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市場調查報告書
商品編碼
1934179
5G晶片組市場-全球產業規模、佔有率、趨勢、機會與預測:IC類型、運作頻率、部署類型、產業垂直領域、地區與競爭格局,2021-2031年5G Chipset Market - Global Industry Size, Share, Trends, Opportunities, and Forecast Segmented By IC Type, By Operational Frequency, By Deployment Type, By Industry Vertical, By Region & Competition, 2021-2031F |
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全球 5G 晶片組市場預計將從 2025 年的 484.7 億美元大幅成長至 2031 年的 1,474.3 億美元,複合年成長率為 20.37%。
該市場涉及整合電路(例如射頻前端模組和數據機)的製造和銷售,這些整合電路支援工業和消費電子設備中的 5G 蜂窩通訊。該行業的主要驅動力是對低延遲、高頻寬數據傳輸的迫切需求,這對於支援智慧製造、自主系統和城市基礎設施數位化至關重要。這些關鍵需求迫使原始設備製造商 (OEM) 採用相容的半導體,以確保其硬體基礎設施能夠滿足現代網路標準對連接可靠性和資料吞吐量的嚴格要求。
| 市場概覽 | |
|---|---|
| 預測期 | 2027-2031 |
| 市場規模:2025年 | 484.7億美元 |
| 市場規模:2031年 | 1474.3億美元 |
| 複合年成長率:2026-2031年 | 20.37% |
| 成長最快的細分市場 | 射頻積體電路 |
| 最大的市場 | 北美洲 |
然而,由於網路基礎設施(尤其是毫米波頻譜部署)的複雜性以及高昂的資本成本,市場擴張面臨巨大的障礙。這種經濟壁壘往往會延緩成本敏感地區的普及,從而限制組件產量的成長。例如,5G Americas 報告稱,到 2025 年,全球 5G 連線數將達到約 26 億。雖然這一數字顯示 5G 普及率很高,但全球基礎設施投資分佈不均仍限制發展中經濟體晶片組供應商的潛在市場規模。
5G智慧型手機和家用電子電器的快速普及正成為晶片組產業銷售成長的關鍵催化劑。隨著行動電話製造商積極更新產品線以支援第五代行動通訊標準,消費者連接所需的整合5G數據機和射頻模組的訂單也隨之激增。持續的組件成本下降進一步推動了這一成長勢頭,使得5G功能得以滲透到中低階設備。全球行動供應商協會(GSA)在其2024年11月發布的《5G設備生態系統》報告中指出,已發布的5G設備數量已達3142款,為半導體供應商創造了巨大的潛在市場,這也印證了這一以設備為中心的擴張趨勢。同時,網路使用量也在不斷成長。愛立信報告稱,到2024年第三季末,全球5G用戶數量將達到21億,顯示市場對搭載晶片組的設備需求將持續旺盛。
隨著消費市場的成長,工業4.0和工業自動化的加速部署也為專用於超可靠、低延遲通訊(URLLC)的5G晶片組開闢了一個高附加價值市場。製造工廠和物流中心正擴大部署專用5G網路,以連接感測器、自主移動機器人和傳統機械設備,這需要工業級晶片來確保安全、持續的資料傳輸。與家用電子電器不同,這些應用更注重邊緣處理能力和穩定性,而非原始吞吐量,從而推動了專用系統晶片(SoC)架構的創新。企業級應用領域的進展顯而易見:諾基亞2025年1月發布的財務更新顯示,該公司已在全球範圍內收購了約850家專用無線網路客戶,這反映出蜂窩技術在營運環境中的融合度日益提高,以及晶片組製造商正在努力拓展收入來源,不再局限於飽和的智慧型手機市場。
網路密集化所需的高額資本投入和技術複雜性正顯著阻礙全球5G晶片組市場的成長。通訊業者在部署獨立組網和毫米波頻譜所需的密集基地台網路方面面臨巨大的財務壓力。這種經濟負擔迫使許多服務供應商,尤其是在發展中地區的服務供應商,放緩了基礎設施部署計畫。這反過來又限制了5G網路的物理覆蓋範圍,直接降低了對基地台基礎設施級晶片組的需求,並因覆蓋盲區而間接抑制了對消費級設備晶片組的需求。
這套頸部體現在向需要高價值半導體元件的先進網路標準過渡的停滯不前。從非獨立組網(NSA)架構升級到獨立組網(SA)架構的複雜性,造成了市場預期與實際執行之間存在巨大差距。例如,全球行動供應商協會(GSA)在2025年8月發布的報告顯示,儘管全球有173通訊業者者正在投資5G獨立網路,但只有77家能夠推出商用服務。這種差異凸顯了阻礙部署的財務和技術障礙,並有效地限制了先進5G數據機和射頻模組製造商的潛在市場規模。
設備內人工智慧 (AI) 和神經處理單元 (NPU) 的整合正在從根本上重塑半導體架構,使生成式 AI 工作負載能夠直接在邊緣設備上處理。晶片組製造商正在超越標準連接,透過整合專用神經網路引擎,使邊緣設備和智慧型手機能夠在本地處理大型語言模型,而無需依賴雲端。這種架構演進顯著提高了每塊晶片的價值,因為 OEM 廠商正在尋求高效能邏輯晶片來使其高階產品脫穎而出。例如,為了凸顯這項技術變革帶來的財務影響,聯發科截至 2025 年 2 月的會計年度財務報告顯示,其具備先進 AI 功能的旗艦 SoC 的收入同比成長超過一倍,在 2024 年達到 20 億美元。
