物聯網晶片市場－全球產業規模、佔有率、趨勢、機會、預測：按產品、最終用戶、地區和競爭對手分類，2021-2031年

全球物聯網晶片市場預計將經歷顯著成長，從 2025 年的 1.26 兆美元成長到 2031 年的 3.35 兆美元，複合年成長率為 17.70%。

這些專用積體電路，包括感測器、連接模組、儲存單元和微控制器，專為在互聯設備環境中實現資料處理和無線通訊而設計。市場擴張的主要驅動力是工業自動化對營運效率日益成長的需求，以及高速 5G 基礎設施的同步部署，這兩者都需要高效能的處理組件。這種強勁的需求也體現在更廣泛的組件產業中。根據世界半導體貿易統計（WSTS）的數據，包括關鍵物聯網處理器在內的邏輯積體電路類別預計在 2024 年將成長 16.9%。

儘管市場成長勢頭強勁，但仍面臨許多挑戰，包括大量設備互聯帶來的日益成長的隱私和安全風險。終端數量的激增擴大了網路威脅的潛在攻擊面，迫使製造商在複雜的加密技術和硬體級安全標準方面投入大量資金。對如此嚴格的安全通訊協定的需求往往會導致更高的開發成本和更長的上市時間，這可能會阻礙成本敏感型企業和消費者市場對該技術的接受速度。

市場促進因素

5G 和先進無線連接技術的部署是推動市場發展的根本動力，這促使半導體製造商生產能夠支援低延遲、高頻寬資料傳輸的積體電路。這種網路演進迫使半導體製造商開發節能型調變解調器和晶片，並增強其射頻性能，以滿足大規模機器通訊的需求。網路存取的改善與硬體部署直接相關，設備製造商需要相容的組件，才能在從自動駕駛汽車到遠端監控等各種應用中利用高速通訊。為了支持這項基礎設施的擴展，5G Americas 在 2024 年 6 月的新聞稿中指出，2024 年第一季全球 5G 無線連接數量達到 19 億，顯示用戶基數不斷擴大，足以支撐對先進連接模組的需求。

同時，邊緣運算和人工智慧的融合正將資料處理從雲端轉移到設備層面，從而改變組件架構。這一趨勢迫使晶片製造商在微控制器中整合加速器和專用神經網路處理單元，從而在工業和消費應用中實現自動化決策和即時分析。因此，對片上智慧的需求要求半導體效能顯著提升，以應對複雜的演算法工作負載。根據羅克韋爾自動化公司2024年2月發布的《智慧製造現狀》報告，83%的製造商計劃在2024年將生成式人工智慧應用於其運營，這將推動對能夠處理資料密集型任務的處理器的需求。為了滿足這些技術需求，SEMI預測2024年全球半導體製造產能將成長6%，確保供應鏈能夠因應智慧感測器和邏輯裝置產量的成長。

市場挑戰

全球物聯網晶片市場面臨的一大障礙是設備間連接日益普及帶來的安全和隱私風險。隨著連網設備數量的增加，網路威脅的潛在攻擊面也隨之擴大，進而在生態系統中造成嚴重的安全漏洞。這種情況迫使半導體製造商將硬體級安全措施和複雜的加密通訊協定直接整合到晶片設計中，以防止資料外洩和未授權存取。

這些嚴格的安全標準要求直接影響市場成長，導致新組件的開發成本增加，上市時間延長。實施安全區域和加密加速器所需的工程資源顯著提高了晶片的最終價格。因此，這些成本的增加可能會延緩工業物流和家用電子電器等對成本敏感的產業的採用。需要保護的設備數量龐大，也反映了安全負擔的沉重。根據GSMA預測，到2024年，獲得許可的蜂巢式物聯網連線數將達到35億，這意味著需要建置安全架構的終端數量極為龐大。保護如此龐大的基礎設施所帶來的財務和技術負擔，限制了製造商部署經濟實惠解決方案的速度。

