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2046806

互連和被動元件市場－全球產業規模、佔有率、趨勢、機會、預測：按元件、應用、地區和競爭對手分類，2021-2031年

Interconnects and Passive Components Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Component, By Application, By Region & Competition, 2021-2031F
出版日期: | 出版商: TechSci Research | 英文 192 Pages | 商品交期: 2-3個工作天內

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簡介目錄

全球互連和被動元件市場預計將從 2025 年的 2,016.2 億美元成長到 2031 年的 2,685 億美元，複合年成長率為 4.89%。

互連元件實現了設備間訊號和電力的傳輸，而電容器和電阻器等被動元件則控制電流，它們是電子電路不可或缺的物理和功能組成部分。目前，汽車產業的快速電氣化，特別是電動車動力傳動系統（EV）的製造，以及高速5G通訊基礎設施的廣泛部署，正在推動這一市場的發展。這些因素共同造就了對可靠且小型化元件的穩定需求。鑑於此穩步發展，德國電氣電子工業協會（ZVEI）預測，到2025年，全球電子元件市場將成長3%，並強調儘管面臨經濟挑戰，工業需求仍將持續存在。

市場概覽
預測期 2027-2031
市場規模：2025年 2016.2億美元
市場規模：2031年 2685億美元
複合年成長率：2026-2031年 4.89%
成長最快的細分市場 互連
最大的市場 亞太地區

然而，原物料價格的波動為該行業帶來了許多挑戰。銅、鎳、鈀等關鍵金屬價格的不可預測波動會損害製造利潤，並破壞供應鏈的穩定性。這種財務上的不確定性阻礙了長期生產計畫，迫使製造商頻繁調整定價策略，從而可能延遲大型整合專案所需零件的交付，並阻礙整體市場擴張。

市場促進因素

電動車 (EV) 和高級駕駛輔助系統 (ADAS) 的日益普及是互連和被動元件行業的主要驅動力。現代汽車架構需要更高密度的高壓連接器、積層陶瓷電容(MLCC) 和高精度電阻器，以支援電源管理系統、電池控制和自主感測模組。這種電氣化趨勢催生了對能夠處理更大電氣負載並承受嚴苛熱環境和振動環境的專用元件的強勁需求。國際能源總署 (IEA) 在其《2024 年全球電動車展望》中預測，到 2024 年全球電動車銷量將達到 1,700 萬輛，這一銷量激增與汽車電子產品需求的成長直接相關，也印證了這一發展勢頭。

同時，5G通訊基礎設施和超大規模資料中心的快速擴張正在重塑對高頻互連和小型化被動元件的需求。隨著網路密度不斷增加以支援人工智慧和物聯網應用，能夠確保大規模天線陣列和伺服器機架上訊號完整性和低延遲的元件至關重要。這種基礎設施的擴張得益於下一代連接技術的快速部署。根據愛立信2024年6月發布的《行動通訊報告》，光是2024年第一季，全球就新增了約1.6億5G用戶，需要持續的硬體升級。電子元件產業協會（ECIA）報告稱，其元件銷售信心指數在2024年8月升至108.4，反映了這些產業強勁表現的廣泛影響。這顯示被動元件和互連市場對成長的預期重燃。

市場挑戰

原物料價格波動是全球互連和被動元件市場面臨的主要限制因素，因為它會破壞維持穩定生產所需的成本結構。當銅、鎳等關鍵金屬的價格出現不可預測的波動時，製造商的營業利潤率會立即受到壓力。這種財務上的不確定性使得企業難以簽訂長期供應合約或維持終端用戶的穩定價格，往往導致庫存管理趨於謹慎，專案進度也因此延誤。因此，原本可以用來擴大生產規模或增加產能的資金，常常被挪用以因應這些波動的投入成本。

近期行業數據也印證了這些對財務表現的直接壓力。 2024年12月，IPC報告稱，45%的電子產品製造商面臨原物料成本上漲的問題。同時，利潤率和新訂單量均出現下滑。原料價格持續上漲，直接阻礙了行業平穩響應汽車和電信行業日益成長的需求，儘管應用領域需求強勁，但這些因素實際上限制了整體市場的成長潛力。

