查看購物車
  • Simplified Chinese
  • English
  • Japanese
  • Korean
亞太地區再分佈層材料市場預測至 2030 年 - 區域分析 - 按類型 [聚醯亞胺 (PI)、聚苯並噁唑 (PBO)、苯並環丁烯 (BCB) 等] 和應用
市場調查報告書
商品編碼
1494359

亞太地區再分佈層材料市場預測至 2030 年 - 區域分析 - 按類型 [聚醯亞胺 (PI)、聚苯並噁唑 (PBO)、苯並環丁烯 (BCB) 等] 和應用

Asia Pacific Redistribution Layer Material Market Forecast to 2030 - Regional Analysis - By Type [Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and Others] and Application
出版日期: | 出版商: The Insight Partners | 英文 119 Pages | 訂單完成後即時交付

價格

2022年亞太地區再分佈層材料市場估值為1.4381億美元，預計2030年將達到3.5193億美元；預計2022年至2030年複合年成長率為11.8%。

汽車和電信業日益成長的需求推動亞太地區再分佈層材料市場

亞太地區的再分佈層材料市場正在經歷顯著成長，這主要是由汽車和電信這兩個關鍵產業的需求激增所推動的。

電信業正在迅速發展，特別是隨著 5G 技術的部署。 5G網路在全球廣泛部署，導致對智慧型手機和其他消費性電子產品的需求增加。例如，2021 年 10 月，AIS 和三星聯合推出了語音 5G 無線電服務，可在泰國的 AIS 5G 獨立 (SA) 網路上進行語音通話。在越南，三星電子和Viettel宣布將於2021年12月在峴港啟動5G商用試驗。頓、平福、承天-順化和峴港。此外，根據Viavi Solutions Inc.的報告，全球已有超過92個國家推出了5G網路。另有23個國家正在進行5G網路預商用試驗，32個國家已宣布其5G部署計畫。 5G網路的廣泛部署導致對智慧型手機和其他消費性電子產品的需求增加。這場革命正在推動高頻、高效能設備和系統的發展。這些要求擴展到再分配層中使用的材料，這些材料必須滿足嚴格的規範，以確保無縫連接和訊號完整性。此外，推動小型化是這些產業之間的共同點。這場革命正在推動高頻、高效能設備和系統的發展。這些要求擴展到再分配層中使用的材料，這些材料必須滿足嚴格的規範，以確保無縫連接和訊號完整性。此外，推動小型化是這些產業之間的共同點。人們需要更小、更強大的設備，這就需要更薄、更先進的重新分佈層材料。這些材料在實現緊湊電子封裝內的高密度互連方面發揮關鍵作用。

汽車產業不斷擴大的生產需求推動了市場的成長。根據尤索夫伊薩東南亞研究院介紹，東南亞也是重要的汽車生產基地。東南亞是全球第七大汽車製造中心，2021 年生產350 萬輛汽車。 （48 萬輛） ）和越南（16萬）。此外，根據國際汽車製造商組織（OICA）的資料，北美、南美和中美洲國家2021年商用車和乘用車產量超過1,610萬輛，產量增加了10%，到2022年商用車和乘用車產量將超過1770萬輛。 2021年7月，馬魯蒂鈴木印度有限公司宣布投資24.2億美元在印度哈里亞納邦新建製造工廠。該工廠預計每年生產 100 萬台。隨著汽車越來越依賴先進的電子設備來實現安全、娛樂和自動駕駛功能，對半導體的需求激增。這些汽車晶片需要複雜的封裝解決方案，通常採用重新分佈層，以實現緊湊的設計和高效的互連。

全球汽車和電信產業的經濟成長對整個供應鏈產生連鎖反應。研發、技術和基礎設施的投資不斷增加，培育了有利於再分佈層材料領域創新和發展的環境。這一趨勢的特徵是產量增加、先進封裝技術、小型化要求、該地區的戰略供應鏈地位以及對整個生態系統的正面經濟影響。這些因素共同推動了亞太地區再分佈層材料市場的發展。

