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市場調查報告書
商品編碼
1881722

封裝內電源晶片市場－全球產業規模、佔有率、趨勢、機會及預測，依產品、應用、地區及競爭格局分類，2020-2030年預測

Power Supply In Package Chip Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Product, By Application, By Region, By Competition, 2020-2030F
出版日期: | 出版商: TechSci Research | 英文 181 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2024年全球電源封裝晶片市場規模為30.6億美元，預計2030年將以7.86%的複合年成長率成長至48.2億美元。電源封裝（PSiP）晶片將電源管理功能（例如DC-DC轉換器和電壓調節器）與其他半導體元件整合到單一緊湊的封裝中。這種設計最佳化了電源傳輸，提高了效率，並縮小了電子系統的尺寸。

市場概覽
預測期 2026-2030
2024年市場規模 30.6億美元
2030年市場規模 48.2億美元
2025-2030年複合年成長率 7.86%
成長最快的細分市場 PwrSoC
最大的市場 亞太地區

主要市場促進因素

主要市場挑戰

主要市場趨勢

目錄

第1章：產品概述

第2章：研究方法

第3章：執行概要

第4章：顧客之聲

第5章：全球封裝內電源晶片市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 按產品（PSiP、PwrSoC）
    • 按應用領域（電信和IT、汽車、消費性電子、醫療器材、軍事和國防）
    • 按地區
    • 按公司（2024 年）
  • 市場地圖

第6章：北美封裝內電源晶片市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 北美洲：國家分析
    • 美國
    • 加拿大
    • 墨西哥

第7章：歐洲封裝內供電晶片市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 歐洲：國家分析
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙

第8章：亞太地區封裝內電源供應晶片市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 亞太地區：國家分析
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲

第9章：中東和非洲封裝晶片電源供應市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 中東和非洲：國家分析
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 南非

第10章：南美洲電源封裝晶片市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 南美洲：國家分析
    • 巴西
    • 哥倫比亞
    • 阿根廷

第11章：市場動態

  • 促進要素
  • 挑戰

第12章：市場趨勢與發展

  • 併購（如有）
  • 產品發布（如有）
  • 最新進展

第13章：全球封裝內供電晶片市場：SWOT分析

第14章：波特五力分析

  • 產業競爭
  • 新進入者的潛力
  • 供應商議價能力
  • 顧客的力量
  • 替代產品的威脅

第15章：競爭格局

  • Infineon Technologies AG
  • Texas Instruments Incorporated
  • Semiconductor Components Industries, LLC
  • STMicroelectronics International NV
  • Analog Devices, Inc.
  • NXP Semiconductors NV
  • Renesas Electronics Corporation
  • Vishay Intertechnology, Inc.
  • Panasonic Corporation
  • Lextar Electronics Corporation

第16章：策略建議

第17章調查會社について,免責事項

簡介目錄
Product Code: 21910

The Global Power Supply In Package Chip Market, valued at USD 3.06 Billion in 2024, is projected to experience a CAGR of 7.86% to reach USD 4.82 Billion by 2030. The Power Supply In Package (PSiP) chip integrates power management functions, such as DC-DC converters and voltage regulators, with other semiconductor components into a single compact package. This design optimizes power delivery, improves efficiency, and reduces the electronic system's footprint.

Market Overview
Forecast Period2026-2030
Market Size 2024USD 3.06 Billion
Market Size 2030USD 4.82 Billion
CAGR 2025-20307.86%
Fastest Growing SegmentPwrSoC
Largest MarketAsia Pacific

Key Market Drivers

The global Power Supply In Package chip market is significantly influenced by the continuous drive towards miniaturization and integration within electronic devices, alongside an escalating demand for energy-efficient power solutions. These twin imperatives directly impact the design and adoption of PSiP technologies, which are critical for optimizing power delivery and reducing system footprints across various applications. The broader semiconductor industry, which encompasses these power management solutions, demonstrated substantial growth, with Infineon Technologies AG reporting in November 2023 that its total revenue for fiscal year 2023 reached €16.309 billion, marking a 15 percent increase over the prior year.

Key Market Challenges

The complexity of thermal management presents a notable challenge directly hampering the growth of the Global Power Supply In Package Chip Market. The dense integration inherent in Power Supply In Package (PSiP) designs generates high power densities within a confined space. This necessitates robust heat dissipation mechanisms to prevent overheating, which is critical for ensuring stable operational performance and extending device longevity. Developing effective thermal solutions adds significant layers of complexity to the design and engineering processes for PSiP products.

