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市場調查報告書
商品編碼
2048394
智慧型手錶晶片市場 - 全球產業規模、佔有率、趨勢、機會、預測:按類型、應用、地區和競爭格局分類,2021-2031年Smartwatch Chips Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Type (32-bit, 64-bit), By Application (Android System, iOS System Smartwatches), By Region & Competition, 2021-2031F |
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全球智慧型手錶晶片市場預計將從 2025 年的 21.2 億美元成長到 2031 年的 39.5 億美元,複合年成長率為 10.93%。
這些晶片包括專用系統晶片(SoC) 架構、微控制器和感測器融合中心,旨在驅動穿戴式腕帶裝置的核心功能。它們支援生物識別健康追蹤、全球定位系統 (GPS) 和無縫無線連接等功能,同時滿足嚴格的熱限制和空間限制。該市場的主要驅動力是消費者對自主健康遙測日益成長的興趣,以及對無需智慧型手機即可獨立運作的蜂窩網路功能的整合。 GSMA 預測,到 2025 年,物聯網 (IoT) 連接總數將超過 250 億,凸顯了這個互聯生態系統的規模,也凸顯了對先進穿戴式半導體日益成長的需求。
| 市場概覽 | |
|---|---|
| 預測期 | 2027-2031 |
| 市場規模:2025年 | 21.2億美元 |
| 市場規模:2031年 | 39.5億美元 |
| 複合年成長率:2026-2031年 | 10.93% |
| 成長最快的細分市場 | 64 位元 |
| 最大的市場 | 北美洲 |
阻礙市場進一步成長的主要障礙之一是平衡高處理能力和能源效率的技術複雜性。隨著製造商將持續血糖監測和5G通訊等電力消耗功能整合到設備中,如何在不增加設備物理尺寸的情況下保持足夠的電池續航時間仍然是一項重大的技術挑戰。這項挑戰增加了晶片設計和製造的難度,使得在現代穿戴式裝置所需的緊湊外殼內實現必要的性能變得困難。
先進生物識別和健康監測功能的日益普及是智慧型手錶晶片領域創新的主要驅動力。現代消費者需要具備醫療級遙測功能的腕戴設備,例如持續性心房顫動檢測、睡眠呼吸中止分析和血氧水平追蹤。這種需求迫使半導體製造商設計先進的模擬前端和感測器融合中心,以便在保持低功耗的同時,高精度地處理複雜的生理訊號。採用這些組件的原始設備製造商 (OEM) 所取得的財務成功也印證了這一趨勢。例如,Garmin 在 2024 年 10 月的財報中指出,受市場對健康類穿戴裝置的強勁需求推動,其健身部門的營收年增 31% 至 4.64 億美元。
同時,人工智慧 (AI) 和機器學習 (ML) 加速器在設備中的整合正在改變晶片結構的要求。為了最大限度地降低延遲並提高資料隱私,處理任務正從雲端轉移到邊緣,這就要求在系統晶片(SoC) 上直接整合專用神經處理單元 (NPU)。這些加速器支援手勢姿態辨識和個人化指導等即時功能,且不會消耗電池電量。這些組件的市場規模龐大。 2024 年 11 月,高通宣布其物聯網業務部門的年收入已達 54 億美元。同樣在 2024 年 10 月,蘋果宣布其穿戴式裝置、家居及配件部門的季度淨收入達到 90.4 億美元,凸顯了依賴高性能穿戴式半導體的龐大生態系統的存在。
如何在強大的處理能力和卓越的能源效率之間取得平衡,是限制全球智慧型手錶晶片市場成長的一大技術難題。製造商一方面努力將持續生物辨識監測和5G連接等高電力消耗功能整合到晶片中,另一方面又面臨著在保持電池續航時間的同時避免設備體積增大的雙重挑戰。這種矛盾使得製造過程更加複雜,因為標準半導體節點往往無法滿足所需的散熱和功耗規格。因此,晶片製造商不得不轉向複雜且高成本的製造流程以達到必要的能源效率,從而導致生產成本上升。這不僅提高了市場進入門檻,也阻礙了市場的進一步擴張和產品商品化。
為了因應能源限制,半導體產業依賴資本密集製造程序,這點在近期的產能趨勢中有所體現。根據SEMI預測,到2024年,全球5奈米及以下製程的先進半導體製造產能預計將成長13%。這項數據凸顯了利用先進微影術技術(主要是為了提高能源效率)的高成本。為確保擁有如此先進的生產能力所需的巨額投資,凸顯了製造過程中存在的巨大障礙,限制了製造商生產價格合理、性能卓越的晶片組的能力,使其無法滿足主流市場在所有價格區間的滲透需求。
對藍牙低功耗音訊 (Bluetooth LE Audio) 和 Auracast 標準的原生支援正在改變智慧型手錶晶片的連接格局,它以節能高效的廣播架構取代了傳統協定。這項技術變革使穿戴式 SoC 能夠透過 Auracast 同時向多個接收器傳輸高品質音頻,從而顯著提升用戶在共用媒體和助聽器方面的體驗,同時又不影響電池續航時間。晶片製造商正擴大將這些低功耗協議棧直接整合到晶片中,以滿足不斷成長的下一代周邊設備生態系統的需求。藍牙技術聯盟 (Bluetooth SIG) 的《2025 年藍牙市場展望》報告強調了這一轉變的規模,該報告預測,到 2025 年,全球藍牙設備出貨量將超過 53 億台,這主要得益於這些先進音頻標準在穿戴式設備中的整合。