亞太地區再分佈層材料市場概況

亞太地區許多發展中國家的製造業正在顯著成長。由於多元化的製造業的存在，該地區被認為是全球製造業中心。隨著中國發展成為高技能製造中心，印度、韓國、台灣和越南等發展中國家正在吸引一些企業計劃將中低技能製造設施遷往鄰國，從而降低勞動成本。根據半導體產業協會的研究，全球約 75% 的半導體產能位於東亞。隨著該地區製造活動的開始，半導體公司將受益於 25% 至 50% 的成本優勢。

此外，亞太地區各國政府正努力改善半導體製造投資計畫。他們提供退稅、資金和補貼等，吸引製造業企業在各自國家設廠。此外，一些政府也採取了「中國製造2025」和「印度製造」等措施來推動製造業的成長。然而，作為最大的製造業中心的中國，由於人口老化的加劇，勞動成本正在上升。這導致製造公司投資於東南亞的公司。基礎設施的改善、國內消費的成長以及成本的降低是吸引製造業企業的幾個因素。

亞太地區的消費電子製造業在全球處於領先地位，預計將支持該地區的亞太再分佈層材料市場。此外，該地區許多國家也擴大採用智慧城市、自動駕駛汽車和物聯網等數位應用，以期成為全球強國。

亞太地區的半導體製造業是全球最大的。晶片製造原料的容易取得、政府對製造業的激勵措施以及亞太地區廉價的勞動力是推動半導體製造業發展的幾個因素。 RDL 材料直接出售給半導體製造商，因為封裝是半導體製造流程不可或缺的一部分。消費性電子產品（尤其是智慧型手機）的日益普及是推動半導體產業收入的主要因素。此外，由於人工智慧和物聯網在多個業務領域的快速採用，預計亞太地區資料中心的部署在未來幾年將會成長。隨著亞太地區各國 5G 部署的增加，網路基礎設施的成長正在加強。所有這些因素都在增加對感測器和其他半導體設備的需求。

工業革命改變了澳洲的生產方式，提高了整個地區的生產力並增加了經濟利潤。因此，智慧工廠的興起、價值鏈升級、資料分析和互聯機器是需要半導體的一些應用。此外，不斷成長的自動化、3D 列印和物聯網以及新興業務正在加速澳洲智慧工廠的採用。該國的電信業對其國內生產毛額的貢獻巨大。電信營運商正在尋求持續創新來實施 5G 網路等先進技術，預計這將對 RDL 材料的使用產生積極影響。

中國和印度人口眾多，包括這些國家不斷擴大的中產階級人口，以及成熟的製造業推動了半導體產業的發展。中國是全球最大的乘用車生產國；日本、印度和韓國也是該地區主要的汽車製造國。日本、中國和韓國自動駕駛汽車和智慧基礎設施的發展將進一步推動對可靠的半導體電子設備的需求。越南、柬埔寨和菲律賓等國家計劃提高半導體產量，進而為亞太地區再分佈層材料市場創造收入做出貢獻。這一因素正在推動該地區汽車行業半導體應用的成長。此外，該地區的消費電子製造業在全球處於領先地位。因此，這些產業不斷成長的製造活動預計將增加對半導體的需求，進而推動整個亞太地區的再分佈層材料市場。

圖表：亞太地區再分配層材料市場收入及 2030 年預測（百萬美元）

亞太地區再分佈層材料市場細分

亞太地區再分佈層材料市場根據類型、應用和國家/地區進行細分。

根據類型，亞太地區再分佈層材料市場分為聚醯亞胺（PI）、聚苯並噁唑（PBO）、苯並環丁烯（BCB）等。 2022 年，聚醯亞胺 (PI) 領域佔據最大佔有率。

依冷卻液類型，亞太地區再分佈層材料市場分為扇出晶圓級封裝（FOWLP）及2.5D/3D IC封裝。 2.5D/3D IC封裝領域在2022年佔據更大佔有率。

依國家/地區分類，亞太地區再分佈層材料市場分為中國大陸、台灣地區、日本、韓國和亞太地區其他地區。 2022年，台灣在亞太再分佈層材料市場佔據主導地位。

SK Hynix Inc、三星電子有限公司、英飛凌科技股份公司、杜邦de Nemours Inc、FUJIFILM Holdings Corp、Amkor Technology Inc、ASE Technology Holding Co Ltd、NXP Semiconductors NV、JCET Group Co Ltd 和Shin-Etsu Chemical Co Ltd等亞太地區再分佈層材料市場的領導公司之一。

