查看購物車
  • English
  • Japanese
  • Korean
封面
市場調查報告書
商品編碼
1934229

3D IC封裝市場－全球產業規模、佔有率、趨勢、機會及預測（依技術、材料、產業垂直領域、地區及競爭格局分類，2021-2031年）

3D IC Packaging Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Technology, By Material, By Industry Vertical, By Region & Competition, 2021-2031F
出版日期: | 出版商: TechSci Research | 英文 186 Pages | 商品交期: 2-3個工作天內

價格

We offer 8 hour analyst time for an additional research. Please contact us for the details.

簡介目錄

全球 3D 積體電路封裝市場預計將從 2025 年的 155.4 億美元成長到 2031 年的 377.4 億美元，複合年成長率為 15.94%。

此市場的特點是互連積體電路晶粒的垂直堆疊，通常使用矽穿孔電極(TSV) 來形成整合的高性能元件。成長要素包括人工智慧領域對高效能運算的需求不斷成長、資料中心對低延遲的需求日益成長，以及家用電子電器對裝置小型化和能源效率的持續追求。

市場概覽
預測期 2027-2031
市場規模：2025年 155.4億美元
市場規模：2031年 377.4億美元
複合年成長率：2026-2031年 15.94%
成長最快的細分市場 3D 包裝疊裝
最大的市場 北美洲

根據SEMI產業數據，預計到2025年，全球半導體封裝材料市場規模將超過260億美元，凸顯了對先進互連技術的巨額投資。然而，該行業在溫度控管面臨嚴峻挑戰，有效散熱垂直堆疊矽層所需的複雜工程設計可能會阻礙市場普及。

市場促進因素

對高效能運算和人工智慧的強勁需求是推動3D IC封裝普及的主要動力。隨著人工智慧模式規模的擴大，傳統的2D封裝方式已無法滿足所需的頻寬和互連密度，迫使代工廠積極提升其垂直整合能力。例如，台積電經營團隊在2024年7月的「2024年第二季財報發布會」上宣布，計劃在2025年將其先進封裝產能較2024年加倍以上，以彌補產能缺口，並強調了現代計算性能對垂直堆疊技術的迫切需求。

同時，對低延遲、高頻寬記憶體日益成長的需求正在推動矽穿孔電極（TSV）技術的應用。製造商們正透過採用先進的3D封裝技術，將DRAM晶片直接晶粒在邏輯單元上，以解決記憶體瓶頸問題。 SK海力士於2024年4月宣布計劃投資38.7億美元在印第安納州建設一座先進的封裝和內存工廠，英特爾也計劃於2024年投資35億美元在其新墨西哥州工廠部署3D封裝技術，這些都印證了這一趨勢。

市場挑戰

溫度控管是限制全球3D IC封裝市場規模化發展的重大技術障礙。晶粒和記憶體晶片的垂直堆疊顯著提高了功率密度，形成難以用傳統方法冷卻的集中熱點。在這種架構中，內部層被周圍的矽層隔絕，導致熱量滯留，迫使處理器降低效能。這抵消了3D整合旨在實現的低延遲和高速優勢。

這種熱故障風險阻礙了製造商在安全關鍵型或成本敏感應用中採用該技術，限制了其廣泛應用。解決這些熱問題所需的複雜製造流程也減緩了產業的資本投入。 2024年7月，SEMI報告稱，全球組裝和封裝設備的年銷售額預計將達到44億美元。這一數字反映了該行業為克服這些重大技術挑戰而進行的持續調整。

市場趨勢

無凸塊銅-銅混合鍵結技術正加速發展，成為實現3D積體電路微縮的關鍵技術。此技術可實現小於10微米的互連間距，這是傳統微凸塊技術無法實現的。這種直接銅-銅鍵合技術能夠降低電阻並提高導熱性，因此對於高密度邏輯堆疊至關重要。 2024年5月，BE Semiconductor Industries NV宣布已訂單，標誌著該技術正在加速量產，也印證了這一轉變的勢頭。

