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歐洲再分佈層材料市場預測至 2030 年 - 區域分析 - 按類型 [聚醯亞胺 (PI)、聚苯並噁唑 (PBO)、苯並環丁烯 (BCB) 等] 和應用
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1494363

歐洲再分佈層材料市場預測至 2030 年 - 區域分析 - 按類型 [聚醯亞胺 (PI)、聚苯並噁唑 (PBO)、苯並環丁烯 (BCB) 等] 和應用

Europe Redistribution Layer Material Market Forecast to 2030 - Regional Analysis - By Type [Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and Others] and Application
出版日期: | 出版商: The Insight Partners | 英文 108 Pages | 訂單完成後即時交付

價格

2022年歐洲再分佈層材料市場估值為1,562萬美元，預計2030年將達3,445萬美元；預計2022年至2030年複合年成長率為10.4%。

封裝技術的進步推動歐洲再分佈層材料市場

為了尋求降低成本，半導體產業一直致力於開發創新解決方案。領先的半導體廠商目前考慮的一種方法是從晶圓和條帶尺寸遷移到專用於 IC 組裝的大尺寸面板。效率和規模經濟是這條道路的附加價值。將扇出封裝製造從晶圓、扇出晶圓級封裝 (FOWLP) 轉移到大規模面板、扇出面板級封裝 (FOPLP)，可能是更廣泛採用的解決方案。隨著消費性電子產品、汽車系統和工業設備變得更加緊湊和複雜，對先進半導體封裝技術的需求不斷成長。重新分佈層是此過程不可或缺的一部分，它可以實現更小的外形尺寸、增加功能並提高效能。全球製造商都準備好透過生產和供應必要的材料來利用這一趨勢。

包裝產業的進步，特別是 2.5D 和 3D 包裝技術的採用，有望成為歐洲再分佈層材料市場的重要推動力。 2.5D和3D封裝技術顯著提高了晶片密度和功能。透過將多個半導體晶片彼此堆疊或並列堆疊，這些技術可以實現更堅固、更緊湊的電子設備。重新分佈層對於在這些堆疊或相鄰晶片之間建立互連至關重要，從而確保高效的資料傳輸和電氣連接。

這些封裝技術在提高效能和能源效率方面具有顯著的優勢。透過 2.5D 和 3D 封裝，更短的互連長度和更少的訊號路徑有助於更快的資料處理和更低的功耗。因此，對能夠保持訊號完整性和熱管理的重新分佈層材料的需求變得更加重要。此外，汽車產業正在採用 2.5D 和 3D 封裝，以實現先進駕駛輔助系統 (ADAS) 和自動駕駛技術的整合。這些應用依賴緊密整合的高性能半導體封裝，需要可靠的再分佈層材料。

全球製造商正在開發新的包裝技術。例如，2021年5月，三星電子推出了I-Cube4，用於人工智慧、5G、雲端和大型資料中心的高效能運算（HPC）、快速通訊，並透過異質整合提高邏輯和記憶體之間的功率效率。此外，2023年9月，ASIC設計服務和IP供應商智原科技宣布推出2.5D/3D高級封裝服務。 2.5D封裝技術用於實現最高效能，針對HPC，如AI加速器、圖形處理單元和網路處理器。封裝技術的此類進步預計將促進歐洲再分佈層材料市場的成長。

歐洲再分配層材料市場概況

歐洲擁有廣泛的主要製造業，如航空航太、機械設備、汽車、造船和軍用車輛。歐盟的汽車工業被認為是關鍵產業，因為它對該地區的 GDP 做出了重大貢獻。歐盟是全球領先的機動車輛生產國，BMW、福斯等許多優質汽車製造商都總部設在該地區。該地區的汽車製造業每年生產約 1,920 萬輛轎車、貨車、巴士和卡車。大約 300 個汽車組裝和製造工廠分佈在該地區約 26 個國家。根據歐洲汽車製造商協會 (ACEA) 的數據，全球 21% 的汽車是由寶馬、大眾、奧迪和阿斯頓馬丁等公司在歐盟生產的。德國佔據該地區汽車市場的最大佔有率，即 30%。由於自動駕駛和先進駕駛輔助系統的出現，汽車製造商迅速傾向於採用汽車電子，導致對汽車電子整合的需求不斷增加。這項因素推動了對半導體材料（包括再分佈層材料）的需求。