目錄

第 1 章：簡介

第 2 章：執行摘要

  • 重要見解
  • 市場吸引力
    • 市場吸引力

第 3 章：研究方法

  • 覆蓋範圍
  • 二次研究
  • 初步研究

第 4 章：亞太地區再分配層材料市場格局

  • 概述
  • 波特五力分析
    • 供應商的議價能力
    • 買家的議價能力
    • 新進入者的威脅
    • 競爭激烈程度
    • 替代品的威脅
  • 生態系分析
    • 原物料供應商
    • 製造商
    • 最終用途
    • 價值鏈供應商名單
      • 價值鏈原料供應商名錄
      • 價值鏈製造商名單

第 5 章：亞太地區再分佈層材料市場 - 主要市場動態

  • 市場促進因素
    • 越來越關注基於人工智慧的設備和工具
    • 汽車和電信業的需求不斷成長
  • 市場限制
    • 原物料價格波動
  • 市場機會
    • 物聯網和互聯設備在各行業的普及
  • 未來的趨勢
    • 封裝技術的進步
  • 影響分析

第 6 章：再分配層材料市場 - 亞太市場分析

  • 亞太地區再分佈層材料市場容量
  • 亞太地區再分配層材料市場收入
  • 亞太地區再分佈層材料市場預測與分析

第 7 章：亞太地區再分佈層材料市場分析 - 類型

  • 聚醯亞胺 (PI)
    • 概述
    • 聚醯亞胺 (PI) 市場容量、收入和 2030 年預測
    • 聚醯亞胺 (PI) 市場、收入和 2030 年預測
  • 聚苯並噁唑 (PBO)
    • 概述
    • 聚苯並噁唑 (PBO) 市場容量、收入和 2030 年預測
    • 聚苯並噁唑 (PBO) 市場、收入和 2030 年預測
  • 苯並環丁烯 (BCB)
    • 概述
    • 苯環丁烯 (BCB) 市場量、收入和 2030 年預測
    • 苯環丁烯 (BCB) 市場、收入和 2030 年預測
  • 其他
    • 概述
    • 其他市場容量、收入和 2030 年預測
    • 其他市場、收入和 2030 年預測

第 8 章：亞太地區再分佈層材料市場分析 - 應用

  • 扇出晶圓級封裝 (FOWLP)
    • 概述
    • 扇出晶圓級封裝 (FOWLP) 市場、收入和 2030 年預測
  • 2 5D/3D IC 封裝
    • 概述
    • 2 5D/3D IC封裝市場收入及2030年預測
    • 高頻寬記憶體 (HBM)
      • 高頻寬記憶體 (HBM) 市場收入及 2030 年預測
    • 多晶片整合
      • 多晶片整合市場收入及 2030 年預測
    • 層疊封裝 (FOPOP)
      • 層疊封裝 (FOPOP) 市場收入及 2030 年預測
    • 其他
      • 其他市場收入及 2030 年預測

第 9 章：亞太地區再分佈層材料市場 - 國家分析

  • 中國
  • 台灣
  • 日本
  • 韓國
  • 亞太地區其他地區

第 10 章：競爭格局

  • 關鍵參與者的熱圖分析
  • 公司定位與專注

第 11 章：產業格局

  • 概述
  • 市場主動性
  • 新產品開發
  • 併購

第 12 章：公司簡介

  • SK Hynix Inc
  • Samsung Electronics Co Ltd
  • Infineon Technologies AG
  • DuPont de Nemours Inc
  • FUJIFILM Holdings Corp
  • Amkor Technology Inc
  • ASE Technology Holding Co Ltd
  • NXP Semiconductors NV
  • JCET Group Co Ltd
  • Shin-Etsu Chemical Co Ltd

第 13 章：附錄

Product Code: TIPRE00026108

The Asia Pacific redistribution layer material market was valued at US$ 143.81 million in 2022 and is expected to reach US$ 351.93 million by 2030; it is estimated to grow at a CAGR of 11.8% from 2022 to 2030.

