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6G通訊：RIS材料與硬體市場（2024-2044）
市場調查報告書
商品編碼
1347334

6G通訊：RIS材料與硬體市場（2024-2044）

6G Communications: Reconfigurable Intelligent Surface Materials and Hardware Markets 2024-2044
出版日期: | 出版商: Zhar Research | 英文 358 Pages | 商品交期: 最快1-2個工作天內

價格
簡介目錄

6G 無線通訊將於 2030 年左右實現，需要廣泛部署 RIS。幾年後，部署面積將超過2億平方米，RIS硬體每年銷售額將超過120億美元，而安裝等相關成本也會大幅增加。

與5G 一樣，6G 將從0.1-0.3 THz 預期頻段的低端開始實現顯著的性能改進，一旦克服本報告中分析的大規模挑戰，將轉向更高的頻率。預計將進入第二階段將於 2035 年透過其他版本實施。屆時，可能會增加 0.3 至 1 THz 處理能力、用於操作無電源用戶端設備的主動（有電源）RIS、近紅外線/可見光 RIS 以及其他先進技術。

其中，滿足微細圖案化、透明性、晶片陣列等要求的高附加價值材料需求量很大，如石墨烯、3-5化合物、二氧化釩、藍寶石等有機材料。這使其成為一個有吸引力的市場，因為它前景廣闊並且避免商品化。其一方面是常規聚合物薄膜可以用作基材的廣泛領域。

本報告審視了 6G 通訊市場，確定了所需的材料和硬體，並提供了最新狀況、前景和機會的最新分析。

目錄

第 1 章 執行摘要與結論，包含 17 條預測線（2023-2043 年）

  • 本報告的定義與目的
  • 本報告的目的和範圍
  • 此分析的研究方法
  • 資訊圖表：6G RIS 和其他超表面在整個領域的應用
  • 15個主要結論
  • 支持 RIS 的組織
  • RIS建設
  • RIS 支援的其他功能
  • 加值 RIS 材料機會
  • 優先考慮新興 RIS 的八個調諧元件系列
  • 評估 6G RIS SWOT 以指導未來 6G RIS 設計
  • 6G RIS 路線圖和 16 條預測線（2024-2044 年）

第2章 簡介

  • 什麼是 RIS？
  • RIS結構與功能
  • 整體情況是 6 種可能的操作模式
  • 替代系統方法：設備到設備
  • 6G RIS、先前產品與中間產品的比較
  • 6G 和 6G RIS 目標正在擴大，但現在需要專注於
  • 緊迫性與標準問題
  • 6G THz頻率的選擇極大影響RIS設計
  • 太赫茲空檔：逃生路線
  • 主動 RIS 和其他 6G 基礎設施的功耗困境
  • 下一章格式

第3章 6G超材料與製造技術，2023 年的重大進展與視角變化

  • 摘要
  • 元原子和圖案選項
  • 商業、營運、理論和結構方案的比較
  • 超材料圖案與材料
  • 超材料的六種形式和範例
  • 超表面底漆
  • 超曲面
  • 超材料的長期整體圖景
  • 超表面能量收集很可能在 6G 中成為現實
  • GHz、THz、紅外線和光學超材料的應用
  • 超材料和超表面的整體 SWOT 評估
  • 2023年以來6G認知、規劃與進展的重大變化：15個案例分析
  • 6G RIS 的製造技術，無論光學、低太赫茲或高太赫茲

第 4 章 6G THz RIS：設計

  • 未來的挑戰
  • 設計背景
  • 波束成形和轉向是趨勢，但 "波束" 只是委婉說法
  • 著眼於未來的 RIS 演變
  • Metasurface RIS 硬體的工作原理
  • 半被動和主動 RIS 元件
  • RIS 與傳統方法的比較
  • 2022 年後的進展
  • 面向 5G 的 RIS
  • 6G RIS
  • 對最近研究管線中九個 RIS 調諧元件系列的評估
  • 主動 RIS 與被動 RIS，消除控制通道和其他任務
  • 用於太赫茲和光學的 ENZ 和低損耗材料
  • 具有整合感測功能的 6G RIS
  • 回顧（2023）
  • 6G RIS 的 SWOT 評估指導未來 6G RIS 設計