中國比亞迪汽車有限公司宣布計畫於2021年在歐洲建立電池生產工廠。此外，由於擁有多家電子設備製造商，匈牙利和捷克共和國是半導體的主要出口市場之一。隨著歐洲對電子設備的需求不斷成長，半導體封裝技術的採用也不斷增加。歐盟委員會的《歐洲 5G 行動計畫》是歐盟私人和公共投資 5G 基礎設施的藍圖。該藍圖列舉了確保所有歐盟成員國採取同步措施，在 2020 年底前向所有公民提供 5G 服務的措施。此外，製造商正在致力於推出大型晶片的高效封裝專案。例如，在德國，Fraunhofer IZM 正在領導一個項目，改進扇出面板級封裝技術，以更高的效率封裝更大的晶片。此外，作為先進封裝的一部分，扇出解決方案可能對提高裝置性能和頻寬至關重要。這項因素正在鼓勵半導體廠商、研發組織和晶片製造商推動扇出封裝解決方案的開發。預計所有上述因素將在預測期內支持歐洲再分佈層材料市場的成長。

歐洲再分配層材料市場收入及 2030 年預測（百萬美元）

歐洲再分配層材料市場細分

歐洲再分佈層材料市場根據類型、應用和國家進行細分。

根據類型，歐洲再分佈層材料市場分為聚醯亞胺（PI）、聚苯並噁唑（PBO）、苯並環丁烯（BCB）等。 2022 年，聚醯亞胺 (PI) 領域佔據最大佔有率。

依應用分類，歐洲再分佈層材料市場分為扇出晶圓級封裝（FOWLP）及2.5D/3D IC封裝。 2.5D/3D IC 封裝領域在 2022 年佔據最大佔有率。

根據國家/地區，歐洲再分配層材料市場分為德國、奧地利、義大利和歐洲其他地區。 2022年，德國主導歐洲再分佈層材料市場。

SK Hynix Inc、三星電子有限公司、英飛凌科技股份公司、杜邦de Nemours Inc、FUJIFILM Holdings Corp、Amkor Technology Inc、ASE Technology Holding Co Ltd、NXP Semiconductors NV、JCET Group Co Ltd 和Shin-Etsu Chemical Co Ltd等歐洲再分佈層材料市場的領導公司之一。

目錄

第 1 章：簡介

第 2 章：執行摘要

  • 重要見解
  • 市場吸引力
    • 市場吸引力

第 3 章：研究方法

  • 覆蓋範圍
  • 二次研究
  • 初步研究

第 4 章：歐洲再分配層材料市場格局

  • 概述
  • 波特五力分析
    • 供應商的議價能力
    • 買家的議價能力
    • 新進入者的威脅
    • 競爭激烈程度
    • 替代品的威脅
  • 生態系分析
    • 原物料供應商
    • 製造商
    • 最終用途

第 5 章：歐洲再分配層材料市場 - 主要市場動態

  • 市場促進因素
    • 越來越關注基於人工智慧的設備和工具
    • 汽車和電信業的需求不斷成長
  • 市場限制
    • 原物料價格波動
  • 市場機會
    • 物聯網和互聯設備在各行業的激增
  • 未來的趨勢
    • 封裝技術的進步
  • 影響分析

