronic Adhesive Market
      • 7.1.1.1. {Product} Breakdown Size & Forecasts, 2022-2032
      • 7.1.1.2. {Application} Breakdown Size & Forecasts, 2022-2032
    • 7.1.2. Canada Electrical and Electronic Adhesive Market
  • 7.2. Europe Electrical and Electronic Adhesive Market
    • 7.2.1. UK Electrical and Electronic Adhesive Market
    • 7.2.2. Germany Electrical and Electronic Adhesive Market
    • 7.2.3. France Electrical and Electronic Adhesive Market
    • 7.2.4. Spain Electrical and Electronic Adhesive Market
    • 7.2.5. Italy Electrical and Electronic Adhesive Market
    • 7.2.6. Rest of Europe Electrical and Electronic Adhesive Market
  • 7.3. Asia Pacific Electrical and Electronic Adhesive Market
    • 7.3.1. China Electrical and Electronic Adhesive Market
    • 7.3.2. India Electrical and Electronic Adhesive Market
    • 7.3.3. Japan Electrical and Electronic Adhesive Market
    • 7.3.4. Australia Electrical and Electronic Adhesive Market
    • 7.3.5. South Korea Electrical and Electronic Adhesive Market
    • 7.3.6. Rest of Asia Pacific Electrical and Electronic Adhesive Market
  • 7.4. Latin America Electrical and Electronic Adhesive Market
    • 7.4.1. Brazil Electrical and Electronic Adhesive Market
    • 7.4.2. Mexico Electrical and Electronic Adhesive Market
    • 7.4.3. Rest of Latin America Electrical and Electronic Adhesive Market
  • 7.5. Middle East & Africa Electrical and Electronic Adhesive Market
    • 7.5.1. Saudi Arabia Electrical and Electronic Adhesive Market
    • 7.5.2. South Africa Electrical and Electronic Adhesive Market
    • 7.5.3. Rest of Middle East & Africa Electrical and Electronic Adhesive Market

Chapter 8. Competitive Intelligence

  • 8.1. Key Company SWOT Analysis
    • 8.1.1. 3M Company
    • 8.1.2. Henkel AG & Co. KGaA
    • 8.1.3. H.B. Fuller Company
  • 8.2. Top Market Strategies
  • 8.3. Company Profiles
    • 8.3.1. 3M Company
      • 8.3.1.1. Key Information
      • 8.3.1.2. Overview
      • 8.3.1.3. Financial (Subject to Data Availability)
      • 8.3.1.4. Product Summary
      • 8.3.1.5. Market Strategies
    • 8.3.2. Dow Inc.
    • 8.3.3. BASF SE
    • 8.3.4. Avery Dennison Corporation
    • 8.3.5. Lord Corporation
    • 8.3.6. Permabond Engineering Adhesives
    • 8.3.7. Master Bond Inc.
    • 8.3.8. Aremco Products Inc.
    • 8.3.9. Panacol-Elosol GmbH
    • 8.3.10. DELO Industrial Adhesives
    • 8.3.11. Parker Hannifin Corporation
    • 8.3.12. Shin-Etsu Chemical Co., Ltd.
    • 8.3.13. Bostik SA

Chapter 9. Research Process

  • 9.1. Research Process
    • 9.1.1. Data Mining
    • 9.1.2. Analysis
    • 9.1.3. Market Estimation
    • 9.1.4. Validation
    • 9.1.5. Publishing
  • 9.2. Research Attributes