切割和背磨膠帶市場－全球產業規模、佔有率、趨勢、機會和預測（按類型、材料、應用、地區和競爭細分，2020-2030 年預測）

2024 年全球切割和背磨膠帶市場價值為 21.2 億美元，預計到 2030 年將達到 31.6 億美元，預測期內複合年成長率為 6.73%。

切割和背面研磨膠帶市場是指半導體製造行業內的專業領域，提供晶圓加工階段使用的膠帶，特別是在切割（將晶圓切割成單個半導體晶片的過程）和背面研磨（將晶圓減薄以適應緊湊電子設備的過程）期間。這些膠帶在保護晶圓表面和內部電路免受高精度切割和減薄操作過程中造成的污染、機械應力和損壞方面發揮關鍵作用。它們提供臨時黏合力，可承受熱應力和機械應力，同時確保後處理過程中清潔、無殘留的去除。市面上有各種類型的膠帶，根據材料成分、黏合強度、可移除性以及與矽、砷化鎵和碳化矽等晶圓類型的兼容性而有所區別。

由於半導體製造技術的快速進步和晶片設計日益複雜，預計切割和背磨膠帶市場將在未來幾年顯著成長。人們對智慧型手機、穿戴式科技、平板電腦和汽車電子產品等更小、更薄、更強大的電子設備的需求不斷成長，加速了對先進晶圓加工解決方案的需求。隨著晶片設計越來越緊湊、密度越來越高，半導體製造商必須更積極地減薄晶圓，並以更高的精度切割晶圓，從而增加了對高性能保護膠帶的依賴。

此外，電動車、5G 基礎設施和高功率電子產品中複合半導體的日益普及，也推動了對能夠處理脆性材料的專用切割和背面研磨膠帶的需求。全球各地政府的獎勵措施和私人對新半導體製造設施的投資也刺激了對這些消耗品的需求。此外，向晶圓級封裝和3D堆疊等先進封裝技術的轉變進一步加強了晶圓保護材料在後端半導體製程的重要性。

關鍵市場促進因素

對小型電子設備的需求不斷成長

主要市場挑戰

不同基材的複雜黏合和脫黏要求

主要市場趨勢

基礎設施和建築業需求不斷成長

目錄

第 1 章：產品概述

第2章：研究方法

第3章：執行摘要

第4章：顧客之聲

第5章：全球切割與背磨膠帶市場展望

• 市場規模和預測
  • 按價值
• 市場佔有率和預測
  • 按類型（切割膠帶、背面研磨膠帶）
  • 依材料（聚烯烴、聚氯乙烯（PVC）、聚對苯二甲酸乙二酯（PET）、其他）
  • 按應用（記憶體、邏輯、MEMS、CMOS影像感測器、電源設備、其他）
  • 按地區（北美、歐洲、南美、中東和非洲、亞太地區）
• 按公司分類（2024）
• 市場地圖

第6章：北美切割與背磨膠帶市場展望

• 市場規模和預測
• 市場佔有率和預測
• 北美：國家分析
  • 美國
  • 加拿大
  • 墨西哥

第7章：歐洲切割與背面研磨膠帶市場展望

• 市場規模和預測
• 市場佔有率和預測
• 歐洲：國家分析
  • 德國
  • 法國
  • 英國
  • 義大利
  • 西班牙

第8章：亞太地區切割與背面研磨膠帶市場展望

• 市場規模和預測
• 市場佔有率和預測
• 亞太地區：國家分析
  • 中國
  • 印度
  • 日本
  • 韓國
  • 澳洲

第9章：中東和非洲切割和背磨膠帶市場展望

• 市場規模和預測
• 市場佔有率和預測
• 中東和非洲：國家分析
  • 沙烏地阿拉伯
  • 阿拉伯聯合大公國
  • 南非

第10章：南美洲切割與背磨膠帶市場展望

• 市場規模和預測
• 市場佔有率和預測
• 南美洲：國家分析
  • 巴西
  • 哥倫比亞
  • 阿根廷

第 11 章：市場動態

• 驅動程式
• 挑戰

第 12 章：市場趨勢與發展

• 合併與收購（如有）
• 產品發布（如有）
• 最新動態

第13章：公司簡介

• 3M Company
• Nitto Denko Corporation
• Tesa SE.
• Lintec Corporation
• Dow Inc.
• Semiconductor Equipment Corporation.
• Kyocera Corporation
• Singamas Container Industry Company Limited
• Mitsui Chemicals, Inc
• Fujifilm Corporation.