第 6 章：再分配層材料市場 - 歐洲市場分析

  • 歐洲再分配層材料市場容量
  • 歐洲再分配層材料市場收入
  • 歐洲再分佈層材料市場預測與分析

第 7 章：歐洲再分配層材料市場分析 - 類型

  • 聚醯亞胺 (PI)
    • 概述
    • 聚醯亞胺 (PI) 市場容量、收入和 2030 年預測
    • 聚醯亞胺 (PI) 市場、收入和 2030 年預測
  • 聚苯並噁唑 (PBO)
    • 概述
    • 聚苯並噁唑 (PBO) 市場容量、收入和 2030 年預測
    • 聚苯並噁唑 (PBO) 市場、收入和 2030 年預測
  • 苯環丁烯 (BCB)
    • 概述
    • 苯環丁烯 (BCB) 市場量、收入和 2030 年預測
    • 苯環丁烯 (BCB) 市場、收入和 2030 年預測
  • 其他
    • 概述
    • 其他市場容量、收入和 2030 年預測
    • 其他市場容量、收入和 2030 年預測

第 8 章：歐洲再分配層材料市場分析 - 應用

  • 扇出晶圓級封裝 (FOWLP)
    • 概述
    • 扇出晶圓級封裝 (FOWLP) 市場、收入和 2030 年預測
  • 2 5D/3D IC 封裝
    • 概述
    • 2 5D/3D IC封裝市場收入及2030年預測
    • 高頻寬記憶體 (HBM)
      • 高頻寬記憶體 (HBM) 市場收入及 2030 年預測
    • 多晶片整合
      • 多晶片整合市場收入及 2030 年預測
    • 層疊封裝 (FOPOP)
      • 層疊封裝 (FOPOP) 市場收入及 2030 年預測
    • 其他
      • 其他市場收入及 2030 年預測

第 9 章：歐洲再分配層材料市場 - 國家分析

    • 歐洲再分配層材料市場收入、預測和分析 - 按國家/地區
      • 按國家/地區分類的再分配層材料市場細分
      • 德國再分配層材料市場容量與 2030 年預測
      • 德國再分配層材料市場收入及 2030 年預測
      • 奧地利再分配層材料市場容量與 2030 年預測
      • 奧地利再分配層材料市場收入與 2030 年預測
      • 義大利再分配層材料市場容量與 2030 年預測
      • 義大利再分配層材料市場收入及2030年預測
      • 歐洲其他地區再分配層材料市場容量和 2030 年預測
      • 歐洲其他地區再分配層材料市場收入與 2030 年預測

第 10 章：競爭格局

  • 關鍵參與者的熱圖分析
  • 公司定位與專注

第 11 章：產業格局

  • 概述
  • 市場主動性
  • 新產品開發
  • 併購

第 12 章：公司簡介

  • SK Hynix Inc
  • Samsung Electronics Co Ltd
  • Infineon Technologies AG
  • DuPont de Nemours Inc
  • FUJIFILM Holdings Corp
  • Amkor Technology Inc
  • ASE Technology Holding Co Ltd
  • NXP Semiconductors NV
  • JCET Group Co Ltd
  • Shin-Etsu Chemical Co Ltd

第 13 章：附錄

Product Code: TIPRE00026109

The Europe redistribution layer material market was valued at US$ 15.62 million in 2022 and is expected to reach US$ 34.45 million by 2030; it is estimated to grow at a CAGR of 10.4% from 2022 to 2030.

Advancements in the Packaging Technology Drive Europe Redistribution Layer Material Market

In the quest for cost reduction, the semiconductor industry has always been involved in developing innovative solutions. One approach currently considered by the leading semiconductor players is the migration from wafer and strip size to large-size panels dedicated to IC assembly. Efficiency and economies of scale are the added value of this path. Moving fan-out package manufacturing from a wafer, Fan-Out Wafer Level Packaging (FOWLP) to a large-scale panel, Fan-Out Panel Level Packaging (FOPLP), could be the solution for a wider adoption. As consumer electronics, automotive systems, and industrial devices become more compact and complex, there is a growing need for advanced semiconductor packaging technologies. Redistribution layers are integral to this process, it enables the creasing of smaller form factors, increases functionality and improves performance. Manufacturers in across the globe are positioned to capitalize on this trend by producing and supplying the necessary materials.