市場趨勢

RISC-V 指令集架構的快速普及正在從根本上改變市場格局，它提供了一種無需授權的開放標準，可取代專有處理器設計。這種架構允許製造商客製化設計針對特定物聯網工作負載（例如嵌入式處理和超低功耗感測）最佳化的內核，而無需承擔傳統架構相關的高額專利費。這種柔軟性正在推動大規模出貨，領先的半導體製造商正將這些核心整合到其產品組合中，以增強供應鏈韌性和設計靈活性。根據 RISC-V International 於 2024 年 12 月發布的簡報，NVIDIA 預測僅在 2024 年一年內，RISC-V 核心的出貨量就將達到 10 億至 20 億顆，這凸顯了嵌入式應用領域向模組化架構的快速產業轉型。

同時，新一代無線標準（尤其是 Wi-Fi 7）的採用，滿足了本地設備網路中對確定性延遲和跨廠商互通性的關鍵需求。與 5G 專注於廣域覆蓋不同，Wi-Fi 7 利用多鏈路操作 (MLO) 等特性，可在多個頻段上同時傳輸數據，從而確保高密度工業IoT環境和頻寬密集型智慧家庭應用所需的可靠性。隨著設備製造商升級其連接模組以支援這些先進規範，這種演進正在商用硬體中迅速實現。根據 Wi-Fi 聯盟 2024 年 1 月發布的新聞稿《Wi-Fi Certified 7 正式發布》，預計到 2024 年，市場上將有超過 2.33 億台 Wi-Fi 7 設備，這標誌著向高效本地連接解決方案的重大轉變。

目錄

第1章概述

第2章：調查方法

第3章執行摘要

第4章：客戶心聲

第5章：全球物聯網晶片市場展望

• 市場規模及預測
  • 按金額
• 市佔率及預測
  • 依產品類別（處理器、感測器、連接積體電路、記憶體、邏輯裝置）
  • 按最終用戶（醫療、家用電子電器、工業、汽車、銀行、金融服務和保險、零售、建築自動化）
  • 按地區
  • 按公司（2025 年）
• 市場地圖

第6章：北美物聯網晶片市場展望

• 市場規模及預測
• 市佔率及預測
• 北美洲：國別分析
  • 美國
  • 加拿大
  • 墨西哥

第7章：歐洲物聯網晶片市場展望

• 市場規模及預測
• 市佔率及預測
• 歐洲：國別分析
  • 德國
  • 法國
  • 英國
  • 義大利
  • 西班牙

第8章：亞太地區物聯網晶片市場展望

• 市場規模及預測
• 市佔率及預測
• 亞太地區：國別分析
  • 中國
  • 印度
  • 日本
  • 韓國
  • 澳洲

第9章：中東和非洲物聯網晶片市場展望

• 市場規模及預測
• 市佔率及預測
• 中東與非洲：國別分析
  • 沙烏地阿拉伯
  • 阿拉伯聯合大公國
  • 南非

第10章：南美物聯網晶片市場展望

• 市場規模及預測
• 市佔率及預測
• 南美洲：國別分析
  • 巴西
  • 哥倫比亞
  • 阿根廷

第11章 市場動態

• 促進因素
• 任務

第12章 市場趨勢與發展

• 併購
• 產品發布
• 近期趨勢

第13章：全球物聯網晶片市場：SWOT分析

第14章：波特五力分析

• 產業競爭
• 新進入者的潛力
• 供應商的議價能力
• 顧客權力
• 替代品的威脅

第15章 競爭格局

• Intel Corporation
• Qualcomm Technologies, Inc.
• Texas Instruments Incorporated
• NXP Semiconductors NV
• Broadcom Inc.
• STMicroelectronics NV
• MediaTek Inc.
• Microchip Technology Inc.
• Renesas Electronics Corporation
• Infineon Technologies AG

第16章 策略建議

第17章：關於研究公司及免責聲明

The Global IoT Chips Market is projected to experience substantial growth, expanding from USD 1.26 Trillion in 2025 to USD 3.35 Trillion by 2031, reflecting a CAGR of 17.70%. These specialized integrated circuits, which encompass sensors, connectivity modules, memory units, and microcontrollers, are explicitly engineered to enable data processing and wireless communication within connected device ecosystems. This market expansion is primarily underpinned by the rising demand for operational efficiency via industrial automation and the simultaneous rollout of high-speed 5G infrastructure, both of which require high-performance processing components. This strong demand is mirrored in the broader component industry; according to World Semiconductor Trade Statistics, the Logic integrated circuit category, which includes essential IoT processors, was forecast to grow by 16.9 percent in 2024.