第 14 章：策略建議

第15章調查會社について,免責事項

The Global Dicing & Backgrinding Tapes Market was valued at USD 2.12 Billion in 2024 and is expected to reach USD 3.16 Billion by 2030 with a CAGR of 6.73% during the forecast period.

The Dicing & Backgrinding Tapes Market refers to the specialized segment within the semiconductor manufacturing industry that provides adhesive tapes used during wafer processing stages, specifically during dicing (the process of cutting wafers into individual semiconductor chips) and backgrinding (the process of thinning wafers to fit into compact electronic devices). These tapes play a critical role in protecting wafer surfaces and internal circuitry from contamination, mechanical stress, and damage caused during high-precision cutting and thinning operations. They offer temporary adhesion and are designed to endure thermal and mechanical stress while ensuring clean and residue-free removal post-processing. The market includes various types of tapes differentiated by material composition, adhesive strength, removability, and compatibility with wafer types including silicon, gallium arsenide, and silicon carbide.

The Dicing & Backgrinding Tapes Market is expected to witness significant growth in the coming years due to the rapid advancements in semiconductor manufacturing technologies and the increasing complexity of chip design. The rising demand for smaller, thinner, and more powerful electronic devices such as smartphones, wearable technology, tablets, and automotive electronics is accelerating the need for advanced wafer processing solutions. As chips are designed to fit into compact and high-density form factors, semiconductor manufacturers must thin wafers more aggressively and cut them with greater precision, thus increasing the reliance on high-performance protective tapes.

Additionally, the growing adoption of compound semiconductors in electric vehicles, 5G infrastructure, and high-power electronics is pushing the need for specialized dicing & backgrinding tapes that can handle brittle materials. Government incentives and private investments in new semiconductor fabrication facilities around the globe are also fueling demand for these consumables. Moreover, the shift toward advanced packaging technologies such as wafer-level packaging and 3D stacking further reinforces the importance of wafer protection materials in backend semiconductor processes.

Key Market Drivers

Growing Demand for Miniaturized Electronic Devices

The relentless trend toward the miniaturization of electronic components and devices has created an urgent and sustained demand for precision semiconductor packaging solutions, which directly benefits the Dicing & Backgrinding Tapes Market. In the consumer electronics sector, devices such as smartphones, smartwatches, tablets, and wireless earbuds are being engineered with more compact and lightweight designs while increasing the density and complexity of their internal components.

This transformation necessitates thinner semiconductor wafers and ultra-fine dicing processes, thereby enhancing the requirement for advanced dicing and backgrinding tapes that can protect delicate wafer surfaces from mechanical stress, contamination, and damage during processing. Moreover, as device form factors shrink, the need for wafer-thinning increases, a process where backgrinding tapes play a critical role by providing temporary surface protection. These tapes must adhere uniformly, endure thermal cycling, and peel off cleanly without leaving residues, contributing to high manufacturing yields and reliability. Industries like automotive electronics, which are adopting advanced driver-assistance systems and electric powertrains, are also integrating compact integrated circuits and system-on-chip solutions, all of which require precision wafer handling supported by high-performance tapes. As the average node size decreases across foundries and fabrication plants worldwide, the Dicing & Backgrinding Tapes Market is expected to flourish by catering to the critical needs of wafer integrity and performance assurance throughout the backend manufacturing stages.

Key Market Challenges

Complex Adhesion and Debonding Requirements Across Varied Substrate Materials

One of the most significant challenges facing the Dicing & Backgrinding Tapes Market lies in the complexity of meeting diverse adhesion and debonding requirements for a wide array of substrate materials used in semiconductor fabrication. As the semiconductor industry progresses toward integrating a broader variety of wafer materials-including silicon, gallium nitride, silicon carbide, gallium arsenide, and indium phosphide-the performance expectations from dicing and backgrinding tapes become increasingly intricate.