Advancements in the packaging industries, specifically the adoption of 2.5D and 3D packaging technologies, are poised to be significant drivers of the Europe redistribution layer material market. 2.5D and 3D packaging technologies significantly increase chip density and functionality. By stacking multiple semiconductors die on each other or side by side, these technologies allow for more robust and compact electronic devices. Redistribution layers are essential for creating interconnections between these stacked or adjacent dies, ensuring efficient data transfer and electrical connectivity.

These packaging technologies offer notable advantages in terms of improved performance and energy efficiency. With 2.5D and 3D packaging, shorter interconnect lengths and reduced signal paths contribute to faster data processing and lower power consumption. As a result, demand for redistribution layer materials capable of maintaining signal integrity and thermal management becomes even more crucial. Furthermore, the automotive industry is embracing 2.5D and 3D packaging to enable the integration of advanced driver-assistance systems (ADAS) and autonomous driving technologies. These applications rely on tightly integrated, high-performance semiconductor packages that demand reliable redistribution layer materials.

Manufacturers across the globe are developing new packaging technologies. For instance, in May 2021, Samsung Electronics launched I-Cube4, for High-Performance Computing (HPC) to AI, 5G, cloud, and large data center, fast communication, and improving power efficiency between logic & memory through heterogeneous integration. In addition, in September 2023, Faraday Technology Corporation, an ASIC design service, and IP provider, announced the launch of its 2.5D/3D advanced package service. The 2.5D package technology is used for achieving the highest performance, targeting HPC such as AI accelerator, graph processing unit, and networking processor. Such advancements in packaging technology are expected to bolster the Europe redistribution layer material market growth.

Europe Redistribution Layer Material Market Overview

Europe has a wide presence of major manufacturing industries such as aerospace, machinery & equipment, automotive, shipbuilding, and military vehicles. The automotive industry of the EU is considered to be a crucial industry as it significantly contributes to the region's GDP. EU is the leading producer of motor vehicles across the globe, and many premium automotive manufacturers such as BMW, Volkswagen are based in the region. In the region, the vehicle manufacturing sector produces ~19.2 million cars, vans, buses, and trucks per year. Approximately 300 vehicle assembly and manufacturing facilities are located in ~26 countries across the region. According to the European Automobile Manufacturers' Association (ACEA), 21% of the cars across the world are manufactured in the EU by companies such as BMW, Volkswagen, Audi, and Aston Martin. Germany holds the largest share of the automotive market in the region, i.e., 30%. The rapid inclination of automotive manufacturers to include automotive electronics due to the emergence of autonomous driving and advanced driver-assist systems has resulted in increased demand for electronic integrations in automobiles. This factor propels the demand for semiconductor materials, including redistribution layer materials.

BYD Auto Co., Ltd, China, announced its plan in 2021 to establish a battery production plant in Europe. Furthermore, Hungary and the Czech Republic are among the key export markets for semiconductors owing to the presence of several electronic equipment manufacturers. With the growing demand for electronic equipment in Europe, the adoption of semiconductor packaging technology is also increasing. The 5G for Europe Action Plan of the EC is a blueprint for private as well as public investment in 5G infrastructure in the EU. The blueprint enumerates measures to ensure a synchronized approach among all EU Member States to make 5G available to all citizens by the end of 2020. This plan has propelled the Europe redistribution layer material market growth across Europe. Additionally, manufacturers are working on projects to launch highly efficient packaging of larger chips. For instance, in Germany, Fraunhofer IZM is leading a project to improve Fan-Out Panel Level Packaging technology for packaging larger chips with higher efficiency. Also, as a part of advanced packaging, the fan-out solutions are likely to become critical for boosting device performance and bandwidth. This factor is encouraging semiconductor players, R&D organizations, and chipmakers to promote the development of fan-out packaging solutions. All the above mentioned factors are anticipated to support the growth of the Europe redistribution layer material market during the forecast period.

