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市場調查報告書
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1938926

藍牙IC市場－全球產業規模、佔有率、趨勢、機會及按類型、應用、地區和競爭格局分類的預測（2021-2031年）

Bluetooth IC Market - Global Industry Size, Share, Trends, Opportunity, and Forecast Segmented By Type, By Application, By Region & Competition, 2021-2031F
出版日期: | 出版商: TechSci Research | 英文 185 Pages | 商品交期: 2-3個工作天內

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簡介目錄

全球藍牙IC市場預計將從2025年的38.1億美元成長到2031年的48.6億美元，複合年成長率為4.14%。

藍牙積體電路（IC）是一種專用半導體，旨在利用2.4 GHz頻段實現短距離無線資料交換。推動這一成長的關鍵因素包括物聯網（IoT）生態系統和汽車產業對節能連接日益成長的需求，以及諸如用於音訊廣播的「Auracast」和用於高精度距離測量的「通道探測」等先進功能的推出。根據藍牙技術聯盟（Bluetooth SIG）預測，到2025年，藍牙設備的年出貨量預計將超過53億台。

市場概覽
預測期 2027-2031
市場規模：2025年 38.1億美元
市場規模：2031年 48.6億美元
複合年成長率：2026-2031年 4.14%
成長最快的細分市場 信標
最大的市場 北美洲

然而，在廣泛使用的2.4GHz頻段，頻譜擁塞問題為市場帶來了嚴峻挑戰。隨著無線設備密度的增加，訊號干擾日益普遍，可能導致效能和可靠性下降。對於業務營運至關重要的複雜工業環境而言，穩定、不間斷的通訊是保障業務正常運作的關鍵，而這個問題也成為部署該技術的巨大障礙。

市場促進因素

物聯網 (IoT) 生態系統的快速擴張是推動這一趨勢的關鍵因素，尤其體現在智慧家庭自動化和工業資產追蹤的廣泛應用上。藍牙 Mesh 等技術和新興的電子貨架標籤標準能夠建立可擴展的設備網路，使照明控制、感測器和標籤等設備能夠無縫通訊，而不會顯著增加電力消耗。這就需要大量專用積體電路 (IC) 來處理間歇性資料傳輸，並實現極高的能源效率。根據藍牙技術聯盟 (Bluetooth SIG) 於 2024 年 5 月發布的《2024 年藍牙市場更新報告》，預計到 2028 年，藍牙設備網路設備的年出貨量將達到 17.3 億台。

同時，穿戴式和可聽設備需求的激增正在加速低功耗音訊傳輸技術的創新。向真無線立體聲的過渡以及低功耗音訊標準的採用，迫使製造商部署能夠提供高音質和長續航時間的先進SoC解決方案。消費性電子產品的復甦正直接影響主要零件供應商的財務表現。例如，2024年10月，Nordic Semiconductor公佈第三季藍牙業務營收為1.431億美元，年增19%。這項技術的廣泛應用正在爆炸式成長，藍牙技術聯盟（SIG）預測，到2028年，藍牙設備的年出貨量將達到75億台。

市場挑戰

廣泛使用的2.4GHz頻寬的頻譜擁塞是全球藍牙IC市場擴張的一大障礙。由於此免許可頻段與包括Wi-Fi和Zigbee在內的多種無線技術共享，大量並發連接導致無線電環境擁塞，進而造成訊號干擾、資料封包遺失和不可預測的延遲。這種不穩定性在工業自動化和醫療應用領域尤其嚴重，因為可靠的資料傳輸是這些領域運作的關鍵，而對連接故障的擔憂正導致這些關鍵產業的潛在用戶推遲部署。

設備數量的持續成長加劇了這個問題，因為每次連接可用的空中頻寬都會減少。根據藍牙技術聯盟（Bluetooth SIG）預測，未來五年藍牙低功耗（Bluetooth Low Energy）設備的出貨量預計將以22%的複合年成長率成長，而新終端的激增加劇了對可用頻寬的競爭，並增加了訊號衝突的可能性。因此，頻寬的實體限制阻礙因素了藍牙技術的成長，並阻礙了其在複雜環境中的部署，而這些環境中不間斷的連接至關重要。

