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晶圓邊緣修整設備市場：全球產業分析、市場規模、市場佔有率及預測（依設備類型、晶圓尺寸、自動化程度、晶圓材質、最終用途、通路、國家及地區分類）－2026年至2033年

Wafer Edge Trimming Equipment Market, By Equipment Type, By Wafer Size, By Automation Level, By Wafer Material, By End Use, By Distribution Channel, By Country, and By Region -Global Industry Analysis, Market Size, Market Share & Forecast from 2026-2033
出版日期: | 出版商: AnalystView Market Insights | 英文 328 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2025年晶圓邊緣修整設備市值為29.807億美元，預計從2026年到2033年將以7.0%的複合年成長率成長。

晶圓邊緣修整設備是一種用於製造的工業設備，用於在特定製程後去除晶圓上不規則、有缺陷或受污染的邊緣。晶圓邊緣修整設備的組成部分包括用於夾持晶圓的卡盤、切割或研磨機以及視覺對準和清潔機。該設備控制晶圓的切割或研磨，透過修整不規則、有缺陷或受污染的邊緣，從而形成均勻的邊緣輪廓。晶圓邊緣修整設備有助於去除在光刻和沈積過程中可能導致晶圓污染和損壞的邊緣毛邊。因此，晶圓邊緣修整設備在先進節點製造、化合物半導體加工和晶圓鍵合中至關重要。

晶圓邊緣修整設備市場 - 市場動態

半導體晶圓生產的擴張正在推動市場需求。

隨著半導體晶圓產量的不斷成長，全球對先進半導體的需求日益增加，推動了晶圓邊緣修整設備市場的發展。半導體產量的成長直接影響對晶圓邊緣修整設備的需求，以提高良率、減少缺陷並最佳化製造流程。根據經合組織的數據，截至2025年12月，全球前五名半導體生產國的晶圓產能佔全球運作中的87%（數據截至2025年9月）。

報告顯示，全球晶圓產能排名前十的半導體公司約佔全球晶圓總產能的50%。展望未來晶圓產能投資，預計美國、中國、韓國、中國台北、日本、德國和新加坡將做出最大貢獻，而印度預計將在其他國家中發揮主導作用。在韓國，晶圓產能分佈高度集中在6nm至22nm製程節點，約佔80%。因此，隨著半導體生產需求的成長，對晶圓邊緣修整設備的需求也不斷上升。

晶圓邊緣修整設備市場－市場區隔分析：

全球晶圓邊緣修整設備市場按設備類型、晶圓尺寸、自動化程度、晶圓材料、最終用途、分銷管道和地區進行細分。

就設備類型而言，雷射修邊在晶圓邊緣修邊設備市場佔有重要地位。這是因為雷射修邊能夠以最小的應力實現精確切割、製程控制和材料去除，從而實現高品質的半導體晶圓加工。 2025年12月，迪斯可公司推出了三款雷射切割機：DFL7162、DFL7363和DFL7563，旨在實現高品質的半導體和晶圓雷射加工。這表明，由於對低應力精確切割的需求不斷成長，雷射修邊市場在未來幾年將蓬勃發展。

晶圓邊緣修整設備市場－區域分析

在北美，受自動化製程設備需求成長的推動，半導體產能正在擴張，技術也日趨地化。例如，根據SEMI Org預測，到2026年7月，全球半導體製造設備銷售額預計將達到創紀錄的1,659億美元，年增23.2%。晶圓和晶圓廠設備（包括晶圓加工和晶圓廠設備）的銷售額預計將在2026年成長高達23.1%，達到1439億美元，這表明對記憶體和先進邏輯裝置的投資正在增加。晶圓代工廠和邏輯元件設備的銷售額預計將成長高達18.9%，達到780億美元，這與人工智慧加速器和高效能運算所需的先進節點產能擴張密切相關。此外，預計到2028年，半導體設備總銷售額將增加至2,295億美元。因此，對半導體投資的增加正在推動北美對自動化製造設備的需求成長。

