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市場調查報告書
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1808862

晶圓背磨膠帶市場，按類型、晶圓尺寸、應用、最終用戶、國家和地區分類 - 2025 年至 2032 年全球行業分析、市場規模、市場佔有率及預測

Wafer Backgrinding Tape Market, By Type, By Wafer Size, By Application, By End-user, By Country, and By Region - Global Industry Analysis, Market Size, Market Share & Forecast from 2025-2032
出版日期: | 出版商: AnalystView Market Insights | 英文 377 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2024 年晶圓背磨膠帶市場規模價值 2.4512 億美元，2025 年至 2032 年的複合年成長率為 4.5%。

晶圓背面研磨膠帶市場主要圍繞半導體製造中晶圓減薄製程中使用的專用膠帶。這些膠帶可在晶圓研磨至所需厚度的過程中保護精密晶圓免受損壞和污染。晶圓背面研磨膠帶不僅具有強大的黏合力，可將晶圓牢固地固定在研磨框架上，還易於去除且不留殘留物。它們有助於保持晶圓的完整性，防止晶圓碎裂或開裂，並確保半導體裝置生產的高良率和高品質。

隨著對更小、更薄、更強大的電子設備的需求不斷成長，對高效能背磨膠帶的需求也隨之成長。這些膠帶種類繁多，包括紫外光固化和熱釋放型，以滿足不同的加工要求。半導體產業的擴張推動了市場發展，尤其是在消費性電子、汽車和電信等領域。膠帶材料和黏合劑的創新不斷提升終端用戶的性能，使製造商能夠滿足日益成長的精度和可靠性標準。總而言之，晶圓背磨膠帶是支援先進晶片製造製程的關鍵材料。

晶圓背磨膠帶市場-市場動態

先進半導體設備對超薄晶圓的需求不斷成長。

先進半導體裝置對超薄晶圓的需求不斷成長，是晶圓背磨膠帶市場的關鍵驅動力。隨著電子設備變得越來越小、越來越輕、功能越來越強大，製造商需要更薄的晶圓，以便在不影響性能的情況下適應緊湊的設計。超薄晶圓能夠實現更好的散熱性能、更佳的電氣特性，並增強智慧型手機、穿戴式裝置和物聯網設備等晶圓尺寸的靈活性。

然而，晶圓減薄會增加其脆性，使其在加工過程中更容易出現裂縫和損壞。晶圓背磨膠帶在研磨過程中起著至關重要的作用，它能夠牢固地固定這些精密的晶圓，保護它們免受機械應力和污染。這種對超薄晶圓的需求推動了背磨膠帶的創新，例如開發具有更強附著力和無殘留去除能力的膠帶。隨著半導體製造商致力於滿足這些小型化趨勢，對先進晶圓背磨膠帶的需求持續成長，從而支撐了市場的整體擴張。

晶圓背磨膠帶市場－關鍵洞察

根據我們的研究分析師的分析，預測期內（2025-2032 年）全球市場預計年複合成長率約為 4.5%

根據類型細分，預計 UV 釋放將在 2024 年佔據最大市場佔有率

根據晶圓尺寸細分，6至8吋是2024年的主要晶圓尺寸

根據應用細分，半導體製造是 2024 年的領先應用

根據最終用戶細分，消費性電子產品在 2024 年佔據領先地位

按地區分類，北美是 2024 年最大的收入來源

晶圓背磨膠帶市場-細分分析：

全球晶圓背磨膠帶市場根據類型、晶圓尺寸、應用、最終用戶和地區進行細分。

市場依類型分為兩類：UV離型膠帶和非UV離型膠帶。 UV離型膠帶在晶圓背磨膠帶市場中佔據主導地位。這種主導地位得益於其高效的離型機制，使得研磨製程後易於去除，且不會在晶圓表面留下殘留物。 UV離型膠帶能夠實現精確的晶圓減薄，這對於生產用於先進半導體和電子應用的超薄晶圓至關重要。

它們在背面研磨過程中對精密晶圓的保護性能卓越，深受追求更高良率和品質的製造商青睞。微型化和高性能電子設備需求的不斷成長，推動了該領域應用的強勁成長。

根據晶圓尺寸，市場分為三類：6吋以下、6至8吋、8吋以上。 6至8吋晶圓尺寸在晶圓背磨膠帶市場中佔據主導地位。這種主導地位源於其在半導體製造中的廣泛應用，尤其是在消費性電子產品和汽車零件領域。