同時，玻璃基板的出現正是為了解決大型封裝中有機核心的物理限制。玻璃基板具有優異的平整度和尺寸穩定性，這對於最大限度地減少翹曲和支援人工智慧加速器中的精細微影術圖案至關重要。這一轉變正在吸引大量投資。 2024年5月，SKC子公司Absolix根據《晶片技術創新與應用法案》（CHIPS Act）獲得了高達7,500萬美元的直接資金籌措，用於開發玻璃基板商業化設施，凸顯了這種材料在高效能運算領域的戰略重要性。

目錄

第1章概述

第2章調查方法

第3章執行摘要

第4章：客戶評價

第5章 全球3D IC封裝市場展望

  • 市場規模及預測
    • 按金額
  • 市佔率及預測
    • 依技術分類（3D矽穿孔、3D封裝疊封裝、3D扇出型封裝、3D焊線）
    • 依材料分類（有機基板、鍵合線、導線架、封裝樹脂、陶瓷封裝、晶片黏接材料）
    • 依產業分類（電子、工業、汽車及交通運輸、醫療保健、IT及通訊、航太及國防）
    • 按地區
    • 按公司（2025 年）
  • 市場地圖

第6章：北美3D IC封裝市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 北美洲：國家分析
    • 美國
    • 加拿大
    • 墨西哥

7. 歐洲3D IC封裝市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 歐洲：國家分析
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙

8. 亞太地區3D IC封裝市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 亞太地區：國家分析
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲

9. 中東和非洲3D IC封裝市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 中東和非洲：國家分析
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 南非

第10章：南美洲3D IC封裝市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 南美洲：國家分析
    • 巴西
    • 哥倫比亞
    • 阿根廷

第11章 市場動態

  • 促進要素
  • 任務

第12章 市場趨勢與發展

  • 併購
  • 產品發布
  • 最新進展

第13章 全球3D IC封裝市場：SWOT分析

第14章：波特五力分析

  • 產業競爭
  • 新進入者的可能性
  • 供應商電力
  • 顧客權力
  • 替代品的威脅

第15章 競爭格局

  • Taiwan Semiconductor Manufacturing Company
  • Samsung Electronics
  • Intel Corporation
  • Advanced Semiconductor Engineering Inc
  • Amkor Technology Inc.
  • Siliconware Precision Industries Co. Ltd.
  • United Microelectronics Corporation
  • Powertech Technology Inc.
  • JCET Group Co., Ltd.
  • Broadcom Inc.

第16章 策略建議

第17章：關於研究公司及免責聲明

簡介目錄
Product Code: 16221

The Global 3D IC Packaging Market is forecasted to expand from USD 15.54 Billion in 2025 to USD 37.74 Billion by 2031, registering a CAGR of 15.94%. This market is characterized by the vertical stacking of interconnected integrated circuit dies, generally utilizing Through-Silicon Vias to create a unified high-performance component. Key growth drivers include the rising demand for high-performance computing in artificial intelligence sectors and the critical need for lower latency in data centers, alongside the ongoing push for device miniaturization and power efficiency in consumer electronics.

Market Overview
Forecast Period2027-2031
Market Size 2025USD 15.54 Billion
Market Size 2031USD 37.74 Billion
CAGR 2026-203115.94%
Fastest Growing Segment3D Package on Package
Largest MarketNorth America

Industry data from SEMI indicates that the global market for semiconductor packaging materials is expected to surpass $26 billion by 2025, highlighting the significant capital being directed toward advanced interconnect technologies. However, the industry faces a major obstacle in thermal management, as the complex engineering required to effectively dissipate heat from vertically stacked silicon layers poses a risk to broader market adoption.

Market Driver

The intense demand for high-performance computing and artificial intelligence serves as the main engine for 3D IC packaging adoption. As AI models increase in size, standard 2D scaling is unable to deliver the required bandwidth and interconnect density, prompting foundries to aggressively boost their vertical integration capabilities. For instance, TSMC management stated during the 'Second Quarter 2024 Earnings Conference' in July 2024 that they plan to more than double their advanced packaging capacity in 2025 compared to 2024 to meet this supply gap, underscoring the necessity of vertical stacking for modern computing performance.

