航太印刷電路板市場－全球產業規模、佔有率、趨勢、機會及預測，依平台類型、產品類型、層壓材料類型、地區及競爭格局分類，2020-2030年預測

2024年全球航太印刷電路板市場規模為48.5億美元，預計2030年將以7.54%的複合年成長率成長至75億美元。航太印刷電路板（PCB）是專用的電子電路板，對關鍵的航空航太應用至關重要，用於互連航空電子設備、導航、通訊和控制系統的組件。 PCB的設計旨在應對嚴苛環境（包括極端溫度和振動）下的極高可靠性。市場成長的促進因素包括：航空電子系統複雜性的不斷提高、對輕量化、高性能電子產品的需求（以提高燃油效率）以及全球商用和軍用飛機生產的擴張。此外，衛星星座和無人機的普及也進一步推動了市場成長。

主要市場促進因素

全球航太印刷電路板市場深受航空電子設備和航太電子系統進步的影響，這些進步不斷要求電子元件具有更高的性能和更小的尺寸。這種發展趨勢促使人們開發出日益複雜且堅固耐用的印刷電路板，使其能夠在高溫、振動和輻射等極端條件下可靠運作。

主要市場挑戰

限制全球航太印刷電路板市場成長的一大挑戰因素是嚴格的監管合規要求及其帶來的高昂製造成本。航太印刷電路板是關鍵航空和太空船應用不可或缺的一部分，需要在嚴苛環境下具備卓越的可靠性。

主要市場趨勢

自主飛行技術日益成長的需求是全球航太印刷電路板市場的重要趨勢，這需要性能卓越且堅固耐用的電子元件。專為無人機和新興先進空中交通平台獨立運作而設計的系統，需要優異訊號完整性、先進散熱管理和固有冗餘的印刷電路板，以確保運作可靠性和安全性。

目錄

第1章：產品概述

第2章：研究方法

第3章：執行概要

第4章：客戶之聲

第5章：全球航太印刷電路板市場展望

• 市場規模及預測
  • 按價值
• 市佔率及預測
  • 依平台類型（商用飛機、支線飛機、通用航空飛機、軍用飛機、直升機、無人機）
  • 依產品類型（剛性單面、雙面、標準多層、軟性、剛柔結合、高密度互連/微孔/堆疊/IC基板、其他）
  • 依層壓板材料類型（FR4、聚醯亞胺、其他）
  • 按地區
  • 按公司（2024 年）
• 市場地圖

第6章：北美航太印刷電路板市場展望

• 市場規模及預測
• 市佔率及預測
• 北美洲：國家分析
  • 美國
  • 加拿大
  • 墨西哥

第7章：歐洲航太印刷電路板市場展望

• 市場規模及預測
• 市佔率及預測
• 歐洲：國家分析
  • 德國
  • 法國
  • 英國
  • 義大利
  • 西班牙

第8章：亞太地區航太印刷電路板市場展望

• 市場規模及預測
• 市佔率及預測
• 亞太地區：國家分析
  • 中國
  • 印度
  • 日本
  • 韓國
  • 澳洲

第9章：中東和非洲航太印刷電路板市場展望

• 市場規模及預測
• 市佔率及預測
• 中東和非洲：國家分析
  • 沙烏地阿拉伯
  • 阿拉伯聯合大公國
  • 南非

第10章：南美洲航太印刷電路板市場展望

• 市場規模及預測
• 市佔率及預測
• 南美洲：國家分析
  • 巴西
  • 哥倫比亞
  • 阿根廷

第11章：市場動態

• 促進要素
• 挑戰

第12章：市場趨勢與發展

• 併購
• 產品發布
• 最新進展

第13章：全球航太印刷電路板市場：SWOT分析

第14章：波特五力分析

• 產業競爭
• 新進入者的潛力
• 供應商議價能力
• 顧客的力量
• 替代產品的威脅

第15章：競爭格局

• TTM Technologies
• Sanmina
• Benchmark Electronics
• Flex
• Celestica
• Jabil
• IEC Electronics
• ACI
• EPIC
• Calumet

