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市場調查報告書
商品編碼
1494357
北美再分佈層材料市場預測至 2030 年 - 區域分析 - 按類型 [聚醯亞胺 (PI)、聚苯並噁唑 (PBO)、苯並環丁烯 (BCB) 等] 和應用North America Redistribution Layer Material Market Forecast to 2030 - Regional Analysis - By Type [Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and Others] and Application |
2022年北美再分佈層材料市場估值為2,234萬美元,預計2030年將達5,886萬美元;預計2022年至2030年複合年成長率為12.9%。
對基於人工智慧的設備和工具的日益關注推動北美再分佈層材料市場
對基於人工智慧的設備和工具不斷成長的需求正在顯著影響北美再分佈層材料市場。對更先進的人工智慧功能的追求需要開發更緊湊、更密集整合的硬體組件。再分佈層 (RDL) 材料是實現半導體封裝小型化的基礎,這對於適應日益複雜的人工智慧設備至關重要。隨著人工智慧系統變得越來越複雜,對更小、更有效率組件的需求也在成長。此外,人工智慧應用程式以其對高效能運算的巨大需求而聞名,這本身就會產生大量熱量。高效的熱管理對於確保人工智慧硬體的可靠性和使用壽命至關重要。 RDL材料透過增強導熱性和散熱性能發揮至關重要的作用。隨著人工智慧設備變得更加強大和熱密集型,對能夠有效解決這些熱挑戰的先進 RDL 材料的需求不斷增加。
可擴展性也是人工智慧領域的關鍵考慮因素。隨著人工智慧技術在各行業的普及,有效擴大硬體生產規模的能力至關重要。 RDL 材料簡化了附加組件或晶片的整合,簡化了製造流程並實現了快速可擴展性。隨著基於人工智慧的工具和設備在金融、醫療保健和製造領域變得越來越重要,這一點尤其有價值。
人工智慧系統非常複雜,通常涉及多個晶片、感測器和處理器,它們必須無縫通訊才能即時處理和分析資料。對人工智慧硬體中改善連接性和訊號完整性的需求不斷成長。 RDL 材料對於促進高速資料傳輸和確保人工智慧系統中的各個組件協調工作至關重要。隨著人工智慧應用跨越從醫療保健到自動駕駛汽車等不同行業,對能夠保持牢固連接的 RDL 材料的需求變得更加明顯。此外,人工智慧領域的特點是快速演變和客製化。不同產業對人工智慧硬體解決方案有獨特的要求,需要設計和配置的彈性。 RDL 材料使製造商能夠客製化半導體封裝以滿足這些特定需求。這種客製化能力推動了 RDL 材料的採用,使人工智慧設備製造商能夠創建針對各種應用進行最佳化的專用硬體。全球經濟的快速成長和產業發展也推動了人工智慧技術的投資增加。這種成長包括智慧城市、自動駕駛汽車和工業 4.0 計畫的發展,所有這些都依賴於基於人工智慧的工具和設備。隨著這些措施的勢頭增強,對作為半導體封裝基礎元件的 RDL 材料的需求也隨之成長。因此,對基於人工智慧的設備和工具不斷成長的需求正在促進北美再分佈層材料市場的成長。
北美洲再分佈層材料市場概況
北美擁有大量 IT 服務供應商、金融業和政府機構。快速的技術發展和配套的政府法規使北美成為資料中心最有前途的市場。美國有超過 2,500 個資料中心和 2,200 家服務供應商。隨著客戶對高品質產品和服務的需求不斷增加、IT產業不斷發展以及資料中心數量不斷增加,許多公司不斷創新和開發新產品,以便為客戶提供最佳服務。
製造業在北美經濟成長中發揮著至關重要的作用。已開發國家擁有高效率的基礎設施,使製造公司能夠探索科學、技術和商業的極限。此外,美國製造業位居世界第二,製造商佔經濟總產出的12%。此外,由於多種有利因素,包括新技術的採用提高了生產力;預計未來幾年美國製造業將快速成長;天然氣價格下降;以及新興市場的高勞動成本。北美各行業的原始設備製造商正在擴大自動化規模,以與中國和日本等全球製造中心競爭。這導致了先進半導體的快速發展。
此外,由於政府吸引外國直接投資的舉措,以及靠近美國以及北美自由貿易協定實現成本競爭力的能力,墨西哥的製造業正在經歷顯著成長。此外,墨西哥的汽車工業正在經歷範式轉變,許多大型汽車公司在該國建造工廠。最近在該國開設工廠的一些公司包括起亞汽車、梅賽德斯-奔馳、日產、奧迪和通用汽車等。
北美的一些主要製造業包括航空航太、汽車、電信和電子等。此外,由於經濟狀況良好,北美地區個人消費能力較高,導致智慧型手機、平板電腦、筆記型電腦、個人電腦、穿戴式裝置和其他消費性電子設備的銷售量呈指數級成長。消費性電子產業是半導體產品的另一個主要使用者。所有這些行業都高度依賴半導體產業的有效績效。 2020 年 9 月,美國資本設備公司 KLA 透過引進新工具改進了其先進封裝的系統產品組合。新工具包括 Kronos 1190 晶圓級封裝檢測系統、ICOS T3/T7 系列和 ICOS F160XP。新系統允許最終用戶在封裝階段即興製造半導體裝置。同樣,2021 年 5 月,英特爾宣布計劃投資 35 億美元用於先進半導體封裝技術的製造。
所有上述因素預計將支持 2022-2030 年北美再分佈層材料市場的成長。
北美再分配層材料市場收入及 2030 年預測(百萬美元)
北美再分佈層材料市場細分
北美再分佈層材料市場根據類型、應用和國家進行細分。
