全球半導體濺鍍靶材市場規模（按類型、應用、區域範圍和預測）

半導體濺鍍靶材市場規模及預測

預計2024年半導體濺鍍靶材市場價值將達45億美元，2031年將達69.6億美元，2024年至2031年的複合年成長率為5.6%。

半導體濺鍍靶材是用於濺鍍製程的專用材料，用於在半導體晶圓上沉積薄膜。在濺鍍過程中，靶材受到高能量離子轟擊，釋放出的原子凝聚在基板上形成薄膜。

這些材料包括金屬、合金和複合材料，對於製造半導體裝置至關重要。

濺鍍靶材對於半導體產業生產各種組件至關重要，包括積體電路 (IC)、儲存晶片和光伏電池。

濺鍍靶材用於在晶圓上沉積導電層、絕緣層和半導體層，這是裝置功能的基礎。

應用範圍包括薄膜電晶體、光伏板和其他先進電子元件的製造。

全球半導體濺鍍靶材市場動態

影響全球半導體濺鍍靶材市場的關鍵市場動態是：

關鍵市場促進因素

半導體技術的進步：半導體裝置的不斷發展，包括小型化和功能增強，正在推動對滿足嚴格製造要求的高性能濺射靶材的需求。根據國際裝置與系統路線圖 (IRDS)，半導體產業的目標是到 2028 年實現 1.5 奈米節點技術。

電子產品需求不斷成長：智慧型手機、平板電腦和穿戴式裝置等消費性電子產品的消費量不斷成長，推動了對高效可靠的濺射靶材的需求，用於製造這些設備的半導體元件。國際數據公司 (IDC) 預測，到 2024 年，全球智慧型手機出貨量將達到 13.8 億部，年增 7.7%。

新興技術的擴展：5G、物聯網和人工智慧等技術創新將創造新的應用和對先進半導體裝置的需求，從而推動濺鍍靶材市場的成長。例如，高通將於2024年4月推出專為物聯網應用設計的全新5G晶片組，這可能會推動對專用濺鍍靶材的需求。

新型半導體材料的開發：化合物半導體和先進合金等新型半導體材料的探索和應用需要專門的濺射靶材來支援尖端裝置的製造。例如，應用材料公司於2024年1月推出了一系列針對氮化鎵（GaN）和碳化矽（SiC）半導體製造進行最佳化的新型濺鍍靶材。

日益重視能源效率：對更節能、更高性能電子設備的需求，推動了對濺射靶材的需求，這些靶材能夠用於生產先進的低功耗半導體元件。美國能源局估計，寬能能隙半導體可將電力電子設備的能量損耗降低高達 90%。

主要挑戰

製造成本高：高純度濺鍍靶材的生產涉及複雜且昂貴的工藝，這使得一些半導體製造商的成本過高，並阻礙了市場成長。

材料可得性：某些原料（例如濺射靶中使用的稀有金屬）的可用性有限，導致供應鏈中斷和成本增加，從而抑制了市場擴張。

技術挑戰：半導體裝置的不斷小型化和日益複雜化，要求濺鍍技術不斷創新，技術挑戰巨大，研發成本高昂。

環境和監管問題：有關濺射靶材原料提取和加工的嚴格環境法規可能會給製造商帶來額外的成本和營運限制。

來自替代沉澱技術的競爭：化學氣相沉積（CVD）和原子層沉積（ALD）等替代薄膜沉積技術的存在可能會限制濺射靶材料在某些應用中的採用，從而影響市場成長。

主要趨勢

轉向先進材料：使用複合半導體和新型合金等先進高純度材料來提高半導體裝置的性能和效率的趨勢日益成長，這推動了濺射靶材的創新。根據半導體產業協會 (SIA) 預測，寬能能隙半導體市場規模將從 2021 年的 21 億美元成長到 2026 年的 65 億美元。

人工智慧與機器學習的融合：在半導體製造過程中採用人工智慧和機器學習，可以提高濺鍍靶材使用的準確性和效率，從而改善品管並最佳化生產。根據麥肯錫的報告，到2025年，人工智慧每年可為半導體公司增加400億美元的價值。

注重永續性：對永續性和環境影響的日益關注，正在推動環保濺鍍靶材和更高效生產流程的開發，以滿足全球監管標準並減少廢棄物。根據世界半導體理事會的數據，全球半導體產業的目標是到2030年將溫室氣體排放在2010年的基礎上減少30%。