此外,嵌入式5G RedCap和蜂巢式物聯網連接支援代表了穿戴式半導體領域的重大進步,使設備能夠在保持自主廣域網路連接的同時,降低功耗和複雜性。將精簡版(RedCap)5G數據機和非地面網路(NTN)衛星通訊支援直接整合到晶片上,使製造商能夠提供強大的獨立通訊能力,例如在偏遠地區發送緊急訊息,而無需擔心全性能數據機帶來的發熱問題。這種整合還支援更複雜的設備設計。高通在2025年8月的新聞稿中表示,最新架構中最佳化的射頻前端將組件尺寸縮小了約20%,加速了更緊湊的蜂巢智慧型手錶的發展。
The Global Smartwatch Chips Market is projected to expand from USD 2.12 Billion in 2025 to USD 3.95 Billion by 2031, reflecting a compound annual growth rate of 10.93%. These chips, which include specialized system-on-chip architectures, microcontrollers, and sensor fusion hubs, are engineered to drive the core functions of wearable wrist devices. They facilitate capabilities such as biometric health tracking, global positioning, and seamless wireless connectivity while adhering to rigorous thermal and spatial limitations. The market is largely driven by growing consumer interest in autonomous health telemetry and the integration of cellular features that allow independent operation from smartphones. Highlighting the scale of this connected ecosystem, the GSMA projected that total Internet of Things (IoT) connections would surpass 25 billion in 2025, underscoring the rising demand for advanced wearable semiconductors.
| Market Overview | |
|---|---|
| Forecast Period | 2027-2031 |
| Market Size 2025 | USD 2.12 Billion |
| Market Size 2031 | USD 3.95 Billion |
| CAGR 2026-2031 | 10.93% |
| Fastest Growing Segment | 64-bit |
| Largest Market | North America |
One major obstacle hindering broader market growth is the technical complexity of balancing high-performance processing with energy efficiency. As manufacturers incorporate power-demanding features like continuous glucose monitoring and 5G communication, maintaining sufficient battery life without increasing the device's physical size remains a significant engineering hurdle. This challenge complicates both chip design and fabrication, making it difficult to achieve the necessary performance within the compact form factors required for modern wearables.