市場趨勢

藍牙頻道探測技術的應用正在改變市場格局，它能夠實現安全、高精度的測距功能，其精確度遠超傳統的接收訊號強度指示器 (RSSI) 方法。這一趨勢代表著技術向基於相位測距的演進，使設備能夠在數位密鑰和安全工業門禁控制等應用中以厘米級精度計算距離。與以往依賴訊號近似的測距方式不同，這種架構使高精度測距成為可能，直接解決了安全漏洞問題，並實現了強大的近距離認證。根據藍牙技術聯盟 (Bluetooth SIG) 發布的《2024 年藍牙市場更新報告》，預計到 2028 年，具備藍牙定位服務的設備的年出貨量將達到 5.63 億台。

同時，採用無電池和能源採集技術的藍牙物聯網架構的出現，正在為大規模資產視覺化創造一種新範式：環境（ Ambient IoT）。這一趨勢涉及部署能夠從無線電波、光和熱中收集能量的設備，從而有效消除供應鏈中電池更換帶來的維護難題。借助超低功耗無線設計，製造商現在能夠將連接功能嵌入到一次性低成本產品中，例如藥品包裝和物流標籤。根據藍牙科技聯盟（Bluetooth SIG）預測，智慧標籤（環境物聯網的關鍵應用案例之一）的年出貨量預計到2028年將達到2.31億個。

目錄

第1章概述

第2章調查方法

第3章執行摘要

第4章：客戶評價

第5章 全球藍牙IC市場展望

  • 市場規模及預測
    • 按金額
  • 市佔率及預測
    • 按類型（藍牙、低功耗藍牙、經典藍牙、其他）
    • 按應用領域（智慧家庭、信標、音訊設備、人機互動設備 (HID)、健康與健身、遙控器、汽車、工業、其他）
    • 按地區
    • 按公司（2025 年）
  • 市場地圖

第6章：北美藍牙IC市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 北美洲：國家分析
    • 美國
    • 加拿大
    • 墨西哥

第7章 歐洲藍牙IC市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 歐洲：國家分析
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙

第8章：亞太地區藍牙IC市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 亞太地區：國家分析
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲

第9章：中東和非洲藍牙IC市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 中東和非洲：國家分析
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 南非

第10章：南美洲藍牙IC市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 南美洲：國家分析
    • 巴西
    • 哥倫比亞
    • 阿根廷

第11章 市場動態

  • 促進要素
  • 任務

第12章 市場趨勢與發展

  • 併購
  • 產品發布
  • 最新進展

第13章：全球藍牙IC市場：SWOT分析

第14章：波特五力分析

  • 產業競爭
  • 新進入者的可能性
  • 供應商電力
  • 顧客權力
  • 替代品的威脅

第15章 競爭格局

  • Qualcomm Incorporated
  • Texas Instruments Incorporated
  • Nordic Semiconductor ASA
  • STMicroelectronics NV
  • Toshiba Corporation
  • NXP Semiconductors NV
  • Broadcom Inc.
  • Silicon Laboratories Inc.
  • Cypress Semiconductor Corporation
  • Microchip Technology Inc.

第16章 策略建議

第17章：關於研究公司及免責聲明

簡介目錄
Product Code: 20655

The Global Bluetooth IC Market is projected to grow from USD 3.81 Billion in 2025 to USD 4.86 Billion by 2031, registering a CAGR of 4.14%. A Bluetooth Integrated Circuit is a specialized semiconductor designed to facilitate wireless data exchange over short distances using the 2.4 GHz frequency band. The primary driver supporting this growth is the rising demand for energy-efficient connectivity within Internet of Things ecosystems and the automotive sector, alongside the implementation of advanced capabilities such as Auracast for broadcast audio and Channel Sounding for high-accuracy distance measurement. According to the Bluetooth Special Interest Group, annual Bluetooth device shipments are expected to exceed 5.3 billion units in 2025.