第 5 章：運作中的 6G THz RIS：材料、硬體、位置和安裝問題

  • 6G RIS 和其他超表面在整個景觀中運行
  • 6G 水下、地下、農業 - 市場差距
  • 工商業：智慧工廠與工業 6.0
  • 部署挑戰
  • 測驗、認證：Greenerwave、羅德與施瓦茲的例子 (2023)
  • 用於精確製圖的 RIS
  • 用於 6G 基地台的 RIS
  • RIS - 以使用者為中心的整合網路：架構與最佳化
  • RIS SWIPT WIET，用於為手機充電和為未通電的用戶設備供電
  • 無所不在的 RIS 和無線通訊超材料
  • 硬體機會
  • 安全性問題

第6章6G光學RIS：近紅外線與可見光

  • 摘要
  • LiFi RIS
  • 可能的混合光學/太赫茲 6G 通信
  • 光學 RIS 概述
  • 增強或取代 RIS 的光學設備

第7章 與企業聯合:各地區

  • 全球 RIS/THz 硬體計劃
  • 北美 - 公司與計劃
  • 北美中小企業使用RIS相關技術的評估
    • Echodyne
    • Evolv Technology
    • Fractal Antenna Systems
    • iQLP
    • Kymeta Corp.
    • Meta
    • Metacept Systems
    • Metawave
    • Pivotal Commware
    • SensorMetrix
  • 歐洲:政府，學術，產業
    • 歐洲聯盟
    • 芬蘭
    • 德國
    • 英國
    • 法國
  • 東亞:政府，學術，產業
    • 中國
    • 印度
    • 日本
    • 韓國
    • 巴基斯坦
    • 新加坡
    • 台灣
簡介目錄

6G wireless communication coming in around 2030 needs widely-deployed Reconfigurable Intelligent Surfaces RIS. Some years will see over 200 million square meters deployed, RIS hardware sales rising to over $12 billion yearly, related costs such as installation greatly adding to this. The new Zhar Research report, "6G Communications: Reconfigurable Intelligent Surface Materials and Hardware Markets: SubTHz, THz, Optical 2024-2044" gives the latest situation and prospects ahead. Uniquely focussing on clearly identifying the materials and hardware needed, free of the obscure software analysis and mathematics of other reports. It is based on close analysis of what is needed, what will possible, the research pipeline - much boosted in 2023 - and how the participants are repositioning. Reports not analysing these major changes from 2023 are relatively useless.

Dr. Peter Harrop, CEO of Zhar Research says, "We find that, without RIS, there will be no 6G. These metasurfaces empowering the propagation path and enhancing base stations will be key both to affordable 6G deployment and to delivering its essential business cases. 6G RIS will appear in many different forms and at many frequencies, from 0.1THz to 1THz and even potentially visible light in later years. Some RIS will even be transparent to retrofit on windows. However, 2023 saw radical changes in achievements and objectives. Uniquely this commercially-oriented report covers that, including many new RIS security issues and particularly presenting our latest analysis of materials and hardware opportunities, including gaps in the emerging market from 2024-2044."

The report advises that, like 5G, 6G will start at the bottom of an envisaged band - around 0.1-0.3THz - to get huge performance increase - then add higher frequency versions for stellar performance when the massive challenges analysed in this report are overcome, maybe a Phase 2 in 2035. That may involve adding 0.3-1THz capability, active (powered) RIS that operates unpowered client devices, near infrared and visible light RIS and other advances forecasted.

Within that, expect major demand for the value-added materials involved including graphene, 3-5 compounds, vanadium dioxide, sapphires and certain organics that are detailed and fine patterning, transparency, chip arrays and other requirements make the market attractive, avoiding commoditisation. Vast areas od regular polymer films as substrates are another aspect.

The Executive Summary and Conclusions has 35 information-packed pages, mostly 16 key conclusions, new infograms, tables, graphs and SWOT RIS appraisal. There is a detailed roadmap and 21 forecast lines 2024-2044.