Each of these materials has unique surface characteristics, mechanical properties, and thermal tolerances that influence how effectively a tape can adhere and subsequently be removed without causing damage or leaving residues. This presents a technological obstacle for tape manufacturers, who must engineer tapes with precise adhesive properties tailored to each substrate while maintaining consistency under high-temperature and high-pressure processing conditions.

The wafer thinning process often reduces wafer thickness to levels below 100 micrometers, increasing their fragility and making the need for effective and non-destructive adhesive solutions even more critical. A tape that adheres too aggressively may cause wafer cracking or damage during debonding, while insufficient adhesion may result in wafer slippage or contamination. Balancing these contradictory demands-strong adhesion during processing and gentle peel-off during removal-requires high-performance materials and precise control of formulation chemistry.

Environmental variables such as humidity, exposure to ultraviolet curing light, and processing equipment configurations further influence tape performance. This variability creates a challenge for standardization across semiconductor manufacturing lines and limits the universal applicability of a single tape solution. As a result, dicing and backgrinding tape manufacturers must continuously invest in research and development to meet application-specific requirements, which elevates production costs and slows down scalability. The inability to deliver universal, cost-effective, and high-performing tape products compatible with all substrate types remains a persistent bottleneck in the Dicing & Backgrinding Tapes Market.

Key Market Trends

Growing Demand from the Infrastructure and Construction Sector

The rising number of large-scale infrastructure projects worldwide is fueling the demand for Dicing & Backgrinding Tapess. Governments are investing heavily in transportation networks, urban development, and renewable energy projects, driving the need for heavy lifting equipment. In countries like China, India, and the United States, massive investments in roads, bridges, and high-rise buildings have led to increased adoption of Dicing & Backgrinding Tapess due to their versatility and mobility. The construction sector prefers these cranes for their ability to handle diverse lifting tasks with minimal setup time. Additionally, the expansion of smart cities and mega projects such as airports, railways, and industrial complexes further contributes to market growth. For example, in 2023, the U.S. government announced significant funding for infrastructure development, increasing demand for advanced lifting solutions. The construction industry's reliance on efficient material handling and lifting equipment continues to boost the adoption of Dicing & Backgrinding Tapess, positioning them as essential assets in infrastructure development.

Key Market Players

• 3M Company
• Nitto Denko Corporation
• Tesa SE.
• Lintec Corporation
• Dow Inc.
• Semiconductor Equipment Corporation.
• Kyocera Corporation
• Singamas Container Industry Company Limited
• Mitsui Chemicals, Inc
• Fujifilm Corporation.

Report Scope:

In this report, the Global Dicing & Backgrinding Tapes Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Dicing & Backgrinding Tapes Market, By Type:

• Dicing Tapes
• Backgrinding Tapes

Dicing & Backgrinding Tapes Market, By Material:

• Polyolefin
• Polyvinyl Chloride (PVC)
• Polyethylene Terephthalate (PET)
• Others

Dicing & Backgrinding Tapes Market, By Application:

• Memory
• Logi
• MEMS
• CMOS Image Sensors
• Power Devices
• Others

Dicing & Backgrinding Tapes Market, By Region:

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
• South America
  • Brazil
  • Argentina
  • Colombia
• Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • South Africa

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Dicing & Backgrinding Tapes Market.

Available Customizations:

Global Dicing & Backgrinding Tapes Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, and Trends

4. Voice of Customer

5. Global Dicing & Backgrinding Tapes Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Type (Dicing Tapes, Backgrinding Tapes)
  • 5.2.2. By Material (Polyolefin, Polyvinyl Chloride (PVC), Polyethylene Terephthalate (PET), Others)
  • 5.2.3. By Application (Memory, Logic, MEMS, CMOS Image Sensors, Power Devices, Others)
  • 5.2.4. By Region (North America, Europe, South America, Middle East & Africa, Asia Pacific)
• 5.3. By Company (2024)
• 5.4. Market Map