Europe Redistribution Layer Material Market Revenue and Forecast to 2030 (US$ Million)

Europe Redistribution Layer Material Market Segmentation

The Europe redistribution layer material market is segmented based on type, application, and country.

Based on type, the Europe redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. The polyimide (PI) segment held the largest share in 2022.

By application, the Europe redistribution layer material market is segmented into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging. The 2.5D/3D IC packaging segment held the largest share in 2022. The 2.5D/3D IC packaging is further subsegmented into high bandwidth memory (HBM), multi-chip integration, package on package (FOPOP), and others.

Based on country, the Europe redistribution layer material market is segmented into Germany, Austria, Italy, and the Rest of Europe. Germany dominated the Europe redistribution layer material market in 2022.

SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, DuPont de Nemours Inc, FUJIFILM Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd, NXP Semiconductors NV, JCET Group Co Ltd, and Shin-Etsu Chemical Co Ltd are some of the leading companies operating in the Europe redistribution layer material market.

Table Of Contents

1. Introduction

  • 1.1 The Insight Partners Research Report Guidance
  • 1.2 Market Segmentation

2. Executive Summary

  • 2.1 Key Insights
  • 2.2 Market Attractiveness
    • 2.2.1 Market Attractiveness

3. Research Methodology

  • 3.1 Coverage
  • 3.2 Secondary Research
  • 3.3 Primary Research

4. Europe Redistribution Layer Material Market Landscape

  • 4.1 Overview
  • 4.2 Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Intensity of Competitive Rivalry
    • 4.2.5 Threat of Substitutes
  • 4.3 Ecosystem Analysis
    • 4.3.1 Raw Material Suppliers
    • 4.3.2 Manufacturers
    • 4.3.3 End Use

5. Europe Redistribution Layer Material Market - Key Market Dynamics

  • 5.1 Market Drivers
    • 5.1.1 Growing Focus on AI-based Equipment and Tools
    • 5.1.2 Increasing Demand from Automotive and Telecommunication Industries
  • 5.2 Market Restraints
    • 5.2.1 Fluctuation in Raw Material Prices
  • 5.3 Market Opportunities
    • 5.3.1 Proliferation of IoT and Connected Devices Across Industry Verticals
  • 5.4 Future Trends
    • 5.4.1 Advancements in the Packaging Technology
  • 5.5 Impact Analysis

6. Redistribution Layer Material Market - Europe Market Analysis

  • 6.1 Europe Redistribution Layer Material Market Volume (Tons)
  • 6.2 Europe Redistribution Layer Material Market Revenue (US$ Million)
  • 6.3 Europe Redistribution Layer Material Market Forecast and Analysis

7. Europe Redistribution Layer Material Market Analysis - Type

  • 7.1 Polyimide (PI)
    • 7.1.1 Overview
    • 7.1.2 Polyimide (PI) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
    • 7.1.3 Polyimide (PI) Market, Revenue and Forecast to 2030 (US$ Million)
  • 7.2 Polybenzoxazole (PBO)
    • 7.2.1 Overview
    • 7.2.2 Polybenzoxazole (PBO) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
    • 7.2.3 Polybenzoxazole (PBO) Market, Revenue and Forecast to 2030 (Tons) (US$ Million)
  • 7.3 Benzocylobutene (BCB)
    • 7.3.1 Overview
    • 7.3.2 Benzocylobutene (BCB) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
    • 7.3.3 Benzocylobutene (BCB) Market, Revenue and Forecast to 2030 (Tons) (US$ Million)
  • 7.4 Others
    • 7.4.1 Overview
    • 7.4.2 Others Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
    • 7.4.3 Others Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

