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市場調查報告書
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1934201

乙太網路供電晶片組市場 - 全球產業規模、佔有率、趨勢、機會及預測（按類型、標準、最終用途、設備、地區和競爭格局分類），2021-2031年

Power Over Ethernet Chipsets Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Type, By Standard, By End-use, By Device, By Region & Competition, 2021-2031F
出版日期: | 出版商: TechSci Research | 英文 180 Pages | 商品交期: 2-3個工作天內

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簡介目錄

全球乙太網路供電 (PoE) 晶片組市場預計將從 2025 年的 27.8 億美元大幅成長至 2031 年的 55.7 億美元，複合年成長率為 12.28%。

這些晶片組是積體電路，對於管理乙太網路線纜上資料和電力的同步傳輸至關重要。推動這一市場成長的主要因素是對經濟高效且靈活的網路基礎設施日益成長的需求，以支援無線網路基地台和IP攝影機等物聯網終端。根據乙太網路聯盟2024年的調查，33%的受訪者計劃在未來一年內部署高功率PoE設備（超過51瓦），這顯示高容量供電系統的應用顯著增加。這直接推動了對先進晶片組的需求。

市場概覽
預測期 2027-2031
市場規模：2025年 27.8億美元
市場規模：2031年 55.7億美元
複合年成長率：2026-2031年 12.28%
成長最快的細分市場 支援 PoE 的設備 (PD) 晶片組
最大的市場 北美洲

然而，市場在專有解決方案和不同設備標準的互通性方面面臨重大挑戰。相容性問題可能導致電源故障和設備失靈，使網路管理員在考慮基礎設施升級時猶豫不決。因此，確保在多樣化的硬體生態系統中實現一致的性能仍然是製造商必須克服的關鍵障礙，才能獲得廣泛的市場認可。

市場促進因素

智慧建築自動化和互聯照明網路的普及是推動先進乙太網路供電（PoE）晶片組應用的主要因素。隨著商業建築日益注重集中管理和能源效率，PoE技術正被廣泛部署，透過單一乙太網路線為人體感應器、智慧照明系統和暖通空調控制器供電。這種融合無需單獨的電氣佈線，有助於設施管理人員降低資本支出和安裝複雜性。智慧家庭與建築協會（Association for Smarter Homes & Buildings）2025年12月發布的一份報告顯示，91%的受訪者已經在使用智慧建築系統，這凸顯了自動化基礎設施的廣泛整合，而這些基礎設施需要先進的晶片組來管理動態功率負載並確保終端之間的無縫通訊。

同時，Wi-Fi 6/7網路基地台和 5G小型基地台的快速部署正在重塑市場格局，因為它們需要更快的資料吞吐量和更高的功率等級。現代無線網路基地台，尤其是支援 Wi-Fi 7 標準的存取點，依賴強大的 PoE++ 解決方案才能在不降低效能的情況下實現最佳運作。根據無線寬頻聯盟 (Wireless Broadband Alliance) 2025 年 12 月發布的行業報告，19% 的企業高管已經採用了 Wi-Fi 7 標準，這標誌著向依賴高性能晶片的下一代連接技術的快速過渡。此外，愛立信預測到 2025 年 5G 用戶數量將達到 29 億，PoE 在小型基地台回程傳輸中的應用正在不斷擴展，迫使製造商優先考慮符合 IEEE 802.3bt 標準的晶片組，以支援這些高功耗技術。

市場挑戰

專有解決方案和不同設備標準之間的互通性挑戰仍然是全球乙太網路供電晶片組市場成長的一大障礙。當晶片組未能嚴格遵循通用通訊協定時，網路管理員將面臨設備故障或完全斷電的高風險。這種技術上的不一致造成了運作上的不確定性，並使買家對將新終端整合到現有基礎設施中猶豫不決。隨著生態系統日益複雜，對投資不相容的硬體的擔憂成為瓶頸，阻礙了先進供電系統的無縫應用。