目錄

第1章：晶圓邊緣修整設備市場概述

  • 分析範圍
  • 市場估算期

第2章執行摘要

  • 市場區隔
  • 競爭考察

第3章：晶圓邊緣修整設備的主要市場趨勢

  • 市場促進因素
  • 市場限制因素
  • 市場機遇
  • 未來市場趨勢

第4章：晶圓邊緣修整設備的產業分析

  • PEST分析
  • 波特五力分析
  • 市場成長前景展望圖
  • 管理體制分析

第5章 晶圓邊緣修整設備市場：地緣政治緊張局勢加劇的影響

  • 新冠疫情的影響
  • 俄烏戰爭的影響
  • 中東衝突的影響

第6章：晶圓邊緣修整設備的市場趨勢

  • 晶圓邊緣修整設備市場佔有率分析，2025年
  • 主要製造商的細分數據
    • 對現有公司的分析
    • 新興企業分析

第7章 晶圓邊緣修整設備市場：依設備類型分類

  • 概述
    • 基於細分市場的市場佔有率分析：按設備類型
    • 化學修剪
    • 雷射修剪
    • 機械修剪

第8章 晶圓邊緣修整設備市場：依晶圓尺寸分類

  • 概述
    • 基於細分市場的市佔率分析：依晶圓尺寸
    • 200 mm
    • 300 mm
    • 450 mm

第9章 晶圓邊緣修整設備市場：依自動化程度分類

  • 概述
    • 基於細分市場的市佔率分析：依自動化程度分類
    • 全自動
    • 半自動
    • 手動的

第10章 晶圓邊緣修整設備市場：依晶圓材料分類

  • 概述
    • 基於細分市場的市場佔有率分析：按晶圓材料分類
    • 氮化鎵
    • 磷化銦
    • 矽
    • 碳化矽

第11章 晶圓邊緣修整設備市場：依最終用途分類

  • 概述
    • 基於細分市場的市佔率分析：依最終用途
    • LED
    • MEMS
      • 執行器
      • 感應器
    • 功率元件
      • 二極體元件
      • IGBT裝置
      • MOSFET元件
    • 半導體裝置
      • 類比裝置公司
      • 邏輯裝置
      • 儲存裝置
    • 太陽能電池

第12章 晶圓邊緣修整設備市場：依通路分類

  • 概述
    • 基於細分市場的市場佔有率分析：按分銷管道分類
    • 離線
    • 線上

第13章 晶圓邊緣修整設備市場：依地區分類

  • 介紹
  • 北美洲
    • 概述
    • 主要製造商：北美
    • 美國
    • 加拿大
  • 歐洲
    • 概述
    • 主要製造商：歐洲
    • 德國
    • 英國
    • 法國
    • 義大利
    • 西班牙
    • 荷蘭
    • 瑞典
    • 俄羅斯
    • 波蘭
    • 丹麥
    • 其他歐洲國家
  • 亞太地區
    • 概述
    • 主要製造商：亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲
    • 印尼
    • 泰國
    • 菲律賓
    • 台灣
    • 越南
    • 其他亞太國家
  • 拉丁美洲
    • 概述
    • 主要製造商：拉丁美洲
    • 巴西
    • 墨西哥
    • 阿根廷
    • 哥倫比亞
    • 其他拉丁美洲國家
  • 中東和非洲
    • 概述
    • 主要生產商：中東和非洲
    • 沙烏地阿拉伯
    • UAE
    • 以色列
    • 土耳其
    • 阿爾及利亞
    • 埃及
    • 伊朗
    • 卡達
    • 其他中東和非洲國家

第14章：主要供應商分析：晶圓邊緣修整設備產業

  • 競爭基準
    • 競爭對手儀錶板
    • 競爭定位
  • 公司簡介
    • Alex Machine Tools Pvt. Ltd.
    • Arnold Gruppe
    • Axus Technology
    • Daitron Incorporated
    • DISCO Corporation
    • G&N GmbH
    • Jiangsu Jinggong Semiconductor Equipment Co., Ltd.
    • JOEN LIH MACHINERY CO., LTD.
    • Komatsu NTC
    • Koyo Machinery USA, Inc.
    • SK GLASS MACHINES PVT. LTD.
    • SpeedFam Company Limited by Obara Group
    • TDG-NISSIN PRECISION MACHINERY CO., Ltd.
    • Tokyo Electron Limited
    • Tokyo Seimitsu Co., Ltd.（ACCRETECH）
    • Okamoto Machine Tool Works, Ltd.
    • Delta Electronics, Inc.
    • Engis Corporation
    • Kulicke & Soffa Industries, Inc.
    • Revasum, Inc.
    • SCREEN Holdings Co., Ltd.
    • Syagrus Systems, LLC
    • Others

第15章：AnalystView 的全景視圖

簡介目錄
Product Code: ANV7622

Wafer Edge Trimming Equipment market size was valued at US$ 2,980.7 Million in 2025, expanding at a CAGR of 7.0% from 2026 to 2033.