目錄

第1章 引言

• 市場定義
• 市場區隔
• 調查方法

第2章執行摘要

• 主要發現
• 市場概況
• 市場亮點

第3章 市場概況

• 市場規模和成長潛力
• 市場趨勢
• 市場促進因素
• 市場限制
• 市場機遇
• 波特五力分析

4. 半導體濺鍍靶材市場（依類型）

• 金屬
• 合金
• 化合物

5. 半導體濺鍍靶材市場（依應用）

• 半導體晶片靶材

第6章 區域分析

• 北美洲
• 美國
• 加拿大
• 墨西哥
• 歐洲
• 英國
• 德國
• 法國
• 義大利
• 亞太地區
• 中國
• 日本
• 印度
• 澳洲
• 拉丁美洲
• 巴西
• 阿根廷
• 智利
• 中東和非洲
• 南非
• 沙烏地阿拉伯
• 阿拉伯聯合大公國

第7章市場動態

• 市場促進因素
• 市場限制
• 市場機遇
• COVID-19 市場影響

第8章 競爭態勢

• 主要企業
• 市佔率分析

第9章：公司簡介

• JX Nippon Mining & Metals Corporation
• Praxair
• Plansee SE
• Mitsui Mining & Smelting
• Hitachi Metals
• Honeywell
• Sumitomo Chemical
• ULVAC
• Materion（formerly Heraeus）

第10章：市場展望與機遇

• 新興技術
• 未來市場趨勢
• 投資機會

第11章 市場展望 附錄

• 簡稱列表
• 來源和參考文獻

Sputtering Target Material For Semiconductor Market Size And Forecast

Sputtering Target Material For Semiconductor Market size was valued at USD 4.50 Billion in 2024 and is projected to reach USD 6.96 Billion by 2031, growing at a CAGR of 5.6% from 2024 to 2031.

Sputtering target materials for semiconductors are specialized materials used in the sputtering process to deposit thin films onto semiconductor wafers. During sputtering, a target material is bombarded with high-energy ions, causing it to eject atoms that then condense onto a substrate, forming a thin film.

These materials can include metals, alloys, and compound materials, and are crucial for fabricating semiconductor devices.

Sputtering target materials are essential in the semiconductor industry for the production of various components, including integrated circuits (ICs), memory chips, and photovoltaic cells.

They are used to create conductive, insulating, and semiconducting layers on wafers, which are fundamental for device functionality.

Applications extend to the production of thin-film transistors, photovoltaic panels, and other advanced electronic components.

Global Sputtering Target Material For Semiconductor Market Dynamics

The key market dynamics that are shaping the global sputtering target material for semiconductor market include:

Key Market Drivers

Advancements in Semiconductor Technology: The continuous evolution of semiconductor devices, including smaller geometries and increased functionality, drives the demand for high-performance sputtering target materials to meet stringent fabrication requirements. According to the International Roadmap for Devices and Systems (IRDS), the semiconductor industry is targeting 1.5nm node technology by 2028.

Growing Demand for Electronics: The rising consumption of consumer electronics, such as smartphones, tablets, and wearable devices, boosts the need for efficient and reliable sputtering targets to produce semiconductor components for these devices. The International Data Corporation (IDC) forecasts global smartphone shipments to reach 1.38 billion units in 2024, a 7.7% year-over-year growth.

Expansion of Emerging Technologies: Innovations in technologies like 5G, IoT, and artificial intelligence create new applications and demand for advanced semiconductor devices, driving growth in the sputtering target materials market. For instance, in April 2024, Qualcomm introduced a new 5G chipset specifically designed for IoT applications, potentially increasing demand for specialized sputtering targets.

Development of New Semiconductor Materials: The exploration and adoption of new semiconductor materials, such as compound semiconductors and advanced alloys, require specialized sputtering targets to support the fabrication of cutting-edge devices. For instance, in January 2024, Applied Materials launched a new line of sputtering targets optimized for gallium nitride (GaN) and silicon carbide (SiC) semiconductor production.

Increasing Focus on Energy Efficiency: The push for more energy-efficient and high-performance electronic devices drives the need for sputtering targets that enable the production of advanced, low-power semiconductor components. The U.S. Department of Energy estimates that wide bandgap semiconductors could reduce energy losses by up to 90% in power electronics.

Key Challenges:

High Production Costs: The manufacturing of high-purity sputtering target materials involves complex and expensive processes, making it cost-prohibitive for some semiconductor manufacturers and limiting market growth.