Key Market Trends

The adoption of wide bandgap (WBG) semiconductor materials, such as silicon carbide and gallium nitride, represents a pivotal trend reshaping the Global Power Supply In Package Chip Market. These materials enable devices to operate at higher voltages, temperatures, and frequencies than traditional silicon, directly leading to greater power density and improved energy efficiency within compact PSiP designs. The superior electrical properties of WBG semiconductors facilitate faster switching speeds and reduced power losses, which are critical for the demanding performance requirements of modern electronics.

Key Market Players

  • Infineon Technologies AG
  • Texas Instruments Incorporated
  • Semiconductor Components Industries, LLC
  • STMicroelectronics International N.V.
  • Analog Devices, Inc.
  • NXP Semiconductors N.V.
  • Renesas Electronics Corporation
  • Vishay Intertechnology, Inc.
  • Panasonic Corporation
  • Lextar Electronics Corporation

Report Scope:

In this report, the Global Power Supply In Package Chip Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Power Supply In Package Chip Market, By Product:

  • PSiP
  • PwrSoC

Power Supply In Package Chip Market, By Application:

  • Telecom and IT
  • Automotive
  • Consumer Electronics
  • Medical Devices
  • Military & Defense

Power Supply In Package Chip Market, By Region:

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies presents in the Global Power Supply In Package Chip Market.

Available Customizations:

Global Power Supply In Package Chip Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Power Supply In Package Chip Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Product (PSiP, PwrSoC)
    • 5.2.2. By Application (Telecom and IT, Automotive, Consumer Electronics, Medical Devices, Military & Defense)
    • 5.2.3. By Region
    • 5.2.4. By Company (2024)
  • 5.3. Market Map

6. North America Power Supply In Package Chip Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Product
    • 6.2.2. By Application
    • 6.2.3. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Power Supply In Package Chip Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Product
        • 6.3.1.2.2. By Application
    • 6.3.2. Canada Power Supply In Package Chip Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Product
        • 6.3.2.2.2. By Application
    • 6.3.3. Mexico Power Supply In Package Chip Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Product
        • 6.3.3.2.2. By Application

7. Europe Power Supply In Package Chip Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Product
    • 7.2.2. By Application
    • 7.2.3. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Power Supply In Package Chip Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Product
        • 7.3.1.2.2. By Application
    • 7.3.2. France Power Supply In Package Chip Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Product
        • 7.3.2.2.2. By Application
    • 7.3.3. United Kingdom Power Supply In Package Chip Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Product
        • 7.3.3.2.2. By Application
    • 7.3.4. Italy Power Supply In Package Chip Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Product
        • 7.3.4.2.2. By Application
    • 7.3.5. Spain Power Supply In Package Chip Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Product
        • 7.3.5.2.2. By Application

8. Asia Pacific Power Supply In Package Chip Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Product
    • 8.2.2. By Application
    • 8.2.3. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China Power Supply In Package Chip Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Product
        • 8.3.1.2.2. By Application
    • 8.3.2. India Power Supply In Package Chip Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Product
        • 8.3.2.2.2. By Application
    • 8.3.3. Japan Power Supply In Package Chip Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Product
        • 8.3.3.2.2. By Application
    • 8.3.4. South Korea Power Supply In Package Chip Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Product
        • 8.3.4.2.2. By Application
    • 8.3.5. Australia Power Supply In Package Chip Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Product
        • 8.3.5.2.2. By Application

9. Middle East & Africa Power Supply In Package Chip Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Product
    • 9.2.2. By Application
    • 9.2.3. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia Power Supply In Package Chip Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Product
        • 9.3.1.2.2. By Application
    • 9.3.2. UAE Power Supply In Package Chip Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Product
        • 9.3.2.2.2. By Application
    • 9.3.3. South Africa Power Supply In Package Chip Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Product
        • 9.3.3.2.2. By Application

10. South America Power Supply In Package Chip Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Product
    • 10.2.2. By Application
    • 10.2.3. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil Power Supply In Package Chip Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Product
        • 10.3.1.2.2. By Application
    • 10.3.2. Colombia Power Supply In Package Chip Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Product
        • 10.3.2.2.2. By Application
    • 10.3.3. Argentina Power Supply In Package Chip Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Product
        • 10.3.3.2.2. By Application

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global Power Supply In Package Chip Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. Infineon Technologies AG
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. Texas Instruments Incorporated
  • 15.3. Semiconductor Components Industries, LLC
  • 15.4. STMicroelectronics International N.V.
  • 15.5. Analog Devices, Inc.
  • 15.6. NXP Semiconductors N.V.
  • 15.7. Renesas Electronics Corporation
  • 15.8. Vishay Intertechnology, Inc.
  • 15.9. Panasonic Corporation
  • 15.10. Lextar Electronics Corporation

16. Strategic Recommendations

17. About Us & Disclaimer