The 99-page Introduction then gives unusually comprehensive coverage of the basics as seen in the very different light of 2023 onwards with a profusion of references for further reading. It includes basic RIS design and purpose, derisking investment for multiple applications, for this report is commercially oriented. See infograms of intended 6G and its RIS across land, sea and air plus what companies are likely to participate where. Understand the unsolved 6G rural challenge and difficulty providing extra infrastructure and many functions. Here you navigate the confusions of RIS terminology, metamaterials and metasurfaces involved, six operational and three directional modes. Such RIS and 6G are compared to traditional approaches and the need for better focus in objectives and standards becoming urgent, since RIS hardware lags progress in 6G system design. Because this is analysis not evangelism, there is a very close look at the pros and cons of frequency choices and RIS becoming part of the problem of this industry grabbing too much of the world's electricity supply, creating heat.

The 32 pages of Chapter 3 are on "Metamaterials and manufacturing technologies for 6G and major advances and changed views from 2023". Understand the meta-atom pattern behaves like an atom, the patterning commercial, operational, theoretical, structural and manufacturing options. Six formats metamaterial are here with materials examples leading to metasurfaces, hypersurfaces and the long-term picture of metamaterials overall, even metasurface energy harvesting likely for 6G then applications of GHz, THz, infrared and optical metamaterials. There is a SWOT assessment. However, vitally, half the chapter reveals major changes in 6G perceptions, plans and progress from 2023 starting with 15 examples analysed. New infograms and a SWOT make it easy to grasp.

Chapter 4 runs to a full 99 pages in order to drill down into detailed materials and device aspects of the different RIS designs needed for different frequency bands and so on. See appraisal of 9 tuning device families for RIS from the recent research pipeline and where the research will be headed in future. There is detail on beam forming, many operating principles affecting materials choices, the merits of semi-passive. Understand active RIS components including such things as High Electron Mobility Transistors HEMT, hybrid CMOS, phase change materials such as vanadium dioxide and chalcogenides and trials of graphene plasmonics in RIS. Learn more on coping with the terahertz gap and on making transparent RIS. Throughout, the latest advances from 2023 are particularly explored.

Chapter 5 (37 pages) concerns issues, opportunities and gaps in the market as we urgently progress from small scale demonstrations to proving and installing the necessarily large RIS across the landscape. Called, "6G THz reconfigurable intelligent surfaces in action: materials, hardware, location and installation issues" it covers 6G underwater, underground, for agriculture, smart factories including their transmissive windows and Industry-6.0. Learn RIS smart radio environments and the issues of selection of sites, components, materials. Be surprised by the cost breakdown of a typically planned RIS. Just how realistic is the dream of RIS Simultaneous Wireless Information and Power Transfer SWIPT enable unpowered, battery-less edge devices at later stage? Many new infograms make all this both clear and comprehensive. Then come comparison tables of opportunities with organic, inorganic and high added value constructs. The chapter ends with the many RIS security concerns coming center stage from 2023 onwards.

Chapter 6 is brief but important. Called, "6G optical reconfigurable intelligent surfaces: near IR and visible" its 20 pages show how the essential role of these frequencies in 5G and 6G in the form of fiber optics is only the beginning. Near IR and visible light can have a place in free space optical transmission and specifically indoor and outdoor LiFi to improve reach and performance. Learn how there is even promising work on handling THz and these frequencies in a single RIS. On the other hand there are optical devices potentially enhancing or replacing RIS.

The report ends with a 75-page chapter on RIS-related companies, collaborations and national and regional initiatives across the world. The new Zhar Research report, "6G Communications: Reconfigurable Intelligent Surface Materials and Hardware Markets: SubTHz, THz, Optical 2024-2044" is essential reading for those seeking to supply the added-value materials and components required. It also has much to interest investors, operations, system integrators and others in the emerging 6G value chain.