Market Driver
The increasing adoption of advanced biometric and health monitoring capabilities acts as a primary catalyst for innovation within the smartwatch chip sector. Modern consumers necessitate wrist-worn devices that offer medical-grade telemetry, including continuous atrial fibrillation detection, sleep apnea analysis, and blood oxygen tracking. This demand compels semiconductor manufacturers to design sophisticated analog front-ends and sensor fusion hubs that can process intricate physiological signals with high precision while keeping power consumption low. The financial success of OEMs using these components validates this trend; for instance, Garmin Ltd. reported in its October 2024 results that revenue from its fitness segment grew 31% year-over-year to $464 million, fueled by strong demand for health-centric wearables.
Concurrently, the integration of on-device Artificial Intelligence and Machine Learning accelerators is reshaping chip architecture requirements. To minimize latency and improve data privacy, processing tasks are shifting from the cloud to the edge, requiring the inclusion of dedicated Neural Processing Units (NPUs) directly on the System-on-Chip (SoC). These accelerators support real-time functions like gesture recognition and personalized coaching without depleting the battery. The scale of the market for these components is immense; Qualcomm Incorporated reported annual revenue of $5.4 billion for its IoT business stream in November 2024, while Apple Inc. announced in October 2024 that its Wearables, Home, and Accessories category generated $9.04 billion in quarterly net sales, highlighting the massive ecosystem reliant on high-performance wearable semiconductors.
Market Challenge
The engineering struggle to balance high-performance processing with energy efficiency stands as a significant barrier to the growth of the Global Smartwatch Chips Market. As manufacturers strive to include power-hungry features like continuous biometric monitoring and 5G connectivity, they encounter the limitation of preserving battery life without enlarging the device. This conflict complicates the manufacturing process because standard semiconductor nodes frequently fail to meet the necessary thermal and power specifications. Consequently, chipmakers must transition to complex and expensive fabrication processes to attain the required efficiency, raising production costs and creating high barriers to entry that stifle broader market expansion and commoditization.
The industry's reliance on capital-intensive fabrication to solve these energy constraints is reflected in recent shifts in manufacturing capacity. According to SEMI, global leading-edge semiconductor capacity for 5nm nodes and smaller was projected to increase by 13% in 2024. This statistic emphasizes the expensive necessity of utilizing superior lithography technologies primarily to mitigate power inefficiencies. The substantial investment needed to secure such advanced capacity underscores the magnitude of the fabrication hurdle, limiting the ability of manufacturers to produce affordable, high-performance chipsets at the volume required for mass-market adoption across all price segments.
Market Trends
Native support for Bluetooth LE Audio and Auracast standards is transforming the connectivity landscape of the smartwatch chip market by replacing legacy protocols with energy-efficient, broadcast-ready architectures. This technological shift allows wearable SoCs to stream high-quality audio to multiple receivers simultaneously via Auracast, greatly improving the user experience for shared media and assistive listening without sacrificing battery endurance. Chipmakers are increasingly embedding these low-energy stacks directly into silicon to support the expanding ecosystem of next-generation peripherals. The scale of this transition is highlighted by the Bluetooth SIG's '2025 Bluetooth Market Update,' which projected global Bluetooth device shipments to exceed 5.3 billion units in 2025, driven largely by the integration of these advanced audio standards in wearables.
Additionally, embedded support for 5G RedCap and Cellular IoT connectivity represents a crucial advancement in wearable semiconductors, enabling devices to maintain autonomous wide-area network connections with reduced power and complexity. By integrating Reduced Capability (RedCap) 5G modems and Non-Terrestrial Network (NTN) satellite support directly onto the die, manufacturers can offer robust standalone communication features, such as emergency messaging in remote areas, without the thermal penalties of full-performance modems. This integration also allows for sleeker device designs; Qualcomm Incorporated noted in an August 2025 press release that the optimized radio frequency front end in their latest architecture reduced component size by approximately 20%, facilitating the creation of more compact cellular-enabled smartwatches.
Report Scope
In this report, the Global Smartwatch Chips Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:
Company Profiles: Detailed analysis of the major companies present in the Global Smartwatch Chips Market.
Global Smartwatch Chips Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report: