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市場調查報告書
商品編碼
2043018

2026年T型玻璃纖維供不應求:人工智慧機架用玻璃纖維的發展趨勢

2026 T-Glass Supply Shortages: AI Rack Fiberglass Trends

出版日期: | 出版商: TrendForce | 英文 17 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

在 3 月 16 日舉行的 GTC 2026 大會上,NVIDIA 再次展示了其 Rubin 系列晶片和機架系統,該產品計劃於 2026 年底發布。與上一代產品相比,Rubin 系列基板的尺寸明顯更大,層數更多,機架板設計也更複雜。

此外,向無纜設計架構的轉變增加了對中板和正交背板等組件的需求。另外,專為推理處理設計的「Rubin LPX」機架的推出,進一步推動了高階玻璃纖維布的需求。

然而,該公司面臨嚴重的供應限制。日東織布機株式會社控制全球約90%的T玻璃市場和60-70%的NER玻璃市場,預計最快也要到2027年中期才能將新的產能運作營運。這意味著關鍵材料的供應缺口將在未來一年持續存在,直接影響整個人工智慧伺服器供應鏈的前置作業時間和成本趨勢。這是業內所有相關人員應密切關注的問題。

本報告詳細分析了以下幾個面向:(1)玻璃纖維布的技術背景和發展現狀;(2)人工智慧對玻璃纖維布的需求趨勢;(3)日東紡機產能瓶頸及其對價格的影響。

本報告旨在全面分析高階玻璃纖維布市場的需求動能、價格趨勢和競爭動態。

主要亮點

  • NVIDIA 在 GTC 大會上發布了 Rubin 系列晶片和機架。這些產品計劃於年底上市,與上一代產品相比,其基板尺寸更大、層數更多、機架電路板也更複雜。
  • 向無電纜架構的轉變推動了對中板和正交背板的需求增加,而用於推理的「Rubin LPX」機架進一步增加了對高品質玻璃纖維布的需求。
  • 由於 T 型玻璃和 NER 型玻璃市場的主要參與企業已將新產能的推出推遲到明年年中或更晚,供應挑戰仍然存在,導致 AI 伺服器產業鏈中材料持續短缺、前置作業時間延長和成本上升。
  • 本報告旨在透過檢驗玻璃纖維布的技術進步、人工智慧驅動的需求趨勢、主要供應商的產能限制及其對價格的影響,來深入了解市場需求、趨勢和競爭格局。

目錄

第1章:玻璃纖維布:背景與發展

第2章:對人工智慧主導的玻璃纖維布的需求

第3章:日東紡織的生產能力限制及其對價格的影響

第4章:TRI的觀點

簡介目錄
Product Code: TRi-180

NVIDIA once again showcased its Rubin-series chips and rack systems - scheduled for launch by the end of 2026 - at GTC 2026 on March 16th. Compared to the previous generation, the Rubin series boasts significantly larger substrate sizes, higher layer counts, and increased rack board complexity.

Furthermore, the shift toward cableless design architectures is driving demand for components such as midplanes and orthogonal backplanes, while the introduction of the inference-focused Rubin LPX rack is further boosting demand for high-end glass fiber cloth.

However, the supply side is facing severe constraints. Nittobo, which controls approximately 90% of the global T-glass market and 60–70% of the NER-glass market, is not expected to bring new capacity online until mid-2027 at the earliest. This implies that supply gaps for critical materials will persist over the next year, with direct implications for lead times and cost trends across the AI server supply chain. This issue warrants close attention from all industry stakeholders.

This report provides an in-depth analysis of: (1) The technology background and development of glass fiber cloth; (2) AI-driven demand trends for glass fiber cloth; (3) Nittobo’s capacity bottlenecks and their impact on pricing.

The objective is to offer a comprehensive view of demand momentum, pricing trends, and competitive dynamics in the high-end fiberglass cloth market.

Key Highlights

  • NVIDIA unveiled Rubin-series chips and racks at GTC, set for late-year launch, featuring expanded substrate sizes, elevated layer counts, and heightened rack board complexity over prior generations.
  • Transition to cableless architectures heightens demand for midplanes and orthogonal backplanes, while the inference-oriented Rubin LPX rack amplifies needs for premium glass fiber cloth.
  • Supply challenges persist as a dominant player in T-glass and NER-glass markets delays new capacity until mid-next year or later, leading to ongoing material shortages, extended lead times, and rising costs in AI server chains.
  • Report examines glass fiber cloth's technological evolution, AI-fueled demand patterns, capacity constraints from the key supplier, and their effects on pricing, aiming for insights into market demand, trends, and competition.

Table of Contents

1. Glass Fiber Cloth: Background and Development

  • Figure 1: Glass Fiber Cloth
  • Figure 2: CCL Material Structure
  • Figure 3: CCL Cost Breakdown
  • Table 1: CCL: Supplier Product Line Comparison
  • Table 2: Specifications of Glass Fiber Cloth by Grade

2. AI-Driven Demand for Glass Fiber Cloth

  • Figure 4: AI Server Shipment Forecast by Type, 2024–2026
  • Figure 5: Changes in the Substrate Area and Number of Layers of NVIDIA GPUs Across Generations
  • Table 3: Evolution of AI Chip Substrate Specifications (2024–2027)
  • Table 4: Evolution of CCL and Glass Fiber Cloth Specifications for AI Servers, 2024–2027
  • Figure 6: NVIDIA Cableless Compute Tray
  • Figure 7: NVIDIA Kyber Midplane and Backplane
  • Figure 8: NVIDIA Rubin Series Midplane and Backplane Location Diagram
  • Figure 9: Groq 3 LPX Rack Architecture

3. Nittobo’s Capacity Constraints and Impact on Pricing

  • Table 5: A Comparison of High-End Glass Fiber Cloth Supplier Product Lines
  • Figure 10: Nittobo Production Schedule
  • Figure 11: Nittobo T-Glass and Downstream Substrate Price Trends (1Q25–3Q26)
  • Figure 12: Quarterly Revenue Mix Changes of Taiwan Glass (2024–2025)

4. TRI’s View