Increasing Demand from Automotive and Telecommunication Industries Drive Asia Pacific Redistribution Layer Material Market

The Asia Pacific redistribution layer material market is experiencing significant growth, driven primarily by the surging demand from two key industries: automotive and telecommunication.

The telecommunication sector is evolving rapidly, particularly with the deployment of 5G technology. There is a widespread rollout of 5G networks in across the globe, which has led to an increased demand for smartphones and other consumer electronics products. For instance, in October 2021, AIS and Samsung jointly launched a voice-over 5G radio service enabling voice calls on AIS's 5G standalone (SA) network in Thailand. In Vietnam, Samsung Electronics and Viettel announced the 5G commercial trials launched in Da Nang in December 2021. Viettel is piloting 5G services in 11 provinces and cities, namely, Ho Chi Minh City, Hanoi, Bac Ninh, Vinh Phuc, Bac Giang, Dong Nai, Ba Ria-Vung Tau, Binh Phuoc, Thua Thien-Hue, and Da Nang. In addition, according to Viavi Solutions Inc.'s report, over 92 countries across the world have launched 5G networks. A further 23 countries have underway pre-commercial 5G network trials, and 32 nations have announced their 5G rollout plans. The widespread rollout of 5G networks has led to an increased demand for smartphones and other consumer electronics products. This revolution is driving the development of high-frequency, high-performance devices and systems. These requirements extend to the material used in redistribution layers, which must meet stringent specifications to ensure seamless connectivity and signal integrity. In addition, the push for miniaturization is a common thread between these industries. This revolution is driving the development of high-frequency, high-performance devices and systems. These requirements extend to the material used in redistribution layers, which must meet stringent specifications to ensure seamless connectivity and signal integrity. In addition, the push for miniaturization is a common thread between these industries. Smaller, more powerful devices are in demand, necessitating thinner and more advanced redistribution layer materials. These materials play a critical role in enabling high-density interconnections within compact electronic packages.

The ever-expanding production needs of the automotive industry propel the growth of the market. According to the ISEAS-Yusof Ishak Institute, Southeast Asia is also an important automobile production base. Southeast Asia is the seventh largest automotive manufacturing hub worldwide, producing 3.5 million vehicles in 2021. Within the region, Thailand is the largest car producer, producing over 1.6 million motor vehicles in 2021, followed by Indonesia (1.1 million), Malaysia (0.48 million), and Vietnam (0.16 million). In addition, as per the data of the Organisation Internationale des Constructeurs d'Automobiles (OICA), countries in North America, South America, and Central America recorded production of over 16.1 million commercial & passenger cars in 2021, and the production has grown by 10% and registered over 17.7 million commercial & passenger car production in 2022. Numerous companies operating in the automotive market are investing heavily in automobile manufacturing to increase production and sales. In July 2021, Maruti Suzuki India Ltd. announced an investment worth US$ 2.42 billion in a new manufacturing facility in Haryana, India. The facility is expected to manufacture 1 million units annually. As vehicles become increasingly reliant on advanced electronics for safety, entertainment, and autonomous capabilities, the demand for semiconductors has soared. These automotive chips require intricate packaging solutions, often employing redistribution layers, to enable compact design and efficient interconnections.

The economic growth of the automotive and telecommunications sectors across the globe has a ripple effect on the entire supply chain. Investments in research and development, technology, and infrastructure are increasing, fostering an environment conducive to innovation and development in the field of redistribution layer materials. This trend is characterized by increased production, advanced packaging technologies, miniaturization requirements, the region's strategic supply chain position, and a positive economic impact on the entire ecosystem. These factors collectively propel the Asia Pacific redistribution layer material market.