第16章：策略建議

第17章調查會社について,免責事項

The Global Aerospace Printed Circuit Board Market, valued at USD 4.85 Billion in 2024, is projected to experience a CAGR of 7.54% to reach USD 7.50 Billion by 2030. Aerospace Printed Circuit Boards (PCBs) are specialized electronic circuit boards crucial for critical air and spacecraft applications, interconnecting components for avionics, navigation, communication, and control systems. Designed for extreme reliability in harsh environments, including severe temperatures and vibrations, market growth is driven by increasing avionic system complexity, demand for lightweight, high-performance electronics enhancing fuel efficiency, and the global expansion of commercial and military aircraft production. Further impetus comes from the proliferation of satellite constellations and unmanned aerial vehicles.

Key Market Drivers

The global aerospace printed circuit board market is significantly influenced by advancements in avionics and aerospace electronic systems, which continually demand higher performance and miniaturization in electronic components. This progression necessitates the development of increasingly complex and robust PCBs capable of operating reliably in extreme conditions, such as high temperatures, vibrations, and radiation environments.

Key Market Challenges

A significant challenging factor impeding the growth of the Global Aerospace Printed Circuit Board Market is the necessity for stringent regulatory compliance and the associated high manufacturing costs. Aerospace PCBs are integral to critical air and spacecraft applications, demanding exceptional reliability in harsh environments. This demand translates into extensive and rigorous certification and testing processes that notably extend development timelines and substantially increase overall project expenditure. The inherent complexity of meeting stringent safety and performance standards for every component, including PCBs, directly escalates production costs.

Key Market Trends

The increasing demands of autonomous flight technology represent a significant trend for the Global Aerospace Printed Circuit Board Market, necessitating robust and high-performance electronic components. Systems designed for independent operation in unmanned aerial vehicles and emerging advanced air mobility platforms require printed circuit boards with superior signal integrity, advanced thermal management, and inherent redundancy to ensure operational reliability and safety. These requirements push for new advancements in PCB materials and design.

Key Market Players

• TTM Technologies
• Sanmina
• Benchmark Electronics
• Flex
• Celestica
• Jabil
• IEC Electronics
• ACI
• EPIC
• Calumet

Report Scope:

In this report, the Global Aerospace Printed Circuit Board Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Aerospace Printed Circuit Board Market, By Platform Type:

• Commercial Aircraft
• Regional Aircraft
• General Aviation
• Military Aircraft
• Helicopter
• Unmanned Aerial Vehicle

Aerospace Printed Circuit Board Market, By Product Type:

• Rigid 1,2-Sided
• Standard Multilayer
• Flexible
• Rigid-Flex
• High-Density Interconnect/Microvia/Build-Up/IC Substrate
• Others

Aerospace Printed Circuit Board Market, By Laminate Material Type:

• FR4
• Polyimide
• Others

Aerospace Printed Circuit Board Market, By Region:

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
• Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
• South America
  • Brazil
  • Argentina
  • Colombia
• Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies presents in the Global Aerospace Printed Circuit Board Market.

Available Customizations:

Global Aerospace Printed Circuit Board Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Aerospace Printed Circuit Board Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Platform Type (Commercial Aircraft, Regional Aircraft, General Aviation, Military Aircraft, Helicopter, Unmanned Aerial Vehicle)
  • 5.2.2. By Product Type (Rigid 1,2-Sided, Standard Multilayer, Flexible, Rigid-Flex, High-Density Interconnect/Microvia/Build-Up/IC Substrate, Others)
  • 5.2.3. By Laminate Material Type (FR4, Polyimide, Others)
  • 5.2.4. By Region
  • 5.2.5. By Company (2024)
• 5.3. Market Map

6. North America Aerospace Printed Circuit Board Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Platform Type
  • 6.2.2. By Product Type
  • 6.2.3. By Laminate Material Type
  • 6.2.4. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Aerospace Printed Circuit Board Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Platform Type
      • 6.3.1.2.2. By Product Type
      • 6.3.1.2.3. By Laminate Material Type
  • 6.3.2. Canada Aerospace Printed Circuit Board Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Platform Type
      • 6.3.2.2.2. By Product Type
      • 6.3.2.2.3. By Laminate Material Type
  • 6.3.3. Mexico Aerospace Printed Circuit Board Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Platform Type
      • 6.3.3.2.2. By Product Type
      • 6.3.3.2.3. By Laminate Material Type