這些晶圓尺寸在成本效益和生產可擴展性之間實現了平衡，使其成為量產的理想選擇。它們與各種製造工具和工藝的兼容性進一步鞏固了其領先地位。隨著對中型高性能晶片的需求持續成長，該領域保持著強勁的市場吸引力。

晶圓背磨膠帶市場-地理洞察

北美憑藉其先進的半導體產業和技術創新，在晶圓背面研磨膠帶市場中佔據強勢地位。受消費性電子產品、電動車和醫療保健設備需求成長的推動，美國在晶圓背面研磨技術的應用方面處於領先地位。加拿大和墨西哥也因製造業活動的增加而穩定成長。該地區對研發的重視，加上主要半導體製造商的佈局，推動了晶圓背面研磨膠帶解決方案的持續進步和市場擴張。

美國是晶圓背面研磨膠帶市場的中心樞紐，這得益於其先進的半導體產業和技術創新。隨著智慧型手機、穿戴式裝置和電動車等微型電子設備需求的不斷成長，晶圓背面研磨技術在美國的快速普及。這些產業需要超薄晶圓，而這需要藉助高品質的背面研磨膠帶實現精確且高效的減薄製程。此外，美國政府為支持國內半導體製造業而推出的《晶片法案》（CHIPS Act）等舉措，進一步加劇了對可靠晶圓加工材料的需求。

晶圓背磨膠帶市場-競爭格局：

晶圓背磨膠帶市場競爭激烈，由專注於創新和品質以滿足半導體行業不斷變化的需求的知名企業主導。日東電工株式會社、三井化學、琳得科株式會社、古河電工和日本電化株式會社等領先公司在研發方面投入巨資，以提高膠帶的附著力、無殘留去除性能和耐熱性，這些性能對於超薄晶圓加工至關重要。市場競爭推動環保和高性能膠帶的不斷進步，以支持永續發展趨勢。

膠帶製造商和半導體製造商之間的策略合作與夥伴關係增強了產品客製化和特定應用解決方案。地域擴張和產能提升也是關鍵的競爭策略。此外，企業透過卓越的技術支援和客戶服務脫穎而出，旨在建立長期合作關係。 AI Technology, Inc. 和 D&X Inc. 等專業利基市場的進入加劇了競爭，鼓勵了創新和成本效率。總體而言，競爭格局促進了技術的快速進步，使參與者能夠應對晶圓背面研磨的複雜性並保持市場成長。

最新動態：

2023年3月，推出全新系列環保晶圓背磨膠帶，增強半導體製造的永續性。

目錄

第1章：晶圓背磨膠帶市場概述

  • 研究範圍
  • 市場估計年限

第2章：執行摘要

  • 市場片段
    • 晶圓背磨膠帶市場片段（按類型）
    • 晶圓背磨膠帶市場片段（依晶圓尺寸）
    • 晶圓背磨膠帶市場應用片段
    • 晶圓背面研磨膠帶市場（依最終用戶）
    • 晶圓背磨膠帶市場（按國家/地區）
    • 晶圓背磨膠帶市場（按地區）
  • 競爭洞察

第3章：晶圓背磨膠帶主要市場趨勢

  • 晶圓背磨膠帶市場促進因素
    • 市場促進因素的影響分析
  • 晶圓背面研磨膠帶市場限制
    • 市場限制的影響分析
  • 晶圓背磨膠帶市場機遇
  • 晶圓背磨膠帶市場未來趨勢