6. North America Dicing & Backgrinding Tapes Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Type
  • 6.2.2. By Material
  • 6.2.3. By Application
  • 6.2.4. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Dicing & Backgrinding Tapes Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Type
      • 6.3.1.2.2. By Material
      • 6.3.1.2.3. By Application
  • 6.3.2. Canada Dicing & Backgrinding Tapes Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Type
      • 6.3.2.2.2. By Material
      • 6.3.2.2.3. By Application
  • 6.3.3. Mexico Dicing & Backgrinding Tapes Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Type
      • 6.3.3.2.2. By Material
      • 6.3.3.2.3. By Application

7. Europe Dicing & Backgrinding Tapes Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Type
  • 7.2.2. By Material
  • 7.2.3. By Application
  • 7.2.4. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Dicing & Backgrinding Tapes Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Type
      • 7.3.1.2.2. By Material
      • 7.3.1.2.3. By Application
  • 7.3.2. France Dicing & Backgrinding Tapes Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Type
      • 7.3.2.2.2. By Material
      • 7.3.2.2.3. By Application
  • 7.3.3. United Kingdom Dicing & Backgrinding Tapes Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Type
      • 7.3.3.2.2. By Material
      • 7.3.3.2.3. By Application
  • 7.3.4. Italy Dicing & Backgrinding Tapes Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Type
      • 7.3.4.2.2. By Material
      • 7.3.4.2.3. By Application
  • 7.3.5. Spain Dicing & Backgrinding Tapes Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Type
      • 7.3.5.2.2. By Material
      • 7.3.5.2.3. By Application

8. Asia Pacific Dicing & Backgrinding Tapes Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Type
  • 8.2.2. By Material
  • 8.2.3. By Application
  • 8.2.4. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Dicing & Backgrinding Tapes Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Type
      • 8.3.1.2.2. By Material
      • 8.3.1.2.3. By Application
  • 8.3.2. India Dicing & Backgrinding Tapes Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Type
      • 8.3.2.2.2. By Material
      • 8.3.2.2.3. By Application
  • 8.3.3. Japan Dicing & Backgrinding Tapes Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Type
      • 8.3.3.2.2. By Material
      • 8.3.3.2.3. By Application
  • 8.3.4. South Korea Dicing & Backgrinding Tapes Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Type
      • 8.3.4.2.2. By Material
      • 8.3.4.2.3. By Application
  • 8.3.5. Australia Dicing & Backgrinding Tapes Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Type
      • 8.3.5.2.2. By Material
      • 8.3.5.2.3. By Application

9. Middle East & Africa Dicing & Backgrinding Tapes Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Type
  • 9.2.2. By Material
  • 9.2.3. By Application
  • 9.2.4. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Dicing & Backgrinding Tapes Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Type
      • 9.3.1.2.2. By Material
      • 9.3.1.2.3. By Application
  • 9.3.2. UAE Dicing & Backgrinding Tapes Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Type
      • 9.3.2.2.2. By Material
      • 9.3.2.2.3. By Application
  • 9.3.3. South Africa Dicing & Backgrinding Tapes Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Type
      • 9.3.3.2.2. By Material
      • 9.3.3.2.3. By Application

10. South America Dicing & Backgrinding Tapes Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Type
  • 10.2.2. By Material
  • 10.2.3. By Application
  • 10.2.4. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Dicing & Backgrinding Tapes Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Type
      • 10.3.1.2.2. By Material
      • 10.3.1.2.3. By Application
  • 10.3.2. Colombia Dicing & Backgrinding Tapes Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Type
      • 10.3.2.2.2. By Material
      • 10.3.2.2.3. By Application
  • 10.3.3. Argentina Dicing & Backgrinding Tapes Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Type
      • 10.3.3.2.2. By Material
      • 10.3.3.2.3. By Application

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends and Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Company Profiles

• 13.1. 3M Company
  • 13.1.1. Business Overview
  • 13.1.2. Key Revenue and Financials
  • 13.1.3. Recent Developments
  • 13.1.4. Key Personnel
  • 13.1.5. Key Product/Services Offered
• 13.2. Nitto Denko Corporation
• 13.3. Tesa SE.
• 13.4. Lintec Corporation
• 13.5. Dow Inc.
• 13.6. Semiconductor Equipment Corporation.
• 13.7. Kyocera Corporation
• 13.8. Singamas Container Industry Company Limited
• 13.9. Mitsui Chemicals, Inc
• 13.10. Fujifilm Corporation.

14. Strategic Recommendations

15. About Us & Disclaimer