7. Europe Aerospace Printed Circuit Board Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Platform Type
  • 7.2.2. By Product Type
  • 7.2.3. By Laminate Material Type
  • 7.2.4. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Aerospace Printed Circuit Board Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Platform Type
      • 7.3.1.2.2. By Product Type
      • 7.3.1.2.3. By Laminate Material Type
  • 7.3.2. France Aerospace Printed Circuit Board Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Platform Type
      • 7.3.2.2.2. By Product Type
      • 7.3.2.2.3. By Laminate Material Type
  • 7.3.3. United Kingdom Aerospace Printed Circuit Board Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Platform Type
      • 7.3.3.2.2. By Product Type
      • 7.3.3.2.3. By Laminate Material Type
  • 7.3.4. Italy Aerospace Printed Circuit Board Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Platform Type
      • 7.3.4.2.2. By Product Type
      • 7.3.4.2.3. By Laminate Material Type
  • 7.3.5. Spain Aerospace Printed Circuit Board Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Platform Type
      • 7.3.5.2.2. By Product Type
      • 7.3.5.2.3. By Laminate Material Type

8. Asia Pacific Aerospace Printed Circuit Board Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Platform Type
  • 8.2.2. By Product Type
  • 8.2.3. By Laminate Material Type
  • 8.2.4. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Aerospace Printed Circuit Board Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Platform Type
      • 8.3.1.2.2. By Product Type
      • 8.3.1.2.3. By Laminate Material Type
  • 8.3.2. India Aerospace Printed Circuit Board Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Platform Type
      • 8.3.2.2.2. By Product Type
      • 8.3.2.2.3. By Laminate Material Type
  • 8.3.3. Japan Aerospace Printed Circuit Board Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Platform Type
      • 8.3.3.2.2. By Product Type
      • 8.3.3.2.3. By Laminate Material Type
  • 8.3.4. South Korea Aerospace Printed Circuit Board Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Platform Type
      • 8.3.4.2.2. By Product Type
      • 8.3.4.2.3. By Laminate Material Type
  • 8.3.5. Australia Aerospace Printed Circuit Board Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Platform Type
      • 8.3.5.2.2. By Product Type
      • 8.3.5.2.3. By Laminate Material Type

9. Middle East & Africa Aerospace Printed Circuit Board Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Platform Type
  • 9.2.2. By Product Type
  • 9.2.3. By Laminate Material Type
  • 9.2.4. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Aerospace Printed Circuit Board Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Platform Type
      • 9.3.1.2.2. By Product Type
      • 9.3.1.2.3. By Laminate Material Type
  • 9.3.2. UAE Aerospace Printed Circuit Board Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Platform Type
      • 9.3.2.2.2. By Product Type
      • 9.3.2.2.3. By Laminate Material Type
  • 9.3.3. South Africa Aerospace Printed Circuit Board Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Platform Type
      • 9.3.3.2.2. By Product Type
      • 9.3.3.2.3. By Laminate Material Type

10. South America Aerospace Printed Circuit Board Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Platform Type
  • 10.2.2. By Product Type
  • 10.2.3. By Laminate Material Type
  • 10.2.4. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Aerospace Printed Circuit Board Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Platform Type
      • 10.3.1.2.2. By Product Type
      • 10.3.1.2.3. By Laminate Material Type
  • 10.3.2. Colombia Aerospace Printed Circuit Board Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Platform Type
      • 10.3.2.2.2. By Product Type
      • 10.3.2.2.3. By Laminate Material Type
  • 10.3.3. Argentina Aerospace Printed Circuit Board Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Platform Type
      • 10.3.3.2.2. By Product Type
      • 10.3.3.2.3. By Laminate Material Type

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global Aerospace Printed Circuit Board Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. TTM Technologies
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. Sanmina
• 15.3. Benchmark Electronics
• 15.4. Flex
• 15.5. Celestica
• 15.6. Jabil
• 15.7. IEC Electronics
• 15.8. ACI
• 15.9. EPIC
• 15.10. Calumet

16. Strategic Recommendations

17. About Us & Disclaimer