Concurrently, the need for low-latency and high-bandwidth memory is driving the implementation of Through-Silicon Via technology. Manufacturers are addressing the memory wall by stacking DRAM dies directly onto logic units through advanced 3D packaging. This trend is evidenced by SK Hynix's April 2024 announcement of a projected $3.87 billion investment to build an advanced packaging and memory facility in Indiana, as well as Intel Corporation's 2024 operationalization of a $3.5 billion investment to equip its New Mexico plant for 3D packaging technologies.

Market Challenge

Thermal management acts as a significant technical barrier that constrains the scalability of the Global 3D IC Packaging Market. Vertical stacking of logic and memory dies drastically increases power density, resulting in concentrated hotspots that are difficult to cool with conventional methods. In these architectures, inner layers are insulated by surrounding silicon, trapping heat and forcing processors to throttle performance, which negates the low-latency and high-speed advantages intended by 3D integration.

This risk of thermal-induced failure makes manufacturers reluctant to utilize these architectures in safety-critical or cost-sensitive applications, thereby limiting widespread adoption. The complex manufacturing processes needed to resolve these thermal issues also slow sector capitalization; SEMI reported in July 2024 that global sales for assembly and packaging equipment were forecast to reach $4.4 billion for the year, a figure that reflects the industry's ongoing calibration to overcome these substantial engineering hurdles.

Market Trends

The uptake of Bumpless Cu-Cu Hybrid Bonding is accelerating as a key enabler for 3D IC scaling, allowing for interconnect pitches under 10 microns that traditional micro-bumps cannot achieve. This direct copper-to-copper technique lowers electrical resistance and enhances thermal conductivity, becoming essential for high-density logic stacking. The momentum of this transition was highlighted by BE Semiconductor Industries N.V. in May 2024, when the company announced an order for 26 hybrid bonding systems from a major logic manufacturer, indicating a production ramp-up for this technology.

Simultaneously, Glass Core Substrates are emerging to address the physical limitations of organic cores in larger packages. Glass substrates provide superior flatness and dimensional stability, which are critical for minimizing warpage and supporting fine lithography patterns in AI accelerators. This shift is attracting major investment, as seen in May 2024 when SKC subsidiary Absolics secured up to $75 million in direct funding under the CHIPS Act to commercialize a facility for glass substrates, underlining the strategic importance of this material for high-performance computing.

Key Market Players

  • Taiwan Semiconductor Manufacturing Company
  • Samsung Electronics
  • Intel Corporation
  • Advanced Semiconductor Engineering Inc
  • Amkor Technology Inc.
  • Siliconware Precision Industries Co. Ltd.
  • United Microelectronics Corporation
  • Powertech Technology Inc.
  • JCET Group Co., Ltd.
  • Broadcom Inc.

Report Scope

In this report, the Global 3D IC Packaging Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

3D IC Packaging Market, By Technology

  • 3D Through silicon via
  • 3D Package on Package
  • 3D Fan Out Based
  • 3D Wire Bonded

3D IC Packaging Market, By Material

  • Organic Substrate
  • Bonding Wire
  • Leadframe
  • Encapsulation Resin
  • Ceramic Package
  • Die Attach Material

3D IC Packaging Market, By Industry Vertical

  • Electronics
  • Industrial
  • Automotive & Transport
  • Healthcare
  • IT & Telecommunication
  • Aerospace & Defense

3D IC Packaging Market, By Region

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global 3D IC Packaging Market.

Available Customizations:

Global 3D IC Packaging Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global 3D IC Packaging Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Technology (3D Through silicon via, 3D Package on Package, 3D Fan Out Based, 3D Wire Bonded)
    • 5.2.2. By Material (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin, Ceramic Package, Die Attach Material)
    • 5.2.3. By Industry Vertical (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense)
    • 5.2.4. By Region
    • 5.2.5. By Company (2025)
  • 5.3. Market Map