依類型,北美再分佈層材料市場分為聚醯亞胺(PI)、聚苯並噁唑(PBO)、苯並環丁烯(BCB)等。 2022 年,聚醯亞胺 (PI) 領域佔據最大佔有率。
依應用分類,北美再分佈層材料市場分為扇出晶圓級封裝(FOWLP)及2.5D/3D IC封裝。 2.5D/3D IC封裝領域在2022年佔據更大佔有率。
依國家分類,北美再分佈層材料市場分為美國、加拿大和墨西哥。 2022年,美國主導北美再分佈層材料市場。
SK Hynix Inc、Samsung Electronics Co Ltd、Infineon Technologies AG、DuPont de Nemours Inc、FUJIFILM Holdings Corp、Amkor Technology Inc、ASE Technology Holding Co Ltd、NXP Semiconductors NV、JCET Group Co Ltd 和 Shin-Etsu Chemical Co Ltd 等北美再分佈層材料市場的領導公司之一。
The North America redistribution layer material market was valued at US$ 22.34 million in 2022 and is expected to reach US$ 58.86 million by 2030; it is estimated to grow at a CAGR of 12.9% from 2022 to 2030.
Growing Focus on AI-based Equipment and Tools Drive North America Redistribution Layer Material Market
The growing demand for AI-based equipment and tools is significantly impacting the North America redistribution layer material market. The quest for more advanced AI capabilities necessitates the development of more compact and densely integrated hardware components. Redistribution layer (RDL) materials are fundamental in enabling the miniaturization of semiconductor packages, which is essential to accommodate the increasing complexity of AI devices. As AI systems become more sophisticated, the demand for smaller and more efficient components grows. In addition, AI applications are known for their voracious appetite for high-performance computing, which inherently generates substantial heat. Efficient thermal management is paramount to ensure the reliability and longevity of AI hardware. RDL materials play a crucial role by enhancing thermal conductivity and heat dissipation properties. As AI equipment becomes more powerful and heat-intensive, the demand for advanced RDL materials that can effectively address these thermal challenges escalates.
Scalability is also a critical consideration in the AI realm. As AI technology proliferates across industries, the ability to scale up hardware production efficiently is paramount. RDL materials simplify the integration of additional components or chips, streamlining the manufacturing process and enabling rapid scalability. This is especially valuable as AI-based tools and equipment become increasingly essential in finance, healthcare, and manufacturing sectors.