第4章：晶圓背磨膠帶產業研究

  • PEST分析
  • 波特五力分析
  • 成長前景圖
  • 規範架構分析

第5章：晶圓背磨膠帶市場：地緣政治緊張局勢升級的影響

  • COVID-19 疫情的影響
  • 俄烏戰爭的影響
  • 中東衝突的影響

第6章：晶圓背磨膠帶市場格局

  • 2024年晶圓背磨膠帶市佔率分析
  • 按主要製造商分類的細分數據
    • 成熟玩家分析
    • 新興企業分析

第7章：晶圓背磨膠帶市場－依類型

  • 概述
    • 按類型分類的細分市場佔有率分析
    • 紫外線隔離膠帶
    • 非紫外線離型膠帶

第8章：晶圓背磨膠帶市場－依晶圓尺寸

  • 概述
    • 按晶圓尺寸分類的細分市場佔有率分析
    • 最大 6 英寸
    • 6到8英寸
    • 8吋以上

第9章：晶圓背磨膠帶市場－依應用

  • 概述
    • 按應用細分市場佔有率分析
    • 半導體製造
    • LED製造
    • 其他

第10章：晶圓背磨膠帶市場－依最終用戶

  • 概述
    • 按晶圓尺寸分類的細分市場佔有率分析
    • 消費性電子產品
    • 汽車電子
    • 醫療保健和醫療器械
    • 工業電子

第 11 章：晶圓背磨膠帶市場-按地區

  • 介紹
    • 按地區分類的細分市場佔有率分析
  • 北美洲
    • 概述
    • 北美晶圓背磨膠帶主要製造商
    • 北美市場規模及預測（按國家/地區）
    • 北美市場規模和預測（按類型）
    • 北美市場規模及預測（依晶圓尺寸）
    • 北美市場規模和預測（按應用）
    • 北美市場規模及預測（按最終用戶）
    • 美國
    • 加拿大
  • 歐洲
    • 概述
    • 歐洲晶圓背磨膠帶主要製造商
    • 歐洲市場規模及預測（按國家/地區）
    • 歐洲市場規模與預測（按類型）
    • 歐洲市場規模及預測（依晶圓尺寸）
    • 歐洲市場規模和預測，按應用
    • 歐洲市場規模及預測（按最終用戶）
    • 德國
    • 英國
    • 法國
    • 義大利
    • 西班牙
    • 荷蘭
    • 瑞典
    • 俄羅斯
    • 波蘭
    • 歐洲其他地區
  • 亞太地區 (APAC)
    • 概述
    • 亞太地區晶圓背磨膠帶主要製造商
    • 亞太地區市場規模及預測（依國家）
    • 亞太地區市場規模及預測（按類型）
    • 亞太地區市場規模及預測（依晶圓尺寸）
    • 亞太地區市場規模及預測（按應用）
    • 亞太地區市場規模及預測（依最終用戶）
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲
    • 印尼
    • 泰國
    • 菲律賓
    • 亞太地區其他地區
  • 拉丁美洲（LATAM）
    • 概述
    • 拉丁美洲晶圓背磨膠帶主要製造商
    • 拉丁美洲市場規模及預測（按國家/地區）
    • 拉丁美洲市場規模及預測（按類型）
    • 拉丁美洲市場規模及預測（依晶圓尺寸）
    • 拉丁美洲市場規模及預測（按應用）
    • 拉丁美洲市場規模及預測（按最終用戶）
    • 巴西
    • 墨西哥
    • 阿根廷
    • 哥倫比亞
    • 拉丁美洲其他地區
  • 中東和非洲（MEA）
    • 概述
    • 中東和非洲晶圓背磨膠帶主要製造商
    • MEA 市場規模及預測（依國家/地區）
    • MEA 市場規模和預測（按類型）
    • MEA市場規模及預測（依晶圓尺寸）
    • MEA 市場規模及預測（按應用）
    • MEA 市場規模及預測（依最終用戶）
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 以色列
    • 土耳其
    • 阿爾及利亞
    • 埃及
    • MEA 其餘地區

第12章：晶圓背磨膠帶產業主要供應商分析

  • 競爭儀錶板
    • Competitive Benchmarking
    • Competitive Positioning
  • 公司簡介
    • Mitsui Chemicals America, Inc.
    • Nitto Denko Corporation
    • Lintec Corporation
    • Furukawa Electric Co., Ltd.
    • Denka Company Limited
    • LG Chem
    • Maxell Corporation
    • D&X Inc.
    • AI Technology, Inc.
    • AMC Co., Ltd.
    • Force-One Applied Materials Inc.
    • Pantech Tape Co., Ltd.
    • Minitron Elektron GmbH
    • NEPTCO, Inc.
    • Sumitomo Bakelite Co., Ltd.
    • Ultron Systems, Inc.
    • Teraoka Seisakusho Co., Ltd.
    • DaehyunST Co., Ltd.
    • QES Group Berhad
    • Advanced Dicing Technologies Ltd.

第 13 章：360 度分析師視角

第 14 章：附錄

  • 研究方法
  • 參考
  • 縮寫
  • 免責聲明
  • 聯絡我們
簡介目錄
Product Code: ANV5516

Wafer Backgrinding Tape Market size was valued at US$ 245.12 Million in 2024, expanding at a CAGR of 4.5% from 2025 to 2032.