市場對此問題的敏感度已在近期的採購趨勢中明顯反映。乙太網路聯盟的一項調查顯示，2024年接受調查的PoE專業人士中，96%表示乙太網路聯盟的認證會影響他們的採購決策，這表明市場上的大多數人檢驗未經驗證的互通性是一個關鍵風險。因此，設備相容性方面的普遍不確定性直接限制了新晶片組的潛在市場。相關人員正在推遲採購，以避免不合規基礎設施帶來的財務和技術影響。

市場趨勢

工業IoT領域中營運技術 (OT) 和資訊技術 (IT) 網路的融合正在從根本上改變晶片組的需求。隨著工廠從傳統的現場匯流排匯流排架構轉向以乙太網路為基礎的整合基礎設施，對能夠直接透過數據線為致動器和感測器供電的堅固耐用型 PoE 晶片組的需求激增。這項變更簡化了惡劣環境下的佈線，並促進了預測性維護所需的無縫資料流。為了支持這項轉型，HMS Networks 報告稱，到 2024 年 6 月，工廠自動化中 71% 的新增節點將採用工業乙太網，這證實了支援高級供電的標準乙太通訊協定的優越性。

同時，低待機功耗設計和節能架構的進步已成為晶片組設計的關鍵因素。製造商正積極最佳化矽架構，以滿足嚴格的環境法規並最大限度地降低功率損耗，尤其是在長時間處於閒置狀態的設備中。這種對綠色技術的關注正在推動負責的矽解決方案的生產，從而減少大規模網路部署的碳足跡。例如，意法半導體在其2024年4月發布的《永續發展報告》中指出，其82%的新產品因其低碳特性和高能效而被歸類為“負責任的產品”，這反映了整個產業對永續發展表現的重視。

目錄

第1章概述

第2章調查方法

第3章執行摘要

第4章：客戶評價

第5章 全球乙太網路供電晶片組市場展望

  • 市場規模及預測
    • 按金額
  • 市佔率及預測
    • 按類型（PoE供電設備（PSE）晶片組、PoE受電設備（PD）晶片組）
    • 依標準（802.3af 標準、802.3at 標準、802.3bt 標準）
    • 按用途（商業、工業、住宅）
    • 依裝置分類（網路攝影機、VoIP電話、乙太網路切換器和注入器、無線Wi-Fi網路基地台、接近感測器、LED照明）
    • 按地區
    • 按公司（2025 年）
  • 市場地圖

6. 北美乙太網路供電晶片組市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 北美洲：國家分析
    • 美國
    • 加拿大
    • 墨西哥

7. 歐洲乙太網路供電晶片組市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 歐洲：國家分析
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙

8. 亞太地區乙太網路供電晶片組市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 亞太地區：國家分析
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲

9. 中東與非洲乙太網路供電晶片組市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 中東和非洲：國家分析
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 南非

10. 南美洲乙太網路供電晶片組市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 南美洲：國家分析
    • 巴西
    • 哥倫比亞
    • 阿根廷

第11章 市場動態

  • 促進要素
  • 任務

第12章 市場趨勢與發展

  • 併購
  • 產品發布
  • 最新進展

第13章：全球乙太網路供電晶片組市場：SWOT分析

第14章：波特五力分析

  • 產業競爭
  • 新進入者的可能性
  • 供應商電力
  • 顧客權力
  • 替代品的威脅

第15章 競爭格局

  • Analog Devices, Inc.
  • Cisco Systems Inc.
  • Microchip Technology Inc.
  • Monolithic Power Systems Inc.
  • NXP Semiconductors NV
  • On Semiconductor Corporation
  • Semtech Corporation
  • Silicon Laboratories Inc.
  • STMicroelectronics NV
  • Texas Instruments Incorporated

第16章 策略建議

第17章：關於研究公司及免責聲明

簡介目錄
Product Code: 20695

The Global Power Over Ethernet Chipsets Market is projected to expand significantly, growing from USD 2.78 Billion in 2025 to USD 5.57 Billion by 2031 at a CAGR of 12.28%. These chipsets are integrated circuits essential for managing the concurrent transmission of data and electrical power through Ethernet cabling. The primary catalyst for this market growth is the increasing demand for cost-effective and flexible network infrastructure to support Internet of Things endpoints, such as wireless access points and IP cameras. According to the Ethernet Alliance, 33 percent of respondents in a 2024 survey intended to deploy high-power PoE devices exceeding 51 watts within the coming year, indicating a measurable rise in the adoption of higher-capacity power delivery systems that directly fuels the demand for advanced chipsets.