市場趨勢

市場正經歷著向超小型被動外形規格的顯著轉變，這主要是由於超大規模人工智慧伺服器和高效能運算叢集對元件密度的需求不斷成長。隨著資料中心架構的演進以適應生成式人工智慧工作負載，製造商被迫在日益緊湊的基板空間內整合數千個多層陶瓷電容器（MLCC），同時也要確保熱穩定性和電源效率。這種高密度趨勢意味著被動元件的單位體積電容必須顯著提高，以應對現代人工智慧加速器快速的負載波動。為了支持這一快速成長趨勢，村田製作所於2025年12月發布的《人工智慧伺服器MLCC成長預測》報告修訂了其對2030年前人工智慧伺服器MLCC出貨量的預測，預計複合年成長率將達到30%，理由是每個基板上的元件數量增加。

隨著小型化需求的成長，可生物分解和永續組件材料的出現已成為關鍵趨勢，從根本上區分了環境合規與單純的監管遵守。相關人員正積極致力於使用可回收生質塑膠和無毒合金設計互連和基板，以滿足循環經濟的要求，超越了基本的衝突礦產報告。這項轉型源於確保長期供應鏈韌性以及響應汽車和家用電子電器產業注重環境、社會和治理（ESG）的籌資策略的需求。 IPC於2025年4月發布的《變革之線》（Wired for Change）報告強調了這一戰略重點，報告顯示，59%的電子產品製造商正積極計劃在2025年擴大其永續材料計劃，以發揮其環境競爭優勢。

目錄

第1章概述

第2章：調查方法

第3章執行摘要

第4章：客戶心聲

第5章：互連與被動元件的全球市場展望

  • 市場規模及預測
    • 按金額
  • 市佔率及預測
    • 依組件（被動元件、互連組件）
    • 依應用領域（家用電子電器、IT及通訊、汽車、工業、航太及國防、醫療、其他）
    • 按地區
    • 按公司（2025 年）
  • 市場地圖

第6章：北美互連與被動元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 北美洲：國別分析
    • 美國
    • 加拿大
    • 墨西哥

第7章：歐洲互連與被動元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 歐洲：國別分析
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙

第8章：亞太地區互連及被動元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 亞太地區：國別分析
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲

第9章：中東和非洲互連和被動元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 中東與非洲：國別分析
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 南非

第10章：南美互連與被動元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 南美洲：國別分析
    • 巴西
    • 哥倫比亞
    • 阿根廷

第11章 市場動態

  • 促進因素
  • 任務

第12章 市場趨勢與發展

  • 併購
  • 產品發布
  • 近期趨勢

第13章 全球互連與被動元件市場：SWOT分析

第14章：波特五力分析

  • 產業競爭
  • 新進入者的潛力
  • 供應商的議價能力
  • 顧客權力
  • 替代品的威脅

第15章 競爭格局

  • TE Connectivity Corporation
  • Amphenol Corporation
  • Molex, LLC
  • Kyocera Corporation
  • AVX Corporation
  • Yageo Corporation
  • STMicroelectronics NV
  • Vishay Intertechnology, Inc.
  • Murata Manufacturing Co., Ltd.
  • KEMET Corporation

第16章 策略建議

第17章：關於研究公司及免責聲明

簡介目錄
Product Code: 20485

The Global Interconnects and Passive Components Market is projected to expand from USD 201.62 Billion in 2025 to USD 268.50 Billion by 2031, registering a CAGR of 4.89%. Interconnects facilitate the transmission of signals and power between devices, while passive components like capacitors and resistors regulate electrical flow, serving as the essential physical and functional units of electronic circuits. Currently, the market is driven by the rapid electrification of the automotive industry, specifically the manufacturing of electric vehicle powertrains, and the widespread rollout of high-speed 5G telecommunications infrastructure. These factors generate consistent demand for reliable, miniaturized components. Reflecting this steady progress, ZVEI projected that the global electronic components market would grow by 3 percent in 2025, highlighting continued industrial needs despite economic challenges.

Market Overview
Forecast Period2027-2031
Market Size 2025USD 201.62 Billion
Market Size 2031USD 268.50 Billion
CAGR 2026-20314.89%
Fastest Growing SegmentInterconnects
Largest MarketAsia Pacific

However, the sector encounters significant obstacles due to the volatility of raw material prices. Unpredictable cost fluctuations for essential metals such as copper, nickel, and palladium can damage manufacturing margins and interrupt supply chain stability. This fiscal uncertainty hinders long-term production planning and forces manufacturers to frequently adjust pricing strategies, which can delay the delivery of components needed for major integration projects and impede overall market expansion.