The Wafer Backgrinding Tape Market revolves around specialized adhesive tapes used during the wafer thinning process in semiconductor manufacturing. These tapes protect delicate wafers from damage and contamination while they are ground down to achieve the desired thickness. Wafer backgrinding tapes provide strong adhesion to hold the wafer securely on the grinding frame but also allow for easy removal without leaving residue. They help maintain wafer integrity, prevent chipping or cracking, and ensure high yield and quality in semiconductor device production.

As demand for smaller, thinner, and more powerful electronic devices grows, the need for efficient backgrinding tapes has increased. These tapes come in various types, including UV-curable and thermal release variants, to suit different processing requirements. The market is driven by the expansion of the semiconductor industry, especially in areas like consumer electronics, automotive, and telecommunications. Innovations in tape materials and adhesive End-user continue to improve performance, enabling manufacturers to meet the rising precision and reliability standards. Overall, wafer backgrinding tapes are critical materials supporting advanced chip manufacturing processes.

Wafer Backgrinding Tape Market- Market Dynamics

Rising demand for ultra-thin wafers in advanced semiconductor devices.

The rising demand for ultra-thin wafers in advanced semiconductor devices is a key driver for the wafer backgrinding tape market. As electronic devices become smaller, lighter, and more powerful, manufacturers require wafers that are thinner to fit into compact designs without compromising performance. Ultra-thin wafers enable better heat dissipation, improved electrical characteristics, and enhanced flexibility for Wafer Sizes like smartphones, wearables, and IoT devices.

However, thinning wafers increases their fragility, making them more prone to cracks and damage during processing. Wafer backgrinding tapes play a crucial role in securely holding these delicate wafers during the grinding process, protecting them from mechanical stress and contamination. This demand for ultra-thin wafers pushes innovation in backgrinding tape End-user, such as developing tapes with stronger adhesion and residue-free removal. As semiconductor manufacturers aim to meet these miniaturization trends, the need for advanced wafer backgrinding tapes continues to grow, supporting the overall expansion of the market.

Wafer Backgrinding Tape Market- Key Insights

As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 4.5% over the forecast period (2025-2032)

Based on Type segmentation, UV Release was predicted to show maximum market share in the year 2024

Based on Wafer Size segmentation, 6 to 8 inches was the leading Wafer Size in 2024

Based on Application segmentation, Semiconductor Manufacturing was the leading Application in 2024

Based on End-user segmentation, Consumer Electronics was the leading in 2024End-user

On the basis of region, North America was the leading revenue generator in 2024

Wafer Backgrinding Tape Market- Segmentation Analysis:

The Global Wafer Backgrinding Tape Market is segmented on the basis of Type, Wafer Size, Application, End-user, and Region.

The market is divided into two categories based on Type: UV Release Tape, Non-UV Release Tape. The UV Release Tape segment is the most dominant in the wafer backgrinding tape market. This dominance is due to its efficient release mechanism, which allows for easy removal after the grinding process without leaving residue on the wafer surface. UV release tapes enable precise wafer thinning, which is crucial for producing ultra-thin wafers used in advanced semiconductor and electronic applications.

Their superior performance in protecting delicate wafers during backgrinding makes them highly preferred by manufacturers aiming for higher yield and quality. This segment's strong adoption is driven by the increasing demand for miniaturized and high-performance electronic devices.

The market is divided into Three categories based on Wafer Size: Up to 6 inches, 6 to 8 inches, above 8 inches. The 6 to 8 inches wafer size segment is the most dominant in the wafer backgrinding tape market. This dominance stems from its widespread use in semiconductor manufacturing, particularly for consumer electronics and automotive components.

These wafer sizes offer a balance between cost-efficiency and production scalability, making them ideal for mass production. Their compatibility with a wide range of fabrication tools and processes further supports their leading position. As demand for mid-sized, high-performance chips continues, this segment maintains strong market traction.

Wafer Backgrinding Tape Market- Geographical Insights

North America holds a strong position in the wafer backgrinding tape market due to its advanced semiconductor industry and technological innovation. The United States leads adoption of wafer backgrinding technologies, driven by growing demand in consumer electronics, electric vehicles, and healthcare devices. Canada and Mexico are also witnessing steady growth supported by increasing manufacturing activities. The region's focus on research and development, along with the presence of major semiconductor manufacturers, fuels ongoing advancements and market expansion in wafer backgrinding tape solutions.

