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市場調查報告書
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1901578

半導體封裝市場－全球產業規模、佔有率、趨勢、機會和預測，依封裝平台、類型、技術、終端用戶產業、地區和競爭格局分類，2021-2031年預測

Semiconductor Packaging Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Packaging Platform, By Type, By Technology, By End-user Industry, By Region & Competition, 2021-2031F
出版日期: | 出版商: TechSci Research | 英文 185 Pages | 商品交期: 2-3個工作天內

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簡介目錄

全球半導體封裝市場規模將從2025年的312.4億美元成長到2031年的469.6億美元，複合年成長率（CAGR）為7.03%。半導體封裝是指將積體電路封裝起來，以提供物理保護、散熱和與印刷電路板的電氣連接。市場成長的主要驅動力是高效能運算和人工智慧領域需求的激增，以及電動車中半導體含量的不斷提高。

市場概覽
預測期 2027-2031
市場規模：2025年 312.4億美元
市場規模：2031年 469.6億美元
複合年成長率：2026-2031年 7.03%
成長最快的細分市場 傳統包裝
最大的市場 亞太地區

主要市場促進因素

人工智慧和高效能運算的快速發展正在從根本上重塑全球半導體封裝市場，因為這使得架構必須最大限度地提高頻寬和能源效率。由於人工智慧演算法需要在邏輯單元和儲存單元之間快速傳輸資料，因此該產業正在向2.

主要市場挑戰

先進封裝製程不斷攀升的成本和技術複雜性嚴重阻礙了全球半導體封裝市場的擴張。隨著產業向異質整合方向發展以應對實體尺寸縮小的限制，對超精密互連的需求也需要對專用基礎設施進行大量資本投入。

主要市場趨勢

高效能運算用玻璃芯基板的商業化正成為關鍵的材料革新，旨在解決傳統有機中介層的穩定性限制。隨著製造商積極推進晶片級架構的小型化，玻璃展現出卓越的平整度和尺寸穩定性，從而能夠實現下一代人工智慧處理器所需的超細互連間距，並有效緩解大尺寸封裝中的翹曲問題。

目錄

第1章：產品概述

第2章：研究方法

第3章：執行概要

第4章：顧客之聲

第5章：全球半導體封裝市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 按包裝平台（先進包裝、傳統包裝）
    • 依類型（覆晶、嵌入式晶片、扇入式WLP、扇出式WLP）
    • 依封裝技術分類（網格陣列封裝、小外形封裝、扁平無引腳封裝、雙扁平無引腳封裝 (DFN)、四扁平無引腳封裝 (QFN)、雙列直插封裝、塑膠雙列直插封裝 (PDIP)、陶瓷雙列直插封裝 (CDIP)、其他）
    • 依最終用戶產業分類（消費性電子、航太與國防、醫療器材、通訊與電信、汽車、能源與照明）
    • 按地區
    • 按公司（2025 年）
  • 市場地圖

第6章：北美半導體封裝市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 北美洲：國家分析
    • 美國
    • 加拿大
    • 墨西哥

第7章：歐洲半導體封裝市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 歐洲：國家分析
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙

第8章：亞太半導體封裝市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 亞太地區：國家分析
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲

第9章：中東和非洲半導體封裝市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 中東和非洲：國家分析
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 南非

第10章：南美洲半導體封裝市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 南美洲：國家分析
    • 巴西
    • 哥倫比亞
    • 阿根廷

第11章：市場動態

  • 促進要素
  • 挑戰

第12章：市場趨勢與發展

  • 併購
  • 產品發布
  • 最新進展

第13章：全球半導體封裝市場：SWOT分析

第14章：波特五力分析

  • 產業競爭
  • 新進入者的潛力
  • 供應商議價能力
  • 顧客的力量
  • 替代產品的威脅

第15章：競爭格局

  • ASE Technology Holding Co., Ltd.
  • Amkor Technology, Inc.
  • Taiwan Semiconductor Manufacturing Company
  • Intel Corporation
  • Samsung Electronics Co., Ltd.
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • Powertech Technology Inc.
  • ChipMOS Technologies Inc.
  • Siliconware Precision Industries Co., Ltd.
  • Texas Instruments Incorporated

第16章：策略建議

第17章調查會社について,免責事項

簡介目錄
Product Code: 16217

The Global Semiconductor Packaging Market will grow from USD 31.24 Billion in 2025 to USD 46.96 Billion by 2031 at a 7.03% CAGR. Semiconductor packaging entails the encasement of integrated circuits to provide physical protection, heat dissipation, and electrical connectivity to printed circuit boards. The market growth is fundamentally driven by the surging demand for high-performance computing and artificial intelligence, coupled with the increasing semiconductor content in electric vehicles.