Asia Pacific Redistribution Layer Material Market Overview

Many developing countries in Asia Pacific are witnessing significant growth in their manufacturing sectors. The region is considered a global manufacturing hub owing to the presence of diverse manufacturing industries. With China's evolution into a high-skilled manufacturing hub, developing countries such as India, South Korea, Taiwan, and Vietnam are attracting several businesses that plan to relocate their low to medium-skilled manufacturing facilities to neighboring countries, which results in reduced labor costs. As per the study by the Semiconductor Industry Association, ~75% of global semiconductor capacity is based in East Asia. Semiconductor companies will benefit from a cost advantage of 25% to 50% with the start of manufacturing activities in the region.

Further, governments of various countries in Asia Pacific are working to improve investment plans regarding semiconductor manufacturing. They are offering tax rebates, funds, and subsidies, among others, to attract manufacturing companies to set up plants in their respective countries. Further, several governments have taken initiatives such as Made in China 2025 and Make in India to propel the growth of the manufacturing sector. However, China, which is the largest manufacturing hub, is experiencing a rise in the country's labor cost owing to the rise in the aging population of the country. This has resulted in manufacturing companies investing in companies based in Southeast Asia. The improving infrastructure, rising domestic consumption, and reducing costs are a few factors attracting manufacturing companies.

The consumer electronics manufacturing industry in Asia Pacific is leading globally, which is anticipated to support the Asia Pacific redistribution layer material market across the region. Additionally, many countries across the region are increasingly adopting digital applications such as smart cities, autonomous vehicles, and IoT in a bid to become global powers.

The semiconductor manufacturing industry in Asia Pacific is the largest in the world. Ease of availability of raw materials for chip manufacturing, government incentives for the manufacturing sector, and inexpensive labor presence in APAC are a few factors driving the semiconductor manufacturing industries. RDL materials are directly sold to the semiconductor manufacturers as packaging is integral to semiconductor manufacturing processes. The growing penetration of consumer electronics, especially smartphones, is a major factor driving the revenues for the semiconductor industry. Also, owing to the rapid adoption of artificial intelligence and IoT in multiple business sectors, data center deployments in APAC are anticipated to grow in the coming years. The growth of network infrastructures is being strengthened with the rise in 5G deployments in various countries of APAC. All these factors are boosting the demand for sensors and other semiconductor-based devices.

The Industrial Revolution has transformed production in Australia, enabling improved productivity and increasing economic profit across the region. Thus, a rise in smart factories, value chain upgradation, data analytics, and connected machines are a few applications that require semiconductors. Furthermore, growing automation, 3D printing, and IoT, as well as emerging businesses, are accelerating the adoption of smart factories in Australia. The country's telecommunication industry contributes heavily to its GDP. The telco operators are seeking continued innovation for the implementation of advanced technologies such as 5G networks, which are projected to positively impact the use of RDL materials.

The large populations of China and India, including the expanding middle-class population in these countries, and well-established manufacturing sectors drive the semiconductor sector. China is the largest producer of passenger cars in the world; Japan, India, and South Korea are also major vehicle manufacturing countries in the region. The development of autonomous vehicles and smart infrastructure in Japan, China, and South Korea will further boost the demand for reliable semiconductor-based electronics devices. Countries such as Vietnam, Cambodia, and the Philippines plan to boost the production of semiconductors, thereby contributing to the revenue generation for the Asia Pacific redistribution layer material market. This factor is propelling the growth of semiconductor applications in the automotive sector in the region. Moreover, the region leads the consumer electronics manufacturing industry across the globe. Thus, the growing manufacturing activities in these industries is anticipated to boost the demand for semiconductors, which, in turn, is fueling the Asia Pacific redistribution layer material market across the region.

Exhibit: Asia Pacific Redistribution Layer Material Market Revenue and Forecast to 2030 (US$ Million)

Asia Pacific Redistribution Layer Material Market Segmentation

The Asia Pacific redistribution layer material market is segmented based on type, application, and country.

Based on type, the Asia Pacific redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. The polyimide (PI) segment held the largest share in 2022.