The United States stands as a central hub in the wafer backgrinding tape market, driven by its advanced semiconductor industry and technological innovations. The nation's rapid adoption of wafer backgrinding technologies is propelled by the escalating demand for miniaturized electronic devices, including smartphones, wearables, and electric vehicles. These sectors necessitate ultra-thin wafers, which require precise and efficient thinning processes facilitated by high-quality backgrinding tapes. Moreover, the U.S. government's initiatives to bolster domestic semiconductor manufacturing, such as the CHIPS Act, have further intensified the need for reliable wafer processing materials.

Wafer Backgrinding Tape Market- Competitive Landscape:

The wafer backgrinding tape market is highly competitive, dominated by established players focusing on innovation and quality to meet the evolving demands of the semiconductor industry. Leading companies such as Nitto Denko Corporation, Mitsui Chemicals, Lintec Corporation, Furukawa Electric, and Denka Company Limited invest significantly in research and development to improve tape adhesion, residue-free removal, and heat resistance, which are critical for ultra-thin wafer processing. The market competition drives continuous advancements in eco-friendly and high-performance tapes to support sustainability trends.

Strategic collaborations and partnerships among tape manufacturers and semiconductor fabricators enhance product customization and application-specific solutions. Geographic expansion and increased production capacities also serve as key competitive strategies. Additionally, companies differentiate themselves through superior technical support and customer service, aiming to build long-term relationships. The entry of specialized niche players such as AI Technology, Inc. and D&X Inc. intensifies competition, encouraging innovation and cost efficiency. Overall, the competitive landscape fosters rapid technological progress, enabling players to address the complexities of wafer backgrinding and sustain market growth.

Recent Developments:

In March 2023, introduced a new series of eco-friendly wafer backgrinding tapes, enhancing sustainability in semiconductor manufacturing.

SCOPE OF THE REPORT

The scope of this report covers the market by its major segments, which include as follows:

GLOBAL WAFER BACKGRINDING TAPE MARKET KEY PLAYERS- DETAILED COMPETITIVE INSIGHTS

  • Mitsui Chemicals America, Inc.
  • Nitto Denko Corporation
  • Lintec Corporation
  • Furukawa Electric Co., Ltd.
  • Denka Company Limited
  • LG Chem
  • Maxell Corporation
  • D&X Inc.
  • AI Technology, Inc.
  • AMC Co., Ltd.
  • Force-One Applied Materials Inc.
  • Pantech Tape Co., Ltd.
  • Minitron Elektron GmbH
  • NEPTCO, Inc.
  • Sumitomo Bakelite Co., Ltd.
  • Ultron Systems, Inc.
  • Teraoka Seisakusho Co., Ltd.
  • DaehyunST Co., Ltd.
  • QES Group Berhad
  • Advanced Dicing Technologies Ltd.

GLOBAL WAFER BACKGRINDING TAPE MARKET, BY TYPE- MARKET ANALYSIS, 2019 - 2032

  • UV Release Tape
  • Non-UV Release Tape

GLOBAL WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE- MARKET ANALYSIS, 2019 - 2032

  • Up to 6 inches
  • 6 to 8 inches
  • Above 8 inches

GLOBAL WAFER BACKGRINDING TAPE MARKET, BY APPLICATION- MARKET ANALYSIS, 2019 - 2032

  • Semiconductor Manufacturing
  • LED Manufacturing
  • Others

GLOBAL WAFER BACKGRINDING TAPE MARKET, BY END-USER- MARKET ANALYSIS, 2019 - 2032

  • Consumer Electronics
  • Automotive Electronics
  • Healthcare & Medical Devices
  • Industrial Electronics

GLOBAL WAFER BACKGRINDING TAPE MARKET, BY REGION- MARKET ANALYSIS, 2019 - 2032

  • North America
  • U.S.
  • Canada
  • Europe
  • Germany
  • UK
  • France
  • Italy
  • Spain
  • The Netherlands
  • Sweden
  • Russia
  • Poland
  • Rest of Europe
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
  • Indonesia
  • Thailand
  • Philippines
  • Rest of APAC
  • Latin America
  • Brazil
  • Mexico
  • Argentina
  • Colombia
  • Rest of LATAM
  • The Middle East and Africa
  • Saudi Arabia
  • UAE
  • Israel
  • Turkey
  • Algeria
  • Egypt
  • Rest of MEA