Market Overview
Forecast Period2027-2031
Market Size 2025USD 31.24 Billion
Market Size 2031USD 46.96 Billion
CAGR 2026-20317.03%
Fastest Growing SegmentTraditional Packaging
Largest MarketAsia Pacific

Key Market Drivers

The surging adoption of artificial intelligence and high-performance computing is fundamentally reshaping the Global Semiconductor Packaging Market by necessitating architectures that maximize bandwidth and power efficiency. As AI algorithms require rapid data movement between logic and memory units, the industry is pivoting toward 2.5D and 3D packaging solutions to bridge the gap that traditional interconnects cannot sustain. This computational intensity drives foundries to aggressively scale their backend capabilities to accommodate complex integration schemes like Chip-on-Wafer-on-Substrate.

Key Market Challenges

The escalating cost and technical complexity associated with advanced packaging processes constitute a severe impediment to the expansion of the Global Semiconductor Packaging Market. As the industry moves toward heterogeneous integration to address physical scaling limits, the requirement for ultra-precise interconnects necessitates substantial capital expenditure on specialized infrastructure. This financial burden creates a high barrier to entry that disproportionately affects smaller market participants who lack the liquidity to upgrade their facilities.

Key Market Trends

The Commercialization of Glass Core Substrates for High-Performance Computing is emerging as a critical material evolution to address the stability limitations of traditional organic interposers. As manufacturers aggressively scale chiplet architectures, glass provides superior flatness and dimensional stability, which enables the ultra-fine interconnect pitches required for next-generation AI processors and mitigates warpage issues in large-form-factor packages. This transition is rapidly moving from research to active industrial deployment as companies build dedicated infrastructure to support this technology.

Key Market Players

  • ASE Technology Holding Co., Ltd.
  • Amkor Technology, Inc.
  • Taiwan Semiconductor Manufacturing Company
  • Intel Corporation
  • Samsung Electronics Co., Ltd.
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • Powertech Technology Inc.
  • ChipMOS Technologies Inc.
  • Siliconware Precision Industries Co., Ltd.
  • Texas Instruments Incorporated

Report Scope:

In this report, the Global Semiconductor Packaging Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Semiconductor Packaging Market, By Packaging Platform:

  • Advanced Packaging
  • Traditional Packaging

Semiconductor Packaging Market, By Type:

  • Flip Chip
  • Embedded DIE
  • Fan-in WLP
  • Fan-out WLP

Semiconductor Packaging Market, By Technology:

  • Grid Array
  • Small Outline Package
  • Flat no-leads packages
  • Dual-flat no-leads (DFN)
  • Quad-flat no-leads (QFN)
  • Dual In-Line Package
  • Plastic Dual Inline Package (PDIP)
  • Ceramic Dual Inline Package (CDIP)
  • Others

Semiconductor Packaging Market, By End-user Industry:

  • Consumer Electronics
  • Aerospace & Defense
  • Medical Devices
  • Communications & Telecom
  • Automotive
  • and Energy & Lighting

Semiconductor Packaging Market, By Region:

  • North America
  • United States
  • Canada
  • Mexico
  • Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
  • Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
  • South America
  • Brazil
  • Argentina
  • Colombia
  • Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Semiconductor Packaging Market.

Available Customizations:

Global Semiconductor Packaging Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Semiconductor Packaging Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Packaging Platform (Advanced Packaging, Traditional Packaging)
    • 5.2.2. By Type (Flip Chip, Embedded DIE, Fan-in WLP, Fan-out WLP)
    • 5.2.3. By Technology (Grid Array, Small Outline Package, Flat no-leads packages, Dual-flat no-leads (DFN), Quad-flat no-leads (QFN), Dual In-Line Package, Plastic Dual Inline Package (PDIP), Ceramic Dual Inline Package (CDIP), Others)
    • 5.2.4. By End-user Industry (Consumer Electronics, Aerospace & Defense, Medical Devices, Communications & Telecom, Automotive, and Energy & Lighting)
    • 5.2.5. By Region
    • 5.2.6. By Company (2025)
  • 5.3. Market Map

6. North America Semiconductor Packaging Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Packaging Platform
    • 6.2.2. By Type
    • 6.2.3. By Technology
    • 6.2.4. By End-user Industry
    • 6.2.5. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Semiconductor Packaging Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Packaging Platform
        • 6.3.1.2.2. By Type
        • 6.3.1.2.3. By Technology
        • 6.3.1.2.4. By End-user Industry
    • 6.3.2. Canada Semiconductor Packaging Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Packaging Platform
        • 6.3.2.2.2. By Type
        • 6.3.2.2.3. By Technology
        • 6.3.2.2.4. By End-user Industry
    • 6.3.3. Mexico Semiconductor Packaging Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Packaging Platform
        • 6.3.3.2.2. By Type
        • 6.3.3.2.3. By Technology
        • 6.3.3.2.4. By End-user Industry

