HBM的全球市場(2026年):HBM3e的價格降低

分析師摘要

三星已完成 NVIDIA HBM3e 認證並開始小批量出貨。供應商競爭日趨激烈，HBM4 升級預計將推高成本和溢價。

主要亮點

• 三星已完成與重要客戶的 HBM3e 認證並開始小批量出貨。
• 為滿足包裝和系統要求，進行了製程調整和重新取樣。
• 由於供應商尋求填滿產能，HBM3e 正面臨激烈的價格和市佔率競爭。
• HBM4 技術升級預計將推高製造成本並帶來溢價壓力。
• 供應商數量和認證時間將決定未來的供應和價格動態。

本報告探討並分析了全球 HBM 市場，並提供了截至 2026 年的市場預測。

目錄

第一章：引言

第二章：HBM3e 12hi 將在 2026 年繼續佔市場主導地位，三星進入 NVIDIA 供應鏈的進程遲早會生效

第三章：HBM3e 細分市場的市場佔有率和價格競爭將加劇，HBM4 將成為下一個戰場

• HBM 產品平均售價不一

第四章：HBM3e 生產對 DDR5/LPDDR5(X) 產品供應的擠出效應可能更明顯

Analyst summary:

Samsung completed NVIDIA certification for HBM3e and began limited shipments; HBM3e will be the near term mainstream. Supplier competition is intensifying while HBM4 upgrades are expected to raise costs and premiums; certification timing will shape prices.

Key Highlights:

• Samsung completed HBM3e certification with a major customer and started limited shipments.
• Process adjustments and re-sampling were made to meet packaging and system requirements.
• HBM3e faces intense price and share competition as suppliers seek to fill capacity.
• HBM4 technology upgrades are expected to raise manufacturing costs and create premium pressure.
• Supplier count and certification timing will determine future supply and pricing dynamics.

Table of Contents

1. Introduction

2. HBM3e 12hi Remains as Market Mainstream for Demand in 2026; Samsung's Penetration of NVIDIA's Supply Chain Proves to be Better Late than Never

3. Trend Is Set for Intensifying Competition for Market Share and Price War in HBM3e Segment; HBM4 Will Be the Next Battleground

• Blended ASP of HBM Products

4. Crowding-Out Effect of HBM3e Production on the Supply of DDR5 and LPDDR5(X) Products Could Become More Pronounced