嵌入式闆卡模組系統

本報告分析了各種硬體外形尺寸（例如模組計算機、模組系統、主機板、單板計算機、整合計算系統和伺服器）的主要市場趨勢和競爭格局。 它還提供各個細分市場的市場份額、對影響商業市場的最大發展和供應商以及當前和未來供應商生態系統的分析。

範例視圖

本報告中介紹的組織

ADLINK Technology Advantech AMD AMETEK Abaco Systems Arm Avnet ASUSTeK Computer (ASUS) BAE Systems Beckhoff Automation Cadence congatec Curtiss-Wright Defense Solutions Dell Technologies Eurotech EVOC Gigabyte

HPE IEI Integration Intel Kontron Lantronix Lenovo MSI NVIDIA Raspberry Pi Shenzhen NORCO Intelligent Technology Sierra Wireless (Semtech) Penguin Solutions Supermicro Computer Synopsys Toradex VIA Technologies

目錄

執行摘要

• 主要發現

世界市場概覽

• 近期趨勢
• 邊緣人工智慧吸引大規模投資
• 模組系統、主機板和邊緣 PC 吸引了新公司

競爭格局

• 競爭格局概覽
• 供應商見解
• AMETEK Abaco Systems
• ADLINK Technology
• Advantech
• Avnet (Avnet Embedded)
• congatec
• Dell Technologies
• Eurotech
• Hewlett Packard Enterprise (HPE)
• Kontron
• Raspberry Pi
• Supermicro Computer
• Toradex

最終使用者見解

• 供應商流失率較低，但供應商仍有很大的進步空間
• 軟體需求因所使用的硬體規格而異。
• 選擇 AI/ML 硬體供應商時，效能和安全性非常重要

關於 VDC 研究

報告圖表

• 依外型尺寸細分：2022-2027 年（十億美元）

This research study analyzes leading market trends and the competitive landscape for a variety of hardware form factors, including computer-on-modules, system-on-modules, motherboards, single-board computers, and integrated computing systems and servers. Accompanied by numerous market share segmentations, this report delivers research-driven commentary on the largest developments and vendors influencing commercial markets and the current and future supplier ecosystem.

SAMPLE VIEW

Organizations Listed in This Report:

Table of Contents

Executive Summary

• Key Findings

Global Market Overview

• Recent Developments
• Edge AI Draws Significant Financial Investments
• System-on-Modules, Motherboards & Edge PCs Attract New Players

Competitive Landscape

• Competitive Landscape Overview
• Vendor Insights
• AMETEK Abaco Systems
• ADLINK Technology
• Advantech
• Avnet (Avnet Embedded)
• congatec
• Dell Technologies
• Eurotech
• Hewlett Packard Enterprise (HPE)
• Kontron
• Raspberry Pi
• Supermicro Computer
• Toradex

End-User Insights

• Vendor Churn is Low but Plenty Room for Improvement for Suppliers
• Software Needs Vary by Hardware Form Factor Use
• AI/ML Hardware Vendor Selection Spotlights Performance & Security

About VDC Research

Report Exhibits

• Exhibit 1: Forecasted Global Shipments of Embedded Boards, Modules & Systems
• Segmented by Form Factor, 2022-2027 (Billions of Dollars)
• Exhibit 2: Global Vendor Shares of Desktop Class Motherboards, 2022 (Millions of Dollars)
• Exhibit 3: Global Vendor Shares of ITX Class Motherboards, 2022 (Millions of Dollars)
• Exhibit 4: Global Vendor Shares of Embedded/Stackable Class Motherboards, 2022 (Millions of Dollars)
• Exhibit 5: Global Vendor Shares of Slot SBCs & Blades, 2022 (Millions of Dollars)
• Exhibit 6: Global Vendor Shares of Computer-on-Modules, 2022 (Millions of Dollars)
• Exhibit 7: Global Vendor Shares of System-on-Modules, 2022 (Millions of Dollars)
• Exhibit 8: Global Vendor Shares of Embedded Integrated Computer Systems & Servers, 2022 (Millions of Dollars)
• Exhibit 9: Likelihood of Using the Same Embedded Hardware Vendor Three Years From Now & Satisfaction with Current Suppliers (Percentage of Respondents; Average Rating)
• Exhibit 10: Embedded Software Stack Components Required on Current/Most Recent Project, Other than the Operating System, Segmented by Users of Different Hardware Form Factors (Percentage of Respondents)
• Exhibit 11: Most Important Elements When Considering AI/ML Vendors/Integrators Segmented by Users of Different Hardware Form Factors (Percentage of Respondents)