Wafer Edge Trimming Equipment is a kind of industrial machine used in the manufacturing industry that serves in the removal of irregular, defective, or contaminated outer edges of a wafer after certain processes. The components of an edge wafer trimming machine include the chuck where the wafer is placed, the cutting machine or grinder, and the vision alignment and cleaning machine. The edge wafer trimming machine facilitates the control of the cutting or grinding of the wafers so that a uniform edge profile is obtained by trimming the irregular, defective, or contaminated edges of the wafers. The edge wafer trimming machine aids in the elimination of edge beads that result in the problem of contamination and breaking of wafers during lithography and deposition processes. Thus, wafer edge trimming equipment is crucial in advanced node fabrication, compound semiconductor processing, and wafer-to-wafer bonding.

Wafer Edge Trimming Equipment Market- Market Dynamics

Growing semiconductor wafer production to propel market demand

Growing semiconductor wafer production is driving the Wafer Edge Trimming Equipment market because the demand for advanced semiconductors is increasing across the globe. The increase in semiconductor production volume is directly impacting the demand for wafer edge trimming equipment to improve the yield, reduce defects, and optimize manufacturing processes. In December 2025, according to the OECD, the five largest semiconductor-producing economies accounted for 87% of global in-production wafer capacity as of September 2025.

The report states that the ten largest semiconductor companies that have the highest wafer capacity account for around 50% of total global wafer capacity. In terms of upcoming wafer capacity investments, it is expected that the United States, China, Korea, Chinese Taipei, Japan, Germany, and Singapore will make the biggest contribution, while India will lead among the other countries. In Korea, wafer capacity distribution is extremely biased towards the 6 nm to below 22 nm process node range with an estimated value of 80%. Thus, increased semiconductor production demand has resulted in rising demand for wafer edge trimming equipment.

Wafer Edge Trimming Equipment Market- Segmentation Analysis:

The Global Wafer Edge Trimming Equipment market is segmented on the basis of Equipment Type, Wafer Size, Automation Level, Wafer Material, End Use, Distribution Channel, and Region.

By equipment type, laser trimming holds a key position in the Wafer Edge Trimming Equipment market because laser trimming makes it possible to strip off the materials with a precise cut, process control, and minimal stress, and engineering of high-quality wafer processing in semiconductors. In December 2025, DISCO Corporation launched three laser saws, DFL7162, DFL7363, and DFL7563, to enable high-quality laser processing of semiconductors and wafers. This shows that the market for laser trimming will flourish in coming years due to high demand for precise cutting with low stress.

Wafer Edge Trimming Equipment Market- Geographical Insights

North America is witnessing semiconductor capacity expansion and a rise in technology localization, which are caused by the growing need for automated process equipment. For instance, in July 2026, according to SEMI Org, the global sales of semiconductor manufacturing equipment will increase to a record of $165,900 million in 2026 at a year-over-year growth rate of 23.2%. The sales of the Wafer Fab Equipment, including the wafer processing and the fab facilities equipment, will grow up to 23.1% and achieve the level of $143,900 million in 2026, and it means that investments into memory and leading-edge logic will grow. The sales of the foundry and logic equipment are expected to grow up to 18.9% and achieve the level of $78,000 million, and it is connected with the build-outs of the advanced-node capacity for AI accelerators and high-performance computing. Moreover, the total sales of the semiconductor equipment are expected to increase to $229,500 million in 2028. Therefore, growing investments in semiconductors result in the increased demand for automated manufacturing equipment in North America.