Table of Contents

1. Wafer Backgrinding Tape Market Overview

  • 1.1. Study Scope
  • 1.2. Market Estimation Years

2. Executive Summary

  • 2.1. Market Snippet
    • 2.1.1. Wafer Backgrinding Tape Market Snippet by Type
    • 2.1.2. Wafer Backgrinding Tape Market Snippet by Wafer Size
    • 2.1.3. Wafer Backgrinding Tape Market Snippet by Application
    • 2.1.4. Wafer Backgrinding Tape Market Snippet by End-user
    • 2.1.5. Wafer Backgrinding Tape Market Snippet by Country
    • 2.1.6. Wafer Backgrinding Tape Market Snippet by Region
  • 2.2. Competitive Insights

3. Wafer Backgrinding Tape Key Market Trends

  • 3.1. Wafer Backgrinding Tape Market Drivers
    • 3.1.1. Impact Analysis of Market Drivers
  • 3.2. Wafer Backgrinding Tape Market Restraints
    • 3.2.1. Impact Analysis of Market Restraints
  • 3.3. Wafer Backgrinding Tape Market Opportunities
  • 3.4. Wafer Backgrinding Tape Market Future Trends

4. Wafer Backgrinding Tape Industry Study

  • 4.1. PEST Analysis
  • 4.2. Porter's Five Forces Analysis
  • 4.3. Growth Prospect Mapping
  • 4.4. Regulatory Framework Analysis

5. Wafer Backgrinding Tape Market: Impact of Escalating Geopolitical Tensions

  • 5.1. Impact of COVID-19 Pandemic
  • 5.2. Impact of Russia-Ukraine War
  • 5.3. Impact of Middle East Conflicts

6. Wafer Backgrinding Tape Market Landscape

  • 6.1. Wafer Backgrinding Tape Market Share Analysis, 2024
  • 6.2. Breakdown Data, by Key Manufacturer
    • 6.2.1. Established Players' Analysis
    • 6.2.2. Emerging Players' Analysis

7. Wafer Backgrinding Tape Market - By Type

  • 7.1. Overview
    • 7.1.1. Segment Share Analysis, By Type, 2024 & 2032 (%)
    • 7.1.2. UV Release Tape
    • 7.1.3. Non-UV Release Tape

8. Wafer Backgrinding Tape Market - By Wafer Size

  • 8.1. Overview
    • 8.1.1. Segment Share Analysis, By Wafer Size, 2024 & 2032 (%)
    • 8.1.2. Up to 6 inches
    • 8.1.3. 6 to 8 inches
    • 8.1.4. Above 8 inches

9. Wafer Backgrinding Tape Market - By Application

  • 9.1. Overview
    • 9.1.1. Segment Share Analysis, By Application, 2024 & 2032 (%)
    • 9.1.2. Semiconductor Manufacturing
    • 9.1.3. LED Manufacturing
    • 9.1.4. Others

10. Wafer Backgrinding Tape Market - By End-user

  • 10.1. Overview
    • 10.1.1. Segment Share Analysis, By Wafer Size, 2024 & 2032 (%)
    • 10.1.2. Consumer Electronics
    • 10.1.3. Automotive Electronics
    • 10.1.4. Healthcare & Medical Devices
    • 10.1.5. Industrial Electronics