Market Driver

The escalating adoption of Electric Vehicles (EVs) and Advanced Driver-Assistance Systems (ADAS) acts as a primary catalyst for the interconnect and passive component industry. Modern automotive architectures demand a significantly higher density of high-voltage connectors, Multi-Layer Ceramic Capacitors (MLCCs), and precision resistors to support power management systems, battery controls, and autonomous sensing modules. This electrification trend creates a robust pipeline for specialized components capable of withstanding severe thermal and vibrational environments while managing heavier electrical loads. Highlighting this momentum, the International Energy Agency (IEA) projected in its 'Global EV Outlook 2024' that global electric car sales would reach 17 million units in 2024, a volume surge that directly correlates with increased demand for automotive-grade electronics.

Simultaneously, the rapid expansion of 5G telecommunications infrastructure and hyperscale data centers is reshaping demand for high-frequency interconnects and miniaturized passives. As network densification increases to support AI and IoT applications, there is a critical need for components that ensure signal integrity and low latency across massive antenna arrays and server racks. This infrastructure buildup is confirmed by the accelerated uptake of next-generation connectivity; Ericsson's 'Mobility Report' from June 2024 noted that approximately 160 million 5G subscriptions were added globally in the first quarter of 2024 alone, necessitating continuous hardware upgrades. Reflecting the broader impact of these sectoral upswings, the Electronic Components Industry Association (ECIA) reported that the component sales trend sentiment index rose to 108.4 in August 2024, indicating a return to positive growth expectations across the passive and interconnect markets.

Market Challenge

The volatility of raw material prices serves as a significant restraint on the Global Interconnects and Passive Components Market by destabilizing the cost structures required for consistent manufacturing. When the prices of essential metals like copper and nickel fluctuate unpredictably, manufacturers face immediate pressure on their operating margins. This financial unpredictability makes it difficult for companies to secure long-term supply contracts or maintain stable pricing for end clients, often resulting in cautious inventory management and delayed project timelines. Consequently, capital that would otherwise be invested in production scaling or capacity expansion is frequently diverted to absorb these variable input costs.

This direct strain on financial performance is substantiated by recent industry data. In December 2024, IPC reported that 45 percent of electronics manufacturers experienced rising material costs, a factor that coincided with a recorded contraction in profit margins and new orders. Such persistent inflationary pressure on inputs directly hampers the industry's ability to seamlessly meet the rising demand from the automotive and telecommunication sectors, effectively limiting the market's overall growth potential despite strong application drivers.

Market Trends

The market is experiencing a decisive shift toward ultra-miniature passive component form factors, driven primarily by the escalating density requirements of hyperscale AI servers and high-performance computing clusters. As data center architectures evolve to support generative AI workloads, manufacturers are compelled to integrate thousands of Multi-Layer Ceramic Capacitors (MLCCs) into increasingly compact board spaces without compromising thermal stability or power efficiency. This densification trend involves engineering passives with significantly higher capacitance per unit volume to handle the rapid load transients of modern AI accelerators. Underscoring this aggressive growth trajectory, Murata's 'AI Server MLCC Growth Forecast' from December 2025 revised its outlook for AI server-grade MLCC shipments, projecting a 30 percent compound annual growth rate (CAGR) through 2030 due to increased component counts per baseboard.

Concurrent with the demand for miniaturization, the emergence of biodegradable and sustainable component materials has solidified as a critical trend, fundamentally separating environmental compliance from mere regulatory adherence. Industry stakeholders are moving beyond basic conflict mineral reporting to actively engineering interconnects and substrates from recyclable bio-plastics and non-toxic alloys to meet circular economy mandates. This transition is motivated by the need to secure long-term supply chain resilience and appeal to ESG-conscious procurement strategies in the automotive and consumer electronics sectors. Highlighting this strategic prioritization, an April 2025 IPC report titled 'Wired for Change' revealed that 59 percent of electronics manufacturing companies are actively planning to expand their sustainable material initiatives in 2025 to capitalize on green competitive advantages.