Market Overview
Forecast Period2027-2031
Market Size 2025USD 2.78 Billion
Market Size 2031USD 5.57 Billion
CAGR 2026-203112.28%
Fastest Growing SegmentPoE Powered Devices (PD) Chipset
Largest MarketNorth America

However, the market faces a substantial challenge regarding the interoperability of proprietary solutions and varying equipment standards. Incompatibility issues can lead to power delivery failures or device malfunctions, causing network administrators to hesitate when considering infrastructure upgrades. Consequently, ensuring consistent performance across diverse hardware ecosystems remains a significant hurdle that manufacturers must overcome to achieve broad market acceptance.

Market Driver

The proliferation of Smart Building Automation and Connected Lighting Networks acts as a major force driving the adoption of advanced Power over Ethernet chipsets. As commercial facilities focus on centralized control and energy efficiency, PoE technology is increasingly deployed to power occupancy sensors, intelligent lighting systems, and HVAC controllers via a single Ethernet cable. This convergence removes the need for separate electrical wiring, thereby lowering capital expenditures and reducing installation complexity for facility managers. Data from the Association for Smarter Homes & Buildings' December 2025 report reveals that 91% of respondents are already utilizing smart building systems, highlighting a widespread integration of automated infrastructure that necessitates sophisticated chipsets capable of managing dynamic power loads and ensuring seamless endpoint communication.

Simultaneously, the rapid deployment of Wi-Fi 6/7 Access Points and 5G Small Cells is reshaping the market by requiring faster data throughput and higher power levels. Modern wireless access points, especially those supporting the Wi-Fi 7 standard, depend on robust PoE++ solutions to operate optimally without performance loss. According to the Wireless Broadband Alliance's December 2025 industry report, 19% of executives have already deployed the Wi-Fi 7 standard, signaling a swift shift toward next-generation connectivity that relies on high-performance silicon. Furthermore, as Ericsson projects 5G subscriptions to reach 2.9 billion in 2025, the use of PoE for backhauling small cells is expanding, compelling manufacturers to prioritize chipsets compliant with IEEE 802.3bt standards to support these power-intensive technologies.

Market Challenge

The challenge of interoperability among proprietary solutions and different equipment standards remains a critical barrier hindering the growth of the Global Power Over Ethernet Chipsets Market. When chipsets fail to strictly adhere to universal protocols, network administrators face a high risk of device malfunctions or complete power delivery failures. This technical inconsistency creates operational volatility, causing buyers to hesitate before integrating new endpoints into their existing infrastructure. As the ecosystem grows more complex, the fear of investing in incompatible hardware acts as a bottleneck, preventing the seamless deployment of advanced power delivery systems.

The market's sensitivity to this issue is clearly reflected in recent purchasing trends. According to the Ethernet Alliance, 96 percent of PoE professionals surveyed in 2024 indicated that Ethernet Alliance certification would influence their buying decisions, demonstrating that the vast majority of the market considers unverified interoperability a disqualifying risk. Consequently, pervasive uncertainty regarding equipment compatibility directly limits the addressable market for new chipsets, as stakeholders delay procurement to avoid the financial and technical repercussions of non-compliant infrastructure.

Market Trends

The convergence of Operational Technology (OT) and IT networks within the Industrial IoT sector is fundamentally altering chipset requirements. As factories transition from legacy fieldbus architectures to unified Ethernet-based infrastructures, there is a critical need for ruggedized PoE chipsets capable of powering actuators and sensors directly from the data cable. This shift simplifies cabling in harsh environments and facilitates seamless data flow for predictive maintenance. Highlighting this transition, HMS Networks reported in June 2024 that Industrial Ethernet captured 71% of all newly installed nodes in factory automation, confirming the dominance of standard Ethernet protocols that support advanced power delivery.