Wafer Edge Trimming Equipment Market- Competitive Landscape:

The Wafers Edge Trimming Equipment market is one of the most competitive markets because it is characterized by advanced technology of processing, modern means of production, and innovative methods of processing of wafers edges for the semiconductor industry and other applications of wafer processing. Major companies operating in this market include Alex Machine Tools Pvt. Ltd., Arnold Gruppe, Axus Technology, Daitron Incorporated, Delta Electronics, Inc., DISCO Corporation, and others. In December 2025, ASM International purchased the assets and certain liabilities of Axus Holdings LLC, Axus Technology LLC, and Trojan Industries LLC from a third party unrelated to ASM International for approximately €101.8 million. This acquisition resulted in the incorporation of wafer processing techniques of Axus into the existing range of products of ASM International in the field of the semiconductor equipment market.

Recent Developments:

In September 2025, Daitron introduced their CVP-2200/3000 Wafer Edge Grinder product to ICSCRM 2025. The product features enhanced accuracy in beveling, measuring functionality as an option, and a capacity of handling wafers of sizes up to 230 mm with 330 mm in development.

In April 2025, Delta Electronics announced that its Wafer Edge Profile Measurement Equipment was SEMI E187 certified, thus making it more secure from cyber threats during the inspection and measurement of the wafer edge.

SCOPE OF THE REPORT

The scope of this report covers the market by its major segments, which include as follows:

GLOBAL WAFER EDGE TRIMMING EQUIPMENT MARKET KEY PLAYERS- DETAILED COMPETITIVE INSIGHTS

  • Alex Machine Tools Pvt. Ltd.
  • Arnold Gruppe
  • Axus Technology
  • Daitron Incorporated
  • DISCO Corporation
  • G&N GmbH
  • Jiangsu Jinggong Semiconductor Equipment Co., Ltd.
  • JOEN LIH MACHINERY CO., LTD.
  • Komatsu NTC
  • Koyo Machinery USA, Inc.
  • S. K. GLASS MACHINES PVT. LTD.
  • SpeedFam Company Limited by Obara Group
  • TDG-NISSIN PRECISION MACHINERY CO., Ltd.
  • Tokyo Electron Limited
  • Tokyo Seimitsu Co., Ltd. (ACCRETECH)
  • Okamoto Machine Tool Works, Ltd.
  • Delta Electronics, Inc.
  • Engis Corporation
  • Kulicke & Soffa Industries, Inc.
  • Revasum, Inc.
  • SCREEN Holdings Co., Ltd.
  • Syagrus Systems, LLC
  • Others

GLOBAL WAFER EDGE TRIMMING EQUIPMENT MARKET, BY EQUIPMENT TYPE- MARKET ANALYSIS, 2020 - 2033

  • Chemical Trimming
  • Laser Trimming
  • Mechanical Trimming

GLOBAL WAFER EDGE TRIMMING EQUIPMENT MARKET, BY WAFER SIZE- MARKET ANALYSIS, 2020 - 2033

  • 200 mm
  • 300 mm
  • 450 mm
  • Others

GLOBAL WAFER EDGE TRIMMING EQUIPMENT MARKET, BY AUTOMATION LEVEL- MARKET ANALYSIS, 2020 - 2033

  • Fully Automatic
  • Semi-Automatic
  • Manual

GLOBAL WAFER EDGE TRIMMING EQUIPMENT MARKET, BY WAFER MATERIAL- MARKET ANALYSIS, 2020 - 2033

  • Gallium Nitride
  • Indium Phosphide
  • Silicon
  • Silicon Carbide

GLOBAL WAFER EDGE TRIMMING EQUIPMENT MARKET, BY END USE- MARKET ANALYSIS, 2020 - 2033

  • LEDs
  • MEMS
  • Actuators
  • Sensors
  • Power Devices
  • Diode Devices
  • IGBT Devices
  • MOSFET Devices
  • Semiconductor Devices
  • Analog Devices
  • Logic Devices
  • Memory Devices
  • Solar Cells

GLOBAL WAFER EDGE TRIMMING EQUIPMENT MARKET, BY DISTRIBUTION CHANNEL- MARKET ANALYSIS, 2020 - 2033

  • Offline
  • Online

GLOBAL WAFER EDGE TRIMMING EQUIPMENT MARKET, BY REGION- MARKET ANALYSIS, 2020 - 2033

  • North America
  • U.S.
  • Canada
  • Europe
  • Germany
  • UK
  • France
  • Italy
  • Spain
  • The Netherlands
  • Sweden
  • Russia
  • Poland
  • Denmark
  • Rest of Europe
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
  • Indonesia
  • Thailand
  • Philippines
  • Taiwan
  • Vietnam
  • Rest of APAC
  • Latin America
  • Brazil
  • Mexico
  • Argentina
  • Colombia
  • Rest of LATAM
  • The Middle East and Africa
  • Saudi Arabia
  • UAE
  • Israel
  • Turkey
  • Algeria
  • Egypt
  • Iran
  • Qatar
  • Rest of MEA