AI systems are intricate and typically involve multiple chips, sensors, and processors that must communicate seamlessly to process and analyze data in real-time. The demand for improved connectivity and signal integrity within AI hardware is ever-increasing. RDL materials are pivotal in facilitating high-speed data transmission and ensuring that various components in AI systems work harmoniously. As AI applications span diverse industries, from healthcare to autonomous vehicles, the need for RDL materials capable of maintaining robust connections becomes even more apparent. Moreover, the AI landscape is characterized by rapid evolution and customization. Different industries have unique requirements for AI hardware solutions, necessitating flexibility in design and configuration. RDL materials enable manufacturers to tailor semiconductor packages to meet these specific demands. This customization capability drives the adoption of RDL materials, empowering AI equipment manufacturers to create specialized hardware optimized for various applications. The rapid economic growth and industrial development across the globe also drive increased investment in AI technology. This growth includes the development of smart cities, autonomous vehicles, and industry 4.0 initiatives, all of which rely on AI-based tools and equipment. As these initiatives gain momentum, the demand for RDL materials as a foundation element in semiconductor packaging grows in tandem. Thus, the escalating demand for AI-based equipment and tools is fostering the growth of the North America redistribution layer material market.
North America Redistribution Layer Material Market Overview
North America has a wide presence of IT service providers, financial industries, and government agencies. The rapid pace of technological development and supporting government regulations made North America the most promising market for data centers. There are more than 2,500 data centers and 2,200 service providers in the US. With the increasing demand from customer for high-quality products and services, growing IT sector, and rising number of data centers, many companies are constantly innovating and developing new products to provide the best possible services to their customers.
The manufacturing industry plays a vital role in the growth of the North American economy. The availability of efficient infrastructure in developed nations has enabled manufacturing companies to explore the limits of science, technology, and commerce. Further, the US manufacturing sector is the second largest in the world, and manufacturers of the country hold 12% of total output in the economy. Moreover, the US manufacturing industry is expected to grow rapidly in the coming years due to several favorable factors, including increased productivity owing to the adoption of new technologies; decreased gas prices; and high labor costs in emerging markets. OEMs across all industries in North America are scaling up automation to compete with global manufacturing hubs such as China and Japan. This has led to the rapid developments in advanced semiconductors.
Also, the manufacturing industry in Mexico is witnessing significant growth due to government initiatives for attracting FDIs, as well as its proximity to the US and ability to achieve cost-competitiveness due to NAFTA. Moreover, the automotive industry in Mexico is experiencing a paradigm shift, with many huge automobile companies constructing their plants in the country. A few of the companies that recently opened their plants in the country include Kia Motors, Mercedes-Benz, Nissan, Audi, and General Motors, among others.
A few of the major manufacturing industries in North America include aerospace, automotive, telecommunications, and electronics, among others. Further, owing to a favorable economy, the spending capacities of individuals in North America are high, which has led to the exponential sales of smartphones, tablets, laptops, personal computers, wearables, and other consumer electronics devices. The consumer electronics industry is another major user of semiconductor-based products. All these industries are highly dependent on the semiconductor industry for effective performance. In September 2020, KLA, the US-based capital equipment company, improved its systems portfolio for advanced packaging by introducing new tools. The new tools consist of a Kronos 1190 wafer-level packaging inspection system, ICOS T3/T7 Series, and ICOS F160XP. The new systems allow the end users to improvise semiconductor device fabrication at a packaging stage. Similarly, in May 2021, Intel announced its plan to invest US$ 3.5 billion in the fabrication of advanced semiconductor packaging technologies.
All the above mentioned factors are anticipated to support the growth of the North America redistribution layer material market during 2022-2030.
North America Redistribution Layer Material Market Revenue and Forecast to 2030 (US$ Million)
North America Redistribution Layer Material Market Segmentation
The North America redistribution layer material market is segmented based on type, application, and country.
Based on type, the North America redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. The polyimide (PI) segment held the largest share in 2022.
By application, the North America redistribution layer material market is segmented into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging. The 2.5D/3D IC packaging segment held a larger share in 2022. The 2.5D/3D IC packaging is further subsegmented into high bandwidth memory (HBM), multi-chip integration, package on package (FOPOP), and others.
Based on country, the North America redistribution layer material market is segmented into US, Canada, and Mexico. The US dominated the North America redistribution layer material market in 2022.
SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, DuPont de Nemours Inc, FUJIFILM Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd, NXP Semiconductors NV, JCET Group Co Ltd, and Shin-Etsu Chemical Co Ltd are some of the leading companies operating in the North America redistribution layer material market.