6. North America 3D IC Packaging Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Technology
    • 6.2.2. By Material
    • 6.2.3. By Industry Vertical
    • 6.2.4. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States 3D IC Packaging Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Technology
        • 6.3.1.2.2. By Material
        • 6.3.1.2.3. By Industry Vertical
    • 6.3.2. Canada 3D IC Packaging Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Technology
        • 6.3.2.2.2. By Material
        • 6.3.2.2.3. By Industry Vertical
    • 6.3.3. Mexico 3D IC Packaging Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Technology
        • 6.3.3.2.2. By Material
        • 6.3.3.2.3. By Industry Vertical

7. Europe 3D IC Packaging Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Technology
    • 7.2.2. By Material
    • 7.2.3. By Industry Vertical
    • 7.2.4. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany 3D IC Packaging Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Technology
        • 7.3.1.2.2. By Material
        • 7.3.1.2.3. By Industry Vertical
    • 7.3.2. France 3D IC Packaging Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Technology
        • 7.3.2.2.2. By Material
        • 7.3.2.2.3. By Industry Vertical
    • 7.3.3. United Kingdom 3D IC Packaging Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Technology
        • 7.3.3.2.2. By Material
        • 7.3.3.2.3. By Industry Vertical
    • 7.3.4. Italy 3D IC Packaging Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Technology
        • 7.3.4.2.2. By Material
        • 7.3.4.2.3. By Industry Vertical
    • 7.3.5. Spain 3D IC Packaging Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Technology
        • 7.3.5.2.2. By Material
        • 7.3.5.2.3. By Industry Vertical

8. Asia Pacific 3D IC Packaging Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Technology
    • 8.2.2. By Material
    • 8.2.3. By Industry Vertical
    • 8.2.4. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China 3D IC Packaging Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Technology
        • 8.3.1.2.2. By Material
        • 8.3.1.2.3. By Industry Vertical
    • 8.3.2. India 3D IC Packaging Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Technology
        • 8.3.2.2.2. By Material
        • 8.3.2.2.3. By Industry Vertical
    • 8.3.3. Japan 3D IC Packaging Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Technology
        • 8.3.3.2.2. By Material
        • 8.3.3.2.3. By Industry Vertical
    • 8.3.4. South Korea 3D IC Packaging Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Technology
        • 8.3.4.2.2. By Material
        • 8.3.4.2.3. By Industry Vertical
    • 8.3.5. Australia 3D IC Packaging Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Technology
        • 8.3.5.2.2. By Material
        • 8.3.5.2.3. By Industry Vertical

9. Middle East & Africa 3D IC Packaging Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Technology
    • 9.2.2. By Material
    • 9.2.3. By Industry Vertical
    • 9.2.4. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia 3D IC Packaging Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Technology
        • 9.3.1.2.2. By Material
        • 9.3.1.2.3. By Industry Vertical
    • 9.3.2. UAE 3D IC Packaging Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Technology
        • 9.3.2.2.2. By Material
        • 9.3.2.2.3. By Industry Vertical
    • 9.3.3. South Africa 3D IC Packaging Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Technology
        • 9.3.3.2.2. By Material
        • 9.3.3.2.3. By Industry Vertical

10. South America 3D IC Packaging Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Technology
    • 10.2.2. By Material
    • 10.2.3. By Industry Vertical
    • 10.2.4. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil 3D IC Packaging Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Technology
        • 10.3.1.2.2. By Material
        • 10.3.1.2.3. By Industry Vertical
    • 10.3.2. Colombia 3D IC Packaging Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Technology
        • 10.3.2.2.2. By Material
        • 10.3.2.2.3. By Industry Vertical
    • 10.3.3. Argentina 3D IC Packaging Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Technology
        • 10.3.3.2.2. By Material
        • 10.3.3.2.3. By Industry Vertical

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global 3D IC Packaging Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. Taiwan Semiconductor Manufacturing Company
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. Samsung Electronics
  • 15.3. Intel Corporation
  • 15.4. Advanced Semiconductor Engineering Inc
  • 15.5. Amkor Technology Inc.
  • 15.6. Siliconware Precision Industries Co. Ltd.
  • 15.7. United Microelectronics Corporation
  • 15.8. Powertech Technology Inc.
  • 15.9. JCET Group Co., Ltd.
  • 15.10. Broadcom Inc.

16. Strategic Recommendations

17. About Us & Disclaimer