Table of Contents

1. Wafer Edge Trimming Equipment Market Overview

  • 1.1. Study Scope
  • 1.2. Market Estimation Years

2. Executive Summary

  • 2.1. Market Snippet
  • 2.2. Competitive Insights

3. Wafer Edge Trimming Equipment Key Market Trends

  • 3.1. Wafer Edge Trimming Equipment Market Drivers
    • 3.1.1. Impact Analysis of Market Drivers
  • 3.2. Wafer Edge Trimming Equipment Market Restraints
    • 3.2.1. Impact Analysis of Market Restraints
  • 3.3. Wafer Edge Trimming Equipment Market Opportunities
  • 3.4. Wafer Edge Trimming Equipment Market Future Trends

4. Wafer Edge Trimming Equipment Industry Study

  • 4.1. PEST Analysis
  • 4.2. Porter's Five Forces Analysis
  • 4.3. Growth Prospect Mapping
  • 4.4. Regulatory Framework Analysis

5. Wafer Edge Trimming Equipment Market: Impact of Escalating Geopolitical Tensions

  • 5.1. Impact of COVID-19 Pandemic
  • 5.2. Impact of Russia-Ukraine War
  • 5.3. Impact of Middle East Conflicts

6. Wafer Edge Trimming Equipment Market Landscape

  • 6.1. Wafer Edge Trimming Equipment Market Share Analysis, 2025
  • 6.2. Breakdown Data, by Key Manufacturer
    • 6.2.1. Established Players' Analysis
    • 6.2.2. Emerging Players' Analysis

7. Wafer Edge Trimming Equipment Market - By Equipment Type

  • 7.1. Overview
    • 7.1.1. Segment Share Analysis, By Equipment Type, 2025 & 2033 (%)
    • 7.1.2. Chemical Trimming
    • 7.1.3. Laser Trimming
    • 7.1.4. Mechanical Trimming

8. Wafer Edge Trimming Equipment Market - By Wafer Size

  • 8.1. Overview
    • 8.1.1. Segment Share Analysis, By Wafer Size, 2025 & 2033 (%)
    • 8.1.2. 200 mm
    • 8.1.3. 300 mm
    • 8.1.4. 450 mm

9. Wafer Edge Trimming Equipment Market - By Automation Level

  • 9.1. Overview
    • 9.1.1. Segment Share Analysis, By Automation Level, 2025 & 2033 (%)
    • 9.1.2. Fully Automatic
    • 9.1.3. Semi-Automatic
    • 9.1.4. Manual

10. Wafer Edge Trimming Equipment Market - By Wafer Material

  • 10.1. Overview
    • 10.1.1. Segment Share Analysis, By Wafer Material, 2025 & 2033 (%)
    • 10.1.2. Gallium Nitride
    • 10.1.3. Indium Phosphide
    • 10.1.4. Silicon
    • 10.1.5. Silicon Carbide

11. Wafer Edge Trimming Equipment Market - By End Use

  • 11.1. Overview
    • 11.1.1. Segment Share Analysis, By End Use, 2025 & 2033 (%)
    • 11.1.2. LEDs
    • 11.1.3. MEMS
      • 11.1.3.1. Actuators
      • 11.1.3.2. Sensors
    • 11.1.4. Power Devices
      • 11.1.4.1. Diode Devices
      • 11.1.4.2. IGBT Devices
      • 11.1.4.3. MOSFET Devices
    • 11.1.5. Semiconductor Devices
      • 11.1.5.1. Analog Devices
      • 11.1.5.2. Logic Devices
      • 11.1.5.3. Memory Devices
    • 11.1.6. Solar Cells