Table of Contents

1. Executive summary and conclusions with 17 forecast lines 2023-2043

  • 1.1. Definition and purpose of this report
    • 1.1.1. Definition and 6G need
    • 1.1.2. The 6G RIS dream
  • 1.2. Purpose and scope of this report
  • 1.3. Methodology of this analysis
  • 1.4. Infogram: 6G RIS and other metasurfaces in action across the landscape
  • 1.5. 15 Primary conclusions
  • 1.6. Organisations backing RIS
  • 1.7. RIS construction
  • 1.8. Extra functionality enabled by RIS
    • 1.8.1. Capabilities of the metasurfaces involved
    • 1.8.2. Different levels of beam management
    • 1.8.3. RIS directional options
    • 1.8.4. RIS for 6G low-latency edge computing
  • 1.9. Your opportunities for added-value RIS materials
  • 1.10. 8 tuning device families prioritised for RIS that are emerging
  • 1.11. 6G RIS SWOT appraisal that must guide future 6G RIS design
  • 1.12. 6G RIS roadmap and 16 forecast lines 2024-2044
    • 1.12.1. Assumptions
    • 1.12.2. 6G RIS roadmap and 16 forecast lines 2024-2044
    • 1.12.3. Planned RIS hardware evolution
    • 1.12.4. 6G reconfigurable intelligent surfaces market yearly area added bn. sq. m., price, value market table 2024-2044
    • 1.12.5. 6G reconfigurable intelligent surfaces market yearly area added bn. sq. m. 2024-2044 graph
    • 1.12.6. Average RIS price $/ square meter. ex-factory 2028-2044 graph with explanation
    • 1.12.7. 6G reconfigurable intelligent surfaces cumulative panels number deployed billion by year end 2024-2044 table and graph
    • 1.12.8. Global yearly RIS sales by five types and total $ billion 2024-2044 table
    • 1.12.9. Global yearly RIS sales by five types $ billion 2023-2043: graph with explanation
    • 1.12.10. Global 6G RIS value market $ billion 2028-2044 compared to other THz hardware
    • 1.12.11. Percentage share of global RIS hardware value market by four regions 2024-2044
    • 1.12.12. Global metamaterial/ metasurface market billion sq. m. civil comms vs other 2024-2044 table and graphs
    • 1.12.13. Global metamaterial, metasurface market $/ sq. m. ex-factory 2024-2044: table and graphs
    • 1.12.14. Market for 6G vs 5G base stations units millions yearly 3 categories 2024-2044: table and graphs
    • 1.12.15. Indium phosphide semiconductor market global with possible 6G impact $billion 2024-2044

2. Introduction

  • 2.1. What is a RIS?
    • 2.1.1. General
    • 2.1.2. RIS technologies are needed for many purposes beyond 6G derisking investment
    • 2.1.3. Infogram: Intended 6G and its RIS across land, sea and air
    • 2.1.4. 6G rural challenge
    • 2.1.5. Challenge to provide extra infrastructure and many transmission media
    • 2.1.6. Infogram: Likely 6G hardware and system providers across land, sea, air
    • 2.1.7. Infogram: Location of primary 6G material and component activity worldwide
    • 2.1.8. RIS terminology thicket
  • 2.2. RIS construction and capability
    • 2.2.1. Metamaterial and metasurface
    • 2.2.2. Two operational phases: control/ programming then normal operation.
    • 2.2.3. Three RIS directional modes, return, forward and STAR
  • 2.3. The bigger picture is six possible operating modes
    • 2.3.1. Reflection mode
    • 2.3.2. Refraction mode
    • 2.3.3. Absorption mode
    • 2.3.4. Backscattering mode
    • 2.3.5. Transmitting mode
    • 2.3.6. Receiving mode
  • 2.4. Alternative system approach: device to device
  • 2.5. RIS for 6G, predecessors and intermediary compared
  • 2.6. Broadening 6G and 6G RIS objectives but now some focus in needed
  • 2.7. Urgency and standards issues
    • 2.7.1. Realisation that hardware lags theory
    • 2.7.2. Major 6G standards initiative for RIS
    • 2.7.3. Overall 6G standards process settled but not the standards themselves
  • 2.8. 6G THz frequency choices will profoundly affect RIS design
    • 2.8.1. Overview
    • 2.8.2. Essential frequencies for 6G success and RIS deployment
    • 2.8.3. Lower frequencies still needed in 6G
    • 2.8.4. Transmission distance dilemma but belief that THz can be practicable outdoors in due course
    • 2.8.5. Unattractive 1-10THz
    • 2.8.6. Belief that THz will not be limited to indoors
    • 2.8.7. Longer distance sub-THz testing
    • 2.8.9. Optical frequency RIS now a serious consideration as well
  • 2.9. The Terahertz gap: escape routes
  • 2.10. Electricity consumption dilemma with active RIS and other 6G infrastructure
  • 2.11. Format of the next chapters