Key Market Players

  • TE Connectivity Corporation
  • Amphenol Corporation
  • Molex, LLC
  • Kyocera Corporation
  • AVX Corporation
  • Yageo Corporation
  • STMicroelectronics N.V.
  • Vishay Intertechnology, Inc.
  • Murata Manufacturing Co., Ltd.
  • KEMET Corporation

Report Scope

In this report, the Global Interconnects and Passive Components Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Interconnects and Passive Components Market, By Component

  • Passive
  • Interconnects

Interconnects and Passive Components Market, By Application

  • Consumer Electronics
  • IT & Telecommunications
  • Automotive
  • Industrial
  • Aerospace & Defense
  • Healthcare
  • Others

Interconnects and Passive Components Market, By Region

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Interconnects and Passive Components Market.

Available Customizations:

Global Interconnects and Passive Components Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Interconnects and Passive Components Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Component (Passive, Interconnects)
    • 5.2.2. By Application (Consumer Electronics, IT & Telecommunications, Automotive, Industrial, Aerospace & Defense, Healthcare, Others)
    • 5.2.3. By Region
    • 5.2.4. By Company (2025)
  • 5.3. Market Map

6. North America Interconnects and Passive Components Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Component
    • 6.2.2. By Application
    • 6.2.3. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Interconnects and Passive Components Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Component
        • 6.3.1.2.2. By Application
    • 6.3.2. Canada Interconnects and Passive Components Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Component
        • 6.3.2.2.2. By Application
    • 6.3.3. Mexico Interconnects and Passive Components Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Component
        • 6.3.3.2.2. By Application

7. Europe Interconnects and Passive Components Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Component
    • 7.2.2. By Application
    • 7.2.3. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Interconnects and Passive Components Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Component
        • 7.3.1.2.2. By Application
    • 7.3.2. France Interconnects and Passive Components Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Component
        • 7.3.2.2.2. By Application
    • 7.3.3. United Kingdom Interconnects and Passive Components Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Component
        • 7.3.3.2.2. By Application
    • 7.3.4. Italy Interconnects and Passive Components Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Component
        • 7.3.4.2.2. By Application
    • 7.3.5. Spain Interconnects and Passive Components Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Component
        • 7.3.5.2.2. By Application

8. Asia Pacific Interconnects and Passive Components Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Component
    • 8.2.2. By Application
    • 8.2.3. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China Interconnects and Passive Components Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Component
        • 8.3.1.2.2. By Application
    • 8.3.2. India Interconnects and Passive Components Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Component
        • 8.3.2.2.2. By Application
    • 8.3.3. Japan Interconnects and Passive Components Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Component
        • 8.3.3.2.2. By Application
    • 8.3.4. South Korea Interconnects and Passive Components Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Component
        • 8.3.4.2.2. By Application
    • 8.3.5. Australia Interconnects and Passive Components Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Component
        • 8.3.5.2.2. By Application

9. Middle East & Africa Interconnects and Passive Components Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Component
    • 9.2.2. By Application
    • 9.2.3. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia Interconnects and Passive Components Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Component
        • 9.3.1.2.2. By Application
    • 9.3.2. UAE Interconnects and Passive Components Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Component
        • 9.3.2.2.2. By Application
    • 9.3.3. South Africa Interconnects and Passive Components Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Component
        • 9.3.3.2.2. By Application

10. South America Interconnects and Passive Components Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Component
    • 10.2.2. By Application
    • 10.2.3. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil Interconnects and Passive Components Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Component
        • 10.3.1.2.2. By Application
    • 10.3.2. Colombia Interconnects and Passive Components Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Component
        • 10.3.2.2.2. By Application
    • 10.3.3. Argentina Interconnects and Passive Components Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Component
        • 10.3.3.2.2. By Application

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global Interconnects and Passive Components Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. TE Connectivity Corporation
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. Amphenol Corporation
  • 15.3. Molex, LLC
  • 15.4. Kyocera Corporation
  • 15.5. AVX Corporation
  • 15.6. Yageo Corporation
  • 15.7. STMicroelectronics N.V.
  • 15.8. Vishay Intertechnology, Inc.
  • 15.9. Murata Manufacturing Co., Ltd.
  • 15.10. KEMET Corporation

16. Strategic Recommendations

17. About Us & Disclaimer