12. Wafer Edge Trimming Equipment Market - By Distribution Channel

  • 12.1. Overview
    • 12.1.1. Segment Share Analysis, By Distribution Channel, 2025 & 2033 (%)
    • 12.1.2. Offline
    • 12.1.3. Online

13. Wafer Edge Trimming Equipment Market - By Geography

  • 13.1. Introduction
    • 13.1.1. Segment Share Analysis, By Geography, 2025 & 2033 (%)
  • 13.2. North America
    • 13.2.1. Overview
    • 13.2.2. Wafer Edge Trimming Equipment Key Manufacturers in North America
    • 13.2.3. North America Market Size and Forecast, By Country, 2020 - 2033 (US$ Million)
    • 13.2.4. North America Market Size and Forecast, By Equipment Type, 2020 - 2033 (US$ Million)
    • 13.2.5. North America Market Size and Forecast, By Wafer Size, 2020 - 2033 (US$ Million)
    • 13.2.6. North America Market Size and Forecast, By Automation Level, 2020 - 2033 (US$ Million)
    • 13.2.7. North America Market Size and Forecast, By Wafer Material, 2020 - 2033 (US$ Million)
    • 13.2.8. North America Market Size and Forecast, By End Use, 2020 - 2033 (US$ Million)
    • 13.2.9. North America Market Size and Forecast, By Distribution Channel, 2020 - 2033 (US$ Million)
    • 13.2.10. U.S.
    • 13.2.11. Canada
  • 13.3. Europe
    • 13.3.1. Overview
    • 13.3.2. Wafer Edge Trimming Equipment Key Manufacturers in Europe
    • 13.3.3. Europe Market Size and Forecast, By Country, 2020 - 2033 (US$ Million)
    • 13.3.4. Europe Market Size and Forecast, By Equipment Type, 2020 - 2033 (US$ Million)
    • 13.3.5. Europe Market Size and Forecast, By Wafer Size, 2020 - 2033 (US$ Million)
    • 13.3.6. Europe Market Size and Forecast, By Automation Level, 2020 - 2033 (US$ Million)
    • 13.3.7. Europe Market Size and Forecast, By Wafer Material, 2020 - 2033 (US$ Million)
    • 13.3.8. Europe Market Size and Forecast, By End Use, 2020 - 2033 (US$ Million)
    • 13.3.9. Europe Market Size and Forecast, By Distribution Channel, 2020 - 2033 (US$ Million)
    • 13.3.10. Germany
    • 13.3.11. UK
    • 13.3.12. France
    • 13.3.13. Italy
    • 13.3.14. Spain
    • 13.3.15. The Netherlands
    • 13.3.16. Sweden
    • 13.3.17. Russia
    • 13.3.18. Poland
    • 13.3.19. Denmark
    • 13.3.20. Rest of Europe
  • 13.4. Asia Pacific (APAC)
    • 13.4.1. Overview
    • 13.4.2. Wafer Edge Trimming Equipment Key Manufacturers in Asia Pacific
    • 13.4.3. APAC Market Size and Forecast, By Country, 2020 - 2033 (US$ Million)
    • 13.4.4. APAC Market Size and Forecast, By Equipment Type, 2020 - 2033 (US$ Million)
    • 13.4.5. APAC Market Size and Forecast, By Wafer Size, 2020 - 2033 (US$ Million)
    • 13.4.6. APAC Market Size and Forecast, By Automation Level, 2020 - 2033 (US$ Million)
    • 13.4.7. APAC Market Size and Forecast, By Wafer Material, 2020 - 2033 (US$ Million)
    • 13.4.8. APAC Market Size and Forecast, By End Use, 2020 - 2033 (US$ Million)
    • 13.4.9. APAC Market Size and Forecast, By Distribution Channel, 2020 - 2033 (US$ Million)
    • 13.4.10. China
    • 13.4.11. India
    • 13.4.12. Japan
    • 13.4.13. South Korea
    • 13.4.14. Australia
    • 13.4.15. Indonesia
    • 13.4.16. Thailand
    • 13.4.17. Philippines
    • 13.4.18. Taiwan
    • 13.4.19. Vietnam
    • 13.4.20. Rest of APAC
  • 13.5. Latin America (LATAM)
    • 13.5.1. Overview
    • 13.5.2. Wafer Edge Trimming Equipment Key Manufacturers in Latin America
    • 13.5.3. LATAM Market Size and Forecast, By Country, 2020 - 2033 (US$ Million)
    • 13.5.4. LATAM Market Size and Forecast, By Equipment Type, 2020 - 2033 (US$ Million)
    • 13.5.5. LATAM Market Size and Forecast, By Wafer Size, 2020 - 2033 (US$ Million)
    • 13.5.6. LATAM Market Size and Forecast, By Automation Level, 2020 - 2033 (US$ Million)
    • 13.5.7. LATAM Market Size and Forecast, By Wafer Material, 2020 - 2033 (US$ Million)
    • 13.5.8. LATAM Size and Forecast, By End Use, 2020 - 2033 (US$ Million)
    • 13.5.9. LATAM Size and Forecast, By Distribution Channel, 2020 - 2033 (US$ Million)
    • 13.5.10. Brazil
    • 13.5.11. Mexico
    • 13.5.12. Argentina
    • 13.5.13. Colombia
    • 13.5.14. Rest of LATAM
  • 13.6. Middle East and Africa
    • 13.6.1. Overview
    • 13.6.2. Wafer Edge Trimming Equipment Key Manufacturers in Middle East and Africa
    • 13.6.3. Middle East and Africa Market Size and Forecast, By Country, 2020 - 2033 (US$ Million)
    • 13.6.4. Middle East and Africa Market Size and Forecast, By Equipment Type, 2020 - 2033 (US$ Million)
    • 13.6.5. Middle East and Africa Market Size and Forecast, By Wafer Size, 2020 - 2033 (US$ Million)
    • 13.6.6. Middle East and Africa Market Size and Forecast, By Automation Level, 2020 - 2033 (US$ Million)
    • 13.6.7. Middle East and Africa Market Size and Forecast, By Wafer Material, 2020 - 2033 (US$ Million)
    • 13.6.8. Middle East and Africa Market Size and Forecast, By End Use, 2020 - 2033 (US$ Million)
    • 13.6.9. Middle East and Africa Market Size and Forecast, By Distribution Channel, 2020 - 2033 (US$ Million)
    • 13.6.10. Saudi Arabia
    • 13.6.11. UAE
    • 13.6.12. Israel
    • 13.6.13. Turkey
    • 13.6.14. Algeria
    • 13.6.15. Egypt
    • 13.6.16. Iran
    • 13.6.17. Qatar
    • 13.6.18. Rest of MEA