By cooling fluid type, the Asia Pacific redistribution layer material market is segmented into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging. The 2.5D/3D IC packaging segment held a larger share in 2022. The 2.5D/3D IC packaging is further subsegmented into high bandwidth memory (HBM), multi-chip integration, package on package (FOPOP), and others.

Based on country, the Asia Pacific redistribution layer material market is segmented into China, Taiwan, Japan, South Korea, and the Rest of Asia Pacific. Taiwan dominated the Asia Pacific redistribution layer material market in 2022.

SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, DuPont de Nemours Inc, FUJIFILM Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd, NXP Semiconductors NV, JCET Group Co Ltd, and Shin-Etsu Chemical Co Ltd are some of the leading companies operating in the Asia Pacific redistribution layer material market.

Table Of Contents

1. Introduction

  • 1.1 The Insight Partners Research Report Guidance
  • 1.2 Market Segmentation

2. Executive Summary

  • 2.1 Key Insights
  • 2.2 Market Attractiveness
    • 2.2.1 Market Attractiveness

3. Research Methodology

  • 3.1 Coverage
  • 3.2 Secondary Research
  • 3.3 Primary Research

4. Asia Pacific Redistribution Layer Material Market Landscape

  • 4.1 Overview
  • 4.2 Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Intensity of Competitive Rivalry
    • 4.2.5 Threat of Substitutes
  • 4.3 Ecosystem Analysis
    • 4.3.1 Raw Material Suppliers
    • 4.3.2 Manufacturers
    • 4.3.3 End Use
    • 4.3.4 List of Vendors in the Value Chain
      • 4.3.4.1 List of Raw Material Suppliers in Value Chain
      • 4.3.4.2 List of Manufacturers in Value Chain

5. Asia Pacific Redistribution Layer Material Market - Key Market Dynamics

  • 5.1 Market Drivers
    • 5.1.1 Growing Focus on AI-based Equipment and Tools
    • 5.1.2 Increasing Demand from Automotive and Telecommunication Industries
  • 5.2 Market Restraints
    • 5.2.1 Fluctuation in Raw Material Prices
  • 5.3 Market Opportunities
    • 5.3.1 Proliferation of IoT and Connected Devices Across Industry Verticals
  • 5.4 Future Trends
    • 5.4.1 Advancements in the Packaging Technology
  • 5.5 Impact Analysis

6. Redistribution Layer Material Market - Asia Pacific Market Analysis

  • 6.1 Asia Pacific Redistribution Layer Material Market Volume (Tons)
  • 6.2 Asia Pacific Redistribution Layer Material Market Revenue (US$ Million)
  • 6.3 Asia Pacific Redistribution Layer Material Market Forecast and Analysis

7. Asia Pacific Redistribution Layer Material Market Analysis - Type

  • 7.1 Polyimide (PI)
    • 7.1.1 Overview
    • 7.1.2 Polyimide (PI) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
    • 7.1.3 Polyimide (PI) Market, Revenue and Forecast to 2030 (US$ Million)
  • 7.2 Polybenzoxazole (PBO)
    • 7.2.1 Overview
    • 7.2.2 Polybenzoxazole (PBO) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
    • 7.2.3 Polybenzoxazole (PBO) Market, Revenue and Forecast to 2030 (US$ Million)
  • 7.3 Benzocylobutene (BCB)
    • 7.3.1 Overview
    • 7.3.2 Benzocylobutene (BCB) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
    • 7.3.3 Benzocylobutene (BCB) Market, Revenue and Forecast to 2030 (US$ Million)
  • 7.4 Others
    • 7.4.1 Overview
    • 7.4.2 Others Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
    • 7.4.3 Others Market, Revenue and Forecast to 2030 (US$ Million)