11. Wafer Backgrinding Tape Market- By Geography

  • 11.1. Introduction
    • 11.1.1. Segment Share Analysis, By Geography, 2024 & 2032 (%)
  • 11.2. North America
    • 11.2.1. Overview
    • 11.2.2. Wafer Backgrinding Tape Key Manufacturers in North America
    • 11.2.3. North America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.2.4. North America Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.2.5. North America Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
    • 11.2.6. North America Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 11.2.7. North America Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.2.8. U.S.
      • 11.2.8.1. Overview
      • 11.2.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.2.8.3. U.S. Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.2.8.4. U.S. Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.2.8.5. U.S. Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.2.8.6. U.S. Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.2.9. Canada
      • 11.2.9.1. Overview
      • 11.2.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.2.9.3. Canada Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.2.9.4. Canada Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.2.9.5. Canada Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.2.9.6. Canada Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 11.3. Europe
    • 11.3.1. Overview
    • 11.3.2. Wafer Backgrinding Tape Key Manufacturers in Europe
    • 11.3.3. Europe Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.3.4. Europe Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.3.5. Europe Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
    • 11.3.6. Europe Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 11.3.7. Europe Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.8. Germany
      • 11.3.8.1. Overview
      • 11.3.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.8.3. Germany Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.8.4. Germany Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.8.5. Germany Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.8.6. Germany Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.9. UK
      • 11.3.9.1. Overview
      • 11.3.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.9.3. UK Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.9.4. UK Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.9.5. UK Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.9.6. UK Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.10. France
      • 11.3.10.1. Overview
      • 11.3.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.10.3. France Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.10.4. France Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.10.5. France Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.10.6. France Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.11. Italy
      • 11.3.11.1. Overview
      • 11.3.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.11.3. Italy Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.11.4. Italy Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.11.5. Italy Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.11.6. Italy Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.12. Spain
      • 11.3.12.1. Overview
      • 11.3.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.12.3. Spain Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.12.4. Spain Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.12.5. Spain Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.12.6. Spain Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.13. The Netherlands
      • 11.3.13.1. Overview
      • 11.3.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.13.3. The Netherlands Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.13.4. The Netherlands Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.13.5. The Netherlands Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.13.6. The Netherlands Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.14. Sweden
      • 11.3.14.1. Overview
      • 11.3.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.14.3. Sweden Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.14.4. Sweden Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.14.5. Sweden Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.14.6. Sweden Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.15. Russia
      • 11.3.15.1. Overview
      • 11.3.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.15.3. Russia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.15.4. Russia Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.15.5. Russia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.15.6. Russia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.16. Poland
      • 11.3.16.1. Overview
      • 11.3.16.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.16.3. Poland Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.16.4. Poland Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.16.5. Poland Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.16.6. Poland Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.17. Rest of Europe
      • 11.3.17.1. Overview
      • 11.3.17.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.17.3. Rest of the Europe Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.17.4. Rest of the Europe Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.17.5. Rest of the Europe Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.17.6. Rest of the Europe Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 11.4. Asia Pacific (APAC)
    • 11.4.1. Overview
    • 11.4.2. Wafer Backgrinding Tape Key Manufacturers in Asia Pacific
    • 11.4.3. APAC Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.4.4. APAC Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.4.5. APAC Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
    • 11.4.6. APAC Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 11.4.7. APAC Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.4.8. China
      • 11.4.8.1. Overview
      • 11.4.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.8.3. China Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.8.4. China Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.4.8.5. China Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.4.8.6. China Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.4.9. India
      • 11.4.9.1. Overview
      • 11.4.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.9.3. India Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.9.4. India Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.4.9.5. India Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.4.9.6. India Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.4.10. Japan
      • 11.4.10.1. Overview
      • 11.4.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.10.3. Japan Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.10.4. Japan Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.4.10.5. Japan Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.4.10.6. Japan Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.4.11. South Korea
      • 11.4.11.1. Overview
      • 11.4.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.11.3. South Korea Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.11.4. South Korea Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.4.11.5. South Korea Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.4.11.6. South Korea Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.4.12. Australia
      • 11.4.12.1. Overview
      • 11.4.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.12.3. Australia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.12.4. Australia Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.4.12.5. Australia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.4.12.6. Australia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.4.13. Indonesia
      • 11.4.13.1. Overview
      • 11.4.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.13.3. Indonesia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.13.4. Indonesia Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.4.13.5. Indonesia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.4.13.6. Indonesia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.4.14. Thailand
      • 11.4.14.1. Overview
      • 11.4.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.14.3. Thailand Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.14.4. Thailand Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.4.14.5. Thailand Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.4.14.6. Thailand Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.4.15. Philippines
      • 11.4.15.1. Overview
      • 11.4.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.15.3. Philippines Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.15.4. Philippines Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.4.15.5. Philippines Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.4.15.6. Philippines Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.4.16. Rest of APAC
      • 11.4.16.1. Overview
      • 11.4.16.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.16.3. Rest of APAC Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.16.4. Rest of APAC Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.4.16.5. Rest of APAC Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.4.16.6. Rest of APAC Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 11.5. Latin America (LATAM)
    • 11.5.1. Overview
    • 11.5.2. Wafer Backgrinding Tape Key Manufacturers in Latin America
    • 11.5.3. LATAM Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.5.4. LATAM Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.5.5. LATAM Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
    • 11.5.6. LATAM Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 11.5.7. LATAM Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.5.8. Brazil
      • 11.5.8.1. Overview
      • 11.5.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.8.3. Brazil Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.8.4. Brazil Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.5.8.5. Brazil Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.5.8.6. Brazil Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.5.9. Mexico
      • 11.5.9.1. Overview
      • 11.5.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.9.3. Mexico Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.9.4. Mexico Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.5.9.5. Mexico Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.5.9.6. Mexico Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.5.10. Argentina
      • 11.5.10.1. Overview
      • 11.5.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.10.3. Argentina Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.10.4. Argentina Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.5.10.5. Argentina Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.5.10.6. Argentina Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.5.11. Colombia
      • 11.5.11.1. Overview
      • 11.5.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.11.3. Colombia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.11.4. Colombia Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.5.11.5. Colombia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.5.11.6. Colombia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.5.12. Rest of LATAM
      • 11.5.12.1. Overview
      • 11.5.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.12.3. Rest of LATAM Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.12.4. Rest of LATAM Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.5.12.5. Rest of LATAM Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.5.12.6. Rest of LATAM Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 11.6. Middle East and Africa (MEA)
    • 11.6.1. Overview
    • 11.6.2. Wafer Backgrinding Tape Key Manufacturers in Middle East and Africa
    • 11.6.3. MEA Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.6.4. MEA Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.6.5. MEA Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
    • 11.6.6. MEA Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 11.6.7. MEA Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.6.8. Saudi Arabia
      • 11.6.8.1. Overview
      • 11.6.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.8.3. Saudi Arabia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.8.4. Saudi Arabia Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.6.8.5. Saudi Arabia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.6.8.6. Saudi Arabia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.6.9. United Arab Emirates
      • 11.6.9.1. Overview
      • 11.6.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.9.3. United Arab Emirates Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.9.4. United Arab Emirates Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.6.9.5. United Arab Emirates Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.6.9.6. United Arab Emirates Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.6.10. Israel
      • 11.6.10.1. Overview
      • 11.6.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.10.3. Israel Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.10.4. Israel Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.6.10.5. Israel Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.6.10.6. Israel Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.6.11. Turkey
      • 11.6.11.1. Overview
      • 11.6.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.11.3. Turkey Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.11.4. Turkey Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.6.11.5. Turkey Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.6.11.6. Turkey Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.6.12. Algeria
      • 11.6.12.1. Overview
      • 11.6.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.12.3. Algeria Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.12.4. Algeria Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.6.12.5. Algeria Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.6.12.6. Algeria Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.6.13. Egypt
      • 11.6.13.1. Overview
      • 11.6.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.13.3. Egypt Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.13.4. Egypt Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.6.13.5. Egypt Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.6.13.6. Egypt Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.6.14. Rest of MEA
      • 11.6.14.1. Overview
      • 11.6.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.14.3. Rest of MEA Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.14.4. Rest of MEA Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.6.14.5. Rest of MEA Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.6.14.6. Rest of MEA Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)