Concurrently, the advancement of Low-Standby Power Designs and Energy-Efficient architectures has become a decisive factor in chipset engineering. Manufacturers are aggressively optimizing silicon architectures to adhere to strict environmental regulations and minimize power loss, particularly for devices that remain idle for long periods. This focus on green technology is driving the production of responsible silicon solutions that reduce the carbon footprint of large-scale network deployments. For instance, STMicroelectronics noted in its April 2024 Sustainability Report that 82% of its new products were categorized as responsible due to their low-carbon characteristics and power efficiency, reflecting an industry-wide prioritization of sustainable performance.

Key Market Players

  • Analog Devices, Inc.
  • Cisco Systems Inc.
  • Microchip Technology Inc.
  • Monolithic Power Systems Inc.
  • NXP Semiconductors N.V.
  • On Semiconductor Corporation
  • Semtech Corporation
  • Silicon Laboratories Inc.
  • STMicroelectronics N.V.
  • Texas Instruments Incorporated

Report Scope

In this report, the Global Power Over Ethernet Chipsets Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Power Over Ethernet Chipsets Market, By Type

  • PoE Power Sourcing Equipment (PSE) Chipset
  • PoE Powered Devices (PD) Chipset

Power Over Ethernet Chipsets Market, By Standard

  • 802.3af standard
  • 802.3at standard
  • 802.3bt standard

Power Over Ethernet Chipsets Market, By End-use

  • Commercial
  • Industrial
  • Residential

Power Over Ethernet Chipsets Market, By Device

  • Network Cameras
  • VoIP Phone
  • Ethernet Switch & Injector
  • Wireless Radio Access Point
  • Proximity Sensor
  • LED lighting

Power Over Ethernet Chipsets Market, By Region

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Power Over Ethernet Chipsets Market.

Available Customizations:

Global Power Over Ethernet Chipsets Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Power Over Ethernet Chipsets Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Type (PoE Power Sourcing Equipment (PSE) Chipset, PoE Powered Devices (PD) Chipset)
    • 5.2.2. By Standard (802.3af standard, 802.3at standard, 802.3bt standard)
    • 5.2.3. By End-use (Commercial, Industrial, Residential)
    • 5.2.4. By Device (Network Cameras, VoIP Phone, Ethernet Switch & Injector, Wireless Radio Access Point, Proximity Sensor, LED lighting)
    • 5.2.5. By Region
    • 5.2.6. By Company (2025)
  • 5.3. Market Map

6. North America Power Over Ethernet Chipsets Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Type
    • 6.2.2. By Standard
    • 6.2.3. By End-use
    • 6.2.4. By Device
    • 6.2.5. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Power Over Ethernet Chipsets Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Type
        • 6.3.1.2.2. By Standard
        • 6.3.1.2.3. By End-use
        • 6.3.1.2.4. By Device
    • 6.3.2. Canada Power Over Ethernet Chipsets Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Type
        • 6.3.2.2.2. By Standard
        • 6.3.2.2.3. By End-use
        • 6.3.2.2.4. By Device
    • 6.3.3. Mexico Power Over Ethernet Chipsets Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Type
        • 6.3.3.2.2. By Standard
        • 6.3.3.2.3. By End-use
        • 6.3.3.2.4. By Device