8. Asia Pacific Redistribution Layer Material Market Analysis - Application

  • 8.1 Fan-Out Wafer Level Packaging (FOWLP)
    • 8.1.1 Overview
    • 8.1.2 Fan-Out Wafer Level Packaging (FOWLP) Market, Revenue, and Forecast to 2030 (US$ Million)
  • 8.2 2 5D/3D IC Packaging
    • 8.2.1 Overview
    • 8.2.2 2 5D/3D IC Packaging Market Revenue, and Forecast to 2030 (US$ Million)
    • 8.2.3 High Bandwidth Memory (HBM)
      • 8.2.3.1 High Bandwidth Memory (HBM) Market Revenue and Forecast to 2030 (US$ Million)
    • 8.2.4 Multi-Chip Integration
      • 8.2.4.1 Multi-Chip Integration Market Revenue and Forecast to 2030 (US$ Million)
    • 8.2.5 Package on Package (FOPOP)
      • 8.2.5.1 Package on Package (FOPOP) Market Revenue and Forecast to 2030 (US$ Million)
    • 8.2.6 Others
      • 8.2.6.1 Others Market Revenue and Forecast to 2030 (US$ Million)

9. Asia Pacific Redistribution Layer Material Market - Country Analysis

  • 9.1 Overview
    • 9.1.1 Asia Pacific Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Countries
      • 9.1.1.1 Redistribution Layer Material Market Breakdown by Country
      • 9.1.1.2 China Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.1.3 China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.1.3.1 China Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.3.2 China Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.3.3 China Redistribution Layer Material Market Breakdown by Application
      • 9.1.1.4 Taiwan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.1.5 Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.1.5.1 Taiwan Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.5.2 Taiwan Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.5.3 Taiwan Redistribution Layer Material Market Breakdown by Application
      • 9.1.1.6 Japan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.1.7 Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.1.7.1 Japan Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.7.2 Japan Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.7.3 Japan Redistribution Layer Material Market Breakdown by Application
      • 9.1.1.8 South Korea Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.1.9 South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.1.9.1 South Korea Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.9.2 South Korea Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.9.3 South Korea Redistribution Layer Material Market Breakdown by Application
      • 9.1.1.10 Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.1.11 Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.1.11.1 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.11.2 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.11.3 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Application

10. Competitive Landscape

  • 11.1 Heat Map Analysis by Key Players
  • 11.2 Company Positioning & Concentration

11. Industry Landscape

  • 12.1 Overview
  • 12.2 Market Initiative
  • 12.3 New Product Development
  • 12.4 Merger and Acquisition

12. Company Profiles

  • 12.1 SK Hynix Inc
    • 13.1.1 Key Facts
    • 13.1.2 Business Description
    • 13.1.3 Products and Services
    • 13.1.4 Financial Overview
    • 13.1.5 SWOT Analysis
    • 13.1.6 Key Developments
  • 12.2 Samsung Electronics Co Ltd
    • 13.2.1 Key Facts
    • 13.2.2 Business Description
    • 13.2.3 Products and Services
    • 13.2.4 Financial Overview
    • 13.2.5 SWOT Analysis
    • 13.2.6 Key Developments
  • 12.3 Infineon Technologies AG
    • 13.3.1 Key Facts
    • 13.3.2 Business Description
    • 13.3.3 Products and Services
    • 13.3.4 Financial Overview
    • 13.3.5 SWOT Analysis
    • 13.3.6 Key Developments
  • 12.4 DuPont de Nemours Inc
    • 13.4.1 Key Facts
    • 13.4.2 Business Description
    • 13.4.3 Products and Services
    • 13.4.4 Financial Overview
    • 13.4.5 SWOT Analysis
    • 13.4.6 Key Developments
  • 12.5 FUJIFILM Holdings Corp
    • 13.5.1 Key Facts
    • 13.5.2 Business Description
    • 13.5.3 Products and Services
    • 13.5.4 Financial Overview
    • 13.5.5 SWOT Analysis
    • 13.5.6 Key Developments
  • 12.6 Amkor Technology Inc
    • 13.6.1 Key Facts
    • 13.6.2 Business Description
    • 13.6.3 Products and Services
    • 13.6.4 Financial Overview
    • 13.6.5 SWOT Analysis
    • 13.6.6 Key Developments
  • 12.7 ASE Technology Holding Co Ltd
    • 13.7.1 Key Facts
    • 13.7.2 Business Description
    • 13.7.3 Products and Services
    • 13.7.4 Financial Overview
    • 13.7.5 SWOT Analysis
    • 13.7.6 Key Developments
  • 12.8 NXP Semiconductors NV
    • 13.8.1 Key Facts
    • 13.8.2 Business Description
    • 13.8.3 Products and Services
    • 13.8.4 Financial Overview
    • 13.8.5 SWOT Analysis
    • 13.8.6 Key Developments
  • 12.9 JCET Group Co Ltd
    • 13.9.1 Key Facts
    • 13.9.2 Business Description
    • 13.9.3 Products and Services
    • 13.9.4 Financial Overview
    • 13.9.5 SWOT Analysis
    • 13.9.6 Key Developments
  • 12.10 Shin-Etsu Chemical Co Ltd
    • 13.10.1 Key Facts
    • 13.10.2 Business Description
    • 13.10.3 Products and Services
    • 13.10.4 Financial Overview
    • 13.10.5 SWOT Analysis
    • 13.10.6 Key Developments

