英特爾的「無伺服器」玻璃基板：TGV面臨的挑戰以及供應鏈在先進封裝中的作用

隨著Google、Meta和聯發科考慮採用英特爾的EMIB封裝技術，英特爾在先進封裝和玻璃基板的技術進步再次引起業界的廣泛關注。尤其是在2026年1月22日舉行的日本NEPCON展會上，英特爾發布了其首個將EMIB封裝與玻璃基板結合的樣品。此樣品支援兩倍於傳統產品的光罩尺寸，並將凸塊間距縮小至45µm。英特爾聲稱在測試中實現了「無微裂紋」（No SeWaRe），這表明玻璃基板的量產距離目標又近了一步。同時，除了英特爾之外，台積電、三星（SEMCO）、Rapidus和SK Absolics預計也將在2027年至2028年間相繼實現玻璃基板的量產。

本報告詳細分析了以下主題：(1) 大型晶片封裝的發展趨勢；(2) 玻璃基板的優勢；(3) 主要晶圓代工廠/OSAT廠商的玻璃基板技術藍圖；(4) 玻璃基板量產面臨的挑戰；(5) 玻璃基板解決方案及對應供應商；(6) 公司基板供應商機。本報告分析了目前對玻璃基板的需求、技術瓶頸、供應商表現以及台灣企業潛在的供應鏈機會。

主要亮點

• 英特爾的進展：他們已經將EMIB和玻璃基板完美地整合到大型晶片中，大規模生產指日可待。
• 產業競爭：主要科技品牌已經採用這項技術，而競爭的晶圓代工廠也正在加速部署這項技術。
• 報告重點：評估台灣的包裝趨勢、技術挑戰和供應鏈前景。

目錄

第1章：大型晶片封裝的發展趨勢

第2章：玻璃基板的優勢

第3章：主要晶圓代工廠/OSAT廠商的玻璃基板技術藍圖

第4章：玻璃基板大規模生產的挑戰

第5章 玻璃基板解決方案及相關供應商

第6章：玻璃基板供應鏈概論及台灣企業的機會

第7章：TRI的觀點

With Google, Meta, and MediaTek all considering adopting Intel’s EMIB packaging technology, Intel’s technological progress in advanced packaging and glass substrates has once again attracted significant attention in the industry. In particular, Intel showcased the first sample at NEPCON Japan on January 22nd 2026 that combines Intel’s EMIB packaging with a glass substrate, capable of supporting a chip twice the reticle size, with bump pitch shrunk to 45µm, and claimed to have achieved No SeWaRe (no micro‑cracks) during testing, implying that glass substrates are one step closer to mass production. On the other hand, besides Intel, TSMC, Samsung (SEMCO), Rapidus, and SK Absolics are also expected to achieve mass production of glass substrates successively between 2027 and 2028.

This report mainly provides in‑depth analysis of: (1) trends in large‑size chip packaging; (2) the advantages of glass substrates; (3) the glass substrate technology roadmaps of major foundries/OSATs; (4) challenges in mass production of glass substrates; (5) glass substrate solutions and corresponding suppliers; and (6) an overview of the glass substrate supply chain and opportunities for Taiwanese manufacturers. This report analyzes current demand drivers for glass substrates, technological bottlenecks, supplier performance, and potential supply‑chain opportunities for Taiwanese companies.

Key Highlights

• Intel's Advance: Flawlessly fused EMIB and glass substrates for large chips, nearing mass production.
• Industry Race: Major tech brands adopt this, prompting rival foundries to accelerate rollouts.
• Report Focus: Assesses packaging trends, technical hurdles, and supply chain prospects for Taiwan.

Table of Contents

1. Trends in Large-Size Chip Packaging

• Figure 1: TSMC’s CoWoS Reticle Size Roadmap
• Table 1: Deployment in Large-Sized Packaging for FOPLP among Foundries/OSATs
• Figure 2: Comparison of Area Utilization between Round and Square Wafers
• Figure 3: Schematics of Warpage among Large-Sized Packaging

2. Advantages of Glass Substrates

• Table 2: Comparison of Performance between Organic Core Substrates and Glass Core Substrates
• Figure 4: Schematics of Organic Core Substrates and Glass Core Substrates

3. Glass Substrate Technology Roadmap of Major Foundries/OSATs

• Table 3: Deployment of 2.5D Packaging Product Lines among Major Foundries/OSATs
• Figure 5: Schematics of Intel’s “10-2-10” Glass Core Substrates

4. Challenges in Mass Production of Glass Substrates

• Figure 6: Schemaatics of SeWaRe Caused by TGV
• Figure 7: Schematics of SeWaRe Caused by Dicing
• Figure 8: Process Flow of Glass Substrates
• Figure 9: Schematics of Edge Coating

5. Glass Substrate Solutions and Corresponding Suppliers

• Figure 10: LPKF LIDE Process Flow
• Figure 11: Glass Substrate after TGV
• Figure 12: LPKF LIDE S5000 Gen2
• Table 4: Comparison of TGV Equipment Specifications by Manufacturer
• Figure 13: Three Glass Substrate Dicing Technologies Presented by DISCO
• Table 5: Comparison of Glass Substrate Cutting Technologies
• Figure 14: Results from Two-Sided Dielectric Layer Pull-Back
• Figure 15: Images of Through-Hole Defects Associated with TGV
• Figure 16: Onto Firely F3
• Figure 17: KLA Lumina

6. Overview of Glass Substrate Supply Chain and Opportunities for Taiwan-Based Companies

• Table 6: Glass Substrate Supply Chain

7. TRI’s View