8. Europe Redistribution Layer Material Market Analysis - Application

  • 8.1 Fan-Out Wafer Level Packaging (FOWLP)
    • 8.1.1 Overview
    • 8.1.2 Fan-Out Wafer Level Packaging (FOWLP) Market, Revenue, and Forecast to 2030 (US$ Million)
  • 8.2 2 5D/3D IC Packaging
    • 8.2.1 Overview
    • 8.2.2 2 5D/3D IC Packaging Market Revenue, and Forecast to 2030 (US$ Million)
    • 8.2.3 High Bandwidth Memory (HBM)
      • 8.2.3.1 High Bandwidth Memory (HBM) Market Revenue and Forecast to 2030 (US$ Million)
    • 8.2.4 Multi-Chip Integration
      • 8.2.4.1 Multi-Chip Integration Market Revenue and Forecast to 2030 (US$ Million)
    • 8.2.5 Package on Package (FOPOP)
      • 8.2.5.1 Package on Package (FOPOP) Market Revenue and Forecast to 2030 (US$ Million)
    • 8.2.6 Others
      • 8.2.6.1 Others Market Revenue and Forecast to 2030 (US$ Million)

9. Europe Redistribution Layer Material Market - Country Analysis

    • 9.1.1 Europe Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Countries
      • 9.1.1.1 Redistribution Layer Material Market Breakdown by Country
      • 9.1.1.2 Germany Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.1.3 Germany Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.1.3.1 Germany Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.3.2 Germany Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.3.3 Germany Redistribution Layer Material Market Breakdown by Application
      • 9.1.1.4 Austria Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.1.5 Austria Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.1.5.1 Austria Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.5.2 Austria Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.5.3 Austria Redistribution Layer Material Market Breakdown by Application
      • 9.1.1.6 Italy Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.1.7 Italy Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.1.7.1 Italy Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.7.2 Italy Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.7.3 Italy Redistribution Layer Material Market Breakdown by Application
      • 9.1.1.8 Rest of Europe Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.1.9 Rest of Europe Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.1.9.1 Rest of Europe Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.9.2 Rest of Europe Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.9.3 Rest of Europe Redistribution Layer Material Market Breakdown by Application

10. Competitive Landscape

  • 10.1 Heat Map Analysis by Key Players
  • 10.2 Company Positioning & Concentration

11. Industry Landscape

  • 11.1 Overview
  • 11.2 Market Initiative
  • 11.3 New Product Development
  • 11.4 Merger and Acquisition

12. Company Profiles

  • 12.1 SK Hynix Inc
    • 12.1.1 Key Facts
    • 12.1.2 Business Description
    • 12.1.3 Products and Services
    • 12.1.4 Financial Overview
    • 12.1.5 SWOT Analysis
    • 12.1.6 Key Developments
  • 12.2 Samsung Electronics Co Ltd
    • 12.2.1 Key Facts
    • 12.2.2 Business Description
    • 12.2.3 Products and Services
    • 12.2.4 Financial Overview
    • 12.2.5 SWOT Analysis
    • 12.2.6 Key Developments
  • 12.3 Infineon Technologies AG
    • 12.3.1 Key Facts
    • 12.3.2 Business Description
    • 12.3.3 Products and Services
    • 12.3.4 Financial Overview
    • 12.3.5 SWOT Analysis
    • 12.3.6 Key Developments
  • 12.4 DuPont de Nemours Inc
    • 12.4.1 Key Facts
    • 12.4.2 Business Description
    • 12.4.3 Products and Services
    • 12.4.4 Financial Overview
    • 12.4.5 SWOT Analysis
    • 12.4.6 Key Developments
  • 12.5 FUJIFILM Holdings Corp
    • 12.5.1 Key Facts
    • 12.5.2 Business Description
    • 12.5.3 Products and Services
    • 12.5.4 Financial Overview
    • 12.5.5 SWOT Analysis
    • 12.5.6 Key Developments
  • 12.6 Amkor Technology Inc
    • 12.6.1 Key Facts
    • 12.6.2 Business Description
    • 12.6.3 Products and Services
    • 12.6.4 Financial Overview
    • 12.6.5 SWOT Analysis
    • 12.6.6 Key Developments
  • 12.7 ASE Technology Holding Co Ltd
    • 12.7.1 Key Facts
    • 12.7.2 Business Description
    • 12.7.3 Products and Services
    • 12.7.4 Financial Overview
    • 12.7.5 SWOT Analysis
    • 12.7.6 Key Developments
  • 12.8 NXP Semiconductors NV
    • 12.8.1 Key Facts
    • 12.8.2 Business Description
    • 12.8.3 Products and Services
    • 12.8.4 Financial Overview
    • 12.8.5 SWOT Analysis
    • 12.8.6 Key Developments
  • 12.9 JCET Group Co Ltd
    • 12.9.1 Key Facts
    • 12.9.2 Business Description
    • 12.9.3 Products and Services
    • 12.9.4 Financial Overview
    • 12.9.5 SWOT Analysis
    • 12.9.6 Key Developments
  • 12.10 Shin-Etsu Chemical Co Ltd
    • 12.10.1 Key Facts
    • 12.10.2 Business Description
    • 12.10.3 Products and Services
    • 12.10.4 Financial Overview
    • 12.10.5 SWOT Analysis
    • 12.10.6 Key Developments