3. Metamaterials and manufacturing technologies for 6G and major advances and changed views from 2023

  • 3.1. Overview
  • 3.2. The meta- atom and patterning options
  • 3.3. Commercial, operational, theoretical, structural options compared
  • 3.4. Metamaterial patterns and materials
  • 3.5. Six formats of metamaterial with examples
  • 3.6. Metasurface primer
  • 3.7. Hypersurfaces
  • 3.8. The long-term picture of metamaterials overall
  • 3.9. Metasurface energy harvesting likely for 6G
  • 3.10. Applications of GHz, THz, infrared and optical metamaterials
  • 3.11. SWOT assessments for metamaterials and metasurfaces generally
  • 3.12. Major changes in 6G perceptions, plans and progress from 2023: 15 examples analysed
    • 3.12.1. Overview
    • 3.12.2. RIS use cases and preparation of standards
    • 3.12.3. Spectrum allocation and needs for RIS
    • 3.12.4. Improving transmission range
    • 3.12.5. Simplifying interfaces and configuration
    • 3.12.6. Demonstrations of RIS and its precursors
    • 3.12.7. Fully active RIS
    • 3.12.8. Trials and proposals mostly at 0.1-0.3THz opening frequencies
    • 3.12.9. World's first mmWave dynamic RIS trial
    • 3.12.10. World's first successful 0.3THz beamforming and high-speed data transmission
    • 3.12.11. New focus on transparent RIS
    • 3.12.12. RIS-aided sensing and localisation
    • 3.12.13. New international company collaboration verifies RIS modules, drives 6G research
    • 3.12.14. Addressing the multiplicative fading effect
    • 3.12.15. Enhancing 6G base stations with RIS
    • 3.12.16. Significant RIS events
  • 3.13. Manufacturing technologies for 6G RIS whether optical, low or high THz

4. 6G THz reconfigurable intelligent surfaces: design

  • 4.1. Challenges ahead
  • 4.2. Design context
  • 4.3. Trend to beam forming and steering but "beam" is a euphemism
    • 4.3.1. Basics
    • 4.3.2. Beamforming: major advances from 2023
  • 4.4. RIS evolution intended in the future
  • 4.5. How metasurface RIS hardware operates
  • 4.6. Semi-passive and active RIS components
    • 4.6.1. Overview
    • 4.6.2. PIN and Schottky diodes for semi-passive 6G RIS lowest THz frequencies
    • 4.6.3. High-Electron Mobility Transistor HEMT for higher up to 0.6THz
    • 4.6.4. CMOS and hybrid lll-V+CMOS approaches sub-THz
    • 4.6.5. RIS assisted wireless communication landscape
  • 4.7. RIS compared to traditional approaches
  • 4.8. Advances from 2022 onwards
  • 4.9. RIS for 5G
    • 4.9.1. Early work
    • 4.9.2. mm wave 5G RIS progress
    • 4.9.3. 5G RIS control issues
    • 4.9.4. Enabling real-time configuration
  • 4.10. RIS for 6G
    • 4.10.1. Comparison of options
    • 4.10.2. The terahertz gap
    • 4.10.3. 6G RIS control issues
    • 4.10.4. Transparent RIS
  • 4.11. Appraisal of 9 tuning device families for RIS from recent research pipeline
    • 4.11.1. Electronic, magnetic
    • 4.11.2. Photoactive, phase change, mechanical
    • 4.11.3. Layouts, materials, operating principles involved, latest achievements, future research trends
  • 4.12. Active vs passive RIS, removing control channels and other work
  • 4.13. ENZ and low loss materials for THz and optical
    • 4.13.1. ENZ
    • 4.13.2. Low loss
  • 4.14. 6G RIS with integral sensing
  • 4.15. Review in 2023
  • 4.16. 6G RIS SWOT appraisal that must guide future 6G RIS design