Market Overview
Forecast Period2027-2031
Market Size 2025USD 3.81 Billion
Market Size 2031USD 4.86 Billion
CAGR 2026-20314.14%
Fastest Growing SegmentBeacons
Largest MarketNorth America

However, the market faces a significant challenge regarding spectrum congestion in the widely used 2.4 GHz frequency band. As the density of wireless devices increases, signal interference becomes more prevalent, which can degrade performance or reliability. This issue presents a substantial barrier to deployment in complex industrial environments where stable and uninterrupted communication is essential for operations.

Market Driver

The rapid expansion of the Internet of Things ecosystem serves as a fundamental driver, specifically through the proliferation of smart home automation and industrial asset tracking. Technologies such as Bluetooth Mesh and the new Electronic Shelf Label standard are enabling scalable device networks where lighting controls, sensors, and tags communicate seamlessly without overburdening power reserves, necessitating high volumes of specialized Integrated Circuits capable of managing intermittent data transmission with extreme energy efficiency. According to the Bluetooth Special Interest Group's '2024 Bluetooth Market Update' from May 2024, annual shipments of Bluetooth device network equipment are projected to reach 1.73 billion units by 2028.

Simultaneously, the surging demand for wearable devices and hearables is accelerating innovation in low-power audio transmission. The transition to True Wireless Stereo and the adoption of LE Audio standards are compelling manufacturers to deploy advanced System-on-Chip solutions that deliver high-fidelity sound and extended battery life, a resurgence in consumer electronics consumption that directly impacts the financial performance of key component suppliers. For instance, Nordic Semiconductor reported in October 2024 that Bluetooth segment revenue rose to USD 143.1 million in Q3, marking a 19% increase year-on-year. Broadly, the technology's trajectory points toward massive ubiquity, with the Bluetooth Special Interest Group forecasting total annual Bluetooth device shipments to climb to 7.5 billion units by 2028.

Market Challenge

Spectrum congestion within the widely used 2.4 GHz frequency band constitutes a formidable barrier to the expansion of the Global Bluetooth IC Market. Since this unlicensed spectrum is utilized simultaneously by various wireless technologies, including Wi-Fi and Zigbee, the presence of numerous active connections creates a crowded radio environment that leads to signal interference, data packet loss, and unpredictable latency. Such instability is particularly detrimental in industrial automation and healthcare sectors where reliable data transmission is an operational mandate, often causing potential adopters in these critical fields to delay implementation due to fears of connection failure.

The continuous escalation of device volume further exacerbates this issue by reducing the available airtime for each connection. According to the Bluetooth Special Interest Group, shipments of Bluetooth Low Energy devices are projected to rise with a compound annual growth rate of 22 percent over the next five years, creating a rapid influx of new endpoints that intensifies competition for available bandwidth and increases the likelihood of signal collision. Therefore, the physical limitation of the frequency band acts as a constraint on growth, deterring deployment in complex environments where uninterrupted connectivity is essential.

Market Trends

The adoption of Bluetooth Channel Sounding is transforming the market by enabling secure, fine-ranging capabilities that far exceed the precision of traditional Received Signal Strength Indicator methods. This trend represents a technical evolution toward Phase-Based Ranging, allowing devices to calculate distance with centimeter-level accuracy for applications such as digital keys and secure industrial access control. Unlike previous generations that relied on signal approximation, this architecture operationalizes High-Accuracy Distance Measurement to directly address security vulnerabilities and enable robust proximity authentication. According to the Bluetooth Special Interest Group's '2024 Bluetooth Market Update,' annual shipments of Bluetooth location services devices are projected to reach 563 million units by 2028.

Simultaneously, the emergence of battery-free and energy-harvesting Bluetooth IoT architectures is creating a new paradigm for massive-scale asset visibility known as Ambient IoT. This trend involves the deployment of devices that harvest energy from radio waves, light, or heat, effectively eliminating the maintenance constraints associated with battery replacement in supply chains. By utilizing ultra-low-power radio designs, manufacturers can now embed connectivity into disposable or low-cost items like pharmaceutical packaging and logistics tags; according to the Bluetooth Special Interest Group, annual shipments of smart labels-a primary Ambient IoT use case-are projected to reach 231 million units by 2028.