14. Key Vendor Analysis- Wafer Edge Trimming Equipment Industry

  • 14.1. Competitive Benchmarking
    • 14.1.1. Competitive Dashboard
    • 14.1.2. Competitive Positioning
  • 14.2. Company Profiles
    • 14.2.1. Alex Machine Tools Pvt. Ltd.
    • 14.2.2. Arnold Gruppe
    • 14.2.3. Axus Technology
    • 14.2.4. Daitron Incorporated
    • 14.2.5. DISCO Corporation
    • 14.2.6. G&N GmbH
    • 14.2.7. Jiangsu Jinggong Semiconductor Equipment Co., Ltd.
    • 14.2.8. JOEN LIH MACHINERY CO., LTD.
    • 14.2.9. Komatsu NTC
    • 14.2.10. Koyo Machinery USA, Inc.
    • 14.2.11. S. K. GLASS MACHINES PVT. LTD.
    • 14.2.12. SpeedFam Company Limited by Obara Group
    • 14.2.13. TDG-NISSIN PRECISION MACHINERY CO., Ltd.
    • 14.2.14. Tokyo Electron Limited
    • 14.2.15. Tokyo Seimitsu Co., Ltd. (ACCRETECH)
    • 14.2.16. Okamoto Machine Tool Works, Ltd.
    • 14.2.17. Delta Electronics, Inc.
    • 14.2.18. Engis Corporation
    • 14.2.19. Kulicke & Soffa Industries, Inc.
    • 14.2.20. Revasum, Inc.
    • 14.2.21. SCREEN Holdings Co., Ltd.
    • 14.2.22. Syagrus Systems, LLC
    • 14.2.23. Others

15. 360 Degree AnalystView

16. Appendix

  • 16.1. Research Methodology
  • 16.2. References
  • 16.3. Abbreviations
  • 16.4. Disclaimer
  • 16.5. Contact Us