5. 6G THz reconfigurable intelligent surfaces in action: materials, hardware, location and installation issues

  • 5.1. 6G RIS and other metasurfaces in action across the landscape
  • 5.2. 6G underwater, underground and for agriculture - gaps in the market
    • 5.2.1. Underwater and underground
    • 5.2.2. Agriculture
  • 5.3. Commercial and industrial: smart factory and Industry-6.0
  • 5.4. Deployment challenges
    • 5.4.1. Five aspects cited by University of Oulu
    • 5.4.2. Five other aspects
    • 5.4.3. Overhead aware resource allocation
    • 5.4.4. Realisation that hardware lags theory
    • 5.4.5. Major 6G RIS standards initiative ETSI
    • 5.4.6. Cost hierarchy challenge
  • 5.5. Testing, accreditation: Greenerwave, Rohde & Schwartz example 2023
  • 5.6. RIS for fine mapping
  • 5.7. RIS for 6G base stations
  • 5.8. RIS- Integrated User-Centric Network: Architecture and Optimization
  • 5.9. RIS for charging your phone and powering unpowered user devices SWIPT WIET
  • 5.10. Ubiquitous RIS and wireless communication metamaterials
    • 5.10.1. Large area locations: smart cities and beyond
    • 5.10.2. Smaller area locations: smart transport, windows and wearables
    • 5.10.3. Choosing physical locations and layouts
    • 5.10.4. RIS smart radio environments
  • 5.11. Hardware opportunities
    • 5.11.1. General
    • 5.11.2. Should we have even more RIS hardware by pairing them?
    • 5.11.3. Semiconductor 6G RIS hardware opportunities by device and material
    • 5.11.4. Potential 6G RIS-related applications of 20 emerging inorganic compounds
    • 5.11.5. Potential 6G RIS-related applications of 20 elements in high-added value formats
    • 5.11.6. Potential 6G RIS-related applications of 20 emerging organic compounds
  • 5.12. Security issues

6. 6G optical reconfigurable intelligent surfaces: near-IR and visible

  • 6.1. Overview
  • 6.2. LiFi RIS
  • 6.3. Possible hybrid light/THz 6G Communications
  • 6.4. Optical RIS generally
  • 6.5. Optical devices enhancing or replacing RIS

7. Companies and collaboration by region

  • 7.1. Global RIS and THz hardware initiatives
    • 7.1.1. ETSI ISG RIS - 32 member organisations
    • 7.1.2. International Consortium for Development of High-Power THz Science and Technology
    • 7.1.3. ATIS global Next G Alliance
  • 7.2. North America - companies and initiatives
    • 7.2.1. Next G in USA and Canada
    • 7.2.2. Terahertz hardware in Canada
    • 7.2.3. DARPA THz Electronics project
    • 7.2.4. THz devices developed and sold
    • 7.2.5. University of Texas 6G Research Center with Samsung, Intel, Honda etc.
  • 7.3. Appraisal of small North American companies with relevant RIS-related technology
    • 7.3.1. Echodyne
    • 7.3.2. Evolv Technology
    • 7.3.3. Fractal Antenna Systems
    • 7.3.4. iQLP
    • 7.3.5. Kymeta Corp.
    • 7.3.6. Meta
    • 7.3.7. Metacept Systems
    • 7.3.8. Metawave
    • 7.3.9. Pivotal Commware
    • 7.3.10. SensorMetrix
  • 7.4. Europe: government, academia and industry
    • 7.4.1. European Union
    • 7.4.2. Finland
    • 7.4.3. Germany
    • 7.4.4. United Kingdom
    • 7.4.5. France
  • 7.5. East Asia: government, academia and industry
    • 7.5.1. China
    • 7.5.2. India
    • 7.5.3. Japan
    • 7.5.4. Korea
    • 7.5.5. Pakistan
    • 7.5.6. Singapore
    • 7.5.7. Taiwan