Key Market Players

  • Qualcomm Incorporated
  • Texas Instruments Incorporated
  • Nordic Semiconductor ASA
  • STMicroelectronics N.V.
  • Toshiba Corporation
  • NXP Semiconductors N.V.
  • Broadcom Inc.
  • Silicon Laboratories Inc.
  • Cypress Semiconductor Corporation
  • Microchip Technology Inc.

Report Scope

In this report, the Global Bluetooth IC Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Bluetooth IC Market, By Type

  • Bluetooth
  • Bluetooth Low Energy
  • Bluetooth Classic
  • Others

Bluetooth IC Market, By Application

  • Smart Homes
  • Beacons
  • Audio Devices
  • Human Interface Devices (HID)
  • Health & Fitness
  • Remote Controls
  • Automotive
  • Industrial
  • Others

Bluetooth IC Market, By Region

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Bluetooth IC Market.

Available Customizations:

Global Bluetooth IC Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Bluetooth IC Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Type (Bluetooth, Bluetooth Low Energy, Bluetooth Classic, Others)
    • 5.2.2. By Application (Smart Homes, Beacons, Audio Devices, Human Interface Devices (HID), Health & Fitness, Remote Controls, Automotive, Industrial, Others)
    • 5.2.3. By Region
    • 5.2.4. By Company (2025)
  • 5.3. Market Map

6. North America Bluetooth IC Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Type
    • 6.2.2. By Application
    • 6.2.3. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Bluetooth IC Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Type
        • 6.3.1.2.2. By Application
    • 6.3.2. Canada Bluetooth IC Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Type
        • 6.3.2.2.2. By Application
    • 6.3.3. Mexico Bluetooth IC Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Type
        • 6.3.3.2.2. By Application

7. Europe Bluetooth IC Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Type
    • 7.2.2. By Application
    • 7.2.3. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Bluetooth IC Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Type
        • 7.3.1.2.2. By Application
    • 7.3.2. France Bluetooth IC Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Type
        • 7.3.2.2.2. By Application
    • 7.3.3. United Kingdom Bluetooth IC Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Type
        • 7.3.3.2.2. By Application
    • 7.3.4. Italy Bluetooth IC Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Type
        • 7.3.4.2.2. By Application
    • 7.3.5. Spain Bluetooth IC Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Type
        • 7.3.5.2.2. By Application

8. Asia Pacific Bluetooth IC Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Type
    • 8.2.2. By Application
    • 8.2.3. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China Bluetooth IC Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Type
        • 8.3.1.2.2. By Application
    • 8.3.2. India Bluetooth IC Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Type
        • 8.3.2.2.2. By Application
    • 8.3.3. Japan Bluetooth IC Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Type
        • 8.3.3.2.2. By Application
    • 8.3.4. South Korea Bluetooth IC Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Type
        • 8.3.4.2.2. By Application
    • 8.3.5. Australia Bluetooth IC Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Type
        • 8.3.5.2.2. By Application

9. Middle East & Africa Bluetooth IC Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Type
    • 9.2.2. By Application
    • 9.2.3. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia Bluetooth IC Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Type
        • 9.3.1.2.2. By Application
    • 9.3.2. UAE Bluetooth IC Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Type
        • 9.3.2.2.2. By Application
    • 9.3.3. South Africa Bluetooth IC Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Type
        • 9.3.3.2.2. By Application

10. South America Bluetooth IC Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Type
    • 10.2.2. By Application
    • 10.2.3. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil Bluetooth IC Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Type
        • 10.3.1.2.2. By Application
    • 10.3.2. Colombia Bluetooth IC Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Type
        • 10.3.2.2.2. By Application
    • 10.3.3. Argentina Bluetooth IC Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Type
        • 10.3.3.2.2. By Application

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global Bluetooth IC Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. Qualcomm Incorporated
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. Texas Instruments Incorporated
  • 15.3. Nordic Semiconductor ASA
  • 15.4. STMicroelectronics N.V.
  • 15.5. Toshiba Corporation
  • 15.6. NXP Semiconductors N.V.
  • 15.7. Broadcom Inc.
  • 15.8. Silicon Laboratories Inc.
  • 15.9. Cypress Semiconductor Corporation
  • 15.10. Microchip Technology Inc.

16. Strategic Recommendations

17. About Us & Disclaimer