同時,面向物聯網的5G低容量標準(RedCap)的採用,正在催生一個高效能5G和低功率廣域網路(LPWAN)的中階市場細分領域。這一趨勢克服了先前阻礙5G在監控系統、穿戴式裝置和中階工業感測器領域普及的複雜性和成本壁壘。這主要得益於晶片組在價格和功耗方面的最佳化,而非追求最大吞吐量。透過剔除高階數據機中不必要的功能,半導體供應商現在可以瞄準對成本敏感的物聯網終端這一龐大市場。全球行動供應商協會(GSA)於2025年3月發布的《5G RedCap》報告便是此基礎設施發展趨勢的佐證。該報告指出,18個國家的26家通訊業者正在積極部署或投資5G RedCap技術,以支援不斷擴展的設備生態系統。
The Global 5G Chipset Market is projected to experience substantial growth, rising from USD 48.47 Billion in 2025 to USD 147.43 Billion by 2031, representing a CAGR of 20.37%. This market involves the manufacturing and sale of integrated circuits, such as radio frequency front-end modules and modems, which facilitate fifth-generation cellular communication in both industrial and consumer devices. The sector is primarily propelled by the urgent need for low-latency and high-bandwidth data transmission essential for supporting smart manufacturing, autonomous systems, and the digitization of urban infrastructure. These critical needs force original equipment manufacturers to incorporate compatible semiconductors, ensuring that hardware infrastructure can handle the rigorous connectivity reliability and data throughput required by modern network standards.
| Market Overview | |
|---|---|
| Forecast Period | 2027-2031 |
| Market Size 2025 | USD 48.47 Billion |
| Market Size 2031 | USD 147.43 Billion |
| CAGR 2026-2031 | 20.37% |
| Fastest Growing Segment | RFIC |
| Largest Market | North America |
Nevertheless, market expansion faces a significant hurdle due to the high capital costs and technical complexities associated with densifying network infrastructure, especially regarding millimeter-wave spectrum deployment. This economic obstacle frequently delays implementation in cost-sensitive areas, creating a bottleneck for the volume growth of components. To illustrate the current scale of adoption, 5G Americas reported that global 5G connections reached roughly 2.6 billion in 2025. Although this figure suggests strong uptake, the uneven distribution of global infrastructure investment continues to constrain the total addressable market for chipset suppliers within developing economies.