Despite this positive growth trajectory, the market encounters a major hurdle regarding the elevated privacy and security risks resulting from massive device interconnectivity. The rapid increase in endpoints widens the potential attack surface for cyber threats, necessitating that manufacturers invest significantly in complex encryption and hardware-level security standards. This need for strict security protocols often raises development costs and extends time-to-market, which potentially hinders the pace of adoption across cost-sensitive enterprise and consumer sectors.

Market Driver

The rollout of 5G and advanced wireless connectivity acts as a fundamental market driver, necessitating the production of integrated circuits capable of supporting low-latency and high-bandwidth data transmission. This network evolution compels semiconductor manufacturers to engineer chips with energy-efficient modems and enhanced radio frequency capabilities suitable for massive machine-type communications. Increased network accessibility is directly linked to hardware adoption, as device makers require compatible components to utilize faster speeds for applications ranging from autonomous vehicles to remote monitoring. Highlighting this infrastructure expansion, 5G Americas reported in a June 2024 press release that global 5G wireless connections rose to 1.9 billion in the first quarter of 2024, illustrating the growing foundation supporting the demand for advanced connectivity modules.

Simultaneously, the integration of edge computing and artificial intelligence is transforming component architecture by shifting data processing from the cloud to the device level. This trend forces chipmakers to embed accelerators and dedicated neural processing units within microcontrollers, enabling automated decision-making and real-time analytics in industrial and consumer applications. Consequently, the demand for on-chip intelligence necessitates substantial upgrades in semiconductor performance to manage complex algorithmic workloads. According to Rockwell Automation's 'State of Smart Manufacturing Report' from February 2024, 83 percent of manufacturers planned to deploy generative AI in their operations in 2024, driving the need for processors capable of data-intensive tasks. To meet these technological needs, SEMI projected that global semiconductor manufacturing capacity would rise by 6 percent in 2024, ensuring the supply chain can accommodate the increased volume of intelligent sensors and logic devices.

Market Challenge

The primary obstacle hindering the Global IoT Chips Market is the intensified security and privacy risk associated with widespread device interconnectivity. As the number of connected endpoints multiplies, the potential attack surface for cyber threats expands, creating critical vulnerabilities within the ecosystem. This situation compels semiconductor manufacturers to integrate hardware-level security measures and complex encryption protocols directly into their chip designs to prevent data breaches and unauthorized access.

This requirement for rigorous security standards directly impacts market growth by increasing development costs and extending the time-to-market for new components. The engineering resources required to implement secure enclaves and cryptographic accelerators significantly raise the final price of the chips. Consequently, cost-sensitive sectors such as industrial logistics and consumer electronics may delay adoption due to these rising expenses. The magnitude of this security burden is evident in the sheer volume of devices requiring protection; according to the GSMA, licensed cellular IoT connections reached 3.5 billion in 2024, representing a massive scale of endpoints that necessitate distinct security architecture. The financial and technical strain of securing such a vast infrastructure restricts the pace at which manufacturers can deploy affordable solutions.

Market Trends

The accelerated adoption of the RISC-V Instruction Set Architecture is fundamentally reshaping the market by offering a license-free, open-standard alternative to proprietary processor designs. This architecture allows manufacturers to custom-design cores optimized for specific IoT workloads, such as embedded processing or ultra-low power sensing, without the prohibitive royalty costs associated with traditional architectures. This flexibility is driving massive volume shipments as major semiconductor players integrate these cores into their portfolios to enhance supply chain resilience and design agility. According to the RISC-V International Newsletter from December 2024, NVIDIA estimated that it would ship between one and two billion RISC-V cores in 2024 alone, underscoring the rapid industrial transition toward this modular architecture for embedded applications.

Concurrently, the adoption of Next-Generation Wireless Standards, particularly Wi-Fi 7, is addressing the critical need for deterministic latency and cross-vendor interoperability within local device networks. Unlike the broad coverage focus of 5G, Wi-Fi 7 utilizes features like Multi-Link Operation (MLO) to simultaneously transmit data across multiple bands, ensuring the reliability required for dense industrial IoT environments and bandwidth-heavy smart home applications. This evolution is rapidly materializing in commercial hardware as device makers upgrade connectivity modules to support these advanced specifications. According to the Wi-Fi Alliance's January 2024 'Wi-Fi Certified 7 Arrives' press release, it was expected that more than 233 million Wi-Fi 7 devices would enter the market in 2024, signaling a major shift toward these high-efficiency local connectivity solutions.