13. Appendix

List Of Tables

  • Table 1. Asia Pacific Redistribution Layer Material Market Segmentation
  • Table 2. Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Table 3. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
  • Table 4. Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - Type
  • Table 5. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - Type
  • Table 6. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - Application
  • Table 7. China Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type
  • Table 8. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type
  • Table 9. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application
  • Table 10. Taiwan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type
  • Table 11. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type
  • Table 12. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application
  • Table 13. Japan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type
  • Table 14. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type
  • Table 15. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application
  • Table 16. South Korea Redistribution Layer Material Market Revenue and Forecasts To 2030 (Kilo Ton) - By Type
  • Table 17. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type
  • Table 18. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application
  • Table 19. Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type
  • Table 20. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type
  • Table 21. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application
  • Table 22. Company Positioning & Concentration

List Of Figures

  • Figure 1. Asia Pacific Redistribution Layer Material Market Segmentation, By Country
  • Figure 2. Porter's Five Forces Analysis
  • Figure 3. Ecosystem: Asia Pacific Redistribution Layer Material Market
  • Figure 4. Market Dynamics: Asia Pacific Redistribution Layer Material Market
  • Figure 5. Asia Pacific Redistribution Layer Material Market Impact Analysis of Drivers and Restraints
  • Figure 6. Asia Pacific Redistribution Layer Material Market Volume (Tons), 2020 - 2030
  • Figure 7. Asia Pacific Redistribution Layer Material Market Revenue (US$ Million), 2020 - 2030
  • Figure 8. Asia Pacific Redistribution Layer Material Market Share (%) - Type, 2022 and 2030
  • Figure 9. Polyimide (PI) Market Volume and Forecasts To 2030 (Tons)
  • Figure 10. Polyimide (PI) Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 11. Polybenzoxazole (PBO) Market Volume and Forecasts To 2030 (Tons)
  • Figure 12. Polybenzoxazole (PBO) Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 13. Benzocylobutene (BCB) Market Volume and Forecasts To 2030 (Tons)
  • Figure 14. Benzocylobutene (BCB) Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 15. Others Market Volume and Forecasts To 2030 (Tons)
  • Figure 16. Others Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 17. Asia Pacific Redistribution Layer Material Market Share (%) - Application, 2022 and 2030
  • Figure 18. Fan-Out Wafer Level Packaging (FOWLP) Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 19. 2 5D/3D IC Packaging Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 20. High Bandwidth Memory (HBM) Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 21. Multi-Chip Integration Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 22. Package on Package (FOPOP) Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 23. Others Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 24. Asia Pacific Redistribution Layer Material Market Breakdown by Key Countries, (2022) (US$ Million)
  • Figure 25. Redistribution Layer Material Market Breakdown by Key Countries, 2022 and 2030 (%)
  • Figure 26. China Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 27. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 28. Taiwan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 29. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 30. Japan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 31. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 32. South Korea Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 33. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 34. Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 35. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 36. Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 37. Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 38. Redistribution Layer Material Market Breakdown by Type (2022 and 2030)
  • Figure 39. Heat Map Analysis by Key Players