13. Appendix

List Of Tables

  • Table 1. Europe Redistribution Layer Material Market Segmentation
  • Table 2. Europe Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Table 3. Europe Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million)
  • Table 4. Europe Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - Type
  • Table 5. Europe Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - Type
  • Table 6. Europe Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - Application
  • Table 7. Germany Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type
  • Table 8. Germany Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - By Type
  • Table 9. Germany Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - By Application
  • Table 10. Austria Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type
  • Table 11. Austria Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - By Type
  • Table 12. Austria Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - By Application
  • Table 13. Italy Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type
  • Table 14. Italy Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - By Type
  • Table 15. Italy Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - By Application
  • Table 16. Rest of Europe Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type
  • Table 17. Rest of Europe Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - By Type
  • Table 18. Rest of Europe Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - By Application
  • Table 19. Company Positioning & Concentration

List Of Figures

  • Figure 1. Europe Redistribution Layer Material Market Segmentation, By Country
  • Figure 2. Porter's Five Forces Analysis
  • Figure 3. Ecosystem: Europe Redistribution Layer Material Market
  • Figure 4. Market Dynamics: Europe Redistribution Layer Material Market
  • Figure 5. Europe Redistribution Layer Material Market Impact Analysis of Drivers and Restraints
  • Figure 6. Europe Redistribution Layer Material Market Volume (Tons), 2020 - 2030
  • Figure 7. Europe Redistribution Layer Material Market Revenue (US$ Million), 2020 - 2030
  • Figure 8. Europe Redistribution Layer Material Market Share (%) - Type, 2022 and 2030
  • Figure 9. Polyimide (PI) Market Volume and Forecasts To 2030 (Tons)
  • Figure 10. Polyimide (PI) Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 11. Polybenzoxazole (PBO) Market Volume and Forecasts To 2030 (Tons)
  • Figure 12. Polybenzoxazole (PBO) Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 13. Benzocylobutene (BCB) Market Volume and Forecasts To 2030 (Tons)
  • Figure 14. Benzocylobutene (BCB) Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 15. Others Market Volume and Forecasts To 2030 (Tons)
  • Figure 16. Others Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 17. Europe Redistribution Layer Material Market Share (%) - Application, 2022 and 2030
  • Figure 18. Fan-Out Wafer Level Packaging (FOWLP) Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 19. 2 5D/3D IC Packaging Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 20. High Bandwidth Memory (HBM) Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 21. Multi-Chip Integration Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 22. Package on Package (FOPOP) Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 23. Others Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 24. Europe Redistribution Layer Material Market by Key Countries - Revenue (2022) (US$ Million)
  • Figure 25. Redistribution Layer Material Market Breakdown by Key Countries, 2022 and 2030 (%)
  • Figure 26. Germany Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 27. Germany Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 28. Austria Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 29. Austria Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 30. Italy Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 31. Italy Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 32. Rest of Europe Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 33. Rest of Europe Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 34. Heat Map Analysis by Key Players