Key Market Players

• Intel Corporation
• Qualcomm Technologies, Inc.
• Texas Instruments Incorporated
• NXP Semiconductors N.V.
• Broadcom Inc.
• STMicroelectronics N.V.
• MediaTek Inc.
• Microchip Technology Inc.
• Renesas Electronics Corporation
• Infineon Technologies AG

Report Scope

In this report, the Global IoT Chips Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

IoT Chips Market, By Product

• Processor
• Sensor
• Connectivity IC
• Memory Device
• logic Device

IoT Chips Market, By End-user

• Healthcare
• Consumer Electronics
• Industrial
• Automotive
• BFSI
• Retail
• Building Automation

IoT Chips Market, By Region

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
• Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
• South America
  • Brazil
  • Argentina
  • Colombia
• Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global IoT Chips Market.

Available Customizations:

Global IoT Chips Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global IoT Chips Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Product (Processor, Sensor, Connectivity IC, Memory Device, logic Device)
  • 5.2.2. By End-user (Healthcare, Consumer Electronics, Industrial, Automotive, BFSI, Retail, Building Automation)
  • 5.2.3. By Region
  • 5.2.4. By Company (2025)
• 5.3. Market Map

6. North America IoT Chips Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Product
  • 6.2.2. By End-user
  • 6.2.3. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States IoT Chips Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Product
      • 6.3.1.2.2. By End-user
  • 6.3.2. Canada IoT Chips Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Product
      • 6.3.2.2.2. By End-user
  • 6.3.3. Mexico IoT Chips Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Product
      • 6.3.3.2.2. By End-user

7. Europe IoT Chips Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Product
  • 7.2.2. By End-user
  • 7.2.3. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany IoT Chips Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Product
      • 7.3.1.2.2. By End-user
  • 7.3.2. France IoT Chips Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Product
      • 7.3.2.2.2. By End-user
  • 7.3.3. United Kingdom IoT Chips Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Product
      • 7.3.3.2.2. By End-user
  • 7.3.4. Italy IoT Chips Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Product
      • 7.3.4.2.2. By End-user
  • 7.3.5. Spain IoT Chips Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Product
      • 7.3.5.2.2. By End-user

8. Asia Pacific IoT Chips Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Product
  • 8.2.2. By End-user
  • 8.2.3. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China IoT Chips Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Product
      • 8.3.1.2.2. By End-user
  • 8.3.2. India IoT Chips Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Product
      • 8.3.2.2.2. By End-user
  • 8.3.3. Japan IoT Chips Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Product
      • 8.3.3.2.2. By End-user
  • 8.3.4. South Korea IoT Chips Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Product
      • 8.3.4.2.2. By End-user
  • 8.3.5. Australia IoT Chips Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Product
      • 8.3.5.2.2. By End-user

9. Middle East & Africa IoT Chips Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Product
  • 9.2.2. By End-user
  • 9.2.3. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia IoT Chips Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Product
      • 9.3.1.2.2. By End-user
  • 9.3.2. UAE IoT Chips Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Product
      • 9.3.2.2.2. By End-user
  • 9.3.3. South Africa IoT Chips Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Product
      • 9.3.3.2.2. By End-user

10. South America IoT Chips Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Product
  • 10.2.2. By End-user
  • 10.2.3. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil IoT Chips Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Product
      • 10.3.1.2.2. By End-user
  • 10.3.2. Colombia IoT Chips Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Product
      • 10.3.2.2.2. By End-user
  • 10.3.3. Argentina IoT Chips Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Product
      • 10.3.3.2.2. By End-user

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global IoT Chips Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. Intel Corporation
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. Qualcomm Technologies, Inc.
• 15.3. Texas Instruments Incorporated
• 15.4. NXP Semiconductors N.V.
• 15.5. Broadcom Inc.
• 15.6. STMicroelectronics N.V.
• 15.7. MediaTek Inc.
• 15.8. Microchip Technology Inc.
• 15.9. Renesas Electronics Corporation
• 15.10. Infineon Technologies AG

16. Strategic Recommendations

17. About Us & Disclaimer