Market Driver
The rapid proliferation of 5G-enabled smartphones and consumer electronics acts as the primary catalyst for volume growth within the chipset sector. As handset manufacturers aggressively update their portfolios to align with fifth-generation standards, there is a corresponding surge in orders for the integrated 5G modems and radio frequency modules required for consumer connectivity. This momentum is further bolstered by continuous reductions in component costs, allowing 5G capabilities to permeate mid-range and budget-tier devices. Highlighting this device-centric expansion, the Global mobile Suppliers Association (GSA) noted in its November 2024 '5G Device Ecosystem' report that the number of announced 5G devices reached 3,142, establishing a massive addressable market for semiconductor vendors. To support this hardware ecosystem, network usage is climbing; Ericsson reported that global 5G subscriptions reached 2.1 billion by the end of the third quarter of 2024, signaling persistent demand for chipset-equipped terminals.
Concurrent with consumer growth, the accelerated deployment of Industry 4.0 and industrial automation is opening a high-value segment for specialized 5G chipsets tailored for ultra-reliable low-latency communications (URLLC). Manufacturing plants and logistics hubs are increasingly adopting private 5G networks to connect sensors, autonomous mobile robots, and legacy machinery, requiring industrial-grade silicon that ensures secure and continuous data flow. Unlike consumer electronics, these applications value edge processing capabilities and stability over raw throughput, driving innovation in specialized system-on-chip architectures. The traction in this enterprise domain is evident; Nokia's January 2025 financial update revealed the company had secured roughly 850 private wireless network customers globally, reflecting the expanding integration of cellular technology into operational environments and diversifying revenue streams for chipset makers beyond the saturated smartphone market.
Market Challenge
The significant capital expenditure and technical complexity required for network densification severely impede the growth of the Global 5G Chipset Market. Telecommunication operators face immense financial pressure to deploy the dense grid of base stations needed for Standalone architectures and millimeter-wave spectrum. This economic burden compels many service providers, especially in developing regions, to decelerate their infrastructure rollout plans. Consequently, this slowdown limits the physical footprint of 5G networks, directly reducing the volume of infrastructure-grade chipsets required for base stations and indirectly suppressing demand for consumer device chipsets as coverage gaps remain.
This bottleneck is further evidenced by the sluggish migration to advanced network standards that necessitate higher-value semiconductor components. The complexity involved in upgrading from Non-Standalone to Standalone architectures creates a tangible gap between market ambition and actual execution. For instance, the Global mobile Suppliers Association (GSA) reported in August 2025 that while 173 operators globally were investing in 5G Standalone networks, only 77 had successfully launched commercial services. This disparity highlights how financial and technical barriers stall deployment, effectively capping the total addressable market for manufacturers producing advanced 5G modems and radio frequency modules.
Market Trends
The integration of On-Device Artificial Intelligence and Neural Processing Units is fundamentally reshaping semiconductor architectures to facilitate generative AI workloads directly at the edge. Chipset manufacturers are moving beyond standard connectivity functions by embedding dedicated neural engines that enable edge devices and smartphones to process large language models locally without relying on the cloud. This architectural evolution significantly increases the silicon value per unit, as original equipment manufacturers seek high-performance logic to differentiate their premium tiers. Highlighting the financial impact of this technical shift, MediaTek's February 2025 financial update reported that revenue from flagship system-on-chips featuring advanced AI capabilities more than doubled year-over-year to reach $2 billion in 2024.
Simultaneously, the adoption of 5G Reduced Capability (RedCap) Standards for IoT is creating a new intermediate market segment between high-performance 5G and low-power wide-area networks. This trend addresses the complexity and cost barriers that previously hindered 5G adoption in surveillance, wearables, and mid-tier industrial sensors by optimizing chipsets for a balance of price and power consumption rather than maximum throughput. By removing unnecessary features found in premium modems, semiconductor vendors can now target a massive volume of cost-sensitive IoT endpoints. Validating this infrastructure commitment, the Global mobile Suppliers Association (GSA) stated in its March 2025 '5G RedCap' report that 26 operators across 18 countries were actively deploying or investing in 5G RedCap technology to support this expanding device ecosystem.
Report Scope
In this report, the Global 5G Chipset Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:
Company Profiles: Detailed analysis of the major companies present in the Global 5G Chipset Market.
Global 5G Chipset Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report: