DRAMeXchange 市場情報服務：晶圓代工白金級報告

晶圓代工白金級資料表

"白金級報告" 首先分析了 TrendForce 的記憶體產業及下游應用需求，然後擴展到上游半導體產業，對晶圓代工產業進行分析，包括晶圓產能、製程節點路線圖和晶圓廠利用率。

"白金級報告" 聚焦於台積電 (TSMC)、聯電 (UMC)、三星 (Samsung)、中芯國際 (SMIC) 和格羅方德 (GlobalFoundries) 等主要公司，深入分析晶圓代工競爭力及利用率，並探討晶圓代工市場的未來前景。

晶圓代工市場最新動態

每家晶圓製造商的資訊均提供，並每兩週更新一次。

Foundry Platinum Datasheet

The Platinum reports provide analyses of the foundry industry, starting from TrendForce's memory industry analysis and application demand in the downstream, extending to the semiconductor upstream, encompassing wafer production capacity, process node roadmap, and capacity utilization of each fab. The Platinum reports provide detailed analyses of foundries' competitiveness and capacity utilization rates, specifically focusing on major players including TSMC, UMC, Samsung, SMIC, and GlobalFoundries, etc.. The Platinum reports also discuss the future outlook of the foundry market.

Foundry Market Bulletin

We will provide and update on each wafer manufacturers on the biweekly basis.