Material Availability: Limited availability of certain raw materials, such as rare metals used in sputtering targets, can lead to supply chain disruptions and increased costs, restraining market expansion.

Technological Challenges: The continuous miniaturization and increasing complexity of semiconductor devices require constant innovation in sputtering technology, posing significant technical challenges and high research and development costs.

Environmental and Regulatory Concerns: Stringent environmental regulations regarding the extraction and processing of raw materials used in sputtering targets can impose additional costs and operational constraints on manufacturers.

Competition from Alternative Deposition Methods: The presence of alternative thin-film deposition techniques, such as chemical vapor deposition (CVD) and atomic layer deposition (ALD), can limit the adoption of sputtering target materials in certain applications, affecting market growth.

Key Trends

Shift towards Advanced Materials: There is an increasing trend towards the use of advanced and high-purity materials, such as compound semiconductors and new alloys, to enhance the performance and efficiency of semiconductor devices, driving innovation in sputtering target materials. According to Semiconductor Industry Association (SIA), the wide bandgap semiconductor market is expected to grow from USD 2.1 Billion in 2021 to USD 6.5 Billion by 2026.

Integration of AI and Machine Learning: The adoption of artificial intelligence and machine learning in semiconductor manufacturing processes is improving the precision and efficiency of sputtering target usage, leading to better quality control and optimized production. According to a report by McKinsey, AI could create up to USD 40 Billion in value annually for semiconductor companies by 2025.

Focus on Sustainability: Growing emphasis on sustainability and environmental impact is leading to the development of eco-friendly sputtering target materials and more efficient production processes, aligning with global regulatory standards and reducing waste. According to the World Semiconductor Council, the global semiconductor industry aims to reduce greenhouse gas emissions by 30% by 2030 compared to 2010 levels.

Global Sputtering Target Material For Semiconductor Market Regional Analysis

Here is a more detailed regional analysis of the global sputtering target material for semiconductor market:

North America

North America dominating the sputtering target material for the semiconductor market. According to the Semiconductor Industry Association (SIA), the U.S. semiconductor industry accounted for 47% of the global semiconductor market share in 2023.

It is driven by robust research and development activities, the presence of major semiconductor manufacturers, and strong demand for advanced electronics. The National Science Foundation's 2022 report shows that the U.S. invested USD 124 Billion in semiconductor R&D in 2021, representing about 18% of global semiconductor R&D spending.

The United States, in particular, leads the region with its high-tech infrastructure and continuous innovation in semiconductor technology. The National Institute of Standards and Technology (NIST) established a new Semiconductor Metrology Division in December 2023 to support the development of advanced measurement techniques for semiconductor manufacturing.

Asia Pacific

The Asia-Pacific region is experiencing rapid growth in the sputtering target material market due to the presence of major semiconductor manufacturing hubs in countries such as China, Japan, South Korea, and Taiwan. According to the World Semiconductor Trade Statistics (WSTS), the Asia Pacific semiconductor market is expected to grow by 15.8% in 2024, reaching USD 415 Billion.

The region's growth is fueled by increasing digitalization, rising demand for consumer electronics, and significant investments in semiconductor fabrication facilities. For instance, Samsung Electronics (South Korea) announced in March 2024 a USD 116 Billion investment plan to become the world leader in advanced chip-making by 2030 and launched production of 3nm chips using Gate-All-Around (GAA) technology in April 2024.

China, in particular, is expanding its semiconductor industry to reduce reliance on imports. The China Semiconductor Industry Association reported that China's integrated circuit (IC) industry revenue reached 1.05 trillion yuan (USD 162 Billion) in 2023, a 17.8% year-on-year increase.

Global Sputtering Target Material For Semiconductor Market: Segmentation Analysis

The Global Sputtering Target Material For Semiconductor Market is Segmented on the basis of Type, Application, And Geography.

Sputtering Target Material For Semiconductor Market, By Type

Metal Sputtering Target Material

Alloy Sputtering Target Material

Based on Type, the Global Sputtering Target Material For Semiconductor Market is bifurcated into Metal Sputtering Target Material and Alloy Sputtering Target Material. In the sputtering target material market for semiconductors, metal sputtering target material is currently dominating due to its widespread use in various semiconductor applications, including integrated circuits and memory devices, where metals like copper, aluminum, and tungsten are essential. Alloy sputtering target material is the second rapidly growing segment, driven by the need for advanced materials that offer enhanced performance characteristics and the ability to support the development of next-generation semiconductor devices. The demand for alloys is increasing as semiconductor technology evolves and the industry seeks materials that can provide superior electrical and thermal properties.