7. Europe Power Over Ethernet Chipsets Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Type
    • 7.2.2. By Standard
    • 7.2.3. By End-use
    • 7.2.4. By Device
    • 7.2.5. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Power Over Ethernet Chipsets Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Type
        • 7.3.1.2.2. By Standard
        • 7.3.1.2.3. By End-use
        • 7.3.1.2.4. By Device
    • 7.3.2. France Power Over Ethernet Chipsets Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Type
        • 7.3.2.2.2. By Standard
        • 7.3.2.2.3. By End-use
        • 7.3.2.2.4. By Device
    • 7.3.3. United Kingdom Power Over Ethernet Chipsets Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Type
        • 7.3.3.2.2. By Standard
        • 7.3.3.2.3. By End-use
        • 7.3.3.2.4. By Device
    • 7.3.4. Italy Power Over Ethernet Chipsets Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Type
        • 7.3.4.2.2. By Standard
        • 7.3.4.2.3. By End-use
        • 7.3.4.2.4. By Device
    • 7.3.5. Spain Power Over Ethernet Chipsets Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Type
        • 7.3.5.2.2. By Standard
        • 7.3.5.2.3. By End-use
        • 7.3.5.2.4. By Device

8. Asia Pacific Power Over Ethernet Chipsets Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Type
    • 8.2.2. By Standard
    • 8.2.3. By End-use
    • 8.2.4. By Device
    • 8.2.5. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China Power Over Ethernet Chipsets Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Type
        • 8.3.1.2.2. By Standard
        • 8.3.1.2.3. By End-use
        • 8.3.1.2.4. By Device
    • 8.3.2. India Power Over Ethernet Chipsets Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Type
        • 8.3.2.2.2. By Standard
        • 8.3.2.2.3. By End-use
        • 8.3.2.2.4. By Device
    • 8.3.3. Japan Power Over Ethernet Chipsets Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Type
        • 8.3.3.2.2. By Standard
        • 8.3.3.2.3. By End-use
        • 8.3.3.2.4. By Device
    • 8.3.4. South Korea Power Over Ethernet Chipsets Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Type
        • 8.3.4.2.2. By Standard
        • 8.3.4.2.3. By End-use
        • 8.3.4.2.4. By Device
    • 8.3.5. Australia Power Over Ethernet Chipsets Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Type
        • 8.3.5.2.2. By Standard
        • 8.3.5.2.3. By End-use
        • 8.3.5.2.4. By Device

9. Middle East & Africa Power Over Ethernet Chipsets Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Type
    • 9.2.2. By Standard
    • 9.2.3. By End-use
    • 9.2.4. By Device
    • 9.2.5. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia Power Over Ethernet Chipsets Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Type
        • 9.3.1.2.2. By Standard
        • 9.3.1.2.3. By End-use
        • 9.3.1.2.4. By Device
    • 9.3.2. UAE Power Over Ethernet Chipsets Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Type
        • 9.3.2.2.2. By Standard
        • 9.3.2.2.3. By End-use
        • 9.3.2.2.4. By Device
    • 9.3.3. South Africa Power Over Ethernet Chipsets Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Type
        • 9.3.3.2.2. By Standard
        • 9.3.3.2.3. By End-use
        • 9.3.3.2.4. By Device

10. South America Power Over Ethernet Chipsets Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Type
    • 10.2.2. By Standard
    • 10.2.3. By End-use
    • 10.2.4. By Device
    • 10.2.5. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil Power Over Ethernet Chipsets Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Type
        • 10.3.1.2.2. By Standard
        • 10.3.1.2.3. By End-use
        • 10.3.1.2.4. By Device
    • 10.3.2. Colombia Power Over Ethernet Chipsets Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Type
        • 10.3.2.2.2. By Standard
        • 10.3.2.2.3. By End-use
        • 10.3.2.2.4. By Device
    • 10.3.3. Argentina Power Over Ethernet Chipsets Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Type
        • 10.3.3.2.2. By Standard
        • 10.3.3.2.3. By End-use
        • 10.3.3.2.4. By Device

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global Power Over Ethernet Chipsets Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. Analog Devices, Inc.
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. Cisco Systems Inc.
  • 15.3. Microchip Technology Inc.
  • 15.4. Monolithic Power Systems Inc.
  • 15.5. NXP Semiconductors N.V.
  • 15.6. On Semiconductor Corporation
  • 15.7. Semtech Corporation
  • 15.8. Silicon Laboratories Inc.
  • 15.9. STMicroelectronics N.V.
  • 15.10. Texas Instruments Incorporated

16. Strategic Recommendations

17. About Us & Disclaimer