7. Europe Semiconductor Packaging Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Packaging Platform
    • 7.2.2. By Type
    • 7.2.3. By Technology
    • 7.2.4. By End-user Industry
    • 7.2.5. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Semiconductor Packaging Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Packaging Platform
        • 7.3.1.2.2. By Type
        • 7.3.1.2.3. By Technology
        • 7.3.1.2.4. By End-user Industry
    • 7.3.2. France Semiconductor Packaging Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Packaging Platform
        • 7.3.2.2.2. By Type
        • 7.3.2.2.3. By Technology
        • 7.3.2.2.4. By End-user Industry
    • 7.3.3. United Kingdom Semiconductor Packaging Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Packaging Platform
        • 7.3.3.2.2. By Type
        • 7.3.3.2.3. By Technology
        • 7.3.3.2.4. By End-user Industry
    • 7.3.4. Italy Semiconductor Packaging Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Packaging Platform
        • 7.3.4.2.2. By Type
        • 7.3.4.2.3. By Technology
        • 7.3.4.2.4. By End-user Industry
    • 7.3.5. Spain Semiconductor Packaging Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Packaging Platform
        • 7.3.5.2.2. By Type
        • 7.3.5.2.3. By Technology
        • 7.3.5.2.4. By End-user Industry

8. Asia Pacific Semiconductor Packaging Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Packaging Platform
    • 8.2.2. By Type
    • 8.2.3. By Technology
    • 8.2.4. By End-user Industry
    • 8.2.5. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China Semiconductor Packaging Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Packaging Platform
        • 8.3.1.2.2. By Type
        • 8.3.1.2.3. By Technology
        • 8.3.1.2.4. By End-user Industry
    • 8.3.2. India Semiconductor Packaging Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Packaging Platform
        • 8.3.2.2.2. By Type
        • 8.3.2.2.3. By Technology
        • 8.3.2.2.4. By End-user Industry
    • 8.3.3. Japan Semiconductor Packaging Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Packaging Platform
        • 8.3.3.2.2. By Type
        • 8.3.3.2.3. By Technology
        • 8.3.3.2.4. By End-user Industry
    • 8.3.4. South Korea Semiconductor Packaging Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Packaging Platform
        • 8.3.4.2.2. By Type
        • 8.3.4.2.3. By Technology
        • 8.3.4.2.4. By End-user Industry
    • 8.3.5. Australia Semiconductor Packaging Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Packaging Platform
        • 8.3.5.2.2. By Type
        • 8.3.5.2.3. By Technology
        • 8.3.5.2.4. By End-user Industry

9. Middle East & Africa Semiconductor Packaging Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Packaging Platform
    • 9.2.2. By Type
    • 9.2.3. By Technology
    • 9.2.4. By End-user Industry
    • 9.2.5. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia Semiconductor Packaging Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Packaging Platform
        • 9.3.1.2.2. By Type
        • 9.3.1.2.3. By Technology
        • 9.3.1.2.4. By End-user Industry
    • 9.3.2. UAE Semiconductor Packaging Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Packaging Platform
        • 9.3.2.2.2. By Type
        • 9.3.2.2.3. By Technology
        • 9.3.2.2.4. By End-user Industry
    • 9.3.3. South Africa Semiconductor Packaging Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Packaging Platform
        • 9.3.3.2.2. By Type
        • 9.3.3.2.3. By Technology
        • 9.3.3.2.4. By End-user Industry

10. South America Semiconductor Packaging Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Packaging Platform
    • 10.2.2. By Type
    • 10.2.3. By Technology
    • 10.2.4. By End-user Industry
    • 10.2.5. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil Semiconductor Packaging Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Packaging Platform
        • 10.3.1.2.2. By Type
        • 10.3.1.2.3. By Technology
        • 10.3.1.2.4. By End-user Industry
    • 10.3.2. Colombia Semiconductor Packaging Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Packaging Platform
        • 10.3.2.2.2. By Type
        • 10.3.2.2.3. By Technology
        • 10.3.2.2.4. By End-user Industry
    • 10.3.3. Argentina Semiconductor Packaging Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Packaging Platform
        • 10.3.3.2.2. By Type
        • 10.3.3.2.3. By Technology
        • 10.3.3.2.4. By End-user Industry

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global Semiconductor Packaging Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. ASE Technology Holding Co., Ltd.
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. Amkor Technology, Inc.
  • 15.3. Taiwan Semiconductor Manufacturing Company
  • 15.4. Intel Corporation
  • 15.5. Samsung Electronics Co., Ltd.
  • 15.6. Jiangsu Changjiang Electronics Technology Co., Ltd.
  • 15.7. Powertech Technology Inc.
  • 15.8. ChipMOS Technologies Inc.
  • 15.9. Siliconware Precision Industries Co., Ltd.
  • 15.10. Texas Instruments Incorporated

16. Strategic Recommendations

17. About Us & Disclaimer