Sputtering Target Material For Semiconductor Market, By Application

Analog IC

Digital IC

Analog/Digital IC

Based on Application, the Global Sputtering Target Material For Semiconductor Market is bifurcated into Analog IC, Digital IC, Analog/Digital IC. In the sputtering target material market for semiconductors, digital ICs dominate due to their extensive use in a wide range of electronic devices, including computers, smartphones, and other consumer electronics that require high-performance digital processing capabilities. Analog/Digital ICs are the second rapidly growing segment, driven by the increasing demand for mixed-signal devices that integrate both analog and digital functions, which are essential for advanced applications such as IoT, automotive electronics, and telecommunications. The need for versatile and high-efficiency ICs in these emerging technologies fuels the growth of this segment.

Sputtering Target Material For Semiconductor Market, By Geography

North America

Europe

Asia Pacific

Rest of the world

Based on Geography, the Global Sputtering Target Material For Semiconductor Market is classified into North America, Europe, Asia Pacific, and the Rest of the world. In the sputtering target material market for semiconductors, Asia Pacific is dominating due to its position as the leading hub for semiconductor manufacturing, with major players like China, Japan, South Korea, and Taiwan driving significant demand. The region benefits from substantial investments in semiconductor fabrication facilities and the high demand for consumer electronics. North America is the second rapidly growing region, propelled by advanced R&D, the presence of leading semiconductor companies, and increasing demand for cutting-edge technologies in sectors such as IT, automotive, and healthcare.

Key Players

The "Global Sputtering Target Material For Semiconductor Market" study report will provide valuable insight with an emphasis on the global market. The major players in the market are JX Nippon Mining & Metals Corporation, Praxair, Plansee SE, Mitsui Mining & Smelting, Hitachi Metals, Honeywell, Sumitomo Chemical, ULVAC, Materion (Heraeus), GRIKIN Advanced Material Co., Ltd., TOSOH, Ningbo Jiangfeng, Heesung, Luvata, Fujian Acetron New Materials Co., Ltd, Changzhou Sujing Electronic Material, Luoyang Sifon Electronic Materials.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with its product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share, and market ranking analysis of the above-mentioned players globally.

Sputtering Target Material For Semiconductor Market Key Developments

• In November 2023, Materion Corporation unveiled a new line of high-purity sputtering targets designed specifically for advanced semiconductor fabrication, featuring enhanced performance for ultra-thin film deposition.
• In September 2023, Hitachi Metals launched an innovative series of sputtering targets made from rare earth metals, aimed at improving the efficiency and reliability of next-generation semiconductor devices.
• In June 2023, Nippon Light Metal introduced a breakthrough sputtering target material with a novel alloy composition that enhances film uniformity and adhesion in high-tech semiconductor applications.

TABLE OF CONTENTS

1. Introduction

• Market Definition
• Market Segmentation
• Research Methodology

2. Executive Summary

• Key Findings
• Market Overview
• Market Highlights

3. Market Overview

• Market Size and Growth Potential
• Market Trends
• Market Drivers
• Market Restraints
• Market Opportunities
• Porter's Five Forces Analysis

4. Sputtering Target Material For Semiconductor Market, By Type

• Metals
• Alloys
• Compounds

5. Sputtering Target Material For Semiconductor Market, By Application

• Semiconductor Chip Target Materials

6. Regional Analysis

• North America
• United States
• Canada
• Mexico
• Europe
• United Kingdom
• Germany
• France
• Italy
• Asia-Pacific
• China
• Japan
• India
• Australia
• Latin America
• Brazil
• Argentina
• Chile
• Middle East and Africa
• South Africa
• Saudi Arabia
• UAE

7. Market Dynamics

• Market Drivers
• Market Restraints
• Market Opportunities
• Impact of COVID-19 on the Market

8. Competitive Landscape

• Key Players
• Market Share Analysis

9. Company Profiles

• JX Nippon Mining & Metals Corporation
• Praxair
• Plansee SE
• Mitsui Mining & Smelting
• Hitachi Metals
• Honeywell
• Sumitomo Chemical
• ULVAC
• Materion (formerly Heraeus)

10. Market Outlook and Opportunities

• Emerging Technologies
• Future Market Trends
• Investment Opportunities

11. Appendix

• List of Abbreviations
• Sources and References