12. Key Vendor Analysis- Wafer Backgrinding Tape Industry

  • 12.1. Competitive Dashboard
    • 12.1.1. Competitive Benchmarking
    • 12.1.2. Competitive Positioning
  • 12.2. Company Profiles
    • 12.2.1. Mitsui Chemicals America, Inc.
    • 12.2.2. Nitto Denko Corporation
    • 12.2.3. Lintec Corporation
    • 12.2.4. Furukawa Electric Co., Ltd.
    • 12.2.5. Denka Company Limited
    • 12.2.6. LG Chem
    • 12.2.7. Maxell Corporation
    • 12.2.8. D&X Inc.
    • 12.2.9. AI Technology, Inc.
    • 12.2.10. AMC Co., Ltd.
    • 12.2.11. Force-One Applied Materials Inc.
    • 12.2.12. Pantech Tape Co., Ltd.
    • 12.2.13. Minitron Elektron GmbH
    • 12.2.14. NEPTCO, Inc.
    • 12.2.15. Sumitomo Bakelite Co., Ltd.
    • 12.2.16. Ultron Systems, Inc.
    • 12.2.17. Teraoka Seisakusho Co., Ltd.
    • 12.2.18. DaehyunST Co., Ltd.
    • 12.2.19. QES Group Berhad
    • 12.2.20. Advanced Dicing Technologies Ltd.

13. 360 Degree AnalystView

14. Appendix

  • 14.1. Research Methodology
  • 14.2. References
  • 14.3. Abbreviations
  • 14.4. Disclaimer
  